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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3

Fabrication of optical components for the ultraviolet spectrometer and polarimeter on the Solar Maximum Mission

The Solar Maximum Mission (SMM) satellite was launched in February 1980 into a 573 km high circular orbit. It contains X-ray, UV, and optical instruments for the simultaneous observation of solar flares. The ultraviolet spectrometer and polarimeter (UVSP) is one of these instruments. The objectives of the UVSP require the employment of a raster scanning telescope to study the spatial dynamics of flares, the use of a high resolution spectrometer to select and scan spectral lines for temperature and velocity diagnostics, and the utilization of a polarimeter to measure magnetic fields in the solar transition zone. The present paper has the objective to provide a description of the optical fabrication techniques developed for the instrument. Attention is given to telescope mirrors, metering rods, the Ebert mirror, grating blanks, a four-mirror polarizer, beam splitter assemblies, beam splitter fabrication, deflector mirrors, and shipping containers.

Spencer, R. S.↗

Advancement of Optical Component Control for an Imaging Fabry-Perot Interferometer

Risk mitigation activities associated with a prototype imaging Fabry-Perot Interferometer (FPI) system are continuing at the NASA Langley Research Center. The system concept and technology center about enabling and improving future space-based atmospheric composition missions, with a current focus on observing tropospheric ozone around 9.6 micron, while having applicability toward measurement in different spectral regions and other applications. Recent activities have focused on improving an optical element control subsystem to enable precise and accurate positioning and control of etalon plates; this is needed to provide high system spectral fidelity critical for enabling the required ability to spectrally-resolve atmospheric line structure. The latest results pertaining to methodology enhancements, system implementation, and laboratory characterization testing will be reported

Larar, Allen M.↗

Testing the optical components for the National Ignition Facility time-resolved soft x-ray opacity spectrometer (OpSpecTR)

Opacity measurements are being carried out at the Z-facility at Sandia National Laboratories and at the National Ignition Facility (NIF) at Lawrence Livermore National Laboratory. The current soft x-ray Opacity Spectrometer (OpSpec) used on the NIF uses two elliptically bent crystals in time-integrated mode on either an image plate or a film. Plans are under way to expand these opacity measurements into a mode of time-resolved detection, called OpSpecTR. Previously, considerations for the available hCMOS detector size and photometrics led to a crystal geometry redesign and the use of a grazing angle x-ray mirror. The mirror acts as a low-pass x-ray energy filter, reducing the contribution of higher energy x rays. The first tests of the mirror and the crystal for OpSpecTR are presented here. The size of the mirror reflection and the reflectivity is tested using a Manson x-ray source. The mirror coupled with the new elliptical crystal shape demonstrates OpSpecTR’s spectral coverage. Finally, the results from the x-ray optics performance testing are shown along with the intended design.

47 OTHER INSTRUMENTATION↗

Moisture-resistant coatings for optical components

Plasma polymerization technique is used to apply thin, adherent, hydrophobic coatings from chlorotrifluoroethylene monomer. Apparently much of the chlorine contained in original monomer is lost during polymerization, and characteristic C-Cl absorption in infrared region is essentially absent.

Hollahan, J. R.↗

System and method for using mechanical loading to create spatially patterned meta surfaces for optical components

The present disclosure relates to a system for producing a patterned nanostructured surface on a component from a pre-existing, nanostructured surface with a first spatial feature distribution on the component. The system makes use of a force application element configured to apply a force to the pre-existing, nanostructured surface, and a force application control subsystem. The force application control subsystem is configured to control elevational movement of the force application element along a first axis of movement into and out of contact with the pre-existing, nanostructured surface to apply a predetermined load to the pre-existing, nanostructured surface. The predetermined load is sufficient to modify the pre-existing, non-patterned nanostructured surface to create the patterned nanostructured surface.

Ray, Nathan James↗

Unidirectional luminescence from InGaN/GaN quantum-well metasurfaces

III–nitride light-emitting diodes (LEDs) are the backbone of ubiquitous lighting and display applications. Imparting directional emission is an essential requirement for many LED implementations. Although optical packaging, nanopatterning and surface roughening4 techniques can enhance LED extraction, directing the emitted light requires bulky optical components. Optical metasurfaces provide precise control over transmitted and reflected waveforms, suggesting a new route for directing light emission. However, it is difficult to adapt metasurface concepts for incoherent light emission, due to the lack of a phase-locking incident wave. Here, we demonstrate a metasurface-based design of InGaN/GaN quantum-well structures that generate narrow, unidirectional transmission and emission lobes at arbitrary engineered angles. We further demonstrate 7-fold and 100-fold enhancements of total and air-coupled external quantum efficiencies, respectively. The results present a new strategy for exploiting metasurface functionality in light-emitting devices.

inorganic LEDs↗

Effects of long-duration exposure on optical system components

The optical materials and UV detectors experiment (SOO50-1) was a set of 18 optical windows, filters, and ultraviolet detectors. The optical specimens were all retrieved in excellent condition. No delamination or blistering of the filters occurred. No discoloration of the optical window materials occurred, but the MgF2 window did experience roughing. The most notable degradation of the optics were the deposition of an organic film on the exposed surfaces. The film absorption was measured using a Fourier transform infrared spectrometer and a UV spectrometer. The 6 percent absorption at 3.4 microns corresponds to about 100 mgm/sq ft of organic film. The UV absorption was almost 100 percent at 200 nm and about 50 percent at 380 nm.

Harvey, Gale A.↗

Effects of long-duration exposure on optical system components

The optical materials and UV detectors experiment (SOO50-1) was a set of 15 optical windows, filters, and ultraviolet detectors. The optical specimens were all retrieved in excellent condition. No discoloration of the bulk optical window materials occurred, but the optical windows did experience several types of contamination. The most notable degradation of the optics were the deposition of an organic film on both surfaces. The films' absorptions were measured using a Fourier Transform Infrared Spectrometer and UV spectrometers. The UV absorptions were almost 100 percent at 200 nm and about 50 percent at 380 nm.

Gale A Harvey↗

Chip packaging technique

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

Jayaraj, Kumaraswamy↗

Advanced Components For Fiber-Optical Systems

Paper reviews statuses of some advanced passive and active optical components for use with optical fibers. Emphasis on highly birefringent components controling polarization, because control of polarization critical in applications as fiber-optical gyroscopes, interferometric sensors, and coherent communications.

Depaula, Ramon↗