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At least 55 records · Page 3

Source circuit design considerations

The cost of several circuit configurations for large (5MW) array fields were investigated to assess the relative costs of high and low voltage configurations. Three source circuit NOC voltages were evaluated: 400V (ungrounded), 800V (+ or 400V center grounded), and 2000V (+ or - 1000V center grounded). Four source circuit configurations were considered for each of the three NOC voltages. The configurations correspond to source circuit currents of 15, 30, 45, and 60 amperes, respectively. Conceptual layouts for 5MW building blocks for each of the above configurations were developed. The designs were optimized to minimize BOS electrical and structural costs. Only the BOS electrical costs were evaluated. The designs were broken down into the following elements for cost: (1) basic source circuit intermodule wiring, bypass diodes and associated hardware, source circuit to J-Box wiring, etc; (2) J-Box blocking diodes, varistors, heat sinks, and housing; (3) disconnects source circuit disconnects, fuses, and housing; (4) bus cabling J-Box to PCU interface wiring, and trenching; (5) interface bus bar, group disconnects, and fuses; and (6) fault detection shunts, signal wire, electronics, and alarm. It is concluded that high voltage low current circuits are not economical, at higher currents high and low voltage circuit costs approach each other, high voltage circuits are not likely to offer near term advantage, and development work/manufacturer stimulation is needed to develop low cost high voltage hardware.

Noel, G. T.↗

Electrical short circuit and current overload tests on aircraft wiring

The findings of electrical short circuit and current overload tests performed on commercial aircraft wiring are presented. A series of bench-scale tests were conducted to evaluate circuit breaker response to overcurrent and to determine if the wire showed any visible signs of thermal degradation due to overcurrent. Three types of wire used in commercial aircraft were evaluated: MIL-W-22759/34 (150 C rated), MIL-W-81381/12 (200 C rated), and BMS 1360 (260 C rated). A second series of tests evaluated circuit breaker response to short circuits and ticking faults. These tests were also meant to determine if the three test wires behaved differently under these conditions and if a short circuit or ticking fault could start a fire. It is concluded that circuit breakers provided reliable overcurrent protection. Circuit breakers may not protect wire from ticking faults but can protect wire from direct shorts. These tests indicated that the appearance of a wire subjected to a current that totally degrades the insulation looks identical to a wire subjected to a fire; however the 'fire exposed' conductor was more brittle than the conductor degraded by overcurrent. Preliminary testing indicates that direct short circuits are not likely to start a fire. Preliminary testing indicated that direct short circuits do not erode insulation and conductor to the extent that ticking faults did. Circuit breakers may not safeguard against the ignition of flammable materials by ticking faults. The flammability of materials near ticking faults is far more important than the rating of the wire insulation material.

Cahill, Patricia↗

Assessment of SOI Devices and Circuits at Extreme Temperatures

Electronics designed for use in future NASA space exploration missions are expected to encounter extreme temperatures and wide thermal swings. Such missions include planetary surface exploration, bases, rovers, landers, orbiters, and satellites. Electronics designed for such applications must, therefore, be able to withstand exposure to extreme temperatures and to perform properly for the duration of mission. The Low Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electrical devices, circuits, and systems suitable for applications in deep space exploration missions and aerospace environment. Silicon-On-Insulator (SOI) technology has been under active consideration in the electronics industry for many years due to the advantages that it can provide in integrated circuit (IC) chips and computer processors. Faster switching, less power, radiationtolerance, reduced leakage, and high temp-erature capability are some of the benefits that are offered by using SOI-based devices. A few SOI circuits are available commercially. However, there is a noticeable interest in SOI technology for different applications. Very little data, however, exist on the performance of such circuits under cryogenic temperatures. In this work, the performance of SOI integrated circuits, evaluated under low temperature and thermal cycling, are reported. In particular, three examples of SOI circuits that have been tested for operation at low at temperatures are given. These circuits are SOI operational amplifiers, timers and power MOSFET drivers. The investigations were carried out to establish a baseline on the functionality and to determine suitability of these circuits for use in space exploration missions at cryogenic temperatures. The findings are useful to mission planners and circuit designers so that proper selection of electronic parts can be made, and risk assessment can be established for such circuits for use in space missions.

