Nondestructive testing for evaluation of strength of bonded materials /metallic/
Bibliographic list on nondestructive tests for evaluating strength of bonded metallic materials
Cohen, S. E.↗
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Investigation of mounting discrete chip components for hybrid microelectronic applications.
In the assembly of hybrid microcircuits, passive and active discrete chip components are attached by epoxy cements and by solders. This study was initiated to determine the integrity of such attachments. Alumina substrates were subjected to a group of thermal and mechanical test environments defined by test methods in MIL-STD-883. Lot samples of substrates with assembly variations were subjected to separately applied testing and to serial testing. These test methods were applied sequentially to the same lot of substrates. Epoxy cements were generally satisfactory with respect to separate tests, although sequential tests severely degraded epoxy bond strengths of all types. Bond strengths to unglazed substrates were slightly superior to those of the same components on glazed types. Solder joints were vulnerable to catastrophic failure in several environments, especially temperature cycling and thermal shock. Vibration and impact shock also produced solder joint failures.
Caruso, S. V.↗
Adaptation of ion beam technology to microfabrication of solid state devices and transducers
It was found that ion beam texturing of silicon surfaces can be used to increase the effective surface area of MOS capacitors. There is, however, a problem with low dielectric breakdown. Preliminary work was begun on the fabrication of ion implanted resistors on textured surfaces and the potential improvement of wire bond strength by bonding to a textured surface. In the area of ion beam sputtering, the techniques for sputtering PVC were developed. A PVC target containing valinomycin was used to sputter an ion selective membrane on a field effect transistor to form a potassium ion sensor.
Topich, J. A.↗
Computations and estimates of rate coefficients for hydrocarbon reactions of interest to the atmospheres of outer solar system
The rate coefficients, including Arrhenius parameters, have been computed for a number of chemical reactions involving hydrocarbon species for which experimental data are not available and which are important in planetary atmospheric models. The techniques used to calculate the kinetic parameters include the Troe and semiempirical bond energy-bond order (BEBO) or bond strength-bond length (BSBL) methods.
Laufer, A. H.↗
Factors Affecting the Processing of Epoxy Film Adhesives
The increasing awareness that adhesive performance is controlled not only by the condition of the adherend surface but also the condition or state of the adhesive and the process parameters used during fabrication is expected to result in improved reliability, as well as bond performance. The critical process variables which have been found to control adhesive bond formation and ultimate bond strength in 250F and 350F curing epoxy adhesives are described in terms of fabrication parameters and adhesive characteristics. These include the heat-up rate and cure temperature during processing and the adhesive moisture content and age condition (degree of advancement). The diagnostic methods used to delineate the effects of these process variables on adhesive performance are illustrated. These are dielectric, thermomechanical (TMA) and dynamic mechanical (DMA) analyses. Correlation of test results with measured mechanical tensile lap shear strengths of bonded joints is presented and the results briefly discussed in terms of the additives and hardeners used in the adhesive systems.
Pike, R. A.↗
Adhesion, friction, and wear behavior of clean metal-ceramic couples
When a clean metal is brought into contact with a clean, harder ceramic in ultrahigh vacuum, strong bonds form between the two materials. The interfacial bond strength between the metal and ceramic surfaces in sliding contact is generally greater than the cohesive bond strength in the metal. Thus, fracture of the cohesive bonds in the metal results when shearing occurs. These strong interfacial bonds and the shearing fracture in the metal are the main causes of the observed wear behavior and the transfer of the metal to the ceramic. In the literature, the surface energy (bond energy) per unit area of the metal is shown to be related to the degree of interfacial bond strength per unit area. Because the two materials of a metal-ceramic couple have markedly different ductilities, contact can cause considerable plastic deformation of the softer metal. It is the ductility of the metal, then, that determines the real area of contact. In general, the less ductile the metal, the smaller the real area of contact. The coefficient of friction for clean surfaces of metal-ceramic couples correlates with the metals total surface energy in the real area of contact gamma A (which is the product of the surface energy per unit area of the metal gamma and the real area of contact (A)). The coefficient of friction increases as gamma A increases. Furthermore, gamma A is associated with the wear and transfer of the metal at the metal-ceramic interface: the higher the value of gamma A, the greater the wear and transfer of the metal.
Miyoshi, Kazuhisa↗
Adherence of ion beam sputter deposited metal films on H-13 steel
An electron bombardment argon ion source sputter deposited 17 metals and metal oxides on H-13 steel. The films ranged 1 to 8 micrometers in thickness and their adherence was generally greater than the capacity of the measuring device; adherence quality depended on proper precleaning of the substrate before deposition. N2 or air was introduced for correct stoichiometry in metallic compounds. Au, Ag, MgO, and Ta5Si3 films 8 microns thick have bond strength equal to 1 micron coatings; the bond strength of pure metallic films up to 5 microns thick was greater than the epoxy to film bond (8000 psi). The results of exposures of coated material to temperatures up to 700 C are presented.
