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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS2008

Miniature, Lightweight, One-Time-Opening Valve

The figure depicts the main parts of a prototype miniature, lightweight, onetime- opening valve. Like some other miniature one-time-opening valves reported in previous issues of NASA Tech Briefs, this valve is opened by melting a material that blocks the flow path. This valve is designed to remain closed at some temperature between room temperature and cryogenic temperature until the time of opening. The prototype valve includes a 1/8-in. (3-mm) aluminum tube, one end of which is plugged with a solder comprising about 37 weight percent of lead and 63 weight percent of tin. The tube and the solder both have a coefficient of thermal expansion of 23 micron/m-K at room temperature. Before plugging, the interior surface of the plug end of the tube is cleaned with a commercial flux paste developed specifically for preparing aluminum for bonding with lead/tin solder. The solder is then melted into the cleaned end of the tube, forming the plug. In a test, the plugged tube was pressurized to 1,000 psi (6.9 MPa) with helium and leak-tested. It was then cooled to a temperature of 77 K (about 196 C) and again leak-tested at the same pressure. Finally, at a lower pressure, the plugged end of the tube was heated to about 200 C (the melting temperature of the solder is 183 C), causing the solder plug to be ejected (see figure). It has been estimated that in a subsequent version of the valve, the plug could be melted by electrical heating, using a nichrome wire having a mass of only 10 g.

Jones, Jack↗
NASA NTRS2011

Payload and Components Real-Time Automated Test System (PACRATS), Data Acquisition of Leak Rate and Pressure Data Test Procedure

The purpose of this activity is to provide the Mechanical Components Test Facility (MCTF) with the capability to obtain electronic leak test and proof pressure data, Payload and Components Real-time Automated Test System (PACRATS) data acquisition software will be utilized to display real-time data. It will record leak rates and pressure/vacuum level(s) simultaneously. This added functionality will provide electronic leak test and pressure data at specified sampling frequencies. Electronically stored data will provide ES61 with increased data security, analysis, and accuracy. The tasks performed in this procedure are to verify PACRATS only, and are not intended to provide verifications for MCTF equipment.

Rinehart, Maegan L.↗
NASA NTRS2013

Hermetic Seal Designs for Sample Return Sample Tubes

Prototypes have been developed of potential hermetic sample sealing techniques for encapsulating samples in a ≈1-cm-diameter thin-walled sample tube that are compatible with IMSAH (Integrated Mars Sample Acquisition and Handling) architecture. Techniques include a heat-activated, finned, shape memory alloy plug; a contracting shape memory alloy activated cap; an expanding shape memory alloy plug; and an expanding torque plug. Initial helium leak testing of the shape memory alloy cap and finned shape memory alloy plug seals showed hermetic- seal capability compared against an industry standard of <1×10-8 atm-cc/s He. These tests were run on both clean tubes and dirty tubes dipped in MMS (Mojave Mars Simulant). The leak tests were also performed after thermal cycling between -135 and +55 ºC to ensure seal integrity after Martian diurnal cycles. Developmental testing is currently being done on the expanding torque plug, and expanding shape memory alloy plug seal designs. The finned shape memory alloy (SMA) plug currently shows hermetic sealing capability based on preliminary tests.

Younse, Paulo J.↗
NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗
NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗
NASA NTRS1979

Initial evaluation tests of General Electric Company 12.0 ampere hour nickel cadmium spacecraft cells with design variables

All evaluation tests were performed at room ambient pressure and temperature, with discharges at a 2 hour rate. Tests consisted of phenolphthalein leak tests, three capacity tests, an auxiliary electrode test, a charge retention test, an internal short test, a charge efficiency test, overcharge tests, and a pressure versus capacity test. Results of the tests and recommendations for improvements in manufacturing are presented.

Harkness, J. D.↗
NASA NTRS1988

Bayonet for superfluid helium transfer in space

A prototype superfluid helium bayonet for potential space applications has been developed and evaluated with a low heat leak test apparatus. Measured heat leak of the 13 mm (1/2 inch) bayonet pair is 0.21 W at 1.8 K with an uncertainty of +0.09/-0.05 W. Bayonets are fabricated with thin, electron beam (EB) welded tubes which are EB welded to machined nose and flange pieces. Low heat leak structural integrity is provided by a 0.9 mm thickness of filament wound fiberglass-epoxy. Superfluid creep is restricted by KEL-F nose seals which form vacuum-tight extensions to the bayonet cold end pieces.

