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At least 55 records · Page 3

Epoxy resin reinforced with carbonized chicken feathers: An innovative composite material with sustainable potentials

Here, this article explores a novel method for enhancing the mechanical properties of epoxy resin composites by incorporating carbonized chicken feathers as a filler material. The fabrication process involves carbonizing chicken feathers at 600°C and incorporating 5-10 wt% of the fillers into an epoxy matrix. The composites showed enhanced mechanical properties and samples containing 10 wt% filler exhibit the best properties. The performance corresponds to 49% increase in tensile strength, 16% rise in Young’s modulus, 40% improvement in flexural modulus, and 57% in flexural strength. X-ray diffraction and scanning electron microscopy with energy dispersive spectroscopy were employed to characterize the filler. This characterization provides valuable insights into the structure and chemical composition of the pulverized carbonized chicken feathers that contributed to the attained improvement in composites’ properties. Microstructural examination of the developed composite under scanning electron microscope also provides insights into matrix-filler interface and dispersion of the fillers within the composite matrix. The study not only highlights the unique combination of carbonized feathers’ inherent strength and compatibility with the epoxy matrix but also underscores the eco-friendly nature of utilizing agricultural waste. The findings suggest promising applications in industries demanding lightweight, high-strength materials, which can contribute to sustainable engineering solutions.

36 MATERIALS SCIENCE↗

Kinetic study of polymerization/curing of filament-wound composite epoxy resin systems with aromatic diamines

The kinetics of polymerization/curing of a filament-wound composite epoxy resin consisting of an 80/20 DGEBA/DGEBD blend and an MDA/m-PDA blend (Tonox 60/40) was studied at various temperatures and at amine epoxy ratios between 1.1 and 4.4 by means of Fourier-transform (FT) IR and bulk viscosity measurements. The activation energy for the polymerization/curing reaction using an amine/epoxy ratio of 1.1 was 11.9 kcal/mole, in agreement with a previous value. The FT-IR conversion-time plots were fitted to a kinetic expression containing two rate constants with activation energies of 13.7 and 10.0 kcal/mole. The bulk viscosity followed the Williams et al. (1955) equation, with a Di Benedetto (1965) expression for the glass transition temperature.

Golub, M. A.↗

Cure of epoxy resins determined by simple tests

Rapid visual and simple quantitative tests indicate the degree of cure of particular epoxy resin binders in prepreg stock. It is possible that these tests may be extended to a number of different epoxy formulations.

Ladaki, M.↗

Fracture Prediction of Epoxy Resin using Morse Bond Potential Embedded in GAFF using Molecular Dynamics Simulations

A generic method is developed to investigate the fracture behavior of an epoxy resin using atomistic molecular (MD) dynamics simulations. The epoxy system consisted of the stoichiometric mixture of tetra-/tri-functional epoxies and di-functional hardener molecules and was cured with a step-growth crosslinking algorithm. A hybrid force field (hFF) in which Morse bond function were added in second generation-general Amber Force Field (GAFF2) was used to capture bond breaking of the crosslinked epoxy system under uniaxial deformation. The Morse bond parameters for covalent bonds in the crosslinked backbone were fit to dissociation curves computed by CASPT2/6-311+G**. After the systems in various crosslink densities were obtained and equilibrated, the full length of stress-strain (𝜎-𝜀) curve was produced including initial elastic regime, yielding, plastic flow, strain hardening, and progressive failure. We found that the hFF was effective in studying the dissociation of crosslinked polymers and understanding the failure mechanism. In the results, the hFF delivered the same elastic property obtained from the unmodified force field GAFF. The stress-strain curve, however, began to be distinct in the plastic regime due to broken covalent bonds capable of altering the tensile behavior. Once the stress reached maximum, it progressively decreased until the ultimate failure (𝜎=0). Since hFF employed the existing GAFF functions with including a minimal change of its bond potential, this approach is easier to perform and computationally more efficient for unveiling the fracture behavior of polymer materials at the molecular level than other approaches with reactive force fields. We expect this approach will be utilized to accelerate the material-by-design process for thermosets by incorporate data from molecular models.

Changwoon Jang↗

Linear and nonlinear mechanical properties of a series of epoxy resins

The linear viscoelastic properties have been measured for a series of bisphenol-A-based epoxy resins cured with the diamine DDS. The linear viscoelastic master curves were constructed via time-temperature superposition of frequency dependent G-prime and G-double-prime isotherms. The G-double-prime master curves exhibited two sub-Tg transitions. Superposition of isotherms in the glass-to-rubber transition (i.e., alpha) and the beta transition at -60 C was achieved by simple horizontal shifts in the log frequency axis; however, in the region between alpha and beta, superposition could not be effected by simple horizontal shifts along the log frequency axis. The different temperature dependency of the alpha and beta relaxation mechanisms causes a complex response of G-double-prime in the so called alpha-prime region. A novel numerical procedure has been developed to extract the complete relaxation spectra and its temperature dependence from the G-prime and G-double-prime isothermal data in the alpha-prime region.

