SEARCH · Search NASA

Results for “Bump Tests”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

SourceResearch connectionFrom yearThrough year

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 55 records · Page 3

All sources NASA NTRS DOE OSTI

NASA NTRS1987

IRAC test report. Gallium doped silicon band 2: Read noise and dark current

A direct readout infrared detector array, a candidate for the Space Infrared Telescope Facility (SIRTF) Infrared Array Camera (IRAC), has been tested. The array has a detector surface of gallium doped silicon, bump bonded to a 58x62 pixel MOSFET multiplexer on a separate chip. Although this chip and system do not meet all the SIRTF requirements, the critically important read noise is within a factor of 3 of the requirement. Significant accomplishments of this study include: (1) development of a low noise correlated double sampling readout system with a readout noise of 127 to 164 electrons (based on the detector integrator capacitance of 0.1 pF); (2) measurement of the readout noise of the detector itself, ranging from 123 to 214 electrons with bias only (best to worst pixel), and 256 to 424 electrons with full clocking in normal operation at 5.4 K where dark current is small. Thirty percent smaller read noises are obtained at a temperature of 15K; (3) measurement of the detector response versus integration time, showing significant nonlinear behavior for large signals, well below the saturation level; and (4) development of a custom computer interface and suitable software for collection, analysis and display of data.

Lamb, Gerald↗

NASA NTRS2014

CFD Analysis of Flexible Thermal Protection System Shear Configuration Testing in the LCAT Facility

This paper documents results of computational analysis performed after flexible thermal protection system shear configuration testing in the LCAT facility. The primary objectives were to predict the shear force on the sample and the sensitivity of all surface properties to the shape of the sample. Bumps of 0.05, 0.10,and 0.15 inches were created to approximate the shape of some fabric samples during testing. A large amount of information was extracted from the CFD solutions for comparison between runs and also current or future flight simulations.

Ferlemann, Paul G.↗

NASA NTRS2013

Toward Verification of USM3D Extensions for Mixed Element Grids

The unstructured tetrahedral grid cell-centered finite volume flow solver USM3D has been recently extended to handle mixed element grids composed of hexahedral, prismatic, pyramidal, and tetrahedral cells. Presently, two turbulence models, namely, baseline Spalart-Allmaras (SA) and Menter Shear Stress Transport (SST), support mixed element grids. This paper provides an overview of the various numerical discretization options available in the newly enhanced USM3D. Using the SA model, the flow solver extensions are verified on three two-dimensional test cases available on the Turbulence Modeling Resource website at the NASA Langley Research Center. The test cases are zero pressure gradient flat plate, planar shear, and bump-inchannel. The effect of cell topologies on the flow solution is also investigated using the planar shear case. Finally, the assessment of various cell and face gradient options is performed on the zero pressure gradient flat plate case.

Pandya, Mohagna J.↗

DOE OSTI2024

Beam test results for the Endcap Timing ReadOut Chip (ETROC2) for the CMS ETL upgrade

The Endcap Timing ReadOut Chip (ETROC) for the Compact Muon Solenoid (CMS) Minimum ionizing particle Timing Detector (MTD) is designed to process Low Gain Avalanche Diode (LGAD) signals with a time resolution of 40-50ps per hit, with 30-35 ps per charged particle using two layer detector. The ETROC2, is the first full size (16x16 pixels) and full functionally design that has been tested in hadron and electron beams at CERN and DESY (Sep 2023 - June 2024). Precision timing studies at these test beams are done using a self-referential beam telescope composed of up to 4 layers/chips. This talk describes the ETROC2 beam telescope and summarizes the performance of the ETROC2 chips bump-bonded to (16x16) Fondazione Bruno Kessler (FBK) and Hamamatsu Photonics K.K. (HPK) LGAD sensors using results from recent test beams. The experiences and lessons learned during the course of these test beams are also detailed in this talk.

Safdari, Murtaza↗

NASA NTRS2005

On the Application of Contour Bumps for Transonic Drag Reduction(Invited)

The effect of discrete contour bumps on reducing the transonic drag at off-design conditions on an airfoil have been examined. The research focused on fully-turbulent flow conditions, at a realistic flight chord Reynolds number of 30 million. State-of-the-art computational fluid dynamics methods were used to design a new baseline airfoil, and a family of fixed contour bumps. The new configurations were experimentally evaluated in the 0.3-m Transonic Cryogenic Tunnel at the NASA Langley Research center, which utilizes an adaptive wall test section to minimize wall interference. The computational study showed that transonic drag reduction, on the order of 12% - 15%, was possible using a surface contour bump to spread a normal shock wave. The computational study also indicated that the divergence drag Mach number was increased for the contour bump applications. Preliminary analysis of the experimental data showed a similar contour bump effect, but this data needed to be further analyzed for residual wall interference corrections.