Elbuluk, Malik↗

Documentation of Stainless Steel Lithium Circuit Test Section Design

The Early Flight Fission-Test Facilities (EFF-TF) team was tasked by Naval Reactors Prime Contract Team (NRPCT) to design, fabricate, and test an actively pumped lithium (Li) flow circuit. This Li circuit takes advantage of work in progress at the EFF TF on a stainless steel sodium/potassium (NaK) circuit. The effort involved modifying the original stainless steel NaK circuit such that it could be operated with Li in place of NaK. This new design considered freeze/thaw issues and required the addition of an expansion tank and expansion/extrusion volumes in the circuit plumbing. Instrumentation has been specified for Li and circuit heaters have been placed throughout the design to ensure adequate operational temperatures and no uncontrolled freezing of the Li. All major components have been designed and fabricated prior to circuit redesign for Li and were not modified. Basic circuit components include: reactor segment, Li to gas heat exchanger, electromagnetic liquid metal pump, load/drain reservoir, expansion reservoir, instrumentation, and trace heaters. The reactor segment, based on a Los Alamos National Laboratory 100-kW design study with 120 fuel pins, is the only prototypic component in the circuit. However, due to earlier funding constraints, a 37-pin partial-array of the core, including the central three rings of fuel pins (pin and flow path dimensions are the same as those in the full design), was selected for fabrication and test. This Technical Publication summarizes the design and integration of the pumped liquid metal Li flow circuit as of May 1, 2005.

Godfroy, T. J.↗

Documentation of Stainless Steel Lithium Circuit Test Section Design

The Early Flight Fission-Test Facilities (EFF-TF) team was tasked by Naval Reactors Prime Contract Team (NRPCT) to design, fabricate, and test an actively pumped lithium (Li) flow circuit. This Li circuit takes advantage of work in progress at the EFF TF on a stainless steel sodium/potassium (NaK) circuit. The effort involved modifying the original stainless steel NaK circuit such that it could be operated with Li in place of NaK. This new design considered freeze/thaw issues and required the addition of an expansion tank and expansion/extrusion volumes in the circuit plumbing. Instrumentation has been specified for Li and circuit heaters have been placed throughout the design to ensure adequate operational temperatures and no uncontrolled freezing of the Li. All major components have been designed and fabricated prior to circuit redesign for Li and were not modified. Basic circuit components include: reactor segment, Li to gas heat exchanger, electromagnetic liquid metal pump, load/drain reservoir, expansion reservoir, instrumentation, and trace heaters. The reactor segment, based on a Los Alamos National Laboratory 100-kW design study with 120 fuel pins, is the only prototypic component in the circuit. However, due to earlier funding constraints, a 37-pin partial-array of the core, including the central three rings of fuel pins (pin and flow path dimensions are the same as those in the full design), was selected for fabrication and test. This Technical Publication summarizes the design and integration of the pumped liquid metal Li flow circuit as of May 1, 2005. This supplement contains drawings, analysis, and calculations

Godfroy, Thomas J.↗

Fingerprinted circuits and methods of making and identifying the same

A circuit having a fingerprint for identification of a particular instantiation of the circuit is disclosed. The circuit may include a plurality of digital circuits or gates. Each of the digital circuits or gates is responsive to a configuration voltage applied to its analog input for controlling whether or not the digital circuit or gate performs its intended digital function and each of the digital circuits or gates transitioning between its functional state and its at least one other state when the configuration voltage equals a boundary voltage. The boundary voltage varies between different instantiations of the circuit for a majority of the digital circuits or gates and these differing boundary voltages serving to identify (or fingerprint) different instantiations of the same circuit.

