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NASA NTRS2011

Polished Panel Optical Receiver for Simultaneous RF/Optical Telemetry with Large DSN Antennas

The polished panel optical receiver concept described here makes use of aluminum panels on the main reflector of the Deep Space Network's (DSN's) 34-meter antennas at optical wavelengths by polishing and coating their surface to efficiently reflect near-infrared wavelengths in the 1,064 1,550-nanometer range. Achievable surface smoothness is not a limiting factor for aluminum panels, and initial field experiments indicate that the surface quality of microwave aluminum panels is sufficient to concentrate the light into small, but not diffraction-limited, spots at their primary focus. Preliminary analysis of data from high-quality microwave panels has shown that the light can be concentrated into 200 400 microradian cones, resulting in spot diameters of 2-4 mm at the 10-meter primary focus F(0) shown in the figure, or 2-4 cm spots at F(1) after magnification by the subreflector, which results in an effective focal length of about 100 meters. Three distinct implementation options are possible, with theoretically identical tracking and communications performance: Option 1: The communications assembly could be placed directly behind the subreflector at F(0), but this placement would require replacing the existing all-aluminum subreflector with a new design that transmits optical wavelengths but reflects RF, thus transmitting the optical signal to the primary focus of the parabolic polished aluminum panels at F(0), as shown in the figure. Option 2: Alternately, the optical communications assembly could be located near the first available focal-spot F(1) following reflection by the subreflector (which would have to be polished), next to the input to the beam waveguide on the main reflector as shown in the figure. Option 3: Finally, the optical communications assembly could be placed inside the pedestal room, and separated from the RF signal after the ellipsoid and before the signal reached the microwave receiver via an RF/optical dichroic near F(3).

Vilnrotter, Victor A.↗

DOE OSTI2020

Channel cut polishing machine

A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from the base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

42 ENGINEERING↗

DOE OSTI2022

Origins of wear-induced tungsten corrosion defects in semiconductor manufacturing during tungsten chemical mechanical polishing

During chemical mechanical polishing (CMP) process optimization, a unique corrosion defect was identified in the tungsten (W) contact plugs, which were investigated to develop practical solutions to improve CMP mass productivity. The corrosion defect occurred in the absence of external incident energy and was observed to occur only at the W plugs connected to the P + /n-well close to the wafer edge. To examine the root cause of the corrosion, a series of experiments was carried out at each W CMP step, using in-line defect inspection. Additional experiments were conducted using on-line inductively coupled plasma mass spectrometry (ICP-MS) to understand pH- and potential-dependent electrochemical dissolution behaviors of W. Experimentally, W corrosion was confirmed to be exacerbated if the surface oxide of the W plugs is removed by the deionized water (DIW) rinsing step under wafer pressurization, then exposed to DIW and alkaline cleaning solution. Although the DIW rinsing step is commonly performed to clean polishing pads right after the main polishing, a small amount of applied pressure (0.5 psi) without slurry supply can lead to corrosion defects. Finally, this wear-induced corrosion of the W plugs can be prevented by removing the applied pressure during the post DIW rinsing step of W CMP.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2024

Precision Polishing of Ablator Capsules via in situ Process Monitoring and Machine Learning–Based Optimization

In inertial confinement fusion (ICF) experiments seeking output gains of unity and beyond, the quality of the ablator capsule is paramount for minimizing the hydrodynamic mix that quenches the central hot spot. Defects in the form of foreign particles or missing mass on the surface and within the wall of the capsule are primary offenders. High-density carbon capsules made for ICF experiments at the National Ignition Facility are precision polished to achieve surface smoothness on the order of a few nanometers as well as to minimize isolated defects in the form of pits. Given the critical role of this process, we are developing smart manufacturing techniques with the goal of elevating the efficiency of this process. Our approach is to use MEMS (micro-electromechanical systems)–based sensors to capture the fine vibration signals generated during the polishing process and combine them with synchronized visual feedback as needed. Beyond using these sensors for process monitoring, we use specific deep learning methods to analyze the data and extract correlations with both the process parameters and the final performance of the polishing run. Here, in this work, we describe the multiple fronts we have explored in this regard and the results we have gotten so far. This approach promises to have the potential to ultimately provide real-time feedback that can be used to ensure the progress of the run as well as a means for faster optimization.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

DOE OSTI2025

Chemical and Chemical-Mechanical Polishing of Surface Roughness on L-PBF/GRCop-42 Cu-Cr-Nb Additive Manufactured 10-GHz RF Structures