Milholen, William E., II↗

NASA NTRS2005

On the Application of Contour Bumps for Transonic Drag Reduction(Invited)

Milholen, William E., II↗

NASA NTRS2007

Indium Hybridization of Large Format TES Bolometer Arrays to Readout Multiplexers for Far-Infrared Astronomy

The advance of new detector technologies combined with enhanced fabrication methods has resulted in an increase in development of large format arrays. The next generation of scientific instruments will utilize detectors containing hundreds to thousands of elements providing a more efficient means to conduct large area sky surveys. Some notable detectors include a 32x32 x-ray microcalorimeter for Constellation-X, an infrared bolometer called SAFIRE to fly on the airborne observatory SOFIA, and the sub-millimeter bolometer SCUBA-2 to be deployed at the JCMT which will use more than 10,000 elements for two colors, each color using four 32x40 arrays. Of these detectors, SCUBA-2 is farthest along in development and uses indium hybridization to multiplexers for readout of the large number of elements, a technology that will be required to enable the next generation of large format arrays. Our current efforts in working toward large format arrays have produced GISMO, the Goddard IRAM Superconducting 2-Millimeter observer. GISMO is a far infrared instrument to be field tested later this year at the IRAM 30 meter telescope in Spain. GISMO utilizes transition edge sensor (TES) technology in an 8x16 filled array format that allows for typical fan-out wiring and wire-bonding to four 1x32 NIST multiplexers. GISMO'S electrical wiring is routed along the tops of 30 micron walls which also serve as the mechanical framework for the array. This architecture works well for the 128 element array, but is approaching the limit for routing the necessary wires along the surface while maintaining a high fill factor. Larger format arrays will benefit greatly from making electrical connections through the wafer to the backside, where they can be hybridized to a read-out substrate tailored to handling the wiring scheme. The next generation array we are developing is a 32x40 element array on a pitch of 1135 microns that conforms to the NIST multiplexer, already developed for the SCUBA-2 instrument This architecture will utilize electrical connections that route from the TES to the support frame and through the wafer. The detector chip will then be hybridized to the NIST multiplexer via indium bump bonding. In our development scheme we are using substrates that allow for diagnostic testing of electrical continuity across the entire array and we are testing our process to minimize or eliminate any contact resistance at metal interfaces. Our goal is hybridizing a fully functional 32x40 array of TES bolometers to a NIST multiplexer. The following work presents our current progress toward enabling this technology.

Miller, Timothy M.↗

NASA NTRS2024

Turbulence Model Validation through Joint Experimental / Computational Studies of Separated Flow Over a Three-Dimensional Tapered Bump: Part II - Computational Investigation

This report serves as documentation of activities related to Computational Fluid Dynamics (CFD) analysis applied to the Smooth Body Separation Experiment designed to produce validation-quality experimental data from wind-tunnel tests performed at the University of Notre Dame. All CFD analysis utilized the Boeing CFD (BCFD) flow solver. BCFD was used to analyze flow over the Boeing Speed Bump with second-order accuracy in space and time. Inviscid fluxes were computed using the HLLE scheme for steady-state simulations, and the Low-Dissipation Roe scheme for time-accurate simulations. The working fluid was modeled as calorically perfect air using Sutherland's law for viscosity. Thermal diffusivity was determined by assuming a constant molecular Prandtl number of 0.72, and a turbulent Prandtl number of 0.9. Reynolds Averaged Navier-Stokes (RANS) simulations were conducted using the one-equation Spalart-Allmaras turbulence model with rotation correction3 and the quadratic constitutive relation (SA-RC-QCR), as well as Menter's two-equation, Shear-Stress Transport (SST) model. Time-accurate computations were conducted using Delayed Detached eddy Simulation (DDES) with the one-equation RANS model, and Large Eddy Stress balance (LESb) with the two-equation RANS model. Implicit dual-time stepping was used to achieve second-order temporal accuracy. The experimental investigation conducted during the course of this study is described in detail in an accompanying report.