Ferguson, Michael Ian↗

Fingerprinted circuits and methods of making and identifying the same

A circuit having a fingerprint for identification of a particular instantiation of the circuit is disclosed. The circuit may include a plurality of digital circuits or gates. Each of the digital circuits or gates is responsive to a configuration voltage applied to its analog input for controlling whether or not the digital circuit or gate performs its intended digital function and each of the digital circuits or gates transitioning between its functional state and its at least one other state when the configuration voltage equals a boundary voltage. The boundary voltage varies between different instantiations of the circuit for a majority of the digital circuits or gates and these differing boundary voltages serving to identify (or fingerprint) different instantiations of the same circuit.

Ferguson, Michael Ian↗

Experiments on Evolving Software Models of Analog Circuits

Analog circuits are of great importance in electronic system design since the world is fundamentally analog in nature. While the amount of digital design activity far outpaces that of analog design, most digital systems require analog modules for interfacing with the external world. It was recently estimated that approximately 60% of digital application- specific integrated circuit designs incorporated analog circuits. With challenging analog circuit design problems and few analog design engineers, there are economic reasons for automating the analog design process, especially time-to-market considerations. Techniques for analog circuit design automation began appearing about two decades ago. These methods incorporated heuristics [6], knowledge bases [1], simulated annealing [5], and other algorithms. Efforts using techniques from evolutionary computation began appearing over the last few years. These include the use of genetic algorithms to select electronic component values (for example, the resistance value of a resistor), to select circuit topologies, and to design amplifiers using a limited set of canned topologies [4]. A genetic programming-based analog circuit design system has been demonstrated in which the circuit sizes, component values, and the circuit topologies are determined automatically [3]. The genetic-algorithm systems typically represent circuit structures as vectors of parameters encoded in binary strings, while the genetic programming system manipulates tree data structures.

Lohn, Jason D.↗

Circuit for high resolution decoding of multi-anode microchannel array detectors

A circuit for high resolution decoding of multi-anode microchannel array detectors consisting of input registers accepting transient inputs from the anode array; anode encoding logic circuits connected to the input registers; midpoint pipeline registers connected to the anode encoding logic circuits; and pixel decoding logic circuits connected to the midpoint pipeline registers is described. A high resolution algorithm circuit operates in parallel with the pixel decoding logic circuit and computes a high resolution least significant bit to enhance the multianode microchannel array detector's spatial resolution by halving the pixel size and doubling the number of pixels in each axis of the anode array. A multiplexer is connected to the pixel decoding logic circuit and allows a user selectable pixel address output according to the actual multi-anode microchannel array detector anode array size. An output register concatenates the high resolution least significant bit onto the standard ten bit pixel address location to provide an eleven bit pixel address, and also stores the full eleven bit pixel address. A timing and control state machine is connected to the input registers, the anode encoding logic circuits, and the output register for managing the overall operation of the circuit.

Kasle, David B.↗

Analog Nonvolatile Computer Memory Circuits

In nonvolatile random-access memory (RAM) circuits of a proposed type, digital data would be stored in analog form in ferroelectric field-effect transistors (FFETs). This type of memory circuit would offer advantages over prior volatile and nonvolatile types: In a conventional complementary metal oxide/semiconductor static RAM, six transistors must be used to store one bit, and storage is volatile in that data are lost when power is turned off. In a conventional dynamic RAM, three transistors must be used to store one bit, and the stored bit must be refreshed every few milliseconds. In contrast, in a RAM according to the proposal, data would be retained when power was turned off, each memory cell would contain only two FFETs, and the cell could store multiple bits (the exact number of bits depending on the specific design). Conventional flash memory circuits afford nonvolatile storage, but they operate at reading and writing times of the order of thousands of conventional computer memory reading and writing times and, hence, are suitable for use only as off-line storage devices. In addition, flash memories cease to function after limited numbers of writing cycles. The proposed memory circuits would not be subject to either of these limitations. Prior developmental nonvolatile ferroelectric memories are limited to one bit per cell, whereas, as stated above, the proposed memories would not be so limited. The design of a memory circuit according to the proposal must reflect the fact that FFET storage is only partly nonvolatile, in that the signal stored in an FFET decays gradually over time. (Retention times of some advanced FFETs exceed ten years.) Instead of storing a single bit of data as either a positively or negatively saturated state in a ferroelectric device, each memory cell according to the proposal would store two values. The two FFETs in each cell would be denoted the storage FFET and the control FFET. The storage FFET would store an analog signal value, between the positive and negative FFET saturation values. This signal value would represent a numerical value of interest corresponding to multiple bits: for example, if the memory circuit were designed to distinguish among 16 different analog values, then each cell could store 4 bits. Simultaneously with writing the signal value in the storage FFET, a negative saturation signal value would be stored in the control FFET. The decay of this control-FFET signal from the saturation value would serve as a model of the decay, for use in regenerating the numerical value of interest from its decaying analog signal value. The memory circuit would include addressing, reading, and writing circuitry that would have features in common with the corresponding parts of other memory circuits, but would also have several distinctive features. The writing circuitry would include a digital-to-analog converter (DAC); the reading circuitry would include an analog-to-digital converter (ADC). For writing a numerical value of interest in a given cell, that cell would be addressed, the saturation value would be written in the control FFET in that cell, and the non-saturation analog value representing the numerical value of interest would be generated by use of the DAC and stored in the storage FFET in that cell. For reading the numerical value of interest stored in a given cell, the cell would be addressed, the ADC would convert the decaying control and storage analog signal values to digital values, and an associated fast digital processing circuit would regenerate the numerical value from digital values.

