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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3

An Experimental Investigation of Heat Transfer for Supercritical Carbon Dioxide Cooling in a Staggered Pin Fin Array

Pin fin geometry in the trailing edge as turbulators in tur-bine blades has been a subject thoroughly researched for the past several decades. To improve the efficiency of turbomachinery, higher turbine inlet temperatures are necessary, introducing the need for internal cooling channel features, such as pin fin arrays. These solutions are necessary to avoid material failure at higher operating conditions by enhancing the heat transfer of the blade. Over the past decade, a shift toward applying supercritical carbon dioxide or sCO2 cycles has shown increased potential compared to the industry standard air cycles. Promising higher cycle ef¬ficiency, smaller footprints, and zero greenhouse gas emissions, sCO2 has become an attractive alternative to well-established air cycles. This alternative cycle introduces the need to re-visit the heat transfer capabilities of internal cooling geometries within this novel operating fluid environment. The first objective of this paper is to experimentally demonstrate the heat transfer charac-teristics of sCO2 as the secondary internal cooling fluid environ¬ment through testing a pin fin array in a closed loop at 200 bar and 400 Celsius inlet conditions, which stands well within the supercritical region of sCO2. Secondly, the experimental process aims to validate numerical simulation methodology for studying sCO2 environments for internal cooling of turbine blades in a matching pin fin geometry.

Wardell, Ryan J↗

Ultra-low thermal resistance and pressure drop copper and copper-tungsten diamond-shaped pin fin cold plates for liquid cooling of electronics

Modern and future data centers face increasing cooling challenges due to increasing chip thermal design power and die size, along with the need to reduce energy consumption used for cooling. High performance cooling solutions that maintain a low chip junction temperature are needed to ensure electronics reliability. This work develops an ultra-low thermal resistance and low pressure drop 75 mm × 75 mm cold plate, intended for next-generation electronics cooling. The cold plate features an array of diamond-shaped pin fins and integrated copper tungsten heat spreader, selected for its low coefficient of thermal expansion which reduces thermomechanical deformation and allows for closer integration of the cold plate with silicon dies. Starting with 300 candidate designs, three-dimensional computational fluid dynamics simulations predict the thermal-hydraulic performance of cold plate subsections. The highest performing geometries are evaluated with high fidelity simulations. Four cold plates are manufactured for experiments: three with diamond-shaped pin fins and one with straights fins for comparison purposes. The cold plates are fabricated from copper-tungsten (CuW), copper (Cu), or aluminum-silicon-magnesium alloy (AlSi10Mg). The diamond-shaped pin fins achieve a roughly 15 % lower thermal resistance compared to the conventional straight fin microchannel. The highest performing design achieves a chip-to-coolant (including thermal interface material) thermal resistance of 9.0 K/kW in CuW and 6.9 K/kW in Cu under a 1 kW heat load with an inlet-to-outlet pressure drop of 9.0 kPa and water as the working fluid. This work demonstrates ultra-low thermal resistance and pressure drop cold plates for large die, high heat load applications, and shows that CuW is an attractive cold plate material for improved reliability in next generation data center cooling.

Coefficient of thermal expansion↗

Temperature-time distribution and thermal stresses on the RTG fins and shell during water cooling

Radioisotope thermoelectric generator (RTG) packages designed for space missions generally do not require active cooling. However, the heat they generate cannot remain inside of the launch vehicle bay and requires active removal. Therefore, before the Shuttle bay door is closed, the RTG coolant tubes attached to the heat rejection fins must be filled with water, which will circulate and remove most of the heat from the cargo bay. There is concern that charging a system at initial temperature around 200 C with water at 24 C can cause unacceptable thermal stresses in the RTG shell and fins. A computer model is developed to estimate the transient temperature distribution resulting from such charging. The thermal stresses resulting from the temperature gradients do not exceed the elastic deformation limit for the material. Since the simplified mathematical model for thermal stresses tends to overestimate stresses, it is concluded that the RTG can be cooled by introducing water at 24 C to the initially hot fin coolant tubes while the RTG is in the Shuttle cargo bay.