Flow separation↗

DOE OSTI2021

Thin-Entrance Window Process for Soft X-Ray Sensors

New free electron lasers, such as SLAC’s LCLS-II, will provide unique scientific imaging opportunities. In order to fully utilize these facilities, we need to develop detectors with shallow entrance windows that will enable detection of soft x-rays from 250 eV to 1.5 KeV. Achieving adequately shallow entrance windows is challenging because the high temperature anneal needed to activate the dopant also drives the dopant profile deeper, growing the region that is insensitive to soft x-rays. A new microwave annealing technology provides an efficient way to achieve shallow entrance windows in fully depleted high-resistivity silicon sensors. The microwave anneal technique can activate dopants at low substrate temperature, with minimal dopant diffusion, and can be used to fabricate both n-type and p-type entrance windows. SRP and SIMS measurements were used to verify dopant activation with negligible dopant diffusion. We then applied the microwave anneal process to a planar sensor wafer, using the new process to create the backside diode contact. Electrical test of the resulting sensors shows good reverse bias characteristics. The sensors have been bump-bonded to a read-out ASIC and used successfully to measure an Fe-55 x-ray spectrum. Process and device simulations were performed to characterize the quantum efficiency of the entrance window for soft x-rays. This technique is useful for other sensor applications requiring a shallow entrance window, including detectors for UV photons, low energy ions and low energy electrons.

47 OTHER INSTRUMENTATION↗

NASA NTRS1990

The electron signature of parallel electric fields

Dynamics Explorer I High-Altitude Plasma Instrument electron data are presented. The electron distribution functions have characteristics expected of a region of parallel electric fields. The data are consistent with previous test-particle simulations for observations within parallel electric field regions which indicate that typical hole, bump, and loss-cone electron distributions, which contain evidence for parallel potential differences both above and below the point of observation, are not expected to occur in regions containing actual parallel electric fields.

Burch, J. L.↗

NASA NTRS2012

Performance of Simple Gas Foil Thrust Bearings in Air

Foil bearings are self-acting hydrodynamics devices used to support high speed rotating machinery. The advantages that they offer to process fluid lubricated machines include: high rotational speed capability, no auxiliary lubrication system, non-contacting high speed operation, and improved damping as compared to rigid hydrodynamic bearings. NASA has had a sporadic research program in this technology for almost 6 decades. Advances in the technology and understanding of foil journal bearings have enabled several new commercial products in recent years. These products include oil-free turbochargers for both heavy trucks and automobiles, high speed electric motors, microturbines for distributed power generation, and turbojet engines. However, the foil thrust bearing has not received a complimentary level of research and therefore has become the weak link of oil-free turbomachinery. In an effort to both provide machine designers with basic performance parameters and to elucidate the underlying physics of foil thrust bearings, NASA Glenn Research Center has completed an effort to experimentally measure the performance of simple gas foil thrust bearing in air. The database includes simple bump foil supported thrust bearings with full geometry and manufacturing techniques available to the user. Test conditions consist of air at ambient pressure and temperatures up to 500 C and rotational speeds to 55,000 rpm. A complete set of axial load, frictional torque, and rotational speed is presented for two different compliant sub-structures and inter-pad gaps. Data obtained from commercially available foil thrust bearings both with and without active cooling is presented for comparison. A significant observation made possible by this data set is the speed-load capacity characteristic of foil thrust bearings. Whereas for the foil journal bearing the load capacity increases linearly with rotational speed, the foil thrust bearing operates in the hydrodynamic high speed limit. In this case, the load capacity is constant and in fact often decreases with speed if other factors such as thermal conditions and runner distortions are permitted to dominate the bearing performance.

Bruckner, Robert J.↗

NASA NTRS2018

Wall-Modeled Lattice Boltzmann and Navier-Stokes Approaches for Separated Flows

Lattice Boltzmann (LB) and hybrid Reynolds-averaged Navier-Stokes/large eddy simulation (RANS/LES) methods within the Launch Ascent and Vehicle Aerodynamics (LAVA) solver framework are applied to NASA's Revolutionary Computational Aerosciences (RCA) standard test cases for separated flows. A detailed comparison between the performance and accuracy of the two emerging numerical methodologies for turbulence resolving simulations, i.e. the LB and hybrid RANS/LES methods will be presented. This contribution addresses the RCA technical challenge to identify and down-select critical turbulence, transition, and numerical method technologies for 40% reduction in predictive error for standard turbulence separated flow test cases. Results for the 2D NASA wall-mounted hump and the axisymmetric transonic bump including time-averaged pressure coefficient, skin friction, and velocity pro les, as well as resolved and modeled Reynolds stresses for both numerical approaches will be presented and differences between LB and hybrid RANS/LES will be discussed.

