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At least 55 records · Page 3

Snapshot multispectral imaging using a diffractive optical network

Abstract Multispectral imaging has been used for numerous applications in e.g., environmental monitoring, aerospace, defense, and biomedicine. Here, we present a diffractive optical network-based multispectral imaging system trained using deep learning to create a virtual spectral filter array at the output image field-of-view. This diffractive multispectral imager performs spatially-coherent imaging over a large spectrum, and at the same time, routes a pre-determined set of spectral channels onto an array of pixels at the output plane, converting a monochrome focal-plane array or image sensor into a multispectral imaging device without any spectral filters or image recovery algorithms. Furthermore, the spectral responsivity of this diffractive multispectral imager is not sensitive to input polarization states. Through numerical simulations, we present different diffractive network designs that achieve snapshot multispectral imaging with 4, 9 and 16 unique spectral bands within the visible spectrum, based on passive spatially-structured diffractive surfaces, with a compact design that axially spans ~72 λ m , where λ m is the mean wavelength of the spectral band of interest. Moreover, we experimentally demonstrate a diffractive multispectral imager based on a 3D-printed diffractive network that creates at its output image plane a spatially repeating virtual spectral filter array with 2 × 2 = 4 unique bands at terahertz spectrum. Due to their compact form factor and computation-free, power-efficient and polarization-insensitive forward operation, diffractive multispectral imagers can be transformative for various imaging and sensing applications and be used at different parts of the electromagnetic spectrum where high-density and wide-area multispectral pixel arrays are not widely available.

36 MATERIALS SCIENCE↗

Handheld multi-sensor biometric imaging device and processing pipeline

A handheld biometric imaging device having an array of cameras configured to simultaneously capture face, iris and fingerprint biometrics of a subject. The device includes a plurality of visible-light cameras and a plurality of infrared-light cameras capable of being triggered simultaneously to obtain a plurality of images from which a 3D image of the light field can be constructed. The device includes a plurality of visible-light illuminators and a plurality of infrared-light illuminators that allow images of a subject to be captured under different lighting profiles. The device may include an onboard control system that is capable of reconstructing a face region, an iris region and a fingerprint region from the 3D light-field image, and then extract a corresponding face template, an iris template, and a fingerprint template from the respective reconstructed regions. The extracted face, iris, and fingerprint templates may be used for enrollment and/or comparison against a biometric-template database associated with one or more watchlists.

Bolme, David S.↗

In-process monitoring and prediction of droplet quality in droplet-on-demand liquid metal jetting additive manufacturing using machine learning

Abstract In droplet-on-demand liquid metal jetting (DoD-LMJ) additive manufacturing, complex physical interactions govern the droplet characteristics, such as size, velocity, and shape. These droplet characteristics, in turn, determine the functional quality of the printed parts. Hence, to ensure repeatable and reliable part quality it is necessary to monitor and control the droplet characteristics. Existing approaches for in-situ monitoring of droplet behavior in DoD-LMJ rely on high-speed imaging sensors. The resulting high volume of droplet images acquired is computationally demanding to analyze and hinders real-time control of the process. To overcome this challenge, the objective of this work is to use time series data acquired from an in-process millimeter-wave sensor for predicting the size, velocity, and shape characteristics of droplets in DoD-LMJ process. As opposed to high-speed imaging, this sensor produces data-efficient time series signatures that allows rapid, real-time process monitoring. We devise machine learning models that use the millimeter-wave sensor data to predict the droplet characteristics. Specifically, we developed multilayer perceptron-based non-linear autoregressive models to predict the size and velocity of droplets. Likewise, a supervised machine learning model was trained to classify the droplet shape using the frequency spectrum information contained in the millimeter-wave sensor signatures. High-speed imaging data served as ground truth for model training and validation. These models captured the droplet characteristics with a statistical fidelity exceeding 90%, and vastly outperformed conventional statistical modeling approaches. Thus, this work achieves a practically viable sensing approach for real-time quality monitoring of the DoD-LMJ process, in lieu of the existing data-intensive image-based techniques.