Laser-based powder bed fusion (L-PBF) allows additive manufacture (AM) of lower hybrid current drive (LHCD) radio-frequency (RF) launchers from Glenn Research Copper, a Cr 2 Nb precipitation-hardened alloy (GRCop-42) in configurations unachievable with conventional machining. Rough surfaces in AM components increase RF losses and lead to arcing in high-power vacuum RF applications. Chemical polishing, chemical-mechanical polishing, or a combination of both were utilized to planarize the internal surfaces of RF structures, resulting in surface roughness as low as R a = 0.2 µm. Refinement in polishing techniques now enables GRCop-42 alloys (4 at. % Cr, 2 at. % Nb) to achieve similar surface roughness to GRCop-84 (8 at. % Cr, 4 at. % Nb) and equivalent cavity losses to extruded oxygen-free copper waveguides at 10 GHz.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

NASA NTRS2013

Performance Evaluation of Large Aperture 'Polished Panel' Optical Receivers Based on Experimental Data

Recent interest in hybrid RF/Optical communications has led to the development and installation of a "polished-panel" optical receiver evaluation assembly on the 34-meter research antenna at Deep-Space Station 13 (DSS-13) at NASA's Goldstone Communications Complex. The test setup consists of a custom aluminum panel polished to optical smoothness, and a large-sensor CCD camera designed to image the point-spread function (PSF) generated by the polished aluminum panel. Extensive data has been obtained via realtime tracking and imaging of planets and stars at DSS-13. Both "on-source" and "off-source" data were recorded at various elevations, enabling the development of realistic simulations and analytic models to help determine the performance of future deep-space communications systems operating with on-off keying (OOK) or pulse-position-modulated (PPM) signaling formats with photon-counting detection, and compared with the ultimate quantum bound on detection performance for these modulations. Experimentally determined PSFs were scaled to provide realistic signal-distributions across a photon-counting detector array when a pulse is received, and uncoded as well as block-coded performance analyzed and evaluated for a well-known class of block codes.

on-off keying (OOK)↗

DOE OSTI2022

High‐Efficiency Solar Cells Grown on Spalled Germanium for Substrate Reuse without Polishing

Abstract Radical reduction of III–V device costs requires a multifaceted approach attacking both growth and substrate costs. Implementing device removal and substrate reuse provides an opportunity for substrate cost reduction. Controlled spalling allows removal of thin devices from the expensive substrate; however, the fracture‐based process currently generates surfaces with significant morphological changes compared to polished wafers. 49 single junction devices are fabricated across the spalled surface of full 50 mm germanium wafers without chemo‐mechanical polishing before epitaxial growth. Device defects are identified and related to morphological spalling defects—arrest lines, gull wings, and river lines—and their impact on cell performance using physical and functional characterization techniques. River line defects have the most consistent and detrimental effect on cell performance. Devices achieve a single junction efficiency above 23% and open‐circuit voltage of 1.01 V, demonstrating that spalled germanium does not need to be returned to a pristine, polished state to achieve high‐quality device performance.

14 SOLAR ENERGY↗

DOE OSTI2021

Investigation on nanoscale material removal process of BK7 and fused silica glass during chemical‐mechanical polishing

Abstract Understanding the nanoscale material removal process in chemical mechanical polishing (CMP) is of fundamental importance for the operation and further development of CMP. In this study, the nanoscale material removal processes of both fused silica glass and BK7 glass were investigated based on single‐pad‐asperity polishing experiments. The results indicate that the material removal characteristics are highly dependent on the composition and structure of glass materials. In the mechanically induced chemical bonding removal mode, only atoms locate near the outermost several layers can participate in the formation and breakage of interfacial bridge bonds. Moreover, the force on the abrasive particle must exceed a threshold value to induce significant removal of Si atoms from the glass substrate, because as the breakage of Si glass –O backbonds does not occur in low‐stress conditions. We reveal for the first time that the chemical and mechanical properties of the topmost layer, which is recognized as densification, hydrated, or redeposition layer, have not been significantly affected by the mechanical action of the abrasive particles when polishing in this kind of material removal mode. The results are expected to provide a deeper insight into the nanoscale material removal mechanism during glass CMP.

