Fluoride solid lubricants for extreme temperatures and corrosive environments
Fluoride solid lubricants for extreme temperature and corrosive environments
HIGH TEMPERATURE ENVIRONMENT↗
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Assessment of SOI AND Gate, Type CHT-7408, for Operation in Extreme Temperature Environments
Electronic parts based on silicon-on-insulator (SOI) technology are finding widespread applications due to their ability to operate in harsh environments and the benefits they offer as compared to their silicon counterparts. Due to their construction, they are tailored for high temperature operation and show good tolerance to radiation events. In addition, their inherent design lessens the formation of parasitic junctions, thereby reducing leakage currents, decreasing power consumption, and enhancing speed. These devices are typically rated in temperature capability from -55 C to about +225 C, and their characteristics over this temperature range are documented in data sheets. Since electronics in some of NASA space exploration missions are required to operate under extreme temperature conditions, both cold and hot, their characteristic behavior within the full temperature spectrum must be determined to establish suitability for use in space applications. The effects of extreme temperature exposure on the performance of a new commercial-off-the-shelf (COTS) SOI AND gate device were evaluated in this work. The high temperature, quad 2-inputs AND gate device, which was recently introduced by CISSOID, is fabricated using a CMOS SOI process. Some of the specifications of the CHT-7408 chip are listed in a table. By supplying a constant DC voltage to one gate input and a 10 kHz square wave into the other associated gate input, the chip was evaluated in terms of output response, output rise (t(sub r)) and fall times (tf), and propagation delays (using a 50% level between input and output during low to high (tPLH) and high to low (tPHL) transitions). The supply current of the gate circuit was also obtained. These parameters were recorded at various test temperatures between -195 C and +250 C using a Sun Systems environmental chamber programmed at a temperature rate of change of 10 C/min. In addition, the effects of thermal cycling on this chip were determined by exposing it to a total of 12 cycles between -195 C and +250 C. Following the cycling activity, measurements were performed again at the test temperatures of -195 C, +21 C, and +250 C.
Patterson, Richard↗
Extreme Temperature Electronics Using a Reconfigurable Analog Array
Temperature and radiation tolerant electronics, as well as long life survivability are key capabilities required for future NASA missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. Compensation techniques such as bias cancellation circuitry have also been employed. However, current technology can only ensure very limited lifetime in extreme environments. Previous work presented a novel approach, based on evolvable hardware technology, which allows adaptive in-situ circuit redesign/reconfiguration during operation in extreme environments. This technology would complement material/device advancements and increase the mission capability to survive harsh environments. This work describes a new reconfigurable analog chip developed by JPL and SPAWAR that is targeted for extreme temperature and evolutionary hardware experiments. Being based on Gm-C technology, this chip can have its functionality tuned and adapted to extreme temperatures through voltage bias adjustment. This tuning process will be controlled by Evolutionary Algorithms. This paper presents details of the reconfigurable analog chip as well as a system level overview. Some early experiments are also described.
evolvable hardware↗
Fault Tolerant Magnetic Bearing Testing and Conical Magnetic Bearing Development for Extreme Temperature Environments
During the six month tenure of the grant, activities included continued research of hydrostatic bearings as a viable backup-bearing solution for a magnetically levitated shaft system in extreme temperature environments (1000 F), developmental upgrades of the fault-tolerant magnetic bearing rig at the NASA Glenn Research Center, and assisting in the development of a conical magnetic bearing for extreme temperature environments, particularly turbomachinery. It leveraged work from the ongoing Smart Efficient Components (SEC) and the Turbine-Based Combined Cycle (TBCC) program at NASA Glenn Research Center. The effort was useful in providing technology for more efficient and powerful gas turbine engines.
