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At least 55 records · Page 3

Earth Observing System/Advanced Microwave Sounding Unit-A (EOS/AMSU-A): Developer derating policy

The derating requirements/factors tabulated in Appendix B of the Goddard Space Flight Center Preferred Parts List (GSFC PPL) and Appendix A of MIL-STD-975 (NASA Standard Electrical, Electronic and Electromechanical (EEE) Parts List) should be used. Where differences occur, the PPL derating factors should have precedence over the derating factors of MIL-STD-975. When a derating factor is not provided in either the PPL or MIL-STD-975, the GSFC EOS Parts Branch Specialist should be consulted. In addition, the Performance Assurance Requirement (PAR) stipulates that all piece parts shall function at or above twice the expected ionizing radiation dose.

Maciel, Roberto M.↗

Space Station Freedom secondary power wiring requirements

Secondary power is produced by DDCU's (direct current to direct current converter units) and routed to and through secondary power distribution assemblies (SPDA's) to loads or tertiary distribution assemblies. This presentation outlines requirements of Space Station Freedom (SSF) EEE (electrical, electronic, and electromechanical) parts wire and the approved electrical wire and cable. The SSF PDRD (Program Definition and Requirements Document) language problems and resolution are reviewed. The cable routing to and from the SPDA's is presented as diagrams and the wire recommendations and characteristics are given.

Sawyer, C. R.↗

X-ray Fluorescence Spectroscopy Study of Coating Thickness and Base Metal Composition

For electrical, electronic, and electromechanical (EEE) parts to be approved for space use, they must be able to meet safety standards approved by NASA. A fast, reliable, and precise method is needed to make sure these standards are met. Many EEE parts are coated in gold (Au) and nickel (Ni), and the thickness coating is crucial to a part s performance. A nondestructive method that is efficient in measuring coating thickness is x-ray fluorescence (XRF) spectroscopy. The XRF spectrometer is a machine designed to measure layer thickness and composition of single or multilayered samples. By understanding the limitations in the collection of the data by this method, accurate composition and thickness measurements can be obtained for samples with Au and Ni coatings. To understand the limitations of data found, measurements were taken with the XRF spectrometer and compared to true values of standard reference materials (SRM) that were National Institute of Standards and Technology (NIST) traceable. For every sample, six different parameters were varied to understand measurement error: coating/substrate combination, number of layers, counting interval, collimator size, coating thickness, and test area location. Each measurement was taken in accordance with standards set by the American Society for Testing and Materials (ASTM) International Standard B 568.

Rolin, T. D.↗

Three-Dimensional Computed Tomography as a Method for Finding Die Attach Voids in Diodes

NASA analyzes electrical, electronic, and electromechanical (EEE) parts used in space vehicles to understand failure modes of these components. The diode is an EEE part critical to NASA missions that can fail due to excessive voiding in the die attach. Metallography, one established method for studying the die attach, is a time-intensive, destructive, and equivocal process whereby mechanical grinding of the diodes is performed to reveal voiding in the die attach. Problems such as die attach pull-out tend to complicate results and can lead to erroneous conclusions. The objective of this study is to determine if three-dimensional computed tomography (3DCT), a nondestructive technique, is a viable alternative to metallography for detecting die attach voiding. The die attach voiding in two- dimensional planes created from 3DCT scans was compared to several physical cross sections of the same diode to determine if the 3DCT scan accurately recreates die attach volumetric variability

