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A systematic approach is presented to constructing a radiation assurance case using Goal Structured Notation (GSN) for spacecraft containing COTS parts. The GSN paradigm is applied to an SRAM single-event upset experiment board designed to fly on a CubeSat November 2016. Construction of a radiation assurance case without use of hardened parts or extensive radiation testing is discussed.
In today's budgetary environment, there is significant interest within the National Aeronautics and Space Administration (NASA) to enable small robotic science missions that can be executed faster and cheaper than previous larger missions. To help achieve this, focus has shifted from using exclusively radiation-tolerant or radiation-hardened parts to using more commercial-off-the-shelf (COTS) components for NASA small satellite missions that can last at least one year in orbit. However, there are some portions of a spacecraft's avionics, such as the Command and Data Handling (C&DH) subsystem and the Power System Electronics (PSE) that need to have a higher level of reliability that goes beyond what is attainable with currently available COTS parts. While there are a number of COTS components that can withstand a total ionizing dose (TID) of tens or hundreds of kilorads, there is still a great deal of concern about tolerance to and mitigation of single-event effects (SEE).
Based on previous demonstrated success at fabricating 5 and 10 kW scale magnetic gearbox (MGB) prototypes, Emrgy and its partners (the project team) proposed to design and construct a 100 kW scale MGB with a 30:1 gear ratio for the low-head hydro applications. The Statement of Project Objectives included tasks covering: 1) Market Applicability; 2) Technical Metrics; 3) Design (initial); 4) Electromagnetic (EM) Load and Structural Analysis; 5) Modal Analysis; 6) Sealing Design and 7) Final Design during Budget Period 1. Budget Period 2 included tasks covering: 1) Materials Procurement and Test Plan Development; 2) Assembly; and 3) Testing. The Market Applicability study (Task 1) led to a clear conclusion and recommendation toward “Low Head” technologies for maximum market share of both New Stream Reach development as well as powering Non-Powered Dams. The findings of this study also identified the opportunity for a larger scale magnetic gearbox-based drive train as a function of increased torque, as opposed to increased speed. The Technical Metrics Study (Task 2) concluded a horizontal orientation was preferred, examined potential loss mechanisms, concluded that a Halbach Array magnetic design was preferred, established a 30:1 gear ratio as optimal, and established a power rating of 100 kW as optimal. The subsequent initial and final detailed design process included electro-magnetic (EM) load and structural analysis (Task 4), a Modal analysis (for vibration) (Task 5), and a sealing design (Task 6) to assure water impermeability. The final design package (Task 7) included 729 individual parts, 117 unique part numbers, and 15 assemblies. In order to facilitate procurement, the full bill of materials was broken down into several sub-components: 1) custom magnetic parts; 2) custom machined parts; 3) custom casted parts; and 4) commercial off the shelf (COTS) parts. The casted parts were fabricated by Oak Ridge National Laboratory (ORNL) via a Cooperative Research and Development Agreement (CRADA) with Emrgy and funded by the Advanced Manufacturing Office (AMO). The procurement effort (Task 8) ultimately covered three time periods based on challenges encountered in meeting the budgeted cost for the prototype. Following the first effort in the early stages of Budget Period 2 in 2017, a no-cost time extension was granted to seek alternative fabrication and procurement options. The project was re-booted in 2020 based on the new ORNL CRADA that would focus on five (5) of the more difficult and expensive parts using their advanced manufacturing expertise. Procurement efforts for the other custom machined parts resulted in quotations that still exceeded the budget by more than $\$$100k. This was, in part, also due to the concurrent COVID-19 pandemic that caused both supply chain disruptions and labor shortages. As the project continued, pricing and availability degraded further. In Q2 FY’22, it was decided to not proceed with the fabrication of the prototype (Task 9) based on budgetary limitations. Outcomes included a full and detailed design of a 100 kW magnetic gearbox and associated indented bill of materials (BOM) and CAD drawings, a full assembly instruction manual with an associated BOM for materials necessary to support assembly, the fabrication of the double Halbach magnetic array for the rotor/stator system, fabrication of five (5) sand-casted/machined parts (via CRADA with ORNL) and an initial draft of a comprehensive testing plan. The most significant non-outcome was the actual fabrication and testing of the prototype gearbox based on budget limitations. Lessons learned included the need for an Application / Design / Cost trade analysis to better elucidate the cost potential of the MGB in the projected volumes anticipated for future demand. This would better establish the efficacy of the original cost target ($\$$0.80/Watt) and/or the need for reconsideration of designs and applications. Likewise, additional consideration of the prototype nature of the gearbox – single use, short lifetime, etc. - either as a separate exercise or in place of the design process completed, to reduce the cost of the demonstration prototype device. Additionally, project continuity was cited as a significant risk based on the loss of the primary design engineering firm after Budget Period 1. A design analysis exercise was conducted at the conclusion of the project to identify potential areas for cost reduction. One concept considered was the removal of the inner ring of magnets (with associated changes in the outer ring magnets) to enable a horizontal collapse of the design. It was estimated this could reduce cost by 10-25% without impacting performance.