Lattice Boltzmann↗

NASA NTRS2023

Turbulence Model Validation Through Joint Experimental /Computational Studies of Separated Flow Over A Three-Dimensional Tapered Bump: Part I - Experimental Investigation

The results of a three-year experimental campaign aimed at comprehensively documenting the separated flow over a three-dimensional bump are presented with the purpose of generating a benchmark experimental database useful in validating computational fluid dynamics (CFD) flow simulations. The bump model geometry was designed to provide well-defined and repeatable smooth-body flow separation conditions that were suitable for both experiments and simulations. The bump had a Gaussian streamwise profile with a constant height equal to 8.5% of its width over the central 60% of the test section width. The remaining 40% were outboard spanwise portions that gradually taper to zero using an error function profile to minimize side-wall boundary layer effects. The model was immersed in a turbulent boundary layer that was developed on a suspended flat plate in the Notre Dame Mach 0.6 Wind Tunnel. In order to document the effect of the incoming boundary layer thickness on the flow separation, the bump model could be located at two streamwise positions. The mean velocity and turbulence intensity of the wind tunnel freestream flow field and approaching turbulent boundary layer were fully documented. The measurements of the flow separation region included surface visualization, wall shear stress using oil-film interferometry, mean and dynamic surface pressure, and planar and stereoscopic particle image velocimetry. The experiments were conducted over a range of Mach numbers from 0.05 to 0.2 corresponding to a range of Reynolds numbers based on the test section spanwise dimension (0.914m) of 1.0 × 10 6 ≤ Re L = U ∞ L/ν ≤ 4.0 × 10 6 . The bulk of the results are presented for the higher Mach number conditions of 0.1 and 0.2 with Re L = 2.0 × 10 6 and 4.0 × 10 6 , respectively. Extensive uncertainty analysis of the data was performed. The data is archived in the NASA Langley Turbulence Modeling Resource website at https://turbmodels.larc.nasa.gov/Other_exp_Data/speedbump_sep_exp.html. In addition to the experiments, a computational effort was made in parallel by the CFD group at Boeing Research & Technology highlighting the usefulness of the data set, which is outlined in the accompanying CFD report.

Flow separation↗

DOE OSTI2020

Measurement of the Spectral Shape of the $β$-Decay of 137 Xe to the Ground State of 137 Cs in EXO-200 and Comparison with Theory

Herein we report on a comparison between the theoretically predicted and experimentally measured spectra of the first-forbidden nonunique $β$-decay transition 137 Xe ( 7/2 - ) → 137 Cs ( 7/2 + ) . The experimental data were acquired by the EXO-200 experiment during a deployment of an AmBe neutron source. The ultralow background environment of EXO-200, together with dedicated source deployment and analysis procedures, allowed for collection of a pure sample of the decays, with an estimated signal to background ratio of more than 99 to 1 in the energy range from 1075 to 4175 keV. In addition to providing a rare and accurate measurement of the first-forbidden nonunique $β$-decay shape, this work constitutes a novel test of the calculated electron spectral shapes in the context of the reactor antineutrino anomaly and spectral bump.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

DOE OSTI2020

Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies

Copper is a commonly used interconnect metal in microelectronic interconnects due to its exceptional electrical and thermal properties. Particularly in applications of the 2.5 and 3D integration, Cu is utilized in through-silicon-vias (TSVs) and flip chip interconnects between microelectronic chips for providing miniaturization, lower power and higher performance than current 2D packaging approaches. Furthermore, SnAg capped Cu pillars are a common high-density interconnect technology for flip chip bonding. For these interconnects, specific properties of the Cu surface, such as roughness and cleanliness, are an important factor in the process to ensure quality solder bumps. During electroplating, tight processing parameters must be met so that defects are avoided, and high bump uniformity is achieved. An understanding of the interactions at the solder and Cu pillar interface is needed, based on the electroplating parameters, to determine the best method for populating solder on the wafer surface. In this study, surface treatment techniques such as oxygen plasma cleaning were performed on the Cu surfaces and the SnAg plating chemistry for depositing the solder were evaluated through hull cell testing to qualitatively determine the range of current densities to investigate. It was observed that current density while plating played a large role in solder bump deposition morphology. At the higher current densities greater than 60 mA/cm 2 , bump height non-uniformity and dendritic growth are observed and at lower current densities, less than or equal to 60 mA/cm 2 , uniform, continuous bump height occurred.