Keith, Theo G., Jr.↗
Extreme-Temperature Carbon- and Ceramic-Matrix Composite Nozzle Extensions for Liquid Rocket Engines
The United States (US) National Aeronautics and Space Administration (NASA) and its US industry partners are developing extreme-temperature composite nozzle extensions for a variety of cryogenic liquid rocket engine propulsion systems. Applications under consideration at the NASA Marshall Space Flight Center (MSFC) include launch vehicle (upper stage), in-space, and lunar lander descent/ascent propulsion systems. Composite material systems of interest include carbon-carbon (C-C) and carbon/silicon-carbide (C-SiC) composites, as well as modified versions of such composites (coatings, mixed matrices, oxidation inhibitors, etc.). Missions addressed include access to low Earth orbit, the lunar surface, and more distant destinations. Cryogenic upper-stage and in-space liquid rocket engines are optimized for performance through the use of high area ratio nozzles to fully expand combustion gases to low exit pressures, increasing exhaust velocities. As a result of the large size of such nozzles, and the related engine performance requirements, composite nozzle extensions are being considered to reduce mass impacts. Currently, metallic and foreign composite nozzle extensions used on the Atlas V, Delta IV, Falcon 9, and Ariane 5 launch vehicles represent the state-of-the-art. Such extensions are limited to use at or slightly above 2000°F (1093°C). Materials under development by MSFC and its industry partners have the potential to operate at temperatures up to (or above) 4250°F (2343°C). Marshall Space Flight Center efforts are aimed at (a) further developing the technology and databases needed to enable the use of composite nozzle extensions on cryogenic liquid rocket engines, (b) developing and demonstrating low-cost capabilities for testing and qualifying such nozzle extensions, and (c) advancing the US domestic supply chain for nozzle extensions. Through the Small Business Innovation Research (SBIR) and Small Business Technology Transfer (STTR) Programs, low-level internal MSFC research projects, and teaming arrangements with domestic industry partners, composite material design, development, hot-fire test, and evaluation efforts are progressing. Hot- fire engine tests of subscale hardware have been conducted using oxygen/hydrogen (LOX/H2), oxygen/methane (LOX/CH4), and oxygen/kerosene (LOX/RP-1) propellants. These engine tests at MSFC have enabled the evaluation of both heritage and state-of-the-art material systems, demonstrating the initial capabilities of the extreme temperature materials and their fabrication methods. Recent, ongoing, and potential future work supporting cryogenic propulsion systems development will be presented. The composite nozzle extension technology and test capabilities being developed are intended to support both NASA and US Department of Defense requirements, as well as those of the broader Commercial Space industry.
Valentine, Peter G.↗
Operation of a Giant Magnetoresistive (GMR) Digital Isolator, Type IL510, Under Extreme Temperatures
A relatively new type of signal isolation based on Giant Magnetoresistive (GMR) technology was investigated for potential use in harsh temperature environments. Operational characteristics of the 2Mbps single channel, IL510-Series commercial-off-the-shelf (COTS) digital isolator chip was obtained under extreme temperature exposure and thermal cycling in the range of -190 C to +120 C. The isolator was evaluated in terms of its output signal delivery and stability, output rise (t(sub r)) and fall times (t(sub f)), and propagation delays at 50% level between input and output during low to high (t(sub PLH)) and high to low (t(sub PHL)) transitions. The device performed very well throughout the entire test temperature range as no significant changes occurred either in its function or in its output signal timing characteristics. The limited thermal cycling, which comprised of 12 cycles between -190 C and +120 C, also had no influence on its performance. In addition, the device packaging underwent no structural damage due to the extreme temperature exposure. These preliminary results indicate that this semiconductor chip has the potential for use in a temperature range that extends beyond its specified regime. Additional and more comprehensive testing, however, is required to establish its operation and reliability and to determine its suitability for long-term use in space exploration missions.
Patterson, Richard↗
Advanced Flip Chips in Extreme Temperature Environments
The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.
Ramesham, Rajeshuni↗
Extreme Temperature Requirements for Spacecraft Electronics Parts, Phase 1 Final Report
Study of extreme temperature requirements for spacecraft electronic piece-parts to be used as thermal design criteria for parts development
Hutchinson, T.↗
Performance of the THS4302 and the Class V Radiation-Tolerant THS4304-SP Silicon Germanium Wideband Amplifiers at Extreme Temperatures
This report discusses the performance of silicon germanium, wideband gain amplifiers under extreme temperatures. The investigated devices include Texas Instruments THS4304-SP and THS4302 amplifiers. Both chips are manufactured using the BiCom3 process based on silicon germanium technology along with silicon-on-insulator (SOI) buried oxide layers. The THS4304-SP device was chosen because it is a Class V radiation-tolerant (150 kRad, TID silicon), voltage-feedback operational amplifier designed for use in high-speed analog signal applications and is very desirable for NASA missions. It operates with a single 5 V power supply [1]. It comes in a 10-pin ceramic flatpack package, and it provides balanced inputs, low offset voltage and offset current, and high common mode rejection ratio. The fixed-gain THS4302 chip, which comes in a 16-pin leadless package, offers high bandwidth, high slew rate, low noise, and low distortion [2]. Such features have made the amplifier useful in a number of applications such as wideband signal processing, wireless transceivers, intermediate frequency (IF) amplifier, analog-to-digital converter (ADC) preamplifier, digital-to-analog converter (DAC) output buffer, measurement instrumentation, and medical and industrial imaging.