Turner, R. H.↗

The Experimental and Numerical Investigation of Internal Heat Transfer for Supercritical Carbon Dioxide Cooling in a Staggered Pin Fin Array and Single-Jet Impingement

Over the past decade, the drive to reduce greenhouse gas emissions and to increase thermal efficiency for turbomachinery has invigorated the application of supercritical carbon dioxide (sCO2) power cycles for energy generation. Compared to the industry standard air cycles, sCO2 applications hold the potential for several advantages, including higher efficiencies, smaller footprints, and zero greenhouse gas emissions. However, like any turbomachinery application, the turbine inlet temperature must increase to increase thermal efficiency. This introduces the need for internal cooling features to avoid material failure as operating conditions rise. Two standard features include pin fin turbulators in the trailing edge and jet impingement in the airfoil's leading edge. Over the past several decades, these features have been the subject of extensive research. However, the move to the sCO2 operating environment creates the need to re-visit these features to quantify the heat transfer capabilities within this supercritical cooling environment. The first objective of this paper is to discuss the development of the experimental demonstration for internal heat transfer testing at 200 bar and 400 Celsius, which sits well within the CO2 supercritical region. Next, the heat transfer for pin fin turbulators and single-jet impingement in the sCO2 environment is compared to existing air data-derived correlations to quantify any deviations from literature correlations. Finally, the experimental process aims to validate internal cooling conjugate heat transfer numerical simulations for sCO2 turbines.

20 FOSSIL-FUELED POWER PLANTS↗

Analytical investigation of chord size and cooling methods on turbine blade cooling requirements. Book 1: Sections 1 through 8 and appendixes A through I

A study was conducted to determine the effect of chord size on air cooled turbine blades. In the preliminary design phase, eight turbine blade cooling configurations in 0.75-in., 1.0-in., and 1.5-in. chord sizes were analyzed to determine the maximum turbine inlet temperature capabilities. A pin fin convection cooled configuration and a film-impingement cooled configuration were selected for a final design analysis in which the maximum turbine inlet temperature was determined as a function of the cooling air inlet temperature and the turbine inlet total pressure for each of the three chord sizes. The cooling air flow requirements were also determined for a varying cooling air inlet temperature with a constant turbine inlet temperature. It was determined that allowable turbine inlet temperature increases with increasing chord for the convection cooled and transpiration cooled designs, however, the film-convection cooled designs did not have a significant change in turbine inlet temperature with chord.

Faulkner, F. E.↗

Impact of Cubic Pin Finned Surface Structure Geometry upon Spray Cooling Heat Transfer

Experiments were conducted to study the effects of enhanced surface structures on heat flux using spray cooling. The surface enhancements consisted of cubic pin fins machined on the top surface of copper heater blocks. The structure height, pitch, and width were parametrically vaned. Each copper block had a projected cross-sectional area of 2.0 sq cm. Measurements were also obtained on a heater block with a flat surface for baseline comparison purposes. A 2 x 2 nozzle array was used with PF-5060 as the working fluid. Thermal performance data were obtained under nominally degassed (chamber pressure of 41.4 kPa) and gassy conditions (chamber with N2 gas at 100.7 kPa) with a bulk fluid temperature of 20.5 C. Results for both the degassed and gassy cases show that structure width and separation distance have a dominant effect upon the heat transfer for the size ranges used. Cubic pin fin height had little impact upon heat flux. The maximum critical heat flux (CHF) attained for any of the surfaces was 121 W/sq cm, giving an enhancement of 51% relative to the flat surface case under nominally degassed conditions. The gassy case had a maximum CHF of 149 W/sq cm, giving an enhancement of 38% relative to the flat surface case.