Mcintosh, G. E.↗
NASA NTRSDate not supplied

Coolant Leak from ISS External Active Thermal Control System (EATCS) – An Examination of Most Probable

The Port (P1) and Starboard (S1) External Active Thermal Control Systems (EATCS) are single phase, mechanically pumped ammonia loops that operate independently to cool the majority of the hardware and payloads onboard the International Space Station (ISS). A slow ammonia leak was detected using pressure and quantity telemetry five years after the P1 EATCS was activated. The leak gradually accelerated to a rate that locating and isolating the leak became imperative to maintain cooling capability. Partial pressure measurements from the Robotic External Leak Locator (RELL) scan surveys narrowed the search to the supply and return jumpers connecting one of three radiators to the system. Subsequently, the ISS crew performed high definition video surveys during an Extravehicular Activity (EVA), or spacewalk, and ammonia flakes were observed projecting from the jumpers. Thus, the ground teams were confident that the culprit for the ammonia leak was the jumpers. The ammonia leak stopped after ground teams remotely isolated and vented those jumpers and associated radiator. Both jumpers were removed and returned to the ground, and a root cause investigation was conducted. A calibrated leak test determined the bulk of the ammonia leaked through a pair of seals in a Quick Disconnect (QD), or connector, on one end of the return jumper. The return jumper QD was dissected, visually inspected, chemically tested and evaluated. The results indicated the most probable cause of the accelerating ammonia leak was due to defective seals, plating delamination underneath the seals, and on-orbit thermal cycles exacerbating the delamination. Both jumpers were refurbished, relaunched to the ISS, and scheduled to be reinstalled during an EVA in 2022. It appeared the issue was unique, but recently the S1 EATCS is showing signs of an accelerating ammonia leak, and RELL scans narrowed the source to a similar pair of radiator jumpers.

Thermal Control↗
NASA NTRSDate not supplied

Coolant Leak from ISS External Active Thermal Control System (EATCS) – An Examination of Most Probable

The Port (P1) and Starboard (S1) External Active Thermal Control Systems (EATCS) are single phase, mechanically pumped ammonia loops that operate independently to cool majority of the hardware and payloads onboard the International Space Station (ISS). A slow ammonia leak was detected using pressure and quantity telemetry five years after the P1 EATCS was activated. The leak gradually accelerated to a rate that locating and isolating the leak became imperative to maintain cooling capability. Partial pressure measurements from the Robotic External Leak Locator (RELL) scan surveys narrowed the search to the supply and return jumpers connecting one of three radiators to the system. Subsequently, the ISS crew performed high definition video surveys during an Extravehicular Activity (EVA), or spacewalk, and ammonia flakes were observed projecting from the jumpers. Thus, the ground teams were confident that the culprit of the ammonia leak were the jumpers. The ammonia leak stopped after ground teams remotely isolated and vented those jumpers and associated radiator. Both jumpers were removed and returned to the ground, and a root cause investigation was conducted. A calibrated leak test determined the bulk of the ammonia leaked through a pair of seals in a Quick Disconnect (QD), or connector, on one end of the return jumper. The return jumper QD was dissected, visually inspected, chemically tested and evaluated. The results indicated the most probable cause of the accelerating ammonia leak was due to defective seals, plating delamination underneath the seals, and on-orbit thermal cycles exacerbating the delamination. Both jumpers were refurbished, relaunched to the ISS, and scheduled to be reinstalled during an EVA in 2022. It appeared the issue was unique, but recently the S1 EATCS is showing signs of an accelerating ammonia leak, and RELL scans narrowed the source to a similar pair of radiator jumpers.

