Synthesis and thermal stability of benzimidazole aromatic imide copolymers
Polymer chemistry and thermal stability of benzimidazole aromatic imide copolymers
Kurosaki, T.↗
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Preparation and properties of imide-pyrrone copolymers
Imide-pyrrone copolymers preparation by solution polymerization, considering base/acid degradation resistance and thermal stability in air and vacuum
Bell, V. L.↗
A novel imide synthesis via silyl-blocked diamines
Efforts have resulted in the production of some trimethylsilyl-blocked diamines, which have been employed in a novel manner for the synthesis of polyimide model compounds. Three new silicon-containing diamides were prepared by reacting 1 mol of bis-/N, N prime-bis (trimethylsilyl) -4-aminophonyl/-disubstituted silanes with 2 mol of phthalic anhydride, thus establishing the reactivity of fully silylated diamides in imide formation.
Pratt, J. R.↗
Improved imide polymerization catalyst
Catalyzation of imide polymers with metallic salts of 2-ethyl hexanoic acid allows reaction in production of flame resistant foams to proceed in one step without formation of undesirable heat-sensitive byproducts.
Estrella, C. A.↗
Imide modified epoxy matrix resins
High char yield epoxy using novel bisimide amines (BIA's) as curing agents with a state of the art epoxy resin was developed. Stoichiometric quantities of the epoxy resin and the BIA's were studied to determine the cure cycle required for preparation of resin specimens. The bisimide cured epoxies were designated IME's (imide modified epoxy). The physical, thermal and mechanical properties of these novel resins were determined. The levels of moisture absorption exhibited by the bisimide amine cured expoxies (IME's) were considerably lower than the state of the art epoxies. The strain-to-failure of the control resin system was improved 25% by replacement of DDS with 6F-DDS. Each BIA containing resin exhibited twice the char yield of the control resin MY 720/DDS. Graphite fiber reinforced control (C) and IME resins were fabricated and characterized. Two of the composite systems showed superior properties compared to the other Celion 6000/IME composite systems and state of the art graphite epoxy systems. The two systems exhibited excellent wet shear and flexural strengths and moduli at 300 and 350 F.
Scola, D. A.↗
Improved Thermosetting Imide Resins
Modified resins have lower curing temperature. Imide monomers are chemically modified to lower cure temperature by 90 degrees, without compromising flame resistance of cured resins made from them.
Fohlen, G. M.↗
Characterization of geometric isomers of Norbornene end-capped imides
Three geometric isomers from the thermal isomerization of methylene-4,4' bis(endo-N-phenylbicyclo/2.2.1/hept-2-ene-5,6-di carboximide) (I) were chromatographically separated and isolated in order to investigate the thermal cure of norbornene end-capped imide oligomers, which display considerable promise for use in various aerospace adhesive and composite applications. Endo-endo (I), endo-exo (II), and exo-exo (III) configurations were assigned to each compound based on the results of NMR spectroscopy. Several chromatographic, spectroscopic, and thermal techniques were then used to characterize these three isomers which serve as model compounds for norbornene end-capped polyimides. It was found that each compound thermally isomerized to an equilibrium mixture of all three compounds prior to cure. It is proposed that these compounds react by different mechanisms in air and nitrogen.
Young, P. R.↗
Polyphenylene ethers with imide linking groups
Novel polyphenylene ethers with imide linking units are disclosed. These polymers incorporate the solvent and thermal resistance of polyimides and the processability of polyphenylene ethers. Improved physical properties over those of the prior art are obtained by incorporating meta linked ethers and/or polyphenylene oxides into the polymer backbone. A novel process for making polymers of this type is also disclosed. The process is unique in that the expected need of high process temperatures and/or special atmospheres are eliminated.
St.clair, T. L.↗
Solvent-Resistant, Thermally Stable Poly(Carbonate-Imides)
New polymers and copolymers based on polyimide backbone with carbonate moieties exhibit high temperature capability. Because of carbonate unit, many of these materials also exhibit high order or crystallinity. All of new imidecontaining polymers insensitive to acetone. New poly (carbonate-imide) exhibits significantly increased temperature resistance and shows less sensitivity to solvents than commercial polycarbonates.
