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The NASA Electronic Parts and Packaging (NEPP) Program - Parts, Packaging, and Radiation Reliability Research on Electronics
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NESC Avionics Packaging Assessment: Avionics Mechanical Packaging Processes and Best Practices
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Package deals for deep savings: Scaling deep retrofits in commercial buildings with integrated systems packages
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NEW SMALL-VOLUME TYPE B PACKAGING and LANL PACKAGING USER COURSE
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Packaged Combined Heat and Power Technology Overview and Market Profile
Combined heat and power (CHP), sometimes referred to as cogeneration, is an efficient and clean approach to generating electric power and useful thermal energy onsite from a single fuel source, offering reliable and affordable energy services to businesses and institutions. Furthermore, CHP provides a cost effective opportunity to improve the environmental footprint and resilience of industrial and commercial facilities across the United States. CHP equipment can be custom-engineered or installed as a predesigned and assembled package. A packaged CHP system is a standardized, pre-engineered system that includes all equipment, piping, wiring, and ancillary components to deliver electricity and thermal energy to a host facility with minimal onsite engineering and design time. Packaged CHP systems can be shipped as single or multiple modules with standard interconnections (e.g., fuel; electrical; thermal—hot water, steam, and/or chilled water), which simplifies installation and reduces the costs associated with the project. Most containerized or single packaged CHP system offerings range from 10 kW to 3 MW in capacity. Packaged CHP systems are extending the operating, efficiency, and emissions benefits of CHP to nontraditional markets in commercial, institutional, multifamily, light manufacturing, government, and military applications. These markets tend to be served by smaller systems (less than 5 MW) that are conducive to pre-engineered packaging and/or modularization. Many of these sectors have limited CHP experience and technical resources to adequately evaluate, install, and maintain onsite CHP systems. The introduction of packaged CHP offerings from experienced CHP Packagers and Solution Providers has accelerated CHP adoption, lowered energy costs, reduced emissions, and strengthened energy resilience in these sectors. In 2019, the US Department of Energy (DOE) launched the Packaged CHP eCatalog to promote increased acceptance of efficient, cost-effective CHP in these applications. The Packaged CHP eCatalog is a web-based, searchable platform that hosts DOE-recognized packaged CHP systems with features designed to reduce economic and performance risks for designers, developers, owners, and facility operators interested in installing CHP. DOE established the Packaged CHP Accelerator at the same time to help launch and publicize the eCatalog, and to validate project performance, cost, and installation time of CHP packages across a variety of applications. Accelerator efforts documented installed cost reductions and installation time reductions of more than 20% for packaged CHP systems over 100 kW compared with custom-engineered systems. The Packaged CHP Accelerator and eCatalog established a peer-to-peer network connecting public and private sector partners including utilities, state energy offices, and energy efficiency program administrators interested in promoting cost-effective, efficient CHP systems, Packagers, and Solution Providers. Feedback from these partners, along with input from DOE’s CHP Technical Assistance Partnerships (CHP TAPs), was critical in understanding the current market for packaged CHP technologies, stimulating investment in these technologies, and guiding future directions for packaged CHP systems and their applications. This report provides background on packaged CHP systems, an overview of their benefits, a profile of current packaged CHP installations, and a summary of future market trends; this report is intended for facility owners, project developers, engineers, policymakers, and other stakeholders looking to increase the adoption of efficient, flexible, and resilient packaged CHP systems.