Gaikwad, Aniruddha (ORCID:0000000285642621)↗

High-resolution in-beam video rate imaging with the ClearXCam for synchrotron beamlines

The ClearXCam detector is a new video rate imaging in-beam monitor based on a diamond sensor. Imaging with 2304 effective pixels is achieved by sequentially biasing one of 48 metal stripes on one side of a diamond sensor, while reading out the current from 48 stripes on the other side of the sensor. This system was characterized for real-time X-ray beam diagnostics at synchrotron beam­line 17-BM at the National Synchrotron Light Source II. Significant results include: detection of in-beam structure via the imaging mode, beam focusing in one minute with real-time imaging feedback during a focusing event, linearity over five orders of magnitude, validation of a fast mode operating at 100 Hz, and sub-micron beam-positioning resolution. The system is now available commercially.

36 MATERIALS SCIENCE↗

Skipper-in-CMOS: Nondestructive Readout With Subelectron Noise Performance for Pixel Detectors

The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a ${15} \times {15}~\mu $ m2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of $0.15\text {e}^ - $ , demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

A 24-Channel Digitizer With a JESD204B-Compliant Serial Interface for High-Speed Detectors

In this report a 24-channel application-specific integrated circuit (ASIC) for the readout of high-speed CMOS active pixel sensors for charged particle detection is presented. The chip comprises 24 preamplifiers, 24 distinct 12-bit, 25 MSPS Pipelined analog-to-digital converters (ADCs) with self-calibration, an internal phase-locked loop (PLL), and a 3 Gbps serial interface that conforms to the JESD204B standard. To simplify interfacing with a variety of sensors, the ASIC also includes an automatic offset calibration loop. The high level of integration of the ASIC reduces overall system cost and area, and exploiting the signal characteristics of the image sensor allows the ADC to be optimized for reduced power dissipation. The use of an integrated serializer and an industry standard protocol simplifies integration of the ASIC into a complete camera system. The ASIC, called the High-Speed Image Preprocessor Targeted for Electron Readout, or HIPSTER, with a die area of 64.26 mm 2 , is packaged in a 480-ball grid array (BGA) and is fabricated in 180-nm CMOS technology. HIPSTER achieves typical differential nonlinearity (DNL) < 0.55 LSB, input-referred thermal noise of $114.5 μV-rms, and a bit error rate (BER) of better than 10-14. The power dissipation is 98 mW/channel.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

High-throughput terahertz imaging: progress and challenges

Abstract Many exciting terahertz imaging applications, such as non-destructive evaluation, biomedical diagnosis, and security screening, have been historically limited in practical usage due to the raster-scanning requirement of imaging systems, which impose very low imaging speeds. However, recent advancements in terahertz imaging systems have greatly increased the imaging throughput and brought the promising potential of terahertz radiation from research laboratories closer to real-world applications. Here, we review the development of terahertz imaging technologies from both hardware and computational imaging perspectives. We introduce and compare different types of hardware enabling frequency-domain and time-domain imaging using various thermal, photon, and field image sensor arrays. We discuss how different imaging hardware and computational imaging algorithms provide opportunities for capturing time-of-flight, spectroscopic, phase, and intensity image data at high throughputs. Furthermore, the new prospects and challenges for the development of future high-throughput terahertz imaging systems are briefly introduced.