Patterson, Richard L.↗
Novel Lightweight Insulation Protects Fuel Tanks from Extreme Temperatures
Quest Thermal Group developed its integrated multi-layer insulation (IMLI) with funding from the NASA SBIR/STTR program. IMLI is high-performance insulation that protects spacecraft and cryogenic systems from extreme temperatures at a lighter weight than traditional MLI. IMLI performed successful flight demonstrations on NASA’s Robotic Refueling Mission 3 in 2018 and NASA’s Green Propellant Infusion Mission in partnership with large business Ball Aerospace in 2019, opening the door for additional opportunities with NASA and commercial customers.
SBIR/STTR↗
Non-linear relationships between daily temperature extremes and US agricultural yields uncovered by global gridded meteorological datasets
Global agricultural commodity markets are highly integrated among major producers. Prices are driven by aggregate supply rather than what happens in individual countries in isolation. Furthermore, estimating the effects of weather-induced shocks on production, trade patterns and prices hence requires a globally representative weather data set. Recently, two data sets that provide daily or hourly records, GMFD and ERA5-Land, became available. Starting with the US, a data rich region, we formally test whether these global data sets are as good as more fine-scaled country-specific data in explaining yields and whether they estimate similar response functions. While GMFD and ERA5-Land have lower predictive skill for US corn and soybeans yields than the fine-scaled PRISM data, they still correctly uncover the underlying non-linear temperature relationship. All specifications using daily temperature extremes under any of the weather data sets outperform models that use a quadratic in average temperature. Correctly capturing the effect of daily extremes has a larger effect than the choice of weather data. In a second step, focusing on Sub Saharan Africa, a data sparse region, we confirm that GMFD and ERA5-Land have superior predictive power to CRU, a global weather data set previously employed for modeling climate effects in the region.
54 ENVIRONMENTAL SCIENCES↗
Enhancing thermal resilience of US residential homes in hot humid climates during extreme temperature events
Increasing occurrences of extreme weather events such as winter storms and heat waves due to climate change pose enormous safety and health-related risks to people, particularly in economically disadvantaged communities. In this study, we investigate some of the most promising retrofittable and weatherization methods to keep the living zone of residential buildings within an acceptable safety level. We use hours of safety as the resilience metric, which is defined as the time taken by the building's indoor environment to reach a safety threshold temperature. We first identify various passive measures, such as adding extra insulation, improving air sealing, and integrating phase-change materials, which can operate without any external power during winter-storm and heat-wave events. We then employ a whole-building simulation tool to examine the impact of various combinations of retrofit measures and conduct a parametric study to determine the optimal solutions.
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
Apparatus for measurement of thermal conductivity of insulation systems subjected to extreme temperature differences
Advanced aerospace designs require thermal insulation systems which are consistent with cryogenic fluids, high thermal loads, and design restrictions such as weight and volume. To evaluate the thermal performance of these insulating systems, an apparatus capable of measuring thermal conductivity using extreme temperature differences (27 to 1100 K) is being developed. This system is described along with estimates of precision and accuracy in selected operating conditions. Preliminary data are presented.