Transporting Non-Compliant TRU Wastes in the OPTIMUS{sup TM} Packages - 20493
The OPTIMUS{sup TM} product line of packages was developed with the purpose of providing a versatile and modular packaging option for shipping problematic wastes and fissile material contents. The product line includes a high-activity design in the OPTIMUS-H and a low activity design in the OPTIMUS-L. The two variants utilize a singular containment vessel design, that is enclosed in different protective components that offer different levels of shielding along with thermal and impact protection. The thick shielding provided by the OPTIMUS-H packaging allows for higher activity contents than the OPTIMUS-L to be transported. But the lightweight design of the OPTIMUS-L packaging allows for more packages to be transported in a single shipment. The containment vessel design shared between the two packages provides leak-tight containment of all radioactive contents along with the capabilities to easily leak test and the option to inert and backfill the contents, as necessary, prior to each shipment of the package. Together the OPTIMUS package designs offer significant flexibility and are capable of handling a wide variety of waste materials and other radioactive contents. One of the primary contents covered in the initial design effort for these packages is TRU waste contents beyond the standard waste materials that are compliant with the WIPP Waste Acceptance Criteria. More specifically, the initial content of interest is TRU Waste drums containing sealed containers with potentially flammable gases. While there are multiple other packaging options available for transporting standard WIPP compliant TRU wastes, the goal of the OPTIMUS packages is to offer a superior option for transporting both standard TRU wastes as well as the more problematic non-compliant wastes, among other contents. The non-compliant TRU waste contents explicitly included for the OPTIMUS packages are standard aerosol cans and DOT 3E lecture bottles. However, the methods applied for the package containment can be easily adjusted to cover other sealed container types with potentially flammable gases. The primary challenges with including these items are both the obvious issue of potential for flammable gases (e.g. aerosol propellants) in the package, but also the uncertainty in the exact state of the contents. Because these desired contents are waste materials, the characterization of the materials present in the waste may include some uncertainties. For example, though it may be known that there are one or more aerosol cans in a TRU waste drum, it may not be known if this can is full, spent, or anywhere in between. Also there may be equal uncertainty in the contents of the aerosol can, specifically in the potentially flammable propellant remaining in the can. To include these types of non-compliant items as acceptable contents for the package, the methods utilized in the safety analyses of the OPTIMUS packages must consider all of the uncertainties in the characterization of the waste. The methods utilized cover a range of concerns with transporting contents of this nature including pressure buildup, gas generation, and gaseous combustion for demonstrating the containment of the package. The ability to transport these problematic contents in the OPTIMUS packages gives TRU waste generating sites the option to relocate these drums to an offsite location where the non-compliant items can be properly managed through removal or destruction. (authors)
3D printing of packaging inserts from biomass-fungi composites: Environmental sustainability analysis
In this study, a comprehensive Life cycle assessment (LCA) is conducted on molded packaging inserts from expanded polystyrene (EPS) foam, molded packaging inserts from biomass-fungi composite, and 3D-printed packaging inserts from biomass-fungi composite under the low mix / high volume (LMHV) scenario and molded and machined packaging inserts from EPS foam, molded and machined packaging inserts from biomass-fungi composite, and 3D-printed packaging inserts from biomass-fungi composite under the high mix / low volume (HMLV) scenario. Six environmental impact categories—climate change, acidification, eutrophication, fossil resource scarcity, land use, and water consumption—are analyzed to evaluate the environmental trade-offs associated with each type of packaging inserts. Under the LMHV scenario, molded packaging inserts from biomass-fungi composite emerge as the best option due to their lower impact on climate change, acidification and water consumption compared to other types of packaging inserts. Conversely, molded packaging inserts from biomass-fungi composite face challenges in land use and eutrophication, primarily due to raw material production. LCA also reveals that 3D-printed packaging inserts from biomass-fungi composite are the most environmentally favorable option under the HMLV scenario, due to significantly lower contributions to climate change, eutrophication, and water consumption compared to other types of packaging inserts. Conversely, 3D-printed packaging inserts from biomass-fungi composite face challenges in acidification and land use, primarily due to raw material production. As part of the LCA, sensitivity analyses show that sourcing energy from 100% renewable sources substantially lowers climate change impacts across all packaging types, while varying transportation distances results in only minor changes, indicating the dominant role of upstream material and manufacturing processes. Additional sensitivity analysis is conducted under the HMLV scenario to assess the impact of material removal during machining on the environment. The amount of material removal is varied from 10 to 70% for the sensitivity analysis and it highlights that the amount of material removed during machining has no significant impact on climate change for packaging inserts from EPS foam. However, molded and machined packaging inserts from biomass-fungi composite show an increasing trend in climate change with higher amount of material removal, while 3D-printed packaging inserts from biomass-fungi composite exhibit a decreasing trend, driven by reduced raw material usage and energy consumption.
Assessment of Quality Management for Transport Packages Not Requiring Authority Design Approval - 18194
The majority of transports of radioactive materials are carried out in packages which don't need a package design approval of a competent authority. Low active radioactive materials are transported in such kind of packages e.g. in the medical and pharmaceutical industry and in the nuclear industry as well. In Germany the decision to phase out nuclear energy leads to a strong demand for packages to transport low and middle active radioactive waste due to the dismantling and decommissioning of nuclear power plants. According to IAEA regulations the 'non-competent authority approved package types' are the excepted packages and the industrial packages of Type IP-1, IP-2 and IP-3 and of Type A. For the packages of Type IP-2, IP-3 and Type A an assessment by the German competent authority is required for the quality management for the design, manufacture, testing, documentation, use, maintenance and inspection. In general a compliance audit of the manufacturer of the packaging is required during this assessment procedure. Their regulatory level in the IAEA regulations is not comparable with the regulatory density for packages requiring competent authority design approval. The countries apply different approaches within the assessment of the quality assurance measures in the management