36 MATERIALS SCIENCE↗

Monte Carlo Modeling and Design of Photon Energy Attenuation Layers for >10× Quantum Yield Enhancement in Si-Based Hard X-ray Detectors

High-energy (>20 keV) X-ray photon detection at high quantum yield, high spatial resolution, and short response time has long been an important area of study in physics. Scintillation is a prevalent method but limited in various ways. Directly detecting high-energy X-ray photons has been a challenge to this day, mainly due to low photon-to-photoelectron conversion efficiencies. Commercially available state-of-the-art Si direct detection products such as the Si charge-coupled device (CCD) are inefficient for >10 keV photons. Here, we present Monte Carlo simulation results and analyses to introduce a highly effective yet simple high-energy X-ray detection concept with significantly enhanced photon-to-electron conversion efficiencies composed of two layers: a top high-Z photon energy attenuation layer (PAL) and a bottom Si detector. We use the principle of photon energy down conversion, where high-energy X-ray photon energies are attenuated down to ≤10 keV via inelastic scattering suitable for efficient photoelectric absorption by Si. Our Monte Carlo simulation results demonstrate that a 10–30× increase in quantum yield can be achieved using PbTe PAL on Si, potentially advancing high-resolution, high-efficiency X-ray detection using PAL-enhanced Si CMOS image sensors.

47 OTHER INSTRUMENTATION↗

Anti-distortion bioinspired camera with an inhomogeneous photo-pixel array

The bioinspired camera, comprising a single lens and a curved image sensor—a photodiode array on a curved surface—, was born of flexible electronics. Its economical build lends itself well to space-constrained machine vision applications. The curved sensor, much akin to the retina, helps image focusing, but the curvature also creates a problem of image distortion, which can undermine machine vision tasks such as object recognition. Here we report an anti-distortion single-lens camera, where 4096 silicon photodiodes arrayed on a curved surface in a nonuniform pattern assimilated to the distorting optics are the key to anti-distortion engineering. That is, the photo-pixel distribution pattern itself is warped in the same manner as images are warped, which correctively reverses distortion. Acquired images feature no appreciable distortion across a 120° horizontal view, as confirmed by their neural-network recognition accuracies. This distortion correction via photo-pixel array reconfiguration is a form of in-sensor computing.

77 NANOSCIENCE AND NANOTECHNOLOGY↗

Design of the high-yield time-gated x-ray hot-spot imager for OMEGA

Time-resolved x-ray self-emission imaging of hot spots in inertial confinement fusion experiments along several lines of sight provides critical information on the pressure and the transient morphology of the hot spot on the University of Rochester’s OMEGA Laser System. At least three quasi-orthogonal lines of sight are required to infer the tomographic information of the hot spots of deuterium–tritium cryogenic layered implosions. OMEGA currently has two time-gated x-ray hot-spot imagers: the time-resolved Kirkpatrick–Baez x-ray microscope and the single-line-of-sight, time-resolved x-ray imager (SLOS-TRXI). The time-gated x-ray hot-spot imager (XRHSI) is being developed for use on OMEGA as the third line of sight for the high-yield operation of up to 4 × 10 14 neutrons. XRHSI follows the SLOS-TRXI concept; however, it will have improved spatial and temporal resolutions of 5 μm and 20 ps, respectively. The simultaneous operation of the three instruments will provide 3-D reconstructions of the assembled hot-spot fuel at various times through peak thermonuclear output. The technical approach consists of a pinhole array imager and demagnifying time-dilation drift tube that are coupled to two side-by-side hybrid complementary metal–oxide semiconductor (hCMOS) image sensors. To minimize the background and to harden the diagnostics, an angled drift-tube assembly shifting the hCMOS sensors out of the direct line of sight and neutron shielding will be applied. As a result, the technical design space for the instrument will be discussed and the conceptual design will be presented.

47 OTHER INSTRUMENTATION↗

Detector thickness effects on nanosecond-gated imager response

Hybrid CMOS multi-frame imagers with exposure times down to ~2 ns have made significant impacts in high energy density physics and inertial confinement fusion research. The detector thickness is a key parameter in both detector quantum efficiency and temporal response. The Icarus hybrid CMOS imager has been fabricated with Si detector thicknesses of 8, 25, and 100 µm. The temporal response of imaging sensors with exposure time down to 2 ns has been examined and compared to directly measured photodiode current. The 100-μm thick variant displays extended features related to charge carrier collection and is more susceptible to field collapse. Here, we also demonstrate charge collection time effects on spatial response.