36 MATERIALS SCIENCE↗

DOE OSTI2025

MaPSA Quality Control and AI-Enhanced Grading For the CMS Phase-II Tracker Upgrade

The Compact Muon Solenoid (CMS) experiment will undergo changes as part of the Large Hadron Collider upgrade. The CMS tracker will be upgraded to cope with the new radiation environment and to provide tracking at the first level trigger. This upgrade features a new type of silicon module called PS Module, which combines a Pixel sensor and a Strip sensor in the same module. The pixel portion of the PS module has a sensor bump bonded to 16 Macro Pixel ASICs (MPA) to form a Macro Pixel Sub Assembly (MaPSA). At Fermilab, MaPSAs are tested for quality control before being assembled with the strip sensors, readout and service electronics to form a PS Module. All of this test data is stored in a centralized database, and is used to grade the final module to determine if it will be installed in the detector. The Phase II Outer Tracker Analyzer of Test Outputs (POTATO) is the software that processes this data and determines the module grades. Using recent technologies, an AI agent is being im plemented into POTATO in order to allow users to more efficiently sort through the large amounts of analysis data and ensure that only the user specified data is being considered. This poster will display the process of testing a MaPSA, how that test data is relevant to module assembly and grading, and how the POTATO grading tool is being improved with the use of an embedded AI agent.

Gzamouranis, Olivia [Purdue U.]↗

NASA NTRS2009

NASA Tech Briefs, June 2009

Topics covered include: Device for Measuring Low Flow Speed in a Duct, Measuring Thermal Conductivity of a Small Insulation Sample, Alignment Jig for the Precise Measurement of THz Radiation, Autoignition Chamber for Remote Testing of Pyrotechnic Devices, Microwave Power Combiners for Signals of Arbitrary Amplitude, Synthetic Foveal Imaging Technology, Airborne Antenna System for Minimum-Cycle-Slip GPS Reception, Improved Starting Materials for Back-Illuminated Imagers, Multi-Modulator for Bandwidth-Efficient Communication, Some Improvements in Utilization of Flash Memory Devices, GPS/MEMS IMU/Microprocessor Board for Navigation, T/R Multi-Chip MMIC Modules for 150 GHz, Pneumatic Haptic Interfaces, Device Acquires and Retains Rock or Ice Samples, Cryogenic Feedthrough Test Rig, Improved Assembly for Gas Shielding During Welding or Brazing, Two-Step Plasma Process for Cleaning Indium Bonding Bumps, Tool for Crimping Flexible Circuit Leads, Yb14MnSb11 as a High-Efficiency Thermoelectric Material, Polyimide-Foam/Aerogel Composites for Thermal Insulation, Converting CSV Files to RKSML Files, Service Management Database for DSN Equipment, Chemochromic Hydrogen Leak Detectors, Compatibility of Segments of Thermoelectric Generators, Complementary Barrier Infrared Detector, JPL Greenland Moulin Exploration Probe, Ultra-Lightweight Self-Deployable Nanocomposite Structure for Habitat Applications, and Room-Temperature Ionic Liquids for Electrochemical Capacitors.

Source record↗

NASA NTRS2011

Fast Imaging Detector Readout Circuits with In-Pixel ADCs for Fourier Transform Imaging Spectrometers

Focal plane arrays (FPAs) with high frame rates and many pixels benefit several upcoming Earth science missions including GEO-CAPE, GACM, and ACE by enabling broader spatial coverage and higher spectral resolution. FPAs for the PanFTS, a high spatial resolution Fourier transform spectrometer and a candidate instrument for the GEO-CAPE mission are the focus of the developments reported here, but this FPA technology has the potential to enable a variety of future measurements and instruments. The ESTO ACT Program funded the developed of a fast readout integrated circuit (ROIC) based on an innovative in-pixel analog-to-digital converter (ADC). The 128 X 128 pixel ROIC features 60 ?m pixels, a 14-bit ADC in each pixel and operates at a continuous frame rate of 14 kHz consuming only 1.1 W of power. The ROIC outputs digitized data completely eliminating the bulky, power consuming signal chains needed by conventional FPAs. The 128 X 128 pixel ROIC has been fabricated in CMOS and tested at the Jet Propulsion Laboratory. The current version is designed to be hybridized with PIN photodiode arrays via indium bump bonding for light detection in the visible and ultraviolet spectral regions. However, the ROIC design incorporates a small photodiode in each cell to permit detailed characterization of the ROICperformance without the need for hybridization. We will describe the essential features of the ROIC design and present results of ROIC performance measurements.

focal plane arrays (FPAs)↗