St. Clair, T. L.↗
Imide modified epoxy matrix resins
The results of a program designed to develop tough imide modified epoxy resins cured by bisimide amine (BIA) hardeners are described. State-of-the-art epoxides MY720 and DER383 were used, and four bismide amines were evaluated. These were the BIA's derived from the 6F anhydride (4,4'-(hexafluoroisopropylidene) bis(phthalic anhydride) and the diamines 3,3'-diaminodiphynyl sulfone, 4,4'-oxygianiline, 4,4'-methylene dianiline, and 1,12-dodecane diamine. A key intermediate, designated 6F anhydride, is required for the synthesis of the bisimide amines. Reaction parameters to synthesize a precursor to the 6F anhydride (6FHC) in high yields were investigated. The catalyst trifluoromethane sulfonic acid was studied. Although small scale runs yielded the 6FHC in 50 percent yield, efforts to ranslate these results to a larger scale synthesis gave the 6FHC in only 9 percent yield. Results show that the concept of using bisimide amine as curing agents to improve the toughness properties of epoxies is valid.
Scola, D. A.↗
Synthesis and properties of copoly(carbonate imides)
Copoly(carbonate imides) with varying amounts of carbonate in the backbone were prepared by reacting 4,4-prime-diaminodiphenyl carbonate and 4,4-prime diaminodiphenyl ether with benzophenonetetracarboxylic acid dianhydride in dimethylacetamide at room temeprature. Homopolymers of the two diamines as well as of 3,4-prime- and 3,3-prime-diaminodiphenyl carbonate were prepared in a similar procedure and their properties compared with those of the copolymers.
Maudgal, S.↗
Initial adhesive screening of novel polyamide-imides and their copolymers
Continued interest by the research community in thermally stable, tough, high temperature adhesives has resulted in the investigation by Langley Research Center of two linear aromatic polyamide-imide (PAI) homopolymers and two linear aromatic PAI copolymers. The homopolymers were made with either 3,3'=DABA or 4,4'-DABA and BTDA. The two polymers were prepared with a monomer ratio of 0.75 DABP:0.25 DABA:1.00 BTDA. These aromatic PAIs possess high thermal stability because of intermolecular hydrogen bonding and chain stiffness. Lap shear strength (LSS) was the main criteria used to evaluate the polymers as adhesives. LSS of bonded Ti-6Al-4V was determined at room temperature (RT), 177, 204 and 232 C. The glass transition temperature and the type of bond failure were also determined. The best LSS values of the four adhesive systems investigated were obtained with the PAI copolymer identified in the report as LARC-TPI (25 percent 3,3'-DABA); however, it did not produce LSSs nearly as high as LARC-TPI. The poor flow properties observed appear to be due to a combination of high molecular weight and the increased interchain electronic interactions associated with the amide group.
Donald J Progar↗
Synthesis and characterization of BTDA-based polyamide-imides
Several thermally stable tough linear polyimides containing amide linkages were synthesized which have application as matrix resins in graphite reinforced structures. Isomers of diaminobenzanilide were reacted with 3,3-prime,4,4-prime-benzophenonetetracarboxylic dianhydride, and then thermally converted to the polyamide-imide. Polymers prepared from unsubstituted amide diamines and from N-substituted amide diamines exhibited high inherent viscosities and glass transition temperatures. The mechanical properties of these polymers were found to be superior to those of LARC-TPI.
Dezern, James F.↗
Initial evaluation of novel polyamide-imides and their copolymers as adhesives
Continued interest by the research community in thermally stable, tough, high temperature adhesives has resulted in the investigation by Langley Research Center of two linear aromatic polyamide-imide (PAI) homopolymers and two linear aromatic PAI copolymers. The homopolymers were made with either 3,3'=DABA or 4,4'-DABA and BTDA. The two polymers were prepared with a monomer ratio of 0.75 DABP:0.25 DABA:1.00 BTDA. These aromatic PAIs possess high thermal stability because of intermolecular hydrogen bonding and chain stiffness. Lap shear strength (LSS) was the main criteria used to evaluate the polymers as adhesives. LSS of bonded Ti-6Al-4V was determined at room temperature (RT), 177, 204 and 232 C. The glass transition temperature and the type of bond failure were also determined. The best LSS values of the four adhesive systems investigated were obtained with the PAI copolymer identified in the report as LARC-TPI (25 percent 3,3'-DABA); however, it did not produce LSSs nearly as high as LARC-TPI. The poor flow properties observed appear to be due to a combination of high molecular weight and the increased interchain electronic interactions associated with the amide group.