Thermal Control↗
NASA NTRSDate not supplied

Coolant Leak from ISS External Active Thermal Control System (EATCS) – An Examination of Most Probable

The Port (P1) and Starboard (S1) External Active Thermal Control Systems (EATCS) are single phase, mechanically pumped ammonia loops that operate independently to cool majority of the hardware and payloads onboard the International Space Station (ISS). A slow ammonia leak was detected using pressure and quantity telemetry five years after the P1 EATCS was activated. The leak gradually accelerated to a rate that locating and isolating the leak became imperative to maintain cooling capability. Partial pressure measurements from the Robotic External Leak Locator (RELL) scan surveys narrowed the search to the supply and return jumpers connecting one of three radiators to the system. Subsequently, the ISS crew performed high-definition video surveys during an Extravehicular Activity (EVA), or spacewalk, and ammonia flakes were observed projecting from the jumpers. Thus, the ground teams were confident that the culprit of the ammonia leak were the jumpers. The ammonia leak stopped after ground teams remotely isolated and vented those jumpers and associated radiator. Both jumpers were removed and returned to the ground, and a root cause investigation was conducted. A calibrated leak test determined the bulk of the ammonia leaked through a pair of seals in a Quick Disconnect (QD), or connector, on one end of the return jumper. The return jumper QD was dissected, visually inspected, chemically tested and evaluated. The results indicated the most probable cause of the accelerating ammonia leak was due to defective seals, plating delamination underneath the seals, and on-orbit thermal cycles exacerbating the delamination. Both jumpers were refurbished, relaunched to the ISS, and scheduled to be reinstalled during an EVA in 2022. It appeared the issue was unique, but recently the S1 EATCS is showing signs of an accelerating ammonia leak, and RELL scans narrowed the source to a similar pair of radiator jumpers.

Darnell Cowan↗
NASA NTRS1978

Initial evaluation tests of Eagle-Picher Industries 9.0 ampere-hour nickel-cadmium spacecraft cells for the heat capacity mapping mission satellite and the stratospheric aerosol and gas experiment satellite

The results of tests to insure that all cells put into the life cycle program are of high quality are reported. The tests consisted of the following: phenolptalein leak tests, internal short test, charge efficiency test, and overcharge tests. The results of tests for 10 cells are tabulated.

Harkness, J. D.↗
NASA NTRS1983

Hermetic edge sealing of photovoltaic modules

The edge sealing technique is accomplished by a combination of a chemical bond between glass and aluminum, formed by electrostatic bonding, and a metallurgical bond between aluminum and aluminum, formed by ultrasonic welding. Such a glass to metal seal promises to provide a low cost, long lifetime, highly effective hermetic seal which can protect module components from severe environments. Development of the sealing techniques and demonstration of their effectiveness by fabricating a small number of dummy modules, up to eight inches square in size, and testing them for hermeticity using helium leak testing methods are reviewed. Non-destructive test methods are investigated.

Source record↗
NASA NTRS2009

Effects of Hypervelocity Impacts on Silicone Elastomer Seals and Mating Aluminum Surfaces

While in space silicone based elastomer seals planned for use on NASA's Crew Exploration Vehicle (CEV) are exposed to threats from micrometeoroids and orbital debris (MMOD). An understanding of these threats is required to assess risks to the crew, the CEV orbiter, and missions. An Earth based campaign of hypervelocity impacts on small scale seal rings has been done to help estimate MMOD threats to the primary docking seal being developed for the Low Impact Docking System (LIDS). LIDS is being developed to enable the CEV to dock to the ISS (International Space Station) or to Altair (NASA's next lunar lander). The silicone seal on LIDS seals against aluminum alloy flanges on ISS or Altair. Since the integrity of a seal depends on both sealing surfaces, aluminum targets were also impacted. The variables considered in this study included projectile mass, density, speed, incidence angle, seal materials, and target surface treatments and coatings. Most of the impacts used a velocity near 8 km/s and spherical aluminum projectiles (density = 2.7 g/cubic centimeter), however, a few tests were done near 5.6 km/s. Tests were also performed using projectile densities of 7.7, 2.79, 2.5 or 1.14 g/cubic centimeter. Projectile incidence angles examined included 0 degrees, 45 degrees , and 60 degrees from normal to the plane of the target. Elastomer compounds impacted include Parker's S0383-70 and Esterline's ELA-SA-401 in the as received condition, or after an atomic oxygen treatment. Bare, anodized and nickel coated aluminum targets were tested simulating the candidate mating seal surface materials. After impact, seals and aluminum plates were leak tested: damaged seals were tested against an undamaged aluminum plate; and undamaged seals were placed at various locations over craters in aluminum plates. It has been shown that silicone elastomer seals can withstand an impressive level of damage before leaking beyond allowable limits. In general on the tests performed to date, the diameter of the crater in either the elastomer, or the aluminum, must be at least as big as 80% to 90% of width of the bulb of the seal before significant leakage occurs.