MacLeod, Todd↗

Integral Battery Power Limiting Circuit for Intrinsically Safe Applications

A circuit topology has been designed to guarantee the output of intrinsically safe power for the operation of electrical devices in a hazardous environment. This design uses a MOSFET (metal oxide semiconductor field-effect transistor) as a switch to connect and disconnect power to a load. A test current is provided through a separate path to the load for monitoring by a comparator against a preset threshold level. The circuit is configured so that the test current will detect a fault in the load and open the switch before the main current can respond. The main current passes through the switch and then an inductor. When a fault occurs in the load, the current through the inductor cannot change immediately, but the voltage drops immediately to safe levels. The comparator detects this drop and opens the switch before the current in the inductor has a chance to respond. This circuit protects both the current and voltage from exceeding safe levels. Typically, this type of protection is accomplished by a fuse or a circuit breaker, but in order for a fuse or a circuit breaker to blow or trip, the current must exceed the safe levels momentarily, which may be just enough time to ignite anything in a hazardous environment. To prevent this from happening, a fuse is typically current-limited by the addition of the resistor to keep the current within safe levels while the fuse reacts. The use of a resistor is acceptable for non-battery applications where the wasted energy and voltage drop across the resistor can be tolerated. The use of the switch and inductor minimizes the wasted energy. For example, a circuit runs from a 3.6-V battery that must be current-limited to 200 mA. If the circuit normally draws 10 mA, then an 18-ohm resistor would drop 180 mV during normal operation, while a typical switch (0.02 ohm) and inductor (0.97 ohm) would only drop 9.9 mV. From a power standpoint, the current-limiting resistor protection circuit wastes about 18 times more power than the switch and the inductor configuration. In the fault condition, both the resistor and the inductor react immediately. The resistor reacts by allowing more current to flow and dropping the voltage. Initially, the inductor reacts by dropping the voltage, and then by not allowing the current to change. When the comparator detects the drop in voltage, it opens the switch, thus preventing any further current flow. The inductor alone is not sufficient protection, because after the voltage drop has settled, the inductor would then allow the current to change, in this example, the current would be 3.7 A. In the fault condition, the resistor is flowing 200 mA until the fuse blows (anywhere from 1 ms to 100 s), while the switch and inductor combination is flowing about 2 A test current while monitoring for the fault to be corrected. Finally, as an additional safety feature, the circuit can be configured to hold the switch opened until both the load and source are disconnected.

