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Results for “HEAT SINK”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1978

Study of heat sink thermal protection systems for hypersonic research aircraft

The feasibility of using a single metallic heat sink thermal protection system (TPS) over a projected flight test program for a hypersonic research vehicle was studied using transient thermal analyses and mission performance calculations. Four materials, aluminum, titanium, Lockalloy, and beryllium, as well as several combinations, were evaluated. Influence of trajectory parameters were considered on TPS and mission performance for both the clean vehicle configuration as well as with an experimental scramjet mounted. From this study it was concluded that a metallic heat sink TPS can be effectively employed for a hypersonic research airplane flight envelope which includes dash missions in excess of Mach 8 and 60 seconds of cruise at Mach numbers greater than 6. For best heat sink TPS match over the flight envelope, Lockalloy and titanium appear to be the most promising candidates

Vahl, W. A.↗
NASA NTRS1973

Ice Pack Heat Sink Subsystem - Phase I

This paper describes the design and test at one-g of a functional laboratory model (non-flight) Ice Pack Heat Sink Subsystem to be used eventually for astronaut cooling during manned space missions. In normal use, excess heat in the liquid cooling garment (LCG) coolant is transferred to a reusable/regenerable ice pack heat sink. For emergency operation, or for extension of extravehicular activity mission time after all the ice has melted, water from the ice pack is boiled to vacuum, thereby continuing to remove heat from the LCG coolant. This subsystem incorporates a quick connect/disconnect thermal interface between the ice pack heat sink and the subsystem heat exchanger.

Roebelen, G. J., Jr.↗
NASA NTRS1973

Ice pack heat sink subsystem - Phase 1, Volume 1

The design, development, fabrication, and test at one-g of a functional laboratory model (non-flight) ice pack heat sink subsystem to be used eventually for astronaut cooling during manned space missions are discussed. In normal use, excess heat in the liquid cooling garment (LCG) coolant is transferred to a reusable/regenerable ice pack heat sink. For emergency operation, or for extension of extravehicular activity mission time after all the ice has melted, water from the ice pack is boiled to vacuum, thereby continuing to remove heat from the LCG coolant. This subsystem incorporates a quick connect/disconnect thermal interface between the ice pack heat sink and the subsystem heat exchanger.

Roebelen, G. J., Jr.↗
NASA NTRSDate not supplied

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗
NASA NTRSDate not supplied

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗
NASA NTRS2011

Design Considerations for Fusible Heat Sink

Traditionally radiator designs are based off a passive or flow through design depending on vehicle requirements. For cyclical heat loads, a novel idea of combining a full flow through radiator to a phase change material is currently being investigated. The flow through radiator can be designed for an average heat load while the phase change material can be used as a source of supplemental heat rejections when vehicle heat loads go above the average load. Furthermore, by using water as the phase change material, harmful radiation protection can be provided to the crew. This paper discusses numerous trades conducted to understand the most optimal fusible heat sink design for a particular heat load. Trades include configuration concepts, amount of phase change needed for supplemental heat rejection, and the form of interstitial material needed for optimal performance. These trades were used to culminate to a fusible heat sink design. The paper will discuss design parameters taken into account to develop an engineering development unit.

Cognata, Thomas J.↗
DOE OSTI2022

Machine learning-based optimization of air-cooled heat sinks

Machine learning-based models using Artificial Neural Network (ANN) and greedy search algorithm are used to optimize air-cooled parallel plate-finned heat sinks (PPFHSs) subjected to laminar flow over an extensive range of design parameters. Here, the thermal and hydraulic performances of PPFHSs are represented by heat transfer coefficient (h) and pressure drop (ΔP), respectively. Optimization objectives for PPFHS designs can vary from industry to industry depending on their design priorities. The present study proposes a novel and generalized optimization method that defines practical optimization objectives and provides an accurate optimization process to design effective PPFHSs for a wide range of industrial applications with different design requirements. Three optimization objectives are presented in this study: (i) the largest h PΔ, (ii) the largest h within a specified maximum allowed flow rate, and (iii) the lowest weight that maximizes h for operation within the maximum allowed flow rate. While the shortcoming of the first objective is demonstrated, the other two objectives are found to be suitable for designing effective heat sinks (HSs) across different applications. Results suggest a promising trend from the third objective to develop HSs with ~ 37-68% lower weight, 80-85% reduced ΔP, and negligible penalty in h compared with optimized HSs obtained from the second objective. However, since the third objective leads to HSs with thinner fins, structural analysis should be performed to ensure reliable operation of the HSs.