Wang, Lin↗

DOE OSTI2020

Mechanisms influencing and prediction of tool influence function spots during hemispherical sub-aperture tool polishing on fused silica

Sub-aperture tool polishing of precision optics requires a detailed understanding of the local material removal [tool influence function (TIF)] at the contact spot between the workpiece and tool to achieve high removal determinism and hence precision of the optic relative to the desired/design surface figure. In this study, the mechanisms influencing and the quantitative prediction of the removal rate and shape of TIF spots during polishing of fused silica glass with cerium oxide slurry using a rotating hemispherical pad-foam tool for a wide variety of process conditions (including tool properties, kinematics, and applied displacements) are investigated. The TIF volumetric removal rate can be estimated utilizing the average relative velocity and contact area using a simple analytical model. In addition, stability of the volumetric removal rate for fixed process conditions is shown to be greatly dependent on the pad preparation and amount of tool use (affecting both pad topography and slurry buildup), whose general behavior shows an increase in removal rate followed by stabilization with polishing time. The determination of the TIF removal shape is more complex. An extended version of the Preston removal model is developed to explain a comprehensive set of measured TIF removal shapes to within ∼ <#comment/> 22 % <#comment/> . This model incorporates a number of phenomena impacting the TIF removal shape including: (a) temporal and spatial dependent relative velocity between the workpiece and tool; (b) an elastic mechanics based, as well as hydrodynamic, pressure distribution; (c) a spatially dependent friction coefficient possibly caused by both reduced slurry replenishment in low velocity regions and pad slurry islands (100 µm scale) and porosity (millimeter scale); and (d) a shear-based removal mechanism on the periphery of the contact spot.

Suratwala, T. (ORCID:0000000190861039)↗

DOE OSTI2022

Understanding the tool influence function during sub-aperture belt-on-wheel glass polishing

The tool influence function (TIF) during sub-aperture belt-on-wheel polishing has been evaluated as a function of various process conditions (belt use/wear, dwell time, displacement, belt velocity, and wheel modulus and diameter) on fused silica glass workpieces using C e O 2 polishing media. TIF spots are circular or elliptical in shape with a largely flat bottom character. Furthermore, the volumetric removal rate varies significantly with belt use (or wear), stabilizing after ~ 15 m i n of use. A modified Preston model, where the pressure dependence is adjusted using a different scaling of the wheel modulus ( E w 0.5 ), largely predicts the volumetric removal rate over the range of process conditions evaluated. The relatively high volumetric removal rate of 30 - 60 m m 3 / h using a fixed C e O 2 -in-resin-host belt offers a rapid, and hence, more economical, initial polish of aspheric and freeform optics.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

DOE OSTI2023

Smoothing tool design and performance during subaperture glass polishing

During subaperture tool grinding and polishing, overlaps of the tool influence function can result in undesirable mid-spatial frequency (MSF) errors in the form of surface ripples, which are often corrected using a smoothing polishing step. Here, in this study, flat multi-layer smoothing polishing tools are designed and tested to simultaneously (1) reduce or remove MSF errors, (2) minimize surface figure degradation, and (3) maximize the material removal rate. A time-dependent convergence model in which spatial material removal varies with a workpiece-tool height mismatch, combined with a finite element mechanical analysis to determine the interface contact pressure distribution, was developed to evaluate various smoothing tool designs as a function of tool material properties, thicknesses, pad textures, and displacements. An improvement in smoothing tool performance is achieved when the gap pressure constant, $\overline{h}$ (which describes the inverse rate at which the pressure drops with a workpiece-tool height mismatch), is minimized for smaller spatial scale length surface features (namely, MSF errors) and maximized for large spatial scale length features (i.e., surface figure). Five specific smoothing tool designs were experimentally evaluated. A two-layer smoothing tool using a thin, grooved IC1000 polyurethane pad (with a high elastic modulus, E pad =360 MPa ), thicker blue foam (with an intermediate modulus, E foam =5.3 MPa ) underlayer, and an optimized displacement (d t =1 mm ) provided the best overall performance (namely, high MSF error convergence, minimal surface figure degradation, and high material removal rate).

47 OTHER INSTRUMENTATION↗

DOE OSTI2023

Improving Nb3Sn Cavity Performance Using Centrifugal Barrel Polishing

Nb3Sn superconducting radiofrequency (SRF) cavities have been an ongoing research topic for many years motivated by the potential for higher accelerating gradients and quality factors compared to niobium SRF cavities. The highest performing Nb3Sn cavities are manufactured using tin vapor-diffusion coating, which creates a Nb3Sn film with a surface roughness of around 100-200 nm. This is thought to be one of the limiting factors for the accelerating gradient of Nb3Sn cavities due to enhancement of magnetic field near sharp surface features. To smooth Nb3Sn SRF cavities, we have developed a mechanical polishing procedure which uses centrifugal barrel polishing to smooth the surface followed by a secondary tin coating step to repair the surface. We show that the accelerating field of a Nb3Sn SRF cavity is improved by applying this procedure. We also investigate the quench mechanism of the polished cavity by utilizing temperature mapping to measure which regions of the cavity e xperience heating during RF operation. We then cut samples from these regions and analyze the film microstructure and chemical composition in 3D using EDS and EBSD measurements together with a focused ion-beam (FIB) tomography technique.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