Curliss, D. B.↗

Molecular Dynamics Investigation of the Structural and Mechanical Properties of Off-Stoichiometric Epoxy Resins

Molecular dynamic (MD) simulations were performed to compute the mechanical properties of off-stoichiometric epoxy resins as a function of hardener/epoxy mixture ratio (r). Properties were characterized in relation to their microscopic structures. Such resins have been used recently for adhesive-free bonding of large-scale composite structures using the co-curing-ply method. In this process, two partially precured composite panels with hardener-poor (HP) off-stoichiometric resins are coupled with ply(ies) of complementary hardener-rich (HR) formulations and then cured simultaneously. This bonding process has the potential to produce reliable and certifiable composite joints without the need for additional fasteners, which are often required for many conventional bonding methods because even small amounts of contamination can cause a weak bond. The reflow and mixing of the HP/HR resin in this bonding process result in a joint with no discernable interface that should not be susceptible to surface contamination. However, incomplete mixing of the two offset resins may result in chemical heterogeneity of the cured polymeric joint. Thus, different r values may be obtained across the joint. Classical MD simulations were performed to compute the Young’s modulus of polymers with different r values and correlate their properties to network structures. High stiffness was associated with molecular packing due to chemical crosslinking, leading to a single network structure. Moreover, the networks became denser as the ratio approached the stoichiometric value r = 1. Thus, the r = 1 systems were single clusters, with high stiffness, high molecular weight, and a high degree of crosslinking. Structural properties such as radius of gyration and mean square displacement were determined to investigate the variation in the stiffness with respect to r. This MD simulation study was validated with experimental measurements.

Chang Woon Jang↗

Tetraglycidyl epoxy resins and graphite fiber composites cured with flexibilized aromatic diamines

Studies were performed to synthesize new ether modified, flexibilized aromatic diamine hardeners for curing epoxy resins. The effect of moisture absorption on the glass transition temperatures of a tetraglycidyl epoxy, MY 720, cured with flexibilized hardeners and a conventional aromatic diamine was studied. Unidirectional composites, using epoxy-sized Celion 6000 graphite fiber as the reinforcement, were fabricated. The room temperature and 300 F mechanical properties of the composites, before and after moisture exposure, were determined. The Mode I interlaminar fracture toughness of the composites was characterized using a double cantilever beam technique to calculate the critical strain energy release rate.

Delvigs, P.↗

Properties of two composite materials made of toughened epoxy resin and high-strain graphite fiber

Results are presented from an experimental evaluation of IM7/8551-7 and IM6/18081, two new toughened epoxy resin, high strain graphite fiber composite materials. Data include ply-level strengths and moduli, notched tension and compression strengths and compression-after-impact assessments. The measured properties are compared with those of other graphite-epoxy materials.

Dow, Marvin B.↗

The stability of new transparent polymeric materials: The epoxy trimethoxyboroxine system. Part 1: The preparation, characterization and curing of epoxy resins and their copolymers

The effects of resin composition, curing conditions fillers, and flame retardant additives on the flammability of diglycidyl ether of bisphenol-A (DGEBA) as measured by the oxygen index is examined. The oxygen index of DGEBA cured with various curing agents was between 0.198 to 0.238. Fillers and flame retardant additives can increase the oxygen index dependent on the material and the amount used. Changes in the basic cured resin properties can be anticipated with the addition of noncompatible additives. High flame resistant epoxy resins with good stability and mechanical properties are investigated.

Pearce, E.↗

High performance, rapid thermal/UV curing epoxy resin for additive manufacturing of short and continuous carbon fiber epoxy composites

An additive manufacturing resin system includes a container; a build platform in the container; a build platform drive; an additive manufacturing resin that forms an additive manufacturing resin bath; an additive manufacturing print head; a build material supply connected to the additive manufacturing print head; an infill resin in the container, wherein the infill resin is supported by the additive manufacturing resin bath; a computer controller; and an extruded material that forms the product, wherein the infill resin at least partially surrounds the extruded material that forms the product. An infill resin supply provides the infill resin into the container and a control valve is connected to the infill resin supply. An IR light sensor is connected to the control valve and operatively connected to the infill resin in the container.

Lewicki, James↗

Molecular Dynamics Investigation of the Structural and Mechanical Properties of Off-Stoichiometric Epoxy Resins

We carried out molecular dynamics (MD) simulations to measure the mechanical properties of various off-stoichiometric polymers regarding amine to epoxy ratios (r) and to understand the stiffness of the polymers in terms of their structures. The aerospace-grade API-60 epoxy resin is used as an adhesive bond for assembling large-scale composite structures via the co-curing-ply bonding method. This method will produce a reliable and certifiable composite joint without additional fasteners. Calculated Young's modulus was measured from the uniaxial tension simulation with several high strain rates, and the experimental modulus was estimated by extrapolating the simulation results. We found that the stiffness was associated with molecular packing caused by chemical cross-linking. We also found that the number of network clusters gradually decreased as the ratio approached r = 1.0, which made the tighter cluster and the system much stiffer with an increase in the molecular weight and the degree of cross-linking. Structural properties such as Rg, MSD were measured to figure out the degree of stiffness with respect to the r.