Progar, Donald J.↗
Copoly(imide-amides) containing hexafluoroisopropylidene
The incorporation of the hexafluoroisopropylidene (HFIP or 6F) group into polymer backbones brings about important and useful changes in properties. These differences include increased thermal and environmental resistance and solubility and decreased dielectric constant and color. Several types of backbones have been substrates for the inclusion of HFIP and all results have reflected impressive property benefits. This project involved the incorporation of 6F groups into a poly(imide-amide) backbone by the condensation of a 6F-containing dianhydride with 4-aminobenzoic acid to yield a diimide terminated with two carboxylic acid groups. This diacid trimer was then polymerized with various diamines. The polymers were obtained in yields of 86-94 percent and with viscosities of 0.90-2.26 dL/g. They were stable to above 500 C and clear, colorless films could be cast from DMAc.
Irvin, David J.↗
Langley Research Center - Soluble Imide (LaRC-SI)
This report is about experimenting and developing uses for the new thermal plastic developed by Dr. Robert Bryant called the 'Langley Research Center - Soluble Imide' (LaRC-SI). The three developments are: the use of the LaRC-SI as a dielectric for thin film sensors, as an adhesive to place diamonds on surfaces to increase thermal conductivity, and as an intermediate layer to allow the placement of metal on aluminum nitride. The LaRC-SI was developed by Dr. Robert G. Bryant, a chemical engineer at NASA Langley Research Center. The unique properties of this material is that it is an amorphous thermoplastic. This means that it can be reformed at elevated temperature and pressures. It can be applied in the form of a spray, spin, dip coating, paint, or spread with a doctors blade. The LaRC-SI has excellent adhesive and dielectric properties. It can also be recycled. Potential applications for this material are resin for mechanical parts such as gears, bearings and valves, advanced composites like carbon fiber, high strength adhesives, thin film circuits, and as a dielectric film for placing electrical components on conductive materials.
Stang, David↗
Adhesive Properties of Cured Phenylethynyl containing Imides
As part of a program to develop structural adhesives for high performance aerospace applications, several phenylethynyl containing oligomer blends of Larc(TM) MPEI and a reactive plasticizer designated LaRC LV-1 21 were prepared and evaluated. The fully imidized blends exhibited minimum melt viscosity as low as 1000 poise at 371 C. Ti/Ti lap shear specimens fabricated at 316 C under 15 psi gave RT strength of approx. 4300 psi and no change in strength was observed at 177 C. The chemistry and properties of this new MPEI as well as some blends of MPEI with LV-121 are presented and compared to the linear version, LARC(TM)-PETI-5.
Chang, Alice C.↗
P-V-T Properties of Polyimides and Model Imide Compounds
Aromatic polyimides are used as matrix resins in advanced composites, as high strength films, and as high-temperature adhesives, owing in part to their unusual thermal and chemical stability. The polyimides' desirable qualities of very high softening temperatures and negligibly small solubilities in and low permeabilities by most solvents have limited the kinds of fundamental studies that can be performed on these systems. Consequently, relationships between the molecular structure of polyimides and their bulk properties are not as well understood as might be expected given their widespread applications. In particular, the intermolecular forces in polyimides that play a critical role determining their densities, solubilities, viscosities, moduli, glass transitions, etc. are less well characterized for polyimides than for other widely used polymeric materials. The purpose of the present study is to obtain experimental data for establishing parameters that characterize the intermolecular forces in polyimides. We report here our studies on tractable low molecular-weight imides that contain the same structural features that are present in polyimide materials. We have measured equation-of-state properties and dipole moments for a variety of such systems in the liquid state. Both pure compounds and binary mixtures have been studied.
Orwoll, Robert A.↗