Brahm, E. N.↗

Solid State Ultracapacitor

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts used in space vehicles. One area that NASA wishes to advance is energy storage and delivery. Currently, space vehicles use rechargeable batteries that utilize silver zinc or lithium ion electrochemical processes. These current state-of-the-art rechargeable batteries cannot be rapidly charged, contain harmful chemicals, and suffer from early wear-out mechanisms. A solid state ultracapacitor is an EEE part that offers significant advantages over current electrochemical and electrolytic devices. The objective of this research is to develop an internal barrier layer ultracapacitor (IBLC) using novel dielectric materials as a battery replacement with a focus on these advantages: longer life, lower mass-toweight ratio, rapid charging, on-demand pulse power, improved on-pad standby time without maintenance, and environmental friendliness. The approach is unique in two areas. A deposition technique is used that has been shown to produce a more uniformly coated nanoparticle than sol-gel, which has resulted in colossal permittivities. These particles are then distributed in an ink formulation developed at NASA Marshall Space Flight Center (MSFC) and deposited utilizing a 3D aerosol jet technique. This additive manufacturing technique controls layer thickness, resulting in extremely large capacitance and energy density.

Rolin, Terry D.↗

NASA Past, Present, and Future: The Use of Commercial Off The Shelf (COTS) Electronics in Space

NASA has a long history of using commercial grade electronics in space. In this presentation we will provide a brief history of NASA's trends and approaches to commercial grade electronics focusing on processing and memory systems. This will include providing summary information on the space hazards to electronics as well as NASA mission trade space. We will also discuss developing recommendations for risk management approaches to Electrical, Electronic and Electromechanical (EEE) parts usage in space. Two examples will be provided focusing on a near-earth Polar-orbiting spacecraft as well as a mission to Mars. The final portion will discuss emerging trends impacting usage.

Commercial off the Shelf (COTS); Electronic and El↗

Tutorial: Radiation Effects in Electronic Systems

This tutorial presentation will give an overview of radiation effects in electrical, electronic, and electromechanical (EEE) components as it applies to civilian space systems of varying size and complexity. The natural space environment presents many unique threats to electronic systems regardless of where the systems operate from low-Earth orbit to interplanetary space. The presentation will cover several topics, including: an overview and introduction to the applicable space radiation environments common to a broad range of mission designs; definitions and impacts of effects due to impinging particles in the space environment e.g., total ionizing dose (TID), total non-ionizing dose (TNID), and single-event effects (SEE); and, testing for and evaluation of TID, TNID, and SEE in EEE components.

total non-ionizing dose (TNID)↗

NASA Past, Present, and Future: The Use of Commercial Off The Shelf (COTS) Electronics in Space

NASA has a long history of using commercial grade electronics in space. In this presentation we will provide a brief history of NASA's trends and approaches to commercial grade electronics focusing on processing and memory systems. This will include providing summary information on the space hazards to electronics as well as NASA mission trade space. We will also discuss developing recommendations for risk management approaches to Electrical, Electronic and Electromechanical (EEE) parts usage in space. Two examples will be provided focusing on a near-earth Polar-orbiting spacecraft as well as a mission to Mars. The final portion will discuss emerging trends impacting usage.

Electronic and Electromechanical (EEE) parts↗

Application of Temperature-Controlled Thermal Atomization for Printing Electronics in Space

Additive Manufacturing (AM) is a technology that builds three dimensional objects by adding material layer-upon-layer throughout the fabrication process. The Electrical, Electronic and Electromechanical (EEE) parts packaging group at Marshall Space Flight Center (MSFC) is investigating how various AM and 3D printing processes can be adapted to the microgravity environment of space to enable on demand manufacturing of electronics. The current state-of-the art processes for accomplishing the task of printing electronics through non-contact, direct-write means rely heavily on the process of atomization of liquid inks into fine aerosols to be delivered ultimately to a machine's print head and through its nozzle. As a result of cumulative International Space Station (ISS) research into the behaviors of fluids in zero-gravity, our experience leads us to conclude that the direct adaptation of conventional atomization processes will likely fall short and alternative approaches will need to be explored. In this report, we investigate the development of an alternative approach to atomizing electronic materials by way of thermal atomization, to be used in place of conventional aerosol generation and delivery processes for printing electronics in space.