Mirtich, M. J.↗
Wood Bond Testing
A joint development program between Hartford Steam Boiler Inspection Technologies and The Weyerhaeuser Company resulted in an internal bond analyzer (IBA), a device which combines ultrasonics with acoustic emission testing techniques. It is actually a spinoff from a spinoff, stemming from a NASA Lewis invented acousto-ultrasonic technique that became a system for testing bond strength of composite materials. Hartford's parent company, Acoustic Emission Technology Corporation (AET) refined and commercialized the technology. The IBA builds on the original system and incorporates on-line process control systems. The IBA determines bond strength by measuring changes in pulsar ultrasonic waves injected into a board. Analysis of the wave determines the average internal bond strength for the panel. Results are displayed immediately. Using the system, a mill operator can adjust resin/wood proportion, reduce setup time and waste, produce internal bonds of a consistent quality and automatically mark deficient products.
Source record↗
Ultrasonic Nondestructive Characterization of Adhesive Bonds
Adhesives and adhesive joints are widely used in various industrial applications to reduce weight and costs, and to increase reliability. For example, advances in aerospace technology have been made possible, in part, through the use of lightweight materials and weight-saving structural designs. Joints, in particular, have been and continue to be areas in which weight can be trimmed from an airframe through the use of novel attachment techniques. In order to save weight over traditional riveted designs, to avoid the introduction of stress concentrations associated with rivet holes, and to take full advantage of advanced composite materials, engineers and designers have been specifying an ever-increasing number of adhesively bonded joints for use on airframes. Nondestructive characterization for quality control and remaining life prediction has been a key enabling technology for the effective use of adhesive joints. Conventional linear ultrasonic techniques generally can only detect flaws (delamination, cracks, voids, etc) in the joint assembly. However, more important to structural reliability is the bond strength. Although strength, in principle, cannot be measured nondestructively, a slight change in material nonlinearity may indicate the onset of failure. Furthermore, microstructural variations due to aging or under-curing may also cause changes in the third order elastic constants, which are related to the ultrasonic nonlinear parameter of the polymer adhesive. It is therefore reasonable to anticipate a correlation between changes in the ultrasonic nonlinear acoustic parameter and the remaining bond strength. It has been observed that higher harmonics of the fundamental frequency are generated when an ultrasonic wave passes through a nonlinear material. It seems that such nonlinearity can be effectively used to characterize bond strength. Several theories have been developed to model this nonlinear effect. Based on a microscopic description of the nonlinear interface binding force, a quantitative method was presented. Recently, a comparison between the experimental and simulated results based on a similar theoretical model was presented. A through-transmission setup for water immersion mode-converted shear waves was used to analyze the ultrasonic nonlinear parameter of an adhesive bond. In addition, ultrasonic guided waves have been used to analyze adhesive or diffusion bonded joints. In this paper, the ultrasonic nonlinear parameter is used to characterize the curing state of a polymer/aluminum adhesive joint. Ultrasonic through-transmission tests were conducted on samples cured under various conditions. The magnitude of the second order harmonic was measured and the corresponding ultrasonic nonlinear parameter was evaluated. A fairly good correlation between the curing condition and the nonlinear parameter is observed. The results show that the nonlinear parameter might be used as a good indicator of the cure state for adhesive joints.
Qu, Jianmin↗
Ultrasonic emission method enables testing of adhesive bonds
Detection of acoustic energy emitted by adhesive bonds subjected to tensile stresses at frequencies above sixteen kilocycles per second is used as a method for determining bond strength. This method is used in measuring adhesive bond strengths on metal honeycomb core panels.
Frank, L.↗
Duplicating Curved Tile Surfaces for Pull Testing
Strength of adhesive bonds to fragile objects with complex shapes tested easily with vacuum chucks. In bond-strength test, contact surface of chuck pressed against matching surface of bonded tile. Vacuum line extending through fine bore in chuck creates vacuum at chuck-and-tile interface. Thus, when chuck pulled away, atmospheric pressure tends to push tile away with chuck. If adhesive resists predetermined pull exerted by chuck on tile, bond acceptable. Originally developed for vacuum chucks used on silica tiles attached to outer surface of Space Shuttle orbiter, used to custom-fabricate chuck for specific tile.
Sebenick, R. H.↗
Method and device for determining bond separation strength using induction heating
An induction heating device includes an induction heating gun which includes a housing, a U-shaped pole piece having two spaced apart opposite ends defining a gap there between, the U-shaped pole piece being mounted in one end of the housing, and a tank circuit including an induction coil wrapped around the pole piece and a capacitor connected to the induction coil. A power source is connected to the tank circuit. A pull test machine is provided having a stationary chuck and a movable chuck, the two chucks holding two test pieces bonded together at a bond region. The heating gun is mounted on the pull test machine in close proximity to the bond region of the two test pieces, whereby when the tank circuit is energized, the two test pieces are heated by induction heating while a tension load is applied to the two test pieces by the pull test machine to determine separation strength of the bond region.
