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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS1993

Advanced microfabrication technologies for microspacecraft

Advanced microfabrication technologies offer the prospect of reducing the weight and size of spacecraft through the use of lighter and stronger materials in conjunction with new mechanical/structural design concepts and design optimization methods. At the same time, electronic components have been scaled down while increasing functional utility. A two-fold benefit is derived for space applications through the use of less expensive components and the lower launch costs associated with lighter components. GE-CRD is actively pursuing research in these key technologies for a wide range of applications including satellites. These key technologies will be reviewed and an update on GE progress will be given. The need to reduce weight and lower cost, while maintaining product quality and reliability are primary drivers in the design of satellites, in general, and microsatellites in particular. For the structural subsystem, these requirements pose a complex design problem unless new mechanical design concepts and computer-aided design optimization methods are employed. Several new concepts, such as battery packs doubling as panel reinforcements and fuel tanks as integral structural members, need to utilized. In addition, new viscoelastic material damping concepts for spacecraft components provide for lighter weight/lower cost designs, while satisfying the structural dynamics requirements. High density interconnect (HDI) technology permits the use of bare IC's on a ceramic substrate with 90 percent active area utilization. A copper/polyimide multilayer structure is the backbone of the technology, which has demonstrated a size/weight reduction of greater than 10x compared to printed circuit board with performance up to the GHz level. HDI modules have exceptional mechanical robustness as evidenced by survival of 180 kg rapid acceleration tests. Microelectromechanical systems (MEMS) are redefining sensors and actuators by miniaturization through micromachining techniques. Sharing many fabrication steps with HDI, we have developed a new technique for surface micromachining of copper/polyimide structures using computer-aided laser patterning.

Ghezzo, M.↗
NASA NTRS1995

Analysis of a microstrip reflectarray antenna for microspacecraft applications

A microstrip reflectarray is a flat reflector antenna that can be mounted conformally onto a spacecraft's outside structure without consuming a significant amount of spacecraft volume and mass. For large apertures (2 m or larger), the antenna's reflecting surface, being flat, can be more easily and reliably deployed than a curved parabolic reflector. This article presents the study results on a microstrip reflect-array with circular polarization. Its efficiency and bandwidth characteristics are analyzed. Numerous advantages of this antenna system are discussed. Three new concepts using this microstrip reflectarray are also proposed.

Huang, J.↗
NASA NTRS1998

Power, Propulsion, and Communications for Microspacecraft Missions

The development of small sized, low weight spacecraft should lead to reduced scientific mission costs by lowering fabrication and launch costs. An order of magnitude reduction in spacecraft size can be obtained by miniaturizing components. Additional reductions in spacecraft weight, size, and cost can be obtained by utilizing the synergy that exists between different spacecraft systems. The state-of-the-art of three major systems, spacecraft power, propulsion, and communications is discussed. Potential strategies to exploit the synergy between these systems and/or the payload are identified. Benefits of several of these synergies are discussed.

deGroot, W. A.↗
NASA NTRS1998

A Combined Laser-Communication and Imager for Microspacecraft (ACLAIM)

ACLAIM is a multi-function instrument consisting of a laser communication terminal and an imaging camera that share a common telescope. A single APS- (Active Pixel Sensor) based focal-plane-array is used to perform both the acquisition and tracking (for laser communication) and science imaging functions.

Laser Communication Optical Communication Science ↗
NASA NTRS1996

Electronic Brain Design for Advanced Microspacecraft

A brief history of NASA robotic spacecraft computing architectures is given. Changing needs driving changes in features (10x reduction in cost, various increases in capability, 10x to 100x reduction in power, mass and volume) for spacecraft computing are discussed. A scaleable, parallel/neural computing architecture which addresses these changes is proposed. Evaluation of some of this architecture's components is detailed. Finally, future directions of exploration for this spacecraft computing architecture are considered.

robotic↗
NASA NTRS1989

Think small - In large numbers

The development and use of microspacecraft are examined. It is proposed that 10-50 microspacecraft per year can be launched; up to 50 microspacecraft can be dispatched with traditional launchers; and 1-3 experiments can be performed on the spacecraft. Various applications for the microspacecraft are discussed and specific examples of proposed missions are presented. Some systems and instruments designed for the microspacecraft are described.