47 OTHER INSTRUMENTATION↗

Light-powered end-to-end neutron detection and imaging with an edge-deployed optical AI chip

Neutron detection is widely used in many applications including nuclear physics, nuclear energy, nuclear technologies and nuclear safeguards. Developing an end-to-end neutron detection and imaging workflow paves way towards fully automated processes for many applications. We implemented an automated workflow for neutron detection experiments which use a solid state image sensor to capture neutron hits as a digital image. We deploy the workflow to an edge-based optical neural network (ONN) to increase the radiation-hardness and lifetime of neutron detection instruments. We present a two-stage neural network framework for detection of neutrons at sub-pixel resolution. The first stage uses a region proposal network to efficiently detect and extract neutron hits from the input camera image. The second stage feeds the extracted hits into a fully connected neural network to predict the sub-pixel hit position. The performance of the two-stage framework is evaluated using the edge-based ONN. The results show that we can achieve above 96% neutron detection accuracy as well as sub-pixel and sub-micron position resolution, while enjoying the advantages of the ONN hardware including radiation-hardness, low energy consumption and high computing speed for integrated edge camera and hardware deployment, when compared with electronic counterparts.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Optics-Free Chip-Scale Intraoperative Imaging Using NIR-Excited Upconverting Nanoparticles

Here we present an optics-free CMOS image sensor that incorporates a novel time-gated dual-photodiode pixel design to allow filter- and lens-less image acquisition of near-infrared-excited (NIR-excited) upconverting nanoparticles. Recent biomedical advances have highlighted the benefits of NIR excitation, but NIR interaction with silicon has remained a challenge, even with high-performance optical blocking filters. Using a secondary diode and a dual-photodiode design, this sensor is able to remove the 100s of mV of NIR background on pixels and bring it down to single-digit mV level, nearing its noise floor of 2.2 mV rms, not achievable with any optical filter. Non-linear effects of background cancellation using the diode pair has been mitigated using an initial one-time pixel-level curve fitting and calibration in a post-processing setting. This imager comprises a highly linear 11 fF metal-oxide-metal (MOM) capacitor and includes integrated angle-selective gratings to reject oblique light and enhance sharpness. Each pixel also includes two distinct correlated double sampling schemes, to remove low frequency flicker noise and systematic offset in the datapath. We demonstrate the performance of this imager using pulsed NIR-excited upconverting nanoparticles on standard United-States-Air-Force (USAF) resolution targets and achieve an SNR of 15 dB, while keeping NIR background below 6 mV. This 36-by-80-pixel array measures only 2.3 mm by 4.8 mm and can be thinned down to 25 µm, allowing it to become surgically compatible with intraoperative instruments and equipment, while remaining optics-free.

42 ENGINEERING↗

NWB Sensors Infrared Cloud Imager Data Products from SGP

NWB Sensors is a company which has developed a commercially available Infrared Cloud Imager (ICI). For more information, consult the company's webpage, https://www.nwbsensors.com/infrared-cloud-imager. To validate the radiometric accuracy of the ICI, NWB Sensors deployed it to the ARM SGP User Facility in 2023. The primary motivation of this deployment was to perform an intercomparison between the ICI and the Atmospheric Emitted Radiance Interferometer (AERI). The AERI spectral radiance data product can be integrated across the response function of the ICI and directly compared to the zenith radiance observed by the ICI. In addition, the ICI uses proprietary models of the downwelling clear-sky radiance in its cloud processing algorithms. They are based on surface meteorology and precipitable water vapor (PWV). These models were validated by comparing their predicted radiances to those derived from radiative transfer models of the ARM radiosondes. Finally, PWV observations derived from the ICI's onboard GNSS-based PWV retrieval system were compared against those from the microwave radiometer. This dataset contains the ICI radiance and cloud data products.