Unscreened commercial, off-the-shelf (COTS) parts, in space applications are especially encouraging when the possibility of capitalizing on the extensive development for high-volume consumer applications is considered. Other applications for MMIC parts in space could possibly open new doors in the future.
This talk will provide insights into new options for parts assurance that are being introduced into NASA policy, which build on the results of the NASA Engineering and Safety Center (NESC) COTS Phase 2 study. It will provide some of the highlights and drivers for the use of COTS and brief recommendations for how to successfully select and use COTS parts.
A whisker from a tin plated part was blamed for the loss of a commercial spacecraft in 1998. Although pure tin finishes are prohibited by NASA, tin plated parts, such as hybrids, relays and commercial off the shelf (COTS) parts, are something discovered to have been installed in NASA spacecraft. Invariably, the assumption is that a conformal coat will prevent the growth of, or short circuits caused by, tin whiskers. This study measures the effect a Uralane coating has on the initiation and growth of tin whiskers, on the ability of this coating to prevent a tin whisker from emerging from the coating, and on the ability to prevent shorting. A sample of fourteen brass substrates (1 inch by 4 inches by 1/16 inch) were plated by two separate processes: half of the specimens were 'bright' tin plated directly over the brass substrate and half received a copper flash over the brass substrate prior to 'bright' tin plating. Each specimen was coated on one half of the substrate with three bi-directional sprays of Uralane 5750 to a nominal thickness of 25 to 75 micrometers (1 to 3 mils). Several specimens of both types, Cu and non-Cu flashed, were placed in an oven maintained at 50 C as others' work suggests that this is the optimal temperature for whisker formation. The remaining specimens were maintained at room ambient conditions. The surfaces of each specimen have been regularly inspected using both optical (15 to 400x power) and Scanning Electronic Microscopy (SEM). Many types of growths, including needle-like whiskers, first appeared approximately three months after plating on the non-conformally coated sides of all specimens. At four months, 4 to 5 times more growth sites were observed on the coated side; however, the density of growth sites on the non-conformally coated side has since increased rapidly, and now, at one year, is about the same for both sides. The density of growth sites is estimated at 90/sq mm with 30 percent of the sites growing whiskers (needle-like forms) with the potential to cause short circuit bridging. The average growth rate of the needle-like whiskers on the non-conformally coated areas is about 130 micrometers per year with some outliers reaching 800 micrometers after one year. It is more difficult to make growth measurements under the conformal coat. As yet no whiskers have been observed to penetrate through the coating surface, however, a number of tin nodules appear on the verge of breaking through the thinner regions of the coating surface. These domes are developing sharper and sharper tips, as if a growing whisker is about to push its way through a tough skin. Our observations are that the specimens with copper flash show a much lower density of nucleation sites and significantly slower whisker growth compared to the specimens that have only bright tin plating over brass. The specimens kept at room temperature have a higher whisker density than those stored at 50 C. This is an unexpected result and does not agree with the published findings of others. All of the whiskers originate from small surface defects (thin, tiny scratches) that appear over the entire surface of each specimen.
The rapid evolution of electronics has heralded countless benefits to humanity, enabling increases in computing power while decreasing costs. However, the constantly changing semiconductor device landscape proves to be an immense challenge for the reliability community, especially for those concerned with radiation effects on microelectronics. Changes in device manufacturing, from device structure to processing steps, may and often do change the way the device responds to radiation. While radiation hardened parts are not as much of a reliability concern, they also lag behind commercial off-the-shelf, or COTS, parts in terms of computing capabilities, some by over a decade. Many missions may have no choice but to utilize COTS. As such, these missions need to ensure their parts are reliable in the face of total ionizing dose (TID). However, part and testing facility costs limit the amount of testing possible.