Jones, Ross M.↗
NASA NTRS1993

Small spacecraft for planetary exploration

There is need for lower cost, more frequent planetary science missions to compliment the 'once a decade' large multidisciplinary missions. The Solar System Exploration Division of NASA's Office of Space Science and Applications has initiated a program of planetary missions using small spacecraft. This program is called Discovery. Conceptual designs of small spacecraft (100 to 500 kg) for potential Discovery missions to near Earth asteroids are summarized. Another class of spacecraft that could be used for Discovery missions are called microspacecraft. Microspacecraft would be compatible with small launch vehicles such as Pegasus. The term 'microspacecraft' is used here for spacecraft concepts whose mass is about 10 kg. A study of a microspacecraft for a mission to near Earth asteroids is also summarized.

Jones, Ross M.↗
NASA NTRS2003

Survivable Failure Data Recorders for Spacecraft

A spacecraft may be unable to communicate critical data associated with a serious or catastrophic failure. A brief report proposes a system, somewhat like a commercial aircraft "black box," for retrieving these data. A microspacecraft attached to the prime spacecraft would continually store recent critical data from that spacecraft. If either spacecraft detected certain serious conditions of the prime spacecraft, the microspacecraft would separate from the prime spacecraft and independently transmit the stored data to Earth. Supplemental data, acquired from sensors onboard the microspacecraft, could be added to this transmission. For example, the orientation and angular rates of the prime spacecraft immediately before separation as well as pictures taken of the prime spacecraft after separation could be included. Functional enhancements over aircraft black boxes include the separation from the prime vehicle (which gains independence from the fate of that vehicle), wireless transmission of data (making physical black box recovery unnecessary), and the optional acquisition of supplemental sensor data.

Carraway, John↗
NASA NTRS1992

Low energy CMOS for space applications

The current focus of NASA's space flight programs reflects a new thrust towards smaller, less costly, and more frequent space missions, when compared to missions such as Galileo, Magellan, or Cassini. Recently, the concept of a microspacecraft was proposed. In this concept, a small, compact spacecraft that weighs tens of kilograms performs focused scientific objectives such as imaging. Similarly, a Mars Lander micro-rover project is under study that will allow miniature robots weighing less than seven kilograms to explore the Martian surface. To bring the microspacecraft and microrover ideas to fruition, one will have to leverage compact 3D multi-chip module-based multiprocessors (MCM) technologies. Low energy CMOS will become increasingly important because of the thermodynamic considerations in cooling compact 3D MCM implementations and also from considerations of the power budget for space applications. In this paper, we show how the operating voltage is related to the threshold voltage of the CMOS transistors for accomplishing a task in VLSI with minimal energy. We also derive expressions for the noise margins at the optimal operating point. We then look at a low voltage CMOS (LVCMOS) technology developed at Stanford University which improves the power consumption over conventional CMOS by a couple of orders of magnitude and consider the suitability of the technology for space applications by characterizing its SEU immunity.

Panwar, Ramesh↗
NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗
NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗
NASA NTRS1999

MEMS Using SOI Substrate

At NASA, the focus for smaller, less costly missions has given impetus for the development of microspacecraft. MicroElectroMechanical System (MEMS) technology advances in the area of sensor, propulsion systems, and instruments, make the notion of a specialized microspacecraft feasible in the immediate future. Similar to the micro-electronics revolution,the emerging MEMS technology offers the integration of recent advances in micromachining and nanofabrication techniques with microelectronics in a mass-producible format,is viewed as the next step in device and instrument miniaturization. MEMS technology offers the potential of enabling or enhancing NASA missions in a variety of ways. This new technology allows the miniaturization of components and systems, where the primary benefit is a reduction in size, mass and power. MEMS technology also provides new capabilities and enhanced performance, where the most significant impact is in performance, regardless of system size. Finally,with the availability of mass-produced, miniature MEMS instrumentation comes the opportunity to rethink our fundamental measurement paradigms. It is now possible to expand our horizons from a single instrument perspective to one involving multi-node distributed systems. In the distributed systems and missions, a new system in which the functionality is enabled through a multiplicity of elements. Further in the future, the integration of electronics, photonics, and micromechanical functionalities into "instruments-on-a-chip" will provide the ultimate size, cost, function, and performance advantage. In this presentation, I will discuss recent development, requirement, and applications of various MEMS technologies and devices for space applications.

Tang, Tony K.↗