Dube, W. P.↗
Self-Adaptive System based on Field Programmable Gate Array for Extreme Temperature Electronics
In this work, we report the implementation of a self-adaptive system using a field programmable gate array (FPGA) and data converters. The self-adaptive system can autonomously recover the lost functionality of a reconfigurable analog array (RAA) integrated circuit (IC) [3]. Both the RAA IC and the self-adaptive system are operating in extreme temperatures (from 120 C down to -180 C). The RAA IC consists of reconfigurable analog blocks interconnected by several switches and programmable by bias voltages. It implements filters/amplifiers with bandwidth up to 20 MHz. The self-adaptive system controls the RAA IC and is realized on Commercial-Off-The-Shelf (COTS) parts. It implements a basic compensation algorithm that corrects a RAA IC in less than a few milliseconds. Experimental results for the cold temperature environment (down to -180 C) demonstrate the feasibility of this approach.
adaptive hardwares↗
Flexible Diaphragm Withstands Extreme Temperatures
Diaphragm seal retains flexibility throughout temperature range of -200 to +600 degree F (-129 to +316 degree C). Diaphragm durable, simple, versatile, and relatively inexpensive to manufacture. Suitable for refrigeration seals, autoclaves, storage lockers, and other sealing applications subjected to extreme temperature differentials.
Lerma, G.↗
Climate Change: A New Metric to Measure Changes in the Frequency of Extreme Temperatures using Record Data
Consensus on global warming is the result of multiple and varying lines of evidence, and one key ramification is the increase in frequency of extreme climate events including record high temperatures. Here we develop a metric- called "record equivalent draws" (RED)-based on record high (low) temperature observations, and show that changes in RED approximate changes in the likelihood of extreme high (low) temperatures. Since we also show that this metric is independent of the specifics of the underlying temperature distributions, RED estimates can be aggregated across different climates to provide a genuinely global assessment of climate change. Using data on monthly average temperatures across the global landmass we find that the frequency of extreme high temperatures increased 10-fold between the first three decades of the last century (1900-1929) and the most recent decade (1999-2008). A more disaggregated analysis shows that the increase in frequency of extreme high temperatures is greater in the tropics than in higher latitudes, a pattern that is not indicated by changes in mean temperature. Our RED estimates also suggest concurrent increases in the frequency of both extreme high and extreme low temperatures during 2002-2008, a period when we observe a plateauing of global mean temperature. Using daily extreme temperature observations, we find that the frequency of extreme high temperatures is greater in the daily minimum temperature time-series compared to the daily maximum temperature time-series. There is no such observable difference in the frequency of extreme low temperatures between the daily minimum and daily maximum.
Munasinghe, L.↗
Qualification of Fiber Optic Cables for Martian Extreme Temperature Environments
Means have been developed for enabling fiber optic cables of the Laser Induced Breakdown Spectrometer instrument to survive ground operations plus the nominal 670 Martian conditions that include Martian summer and winter seasons. The purpose of this development was to validate the use of the rover external fiber optic cabling of ChemCam for space applications under the extreme thermal environments to be encountered during the Mars Science Laboratory (MSL) mission. Flight-representative fiber optic cables were subjected to extreme temperature thermal cycling of the same diurnal depth (or delta T) as expected in flight, but for three times the expected number of in-flight thermal cycles. The survivability of fiber optic cables was tested for 600 cumulative thermal cycles from -130 to +15 C to cover the winter season, and another 1,410 cumulative cycles from -105 to +40 C to cover the summer season. This test satisfies the required 3 times the design margin that is a total of 2,010 thermal cycles (670 x 3). This development test included functional optical transmission tests during the course of the test. Transmission of the fiber optic cables was performed prior to and after 1,288 thermal cycles and 2,010 thermal cycles. No significant changes in transmission were observed on either of the two representative fiber cables subject through the 3X MSL mission life that is 2,010 thermal cycles.
Ramesham, Rajeshuni↗
First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits
A separate submission to this conference reports that 4H-SiC Junction Field Effect Transistor (JFET) digital and analog Integrated Circuits (ICs) with two levels of metal interconnect have reproducibly demonstrated electrical operation at 500 C in excess of 1000 hours. While this progress expands the complexity and durability envelope of high temperature ICs, one important area for further technology maturation is the development of reasonably accurate and accessible computer-aided modeling and simulation tools for circuit design of these ICs. Towards this end, we report on development and verification of 25 C to 500 C SPICE simulation models of first order accuracy for this extreme-temperature durable 4H-SiC JFET IC technology. For maximum availability, the JFET IC modeling is implemented using the baseline-version SPICE NMOS LEVEL 1 model that is common to other variations of SPICE software and importantly includes the body-bias effect. The first-order accuracy of these device models is verified by direct comparison with measured experimental device characteristics.
JFET↗