Burns, Bradley M.↗

Validation of an Accurate Three-Dimensional Helical Slow-Wave Circuit Model

The helical slow-wave circuit embodies a helical coil of rectangular tape supported in a metal barrel by dielectric support rods. Although the helix slow-wave circuit remains the mainstay of the traveling-wave tube (TWT) industry because of its exceptionally wide bandwidth, a full helical circuit, without significant dimensional approximations, has not been successfully modeled until now. Numerous attempts have been made to analyze the helical slow-wave circuit so that the performance could be accurately predicted without actually building it, but because of its complex geometry, many geometrical approximations became necessary rendering the previous models inaccurate. In the course of this research it has been demonstrated that using the simulation code, MAFIA, the helical structure can be modeled with actual tape width and thickness, dielectric support rod geometry and materials. To demonstrate the accuracy of the MAFIA model, the cold-test parameters including dispersion, on-axis interaction impedance and attenuation have been calculated for several helical TWT slow-wave circuits with a variety of support rod geometries including rectangular and T-shaped rods, as well as various support rod materials including isotropic, anisotropic and partially metal coated dielectrics. Compared with experimentally measured results, the agreement is excellent. With the accuracy of the MAFIA helical model validated, the code was used to investigate several conventional geometric approximations in an attempt to obtain the most computationally efficient model. Several simplifications were made to a standard model including replacing the helical tape with filaments, and replacing rectangular support rods with shapes conforming to the cylindrical coordinate system with effective permittivity. The approximate models are compared with the standard model in terms of cold-test characteristics and computational time. The model was also used to determine the sensitivity of various circuit parameters including typical manufacturing dimensional tolerances and support rod permittivity. By varying the circuit parameters of an accurate model using MAFIA, these sensitivities can be computed for manufacturing concerns, and design optimization previous to fabrication, thus eliminating the need for costly experimental iterations. Several variations were made to a standard helical circuit using MAFIA to investigate the effect that variations on helical tape and support rod width, metallized loading height and support rod permittivity, have on TWT cold-test characteristics.

Kory, Carol L.↗

Ground Isolation Circuit for Isolating a Transmission Line from Ground Interference

This invention relates generally to a system for isolating ground interference from a transmission line, e.g., a ground isolation circuit for isolating a wideband transmission signal (such as a video signal) from ground by modulating the base signal on a carrier signal to permit the transmission signal to be isolated. In one embodiment, the circuit includes a pair of matched mixer circuits, each of which receives a carrier signal from the same oscillator circuit. The first mixer circuit also receives the baseband signal input, after appropriate conditioning, and modulates the baseband signal onto the carrier signal. In a preferred embodiment the carrier signal has a predetermined frequency which is at least two times the frequency of the baseband signal. The modulated signal (which can comprise an rf signal) is transmitted via an rf transmission line to the second mixer, which demodulates the rf signal to recover the baseband signal. Each port of the mixer connects to an isolation transformer to ensure isolation from ground interference. The circuit is considered to be of commercial value in that it can provide isolation between transmitting and receiving circuits, e.g., ground isolation for television circuits or high frequency transmitters, without the need for video transformers or optical isolators, thereby reducing the complexity, power consumption, and weight of the system.

Davidson, Craig A.↗

Focal plane infrared readout circuit with automatic background suppression

A circuit for reading out a signal from an infrared detector includes a current-mode background-signal subtracting circuit having a current memory which can be enabled to sample and store a dark level signal from the infrared detector during a calibration phase. The signal stored by the current memory is subtracted from a signal received from the infrared detector during an imaging phase. The circuit also includes a buffered direct injection input circuit and a differential voltage readout section. By performing most of the background signal estimation and subtraction in a current mode, a low gain can be provided by the buffered direct injection input circuit to keep the gain of the background signal relatively small, while a higher gain is provided by the differential voltage readout circuit. An array of such readout circuits can be used in an imager having an array of infrared detectors. The readout circuits can provide a high effective handling capacity.