Field programmable gate arrays (FPGA) are used in every space application. Currently, most space flight applications use radiation hardened (RH) FPGAs, which are very expensive. There is a desire to use cheaper, commercial off the shelf reprogrammable FPGAs, which are more susceptible to radiation effects known as single-event effects (SEE). The RH parts have SEE and total ionizing dose (TID) hardened elements pre-integrated into the part. This means that the designer does not need to implement any hardening techniques while configuring the device. The COTS parts on the other hand must be mitigated by design in order to insure any form of mitigation. The design techniques this project examines concern the use of localized triple modular redundancy (LTMR) and distributed triple modular redundancy (DTMR). LTMR triples every flip flop in the device architecture while DTMR triples everything except for the global routes (clocks, resets, and enables). The testing was performed on a ProASIC3E FPGA at the Texas A&M cyclotron facility. Two design architectures were used: shift registers and counters, both with LTMR and DTMR mitigation techniques. The test results prove that DTMR is more effective at reducing SEE than LTMR. We also determined that there was not a significant difference between the use of shift registers and counters for test purposes. More testing is required to obtain additional linear energy transfer values for each architecture and mitigation technique in order to determine the most cost-effective method of SEE mitigation.
This report presents preliminary results from the performance evaluation of a powered air purifying respirator (PAPR) assembled from commercial off-the-shelf (COTS) parts. Cost is a major limiting factor to PAPR adoption in healthcare. Moreover, the lack of standardization for filters and batteries poses a challenge for clinics and hospitals. Rapid prototyping of connectors, both mechanical and electrical, offers a possible solution in addressing both issues. We used 3-D printed connectors to assemble COTS components into a prototype PAPR. Large-scale manufacturing of 3-D printed connectors may be accomplished by converting the computer-aided design (CAD) drawings to pressure-injection molds.
Certifying electronic components is a very involved process. It includes pre-coordination with the radiation test facility for time, schedule and cost, as well as intimate work with designers to develop test procedures and hardware. It also involves work with radiation engineers to understand the effects of the radiation field on the test article/setup as well as the analysis and production of a test report. The technical content of traditional ionizing radiation testing protocol is in wide use and generally follows established standards (ref. Appendix C). This document is not intended to cover all these areas but to cover the methodology of using Variable Depth Bragg Peak (VDBP) to accomplish the goal of characterizing an electronic component. The Variable Depth Bragg Peak (VDBP) test method is primarily used for deep space applications of electronics. However, it can be used on any part for any radiation environment, especially those parts where the sensitive volume cannot be reached by the radiation beam. An example of this problem would be issues that arise in de-lidding of parts or in parts with flip-chip designs, etc. The VDBP method is ideally suited to test modern avionics designs which increasingly incorporate commercial off-the-shelf (COTS) parts and units. Johnson Space Center (JSC) developed software provides assistance to users in developing the radiation characterization data from the raw test data.
A systematic approach is presented to constructing a radiation assurance case using Goal Structuring Notation (GSN) for spacecraft containing COTS parts. The GSN paradigm is applied to an SRAM single-event upset experiment board designed to fly on a CubeSat in January 2017. A custom software language for development of a GSN assurance case is under development at Vanderbilt. Construction of a radiation assurance case without use of hardened parts or extensive radiation testing is discussed.
Researchers at Los Alamos National Laboratory have developed the Unattended Dual Current Monitor (UDCM). The UDCM is an ideal solution for current measurement needs such as ion chamber gamma measurements. This data acquisition system simplifies hardware requirements for current applications, and provides added reliability, flexibility, and compatibility as compared with the legacy Miniature Gamma Ray and Neutron Detector (MiniGRAND) technology. It is lightweight, can be portable or mounted, is manufactured using COTS parts, and features a modern Internet-of-Things (IoT) enabled design.
Conducting space experiments with small budgets is a fact of life for many design groups with low-visibility science programs. One major consequence is that specialized space grade electronic components are often too costly to incorporate into the design. Radiation mitigation now becomes more complex as a result of being restricted to the use of commercial off-the-shelf (COTS) parts. Unique hardware and software design techniques are required to succeed in producing a viable instrument suited for use in space. This paper highlights some of the design challenges and associated solutions encountered in the production of a highly capable, low cost space experiment package.