Coultrip, Robert H.↗
The effect of processing on autohesive strength development in thermoplastic resins and composites
In the present investigation of processing effects on the autohesive bond strength of neat polysulfone resin and graphite-reinforced polysulfone-matrix composites measured resin bond strength development in precracked compact tension specimens 'healed' by heating over a contact period at a given temperature. The critical strain energy release rate of refractured composite specimens did not exhibit the strong time or temperature dependence of the neat resin tests; only 80-90 percent of the undamaged fracture energy is recoverable.
Howes, Jeremy C.↗
A noncontacting scanning photoelectron emission technique for bonding surface cleanliness inspection
Molecular contamination of bonding surfaces can drastically affect the bond strength that can be achieved and therefore the structural integrity and reliability of the bonded part. The presence of thin contaminant films on bonding surfaces can result from inadequate or incomplete cleaning methods, from oxide growth during the time between cleaning (such as grit blasting) and bonding, or from failure to properly protect cleaned surfaces from oils, greases, fingerprints, release agents, or deposition of facility airborne molecules generated by adjacent manufacturing or processing operations. Required cleanliness levels for desired bond performance can be determined by testing to correlate bond strength with contaminant type and quantity, thereby establishing the degree of contamination that can be tolerated based on the strength that is needed. Once the maximum acceptable contaminant level is defined, a method is needed to quantitatively measure the contaminant level on the bonding surface prior to bonding to verify that the surface meets the established cleanliness requirement. A photoelectron emission technique for the nondestructive inspection of various bonding surfaces, both metallic and nonmetallic, to provide quantitative data on residual contaminant levels is described. The technique can be used to scan surfaces at speeds of at least 30 ft/min using a servo system to maintain required sensor to surface spacing. The fundamental operation of the photoelectron emission sensor system is explained and the automated scanning system and computer data acquisition hardware and software are described.
Gause, Raymond L.↗
Bonding and nondestructive evaluation of graphite/PEEK composite and titanium adherends with thermoplastic adhesives
Bonded single overlap shear specimens were fabricated from Graphite/PEEK (Polyetheretherketone) composite adherends and titanium adherends. Six advanced thermoplastic adhesives were used for the bonding. The specimens were bonded by an electromagnetic induction technique producing high heating rates and high-strength bonds in a few minutes. This contrasts with conventionally heated presses or autoclaves that take hours to process comparable quality bonds. The Graphite/PEEK composites were highly resistant to delamination during the testing. This allowed the specimen to fail exclusively through the bondline, even at very high shear loads. Nondestructive evaluation of bonded specimens was performed ultrasonically by energizing the entire thickness of the material through the bondline and measuring acoustic impedance parameters. Destructive testing confirmed the unique ultrasonic profiles of strong and weak bonds, establishing a standard for predicting relative bond strength in subsequent specimens.
Hodges, W. T.↗
Effect of preforming adherends on static and fatigue strength of bonded composite single-lap joints
An analytical and experimental investigation was conducted on bonded composite single-lap joints with the adherends performed to reduce the angle between the line of action of the applied in-plane force and the bondline. A classical closed-form solution was used to analyze the composite joints with various preform angles and overlap lengths. The adherends of the test specimens were preformed before bonding, during the layup and curing process. Static tests were conducted for preform angles of 0, 5, 10, and 15 deg and overlap lengths of 0.75, 1.75, 2.75, and 3.75 in. A limited fatigue study was conducted for specimens with a 2.75-in. overlap and a preform angle of 5 deg. Results of the analysis showed that preforming the adherends of bonded composite single-lap joints significantly reduced the shear and peel stress concentrations in the adhesive. Experimental results showed that preforming the adherends significantly increased their static and fatigue strength and thus increased the load level for which bonded composite single-lap joints can be designed.
Sawyer, J. W.↗
Bonding to Bulk Metallic Glass using Aerospace-Grade Structural Adhesive
Bulk metallic glasses (BMGs) are non-crystalline metals with growing applications in aerospace. Due to their amorphous nature, BMGs generally exhibit stronger mechanical properties than most crystalline alloys and are more corrosion resistant. The limited reactivity of a corrosion resistant surface may explain the difficulty in establishing robust bonds to certain adhesives, especially commonly used structural adhesives for aerospace applications. Here, an amine cured aerospace adhesive was used for bonding an iron-nickel based BMG satellite component. Various types of processes were explored to avoid adhesive failure and increase bond strength. It was found that the BMG required specific chemical derivatization of the metal surface in order to achieve cohesive failure. Surface analysis was used to determine the mechanisms of adhesion enhancement. The process was optimized to maximize bond strength. This work helps explain the difficulties in bonding BMG materials and provides strategies for design of future bonded BMG components.
Roberts, Rose↗
Dot patterns provide reproducible flaw areas for study of adhesive bonds
Photographic production of a small-dot pattern of known geometry on the surface of a substrate for controlled area degradation enables a study of adhesive bond strengths. These dot patterns may also be applied to force-limiting devices which must depend on the adhesive bonding strength between mating surfaces.
Frank, L.↗