Jang, Chang Woon↗

Dynamics and mechanism of cavitation erosion on perspex and epoxy resins tested in a rotating disk device

The cavitation erosion behavior including the initiation, dynamics and mechanism of damage process on perspex and epoxy resin specimens tested in a rotating disk device were discussed with respect to exposure time. The inception of erosion always took place at the location nearest to the center of rotation of the disk. Subsequently, as exposure time increased, erosion initiated at other locations as well. Light optical photographs and scanning electron micrographs clearly indicate that most of the material loss appears to occur form the networks of cracks due to their interaction and pits indicate particle debris. The optical degradation (loss of transmittance) on perspex was observed to be more on the rear side than on the front side.

Rao, P. V.↗

Thermal Expansion and Swelling of Cured Epoxy Resin Used in Graphite/Epoxy Composite

The thermal expansion and swelling of resin material as influenced by variations in temperature during moisture absorption is discussed. Comparison measurements using composites constructed of graphite fibers and each of two epoxy resin matrices are included. Polymer theory relative to these findings is discussed and modifications are proposed.

Adamson, M. J.↗

Curing agent for polyepoxides and epoxy resins and composites cured therewith

A curing for a polyepoxide is described which contains a divalent aryl radical such as phenylene a tetravalent aryl radical such as a tetravalent benzene radical. An epoxide is cured by admixture with the curing agent. The cured epoxy product retains the usual properties of cured epoxides and, in addition, has a higher char residue after burning, on the order of 45% by weight. The higher char residue is of value in preventing release to the atmosphere of carbon fibers from carbon fiber-epoxy resin composites in the event of burning of the composite.

Serafini, T. T.↗

Electron Beam Cured Epoxy Resin Composites for High Temperature Applications

Electron beam curing of Polymer Matrix Composites (PMC's) is a nonthermal, nonautoclave curing process that has been demonstrated to be a cost effective and advantageous alternative to conventional thermal curing. Advantages of electron beam curing include: reduced manufacturing costs; significantly reduced curing times; improvements in part quality and performance; reduced environmental and health concerns; and improvement in material handling. In 1994 a Cooperative Research and Development Agreement (CRADA), sponsored by the Department of Energy Defense Programs and 10 industrial partners, was established to advance the electron beam curing of PMC technology. Over the last several years a significant amount of effort within the CRADA has been devoted to the development and optimization of resin systems and PMCs that match the performance of thermal cured composites. This highly successful materials development effort has resulted in a board family of high performance, electron beam curable cationic epoxy resin systems possessing a wide range of excellent processing and property profiles. Hundreds of resin systems, both toughened and untoughened, offering unlimited formulation and processing flexibility have been developed and evaluated in the CRADA program.

Janke, Christopher J.↗

Latent Cure Epoxy Resins for Reliable Joints in Secondary-Bonded Composite Structures

In high-performance polymer matrix composite assemblies, adhesive bonding is generally superior to mechanical fastening in structural performance and manufacturing efficiency. However, adhesive bonds are susceptible to minute levels of contamination accumulated during assembly that can lead to unpredictable, weak bonds. Current methods of measuring bond strength are all destructive mechanical tests. To overcome these challenges, redundant load paths (e.g., mechanical fasteners) are often implemented in secondary-bonded, primary-structures, which can greatly reduce structural performance. This study investigated reformulated aerospace epoxy matrix resins with stoichiometric offset to inhibit cure of the matrix resin prior to assembly. Inhibited resins can reflow and mix across the joint interface, which eliminates the material discontinuity and forms a homogenous joint with reliable fracture properties. The goal of this study was to develop and demonstrate secondary composite assemblies that are mechanically and microscopically indistinguishable from a co-cured composite joint. This article describes the development of latent epoxy resins, the fabrication of test articles, and the mechanical properties measured from experimental joints compared with conventional, co-cured laminates. Methods of in-line quality control using and infrared spectroscopy and post-assembly forensics are also described. The final mode-II fracture toughness measured from precracked AERoBOND specimens was similar to that measured from co-cured laminates indicating that later cure epoxy materials could be a suitable replacement for secondary bonding.

Polymer-matrix composites (PMCs)↗

Epoxy Resins with Reduced Viscoelastic Relaxation

The payloads of current space launch systems, e.g. rockets, are constrained to a small size due to aerodynamic, weight, and cost limitations. Deployable structures allow for a folded or stowed configuration during launch and deployment at the mission location. Polymer composites have shown both high weight savings over current metallic structure, as well as improved specific mechanical strengths overall. One issue encountered with polymer composite deployables, however, is stress relaxation of the polymer matrix in the stowed configuration. In this study, a range of different epoxy formulations were evaluated as potential matrix resins for deployable composites. A new multifunctional epoxy resin with a fortifying additive is predicted to show 70% less stress relaxation after 1 year as compared to a state-of-the-art aerospace epoxy matrix.

Ray S. Peterson↗