deGroh, Henry C., III↗
NASA NTRS2009

Effects of Hypervelocity Impacts on Silicone Elastomer Seals and Mating Aluminum Surfaces

While in space silicone based elastomer seals planned for use on NASA's Crew Exploration Vehicle (CEV) are exposed to threats from micrometeoroids and orbital debris (MMOD). An understanding of these threats is required to assess risks to the crew, the CEV orbiter, and missions. An Earth based campaign of hypervelocity impacts on small scale seal rings has been done to help estimate MMOD threats to the primary docking seal being developed for the Low Impact Docking System (LIDS). LIDS is being developed to enable the CEV to dock to the ISS (International Space Station) or to Altair (NASA's next lunar lander). The silicone seal on LIDS seals against aluminum alloy flanges on ISS or Altair. Since the integrity of a seal depends on both sealing surfaces, aluminum targets were also impacted. The variables considered in this study included projectile mass, density, speed, incidence angle, seal materials, and target surface treatments and coatings. Most of the impacts used a velocity near 8 km/s and spherical aluminum projectiles (density = 2.7 g/cubic cm), however, a few tests were done near 5.6 km/s. Tests were also performed using projectile densities of 7.7, 2.79, 2.5 or 1.14 g/cubic cm. Projectile incidence angles examined included 0 deg, 45 deg, and 60 deg from normal to the plane of the target. Elastomer compounds impacted include Parker's S0383-70 and Esterline's ELA-SA-401 in the as received condition, or after an atomic oxygen treatment. Bare, anodized and nickel coated aluminum targets were tested simulating the candidate mating seal surface materials. After impact, seals and aluminum plates were leak tested: damaged seals were tested against an undamaged aluminum plate; and undamaged seals were placed at various locations over craters in aluminum plates. It has been shown that silicone elastomer seals can withstand an impressive level of damage before leaking beyond allowable limits. In general on the tests performed to date, the diameter of the crater in either the elastomer, or the aluminum, must be at least as big as 80% to 90% of width of the bulb of the seal before significant leakage occurs.

deGroh, Henry C., III↗
NASA NTRS1966

Expandable rubber plug seals openings for pressure testing

Plug assembly seals openings in piping systems, vessels, and chambers for low pressure leak testing. The assembly, which consists of a rubber sealing plug and the mechanism for expanding it into a pressure-tight configuration, adequately seals irregular diameters without damage to mating surfaces.

Source record↗
NASA NTRS1976

Testing the Shuttle heat-protection armor

The article deals with the thermal protection system (TPS) designed to keep Space Shuttle structures at 350 F ratings over a wide range of temperatures encountered in orbit, but also during prelaunch, launch, deorbit and re-entry, landing and turnaround. The structure, function, fabrication, and bonding of various types of reusable surface insulation and composite materials are described. Test programs are developed for insulation, seals, and adhesion bonds; leak tests and acoustic fatigue tests are mentioned. Test facilities include arc jets, radiant heaters, furnaces, and heated tunnels. The certification tests to demonstrate TPS reusability, structural integrity, thermal performance, and endurance will include full-scale assembly tests and initial orbital flight tests.

Strouhal, G.↗
NASA NTRS1991

Seal testing of large diameter rocket motors

This investigative program examines leakage testing of elastomeric O-ring seals for a solid rocket casing and provides direction towards an improved nondestructive postassembly test. It also details test equipment for the Space Shuttle systems solid rocket boosters (SRB). The results are useful to designers of hardware for pressure containment vessels which use O-ring seals. Using several subscale seal and groove configuration test fixtures equipped with either two or three O-ring seals in series, seal integrity is investigated with both a pressure decay and flowmeter methods. Both types of test equipment adequately detect the practical range of expected seal leak rates of 1 to 0.0001 sccs. The flowmeter leak test equipment appears to reduce testing time substantially. Limited seal leakage testing is performed on full-sized rocket motor segment seals, a pre-Challenger short stack, providing comparison of bore seals to test specimen bore and face seals. The conclusions are that seal reliability, verified via a performance pressure test, can be affected by temperature, quantity of grease, test pressure, and seal pressure load direction. Potential seal failure scenarios including contamination, seal damage, and sealing surface damage are discussed. Recommendations are made for an improved test procedure.

Moore, N. B.↗