Pain, Bedabrata↗

Continuous, Full-Circle Arctangent Circuit

A circuit generates an analog voltage proportional to an angle, in response to two sinusoidal input voltages having magnitudes proportional to the sine and cosine of the angle, respectively. That is to say, given input voltages proportional to sin(Omega(t))sin(Theta) and sin(Omega(t))cos(Theta) [where Theta denotes the angle, mega denotes 2(pi) x a carrier frequency, and t denotes time], the circuit generates a steady voltage proportional to Theta. The output voltage varies continuously from its minimum to its maximum value as Theta varies from -180deg to 180deg. While the circuit could accept input modulated sine and cosine signals from any source, it must be noted that such signals are typical of the outputs of shaft-angle resolvers in electromagnetic actuators used to measure and control shaft angles for diverse purposes like aiming scientific instruments and adjusting valve openings. In effect, the circuit is an analog computer that calculates the arctangent of the ratio between the sine and cosine signals. The full-circle angular range of this arctangent circuit stands in contrast to the range of prior analog arctangent circuits, which is from slightly greater than -90deg to slightly less than +90deg. Moreover, for applications in which continuous variation of output is preferred to discrete increments of output, this circuit offers a clear advantage over resolver- to-digital integrated circuits.

Alhorn, Dean C.↗

Taking evolutionary circuit design from experimentation to implementation: some useful techniques and a silicon demonstration

Current techniques in evolutionary synthesis of analogue and digital circuits designed at transistor level have focused on achieving the desired functional response, without paying sufficient attention to issues needed for a practical implementation of the resulting solution. No silicon fabrication of circuits with topologies designed by evolution has been done before, leaving open questions on the feasibility of the evolutionary circuit design approach, as well as on how high-performance, robust, or portable such designs could be when implemented in hardware. It is argued that moving from evolutionary 'design-for experimentation' to 'design-for-implementation' requires, beyond inclusion in the fitness function of measures indicative of circuit evaluation factors such as power consumption and robustness to temperature variations, the addition of certain evaluation techniques that are not common in conventional design. Several such techniques that were found to be useful in evolving designs for implementation are presented; some are general, and some are particular to the problem domain of transistor-level logic design, used here as a target application. The example used here is a multifunction NAND/NOR logic gate circuit, for which evolution obtained a creative circuit topology more compact than what has been achieved by multiplexing a NAND and a NOR gate. The circuit was fabricated in a 0.5 mum CMOS technology and silicon tests showed good correspondence with the simulations.

digital circuits designs↗

An improved logarithmic amplifier circuit for PDS microdensitometers

A high speed logarithmic amplifier circuit for the Perkin-Elmer PDS microdensitometer is discussed. The circuit is designed around an Analog Devices 757p log-amp module. The amplifier produces undistorted profiles of rapidly changing, dense ( 4) images over the available range of scanning speeds. The circuit board was designed to replace directly the manufacturer supplied unit; neither electrical nor mechanical modifications of the basic PDS are required. The performance of the circuit is illustrated through its effects on the overall modulation transfer function of the instrument and by scans of a well exposed stellar image. Circuit diagrams and parts lists a mechanism for obtaining either circuit board layout art work or finished circuit boards are presented.

Anderson, C. M.↗

An adjustable RF tuning element for microwave, millimeter wave, and submillimeter wave integrated circuits

Planar RF circuits are used in a wide range of applications from 1 GHz to 300 GHz, including radar, communications, commercial RF test instruments, and remote sensing radiometers. These circuits, however, provide only fixed tuning elements. This lack of adjustability puts severe demands on circuit design procedures and materials parameters. We have developed a novel tuning element which can be incorporated into the design of a planar circuit in order to allow active, post-fabrication tuning by varying the electrical length of a coplanar strip transmission line. It consists of a series of thin plates which can slide in unison along the transmission line, and the size and spacing of the plates are designed to provide a large reflection of RF power over a useful frequency bandwidth. Tests of this structure at 1 GHz to 3 Ghz showed that it produced a reflection coefficient greater than 0.90 over a 20 percent bandwidth. A 2 GHz circuit incorporating this tuning element was also tested to demonstrate practical tuning ranges. This structure can be fabricated for frequencies as high as 1000 GHz using existing micromachining techniques. Many commercial applications can benefit from this micromechanical RF tuning element, as it will aid in extending microwave integrated circuit technology into the high millimeter wave and submillimeter wave bands by easing constraints on circuit technology.

Lubecke, Victor M.↗