DOE OSTI2026

Precision Polishing of Spheres Via In-Situ Process Monitoring and Machine-Learning-Based Optimization

In inertial confinement fusion (ICF) experiments seeking output gains of unity and beyond, the quality of the ablator capsule is paramount for minimizing hydrodynamic mix that quenches the central hot spot. Defects in the form of foreign particles or missing mass on the surface and within the wall of the capsule are primary offenders. High density carbon capsules made for ICF experiments on the National Ignition Facility (NIF) are precision polished to achieve the surface smoothness in the order of a few nm as well as to minimize isolated defects in the form of pits. Given the critical role of this process, we are developing smart manufacturing techniques with goal of elevating the efficiency of this process. Our approach is to use MEMS-based sensors to capture the fine vibrational signals generated during the polishing process and combine it with synchronized visual feedback as needed. Beyond using these sensors for process monitoring, we use specific deep learning methods to analyze the data and extract correlations with both the process parameters and the final performance of the polishing run. Here, we describe the multiple fronts that we have explored in this regard and the results we have gotten so far. This approach promises to have the potential to ultimately provide real-time feedback that can be used for ensuring the progress of the run as well as a means for faster optimization.

36 MATERIALS SCIENCE↗

NASA NTRS1989

Enclosed Cutting-And-Polishing Apparatus

Proposed apparatus cuts and polishes specimens while preventing contamination of outside environment or of subsequent specimens processed in it. Designed for use in zero gravity but also includes features useful in cutting and polishing of toxic or otherwise hazardous materials on Earth. Includes remote manipulator for handling specimens, cutting and polishing wire, inlets for gas and liquid, and outlets for waste liquid and gas. Replaceable plastic liner surrounds working space.

Rossier, R. N.↗

NASA NTRS1988

SiO overcoating and polishing of CFRP telescope panels

Development of carbon fiber reinforces plastic (CFRP) panel overcoating and polishing is structured in two parts. The first part utilized a short series of experiments to determine the feasibility of overcoating and polishing CFRP panels, and the second part employes a systematic approach to optimize techniques learned. Questions which required answers in the initial investigation are summarized. Tests were performedin the Steward Observatory's 2.2 Meter Vacuum Coating Chamber and began with 3 cm square pieces of CFRP facesheet material. Next, a 10 cm square and one-inch-thick CFPR-Aluminum core panel was tested. Tests were then conducted on a 0.5-meter-square Dornier panel (QUAD 4) with CFRP facesheets on two-inch aluminum Flexcore. To complete the initial study, a previously characterized 0.5 m Dornier panel (QUAD 23) was coated and hand polished. The mirror's optical performance was not affected by the SiO coating.

Woida, Patrick↗

NASA NTRS1991

Fabrication of a grazing incidence telescope by grinding and polishing techniques on aluminum

The paper describes the fabrication processes, by grinding and polishing, used in making the mirrors for a f/2.8 Wolter type-I grazing incidence telescope at Boulder (Colorado), together with testing procedure used to determine the quality of the images. All grinding and polishing is done on specially designed machine that consists of a horizontal spindle to hold and rotate the mirror and a stroke arm machine to push the various tools back and forth along the mirrors length. The progress is checked by means of the ronchi test during all grinding and polishing stages. Current measurements of the telescope's image quality give a FWHM measurement of 44 arcsec, with the goal set at 5-10 arcsec quality.

Gallagher, Dennis↗

NASA NTRS2001

Constellation-X Cylinder Figuring and Polishing Studies

In support of Goddard's Constellation-X mandrel manufacturing effort a series of fabrication experiments are being performed to determine a best approach. Currently, polishing immediately after diamond turning, produces a RMS surface roughness of 0.31 nm, on a nickel plated aluminum mandrel. Studies currently under way will incorporate an abrasive figuring step followed by a polishing operation. The current diamond turning, figuring and polishing procedures will be described and the results presented.

Waluschka, Eugene↗

NASA NTRS2006

Electro-Chemically Enhanced Mechanical Polishing of Nickel Mandrels

Grinding and mechanical polishing techniques used for x-ray optics mandrel figuring lead to mid-frequency surface ripple. These small figure variations have to be addressed in order to improve the performance of the resulting x-ray mirrors. If the electrochemical etching is combined with mechanical polishing, the figuring and the surface finishing cm be done simultaneously and be used to correct the mid-frequency surface ripple. It is shown that the electrochemical mechanical polishing method allows selective removal of nickel alloy without mandrel surface microroughness degradation.

Gubarev, Mikhail↗