Atmosphere↗

Event-to-Video Conversion for Overhead Object Detection

Collecting overhead imagery using an event camera is desirable due to the energy efficiency of the image sensor compared to standard cameras. However, event cameras complicate downstream image processing, especially for complex tasks such as object detection. In this paper, we investigate the viability of event streams for overhead object detection. We demonstrate that across a number of standard modeling approaches, there is a significant gap in performance between dense event representations and corresponding RGB frames. We establish that this gap is, in part, due to a lack of overlap between the event representations and the pre-training data that the object detectors were initially trained on through a number of experiments. Then, apply an off-the-shelf event-to-video conversion tool that converts event streams into gray-scale video to close this gap. We demonstrate that this approach results in a large performance increase, outperforming even event-specific object detection techniques on our overhead target task. These results suggest that better aligning event representations with existing large pre-trained models may result in greater short-term performance gains compared to end-to-end event-specific architectural improvements.

machine learning (ML), computer vision, Neuromorph↗

Super resolution for magneto-optical microscopy

Sub-diffraction limited magneto-optical microscopy, such as Kerr or Faraday effect microscopy, provide many advantages to fields of science and technology for measuring, or imaging, the magnetization structures and magnetization domains of materials. Disclosed is a method and system for performing sub-diffraction limited magneto-optic microscopy. The method includes positioning a microlens or microlens layer relative to a surface of a sample to image the surface of the sample, forming a photonic nanojet to probe the surface of the sample, and receiving light reflected by the surface of the sample or transmitted through the sample at an imaging sensor. The methods and associated systems and devices enable sub-diffraction limited imaging of magnetic domains at resolutions 2 to 8 times the classical diffraction limit.

te Velthuis, Suzanne Gabriëlle Everdine↗

Artificial illumination identification from an unmanned aerial vehicle

Artificial illumination identification within images is a useful tool for many applications. Performing such identification allows for an estimation of the illumination source spectrum, which in turn can be used for additional applications ranging from spectral detection and exploitation to statistics about nighttime light usage. Illumination identification has been performed in laboratory settings but not from an unmanned aerial vehicle (UAV) platform. Here, we test the feasibility of using a UAV and commercial off-the-shelf multispectral imaging sensor to perform such artificial illumination identification through linear discriminant analysis using nighttime UAV images. The results are very promising, showing source classification accuracies of 83.3%, 92.3%, 100%, and 100% for the incandescent, light-emitting diode, high pressure sodium, and metal halide illumination sources, respectively. We show that the information gained from the source identification can be further used to inform additional analysis, such as spectral identification. The high resolution of UAV imaging techniques combined with the knowledge of the illumination source can lead to better exploitation of such nighttime data for many applications.

42 ENGINEERING↗

LumaCam: a novel class of position-sensitive event mode particle detectors using scintillator screens

A new type of position-sensitive detectors is gaining attention in the neutron community. They are scintillator based detectors that detect the scintillation light on an individual photon basis via an image intensifier and a fast image sensor. Their readout operates in event mode i.e. it produces information about individual neutron interactions, reconstructed from the sensor data, thus enabling to achieve superior spatial and temporal resolutions compared to regular detectors. Although the development of current detectors is focused on neutrons, the concept is also applicable to the detection of other particles such as high-energy photons. This document provides a description on how these detectors are built, how they operate, and what their characteristics are. An example of a detector implementation based on a Timepix3 chip is described to illustrate the detector concept. This includes a detailed description of the algorithm that reconstructs the neutron interactions from the sensor data, one of the core components that sets it apart from established scintillator-based imaging detectors. Energy-resolved epithermal neutron radiography was performed at the ISIS EMMA beamline with this detector, illustrating some of the fundamental differences in the data that can be produced with the new type of detector compared to more established types of scintillator based neutron detectors. The term LumaCam is proposed to refer to this new class of position-sensitive event-mode detectors.

47 OTHER INSTRUMENTATION↗