Silk, Eric A.↗

Comparative Analysis of Direct and Indirect Cooling of Wide-Bandgap Power Modules and Performance Enhancement of Jet Impingement-Based Direct Substrate Cooling

With the development of high-power and high-torque machines, requirements for high-power density electronics are increasing. Thermal management of such systems requires high heat extraction. Conventional air cooling based heat sinks and cold plate based liquid cooling have their own benefits for various applications but has limitations for high power density applications. The current study explores a jet impingement based direct substrate cooling system that was implemented for a SiC based direct bonded Cu substrate for various power losses. Numerical comparison between jet impingement cooling and conventional horizontal/indirect cooling (pin fin heat sink and genetic algorithm-optimized heat sink) showed that the area weighted average of the heat transfer coefficient (HTC) is high for both horizontal cooling designs, and the local HTC is higher for jet impingement. Design iterations were undertaken to resolve the bottleneck of this cooling system. Increasing the number of nozzles helped to cover more area at the direct bonded Cu bottom plate, which drops the chip temperature considerably. With a constant flow rate, increasing the number of nozzles would decrease local jet velocity, which reduces the heat extraction by jet impingement. This issue can be addressed by reducing the diameter of nozzle but doing so results in a high pressure drop where the design constraint is 2 psi. A flared nozzle design is proposed, which has a higher spreading angle of the jet that increases the flow coverage and reduces the pressure drop of the coolant loop.

Barua, Himel↗

Cooling performance of an active-passive hybrid composite phase change material (HcPCM) finned heat sink: Constant operating mode

Here, the present study explores a hybrid thermal management technology based on air cooling and hybrid composite phase change material (HcPCM) filled finned heat sink for cooling performance of lower to medium heat flux dissipating electronic devices. Two-dimensional numerical simulations are conducted to study the conjugate heat transfer effects of three types of finned heat sink: air-cooled finned heat sink, HcPCM-cooled finned heat sink, and hybrid (air-HcPCM) cooled finned heat sink. A heat sink with a constant volume faction of plate-fins is designed in all cases and simultaneous effects of hybrid nanoparticles and air are investigated to keep the heat sink temperature at safe operating conditions between 40–60°C. The effect of air is incorporated into the heat sink by applying the convective heat transfer coefficient of h c = 10–100W /m 2 .K which tends to create the natural convection and forced convection heat transfer characteristics. The heat flux is varied from 25–40kW /m 2 in the current study. The hybrid nanoparticles of carbon additives (GO and MWCNTs) are dispersed into the RT-35HC, used as a PCM, with a volume fraction of 0% to 6%. Transient simulations are carried out using COMSOL Multiphysics to solve the governing equations for PCM based conjugate heat transfer model. The results showed that forced convection heat transfer improved the cooling performance of the hybrid heat sink compared to natural convection heat transfer. The addition of nanoparticles further enhanced thermal enhancement and uniform melting distribution of PCM inside the finned heat sink. The h c between 30 to 50W/m 2 .K shows optimized values for forced convection heat transfer operating conditions. The volume fraction of 2% of GO+MWCNTs nanoparticles in recommended or optimum concentration for uniform melting of PCM inside the finned heat sink.

36 MATERIALS SCIENCE↗

Rate of Heat Transfer from Finned Metal Surfaces

The object was to evaluate the factors which control the rate of heat transfer to a moving current of air from finned metal surfaces similar to those used on aircraft engine cylinders. The object was to establish data which will enable the finning of cooling surfaces to be designed to suit the particular needs of any specific application. Most of the work was done on flat copper specimens 6 inches square, upon which were mounted copper fins with spacings varying from 1/2 inch to 1/12 inch. All fins were 1 inch deep, 6 inches long, and .020 inch thick. The results of the investigation are given in the form of curves included here. In general, it was found that for specimens of this kind, the effectiveness of a given fin does not decrease very rapidly until its distance from adjacent fins has been reduced to 1/9 or 1/10 of an inch. A formula for the heat transfer from a flat surface without fins was developed, and an approximate formula for the finned specimens is suggested.

Taylor, G Fayette↗