The commercial microelectronics industry is rapidly moving to completely Pb-free assembly strategies within the next decade. This trend is being driven by existing and proposed legislation in Europe and in Japan. The microelectronics industry has become truly global, as indicated by major U .S. firms who already adopted Pb-free implementation programs. Among these forward-looking firms are AT&T, IBM, Motorola, HP and Intel to name a few.Following Moore's law, advances in microelectronics are happening very rapidly. In many cases, commercial industry is ahead of the aerospace sector in technology. Progress by commercial industry, along with cost, drives the use of Commercial Off-The-Shelf (COTS) parts for military and space applications. We can thus anticipate that the aerospace industry will, at some point, be forced to use Pb-free components and subsystems as part of their standard business practices. In this paper we attempt to provide a snapshot of the commercial industry trends and how they may impact electronics in the aerospace environment. In addition, we also look at different strategies for implementation. Finally we present data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The world is moving toward implementation of environmentally friendly manufacturing techniques. The aerospace industry will be forced to deal with issues related with Pb free assembly, either by availability or legislation. This paper provides some insight into some of the tradeoffs that should be considered.
In this work, we report the implementation of a self-adaptive system using a field programmable gate array (FPGA) and data converters. The self-adaptive system can autonomously recover the lost functionality of a reconfigurable analog array (RAA) integrated circuit (IC) [3]. Both the RAA IC and the self-adaptive system are operating in extreme temperatures (from 120 C down to -180 C). The RAA IC consists of reconfigurable analog blocks interconnected by several switches and programmable by bias voltages. It implements filters/amplifiers with bandwidth up to 20 MHz. The self-adaptive system controls the RAA IC and is realized on Commercial-Off-The-Shelf (COTS) parts. It implements a basic compensation algorithm that corrects a RAA IC in less than a few milliseconds. Experimental results for the cold temperature environment (down to -180 C) demonstrate the feasibility of this approach.
This viewgraph presentation reviews the low temperature, Total Ionizing Dose (TID) tests of radiation hardened serial to parallel converter to be used on the James Webb Space Telescope. The test results show that the original HV583 level shifter - a COTS part -was not suitable for JWST because the supply currents exceeded specs after 20 krad( Si) .The HV584 - functionally similar to the HV583 -was designed using RHBD approach that reduced the leakage currents to within acceptable levels and had only a small effect on the level-shifted output voltage.
A temperature sensor based on a commercial-off-the-shelf (COTS) Silicon-on-Insulator (SOI) Timer was designed for extreme temperature applications. The sensor can operate under a wide temperature range from hot jet engine compartments to cryogenic space exploration missions. For example, in Jet Engine Distributed Control Architecture, the sensor must be able to operate at temperatures exceeding 150 C. For space missions, extremely low cryogenic temperatures need to be measured. The output of the sensor, which consisted of a stream of digitized pulses whose period was proportional to the sensed temperature, can be interfaced with a controller or a computer. The data acquisition system would then give a direct readout of the temperature through the use of a look-up table, a built-in algorithm, or a mathematical model. Because of the wide range of temperature measurement and because the sensor is made of carefully selected COTS parts, this work is directly applicable to the NASA Fundamental Aeronautics/Subsonic Fixed Wing Program--Jet Engine Distributed Engine Control Task and to the NASA Electronic Parts and Packaging (NEPP) Program. In the past, a temperature sensor was designed and built using an SOI operational amplifier, and a report was issued. This work used an SOI 555 timer as its core and is completely new work.
Over the last few years, MEMS (Micro-Electro-Mechanical Systems) resonator-based oscillators began to be offered as commercial-off-the-shelf (COTS) parts by a few companies [1-2]. These quartz-free, miniature silicon devices could compete with the traditional crystal oscillators in providing the timing (clock function) for many digital and analog electronic circuits. They provide stable output frequency, offer great tolerance to shock and vibration, and are immune to electro-static discharge [1-2]. In addition, they are encapsulated in compact lead-free packages, cover a wide frequency range (1 MHz to 125 MHz), and are specified, depending on the grade, for extended temperature operation from -40 C to +85 C. The small size of the MEMS oscillators along with their reliability and thermal stability make them candidates for use in space exploration missions. Limited data, however, exist on the performance and reliability of these devices under operation in applications where extreme temperatures or thermal cycling swings, which are typical of space missions, are encountered. This report presents the results of the work obtained on the evaluation of an ABRACON Corporation MEMS silicon oscillator chip, type ASFLM1, under extreme temperatures.