Wu, Chih-Hao↗

A Year in the Life of the NASA Electronic Parts and Packaging (NEPP) Program

NEPP Mission Statement: Provide NASAs leadership for developing and maintaining guidance for the screening, qualification, test, and reliable usage of electrical, electronic, and electromechanical (EEE) parts by NASA, in collaboration with other government Agencies and industry.

NASA Electronic Parts and Packaging (NEPP) Program↗

Transparent Conductive Ink for Additive Manufacturing

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts. Nanotechnology is listed in NASA's Technology Roadmap as a key area to invest for further development.1 This research project focused on using nanotechnology to improve electroluminescent lighting in terms of additive manufacturing and to increase energy efficiency. Specifically, this project's goal was to produce a conductive but transparent printable ink that can be sprayed on any surface for use as one of the electrodes in electroluminescent device design. This innovative work is known as thick film dielectric electroluminescent (TDEL) technology. TDEL devices are used for "backlighting, illumination, and identification due to their tunable color output, scalability, and efficiency" (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). These devices use a 'front-to-back' printing method, where the substrate is the transparent layer, and the dielectric and phosphor are layered on top. This project is a first step in the process of creating a 3D printable 'back-to-front' electroluminescent device. Back-to-front 3D-printed devices are beneficial because they can be printed onto different substrates and embedded in different surfaces, and the substrate is not required to be transparent, all because the light is emitted from the top surface through the transparent conductor. Advances in this area will help further development of printing TDEL devices on an array of different surfaces. Figure 1 demonstrates the layering of the two electrodes that are aligned in a parallel plate capacitor structure (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). Voltage is applied across the device, and the subsequent electron excitation results in light emission at the top layer.

Patlan, X. J.↗

NASA and COTS Electronics: Past Approach and Successes - Future Considerations

NASA has a long history of using commercial grade electronics in space. In this talk, a brief history of NASAâ's trends and approaches to commercial grade electronics focusing on processing and memory systems will be presented. This will include providing summary information on the space hazards to electronics as well as NASA mission trade space. We will also discuss developing recommendations for risk management approaches to Electrical, Electronic and Electromechanical (EEE) parts and reliability in space. The final portion of the talk will discuss emerging aerospace trends and the future for Commercial Off The Shelf (COTS) usage.

LaBel, Kenneth A.↗

Radiation Single Event Effects (SEE) Impact on Complex Avionics Architecture Reliability

The NASA Engineering and Safety Center (NESC) has an urgent need to understand how system-level reliability of an avionics architecture is compromised when portions of the architecture are temporarily unavailable due to single event effects (SEE). The proposed activity parametrically evaluated these SEE impacts on system reliability based on mission duration, upset rate and recovery times for a representative redundant architecture. The key stakeholders for this study are NASA programs and projects that expect to use avionics architectures with electrical, electronic and electromechanical (EEE) parts susceptible to SEE when exposed to the mission expected radiation environment.

Hodson, Robert F.↗

A Study of Lessons and Experiences of NASA Centers in the Use of Commercial Off the Shelf (COTS) Electronics

The NASA Engineering and Safety Center (NESC) sponsored a Technical Assessment relating to the utilization of commercial-off-the-shelf (COTS) electrical, electronic, and electromechanical (EEE) parts in spaceflight systems at NASA Centers. The assessment had two primary goals. The first was to capture each NASA Centers’ current practices, best practices, lessons learned and Center-proposed recommendations on the use of COTS EEE parts and assemblies in critical ground support equipment (GSE). The second was to provide recommendations on the use of COTS, including a set of current best practices based on the Centers’ current and best practices and the NESC team’s discussions. One key achievement made by the assessment team was the characterization of the term Industry Leading Parts Manufacturers (ILPMs) as parts manufacturer with high volume automatic production facilities and which can provide documented proof of the technology, process and product qualification, and its implementation of the best practices for “zero defects” for parts quality, reliability and workmanship. The assessment concluded with numerous findings, takeaways and recommendations that will be discussed during this presentation.

commercial↗