42 ENGINEERING↗
NASA NTRS1968

Heat-load simulator for heat sink design

Heat-load simulator is fabricated from 1/4-inch aluminum plate with a contact surface equal in dimensions and configuration to those of the electronic installation. The method controls thermal output to simulate actual electronic component thermal output.

Dunleavy, A. M.↗
NASA NTRS2000

Heat Sink Welding for Preventing Hot Cracking in Alloy 2195 Intersection Welds: A Feasibility Study

Two concepts, stationary cooling and trailing cooling, were proposed to prevent weld intersection cracking. Finite element analysis was used to demonstrate the potential effectiveness of those two concepts. Both stationary and trailing heat sink setups were proposed for preventing intersection cracking. The cooling media could be liquid nitrogen, or pressured air knife. Welding experiments on the small test panel with the localized heat sink confirmed the feasibility of using such a stationary cooling technique. The required cooling was achieved in this test panel. Systematic welding experiments should be conducted in the future to validate and refine the heat sink technique for preventing intersection cracking.

Yang, Yu-Ping↗
NASA NTRS2019

Design and Test of a Structurally-Integrated Heat Sink for the Maxwell X-57 High Lift Motor Controller

An innovative thermal management solution was conceptualized, built and tested for the X57 Maxwell electric airplane. A combination of commercial CFD codes and bespoke thermal modeling tools were employed to rapidly develop a structurally-integral power electronics heat sink. A structurally-integrated heat sink was devised for the GIMC-SCEPTOR high lift motor controller. The nacelle-conforming sink is designed to dissipate heat from the power electronics assembly while simultaneously acting as the mechanical load path between the wing structure and high lift motor.

Edwards, Ryan↗
DOE OSTI2024

Double-sided cooling cold plates with overhanging heat sinks and through body busbar for high-power density power electronics

A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.

Zhou, Feng↗
NASA NTRS1992

Fusible heat sink materials - Evaluation of alternate candidates

Fusible heat sinks are a possible source for thermal regulation of space suited astronauts. Materials with greater thermal storage capability than water could enable both an extension of time between recharging and/or a reduction in size and/or mass. An extensive literature search identified 1,215 candidates with a solid-liquid transformation within the temperature range of -13 C to 5 C. Based on data available in the literature, several candidates with a cooling capacity significantly greater than water were identified. Measurements of the transformation temperature and enthalpy of transformation were then undertaken with a differential scanning calorimeter in order to confirm the accuracy of the literature. Laboratory measurements have thus far not been able to corroborate the extremely high values found from the literature. This paper presents the approach for materials selection utilized in this study, the experimental procedure, and the results of the measurements thus far undertaken.

Selvaduray, Guna S.↗
NASA NTRS1989

Forced air heat sink apparatus

A high efficiency forced air heat sink assembly employs a split feed transverse flow configuration to minimize the length of the air flow path through at least two separated fin structures. Different embodiments use different fin structure material configurations including honeycomb, corrugated and serpentine. Each such embodiment uses a thermally conductive plate having opposed exterior surfaces; one for receiving a component to be cooled and one for receiving the fin structures. The serpentine structured fin embodiment employs a plurality of fin supports extending from the plate and forming a plurality of channels for receiving the fin structures. A high thermal conductivity bondant, such as metal-filled epoxy, may be used to bond the fin structures to either the plate or the fin supports. Dip brazing and soldering may also be employed depending upon the materials selected.

Rippel, Wally E.↗
DOE OSTI2024

Exploration of Binder Jet Additive Manufacturing for Automotive Heat Sink Component Fabrication

ORNL (Contractor) and Magna Services of America Inc. (Participant) collaborated to determine the feasibility of binder jet additive manufacturing (BJAM) for the fabrication of copper components for automotive heat sink applications. This Phase 1 collaboration focused on printing copper heat sinks that rely on capillary effect to move fluids rather than mechanical pumps in electric vehicles to extend the battery range and life. Partial sintering of copper powders deposited via BJAM was hypothesized to aid capillary effect to improve the heat transfer. Further, BJAM offers the potential for scalability at a production level.

36 MATERIALS SCIENCE↗
NASA NTRS1991

Fusible heat sink materials - An identification of alternate candidates

Fusible heat sinks are a possible source for thermal regulation of space suited astronauts. An extensive database search was undertaken to identify candidate materials with liquid solid transformations over the temperature range of -18 C to 5 C; and 1215 candidates were identified. Based on available data, 59 candidate materials with thermal storage capability, DeltaH values higher than that of water were identified. This paper presents the methodology utilized in the study, including the decision process used for materials selection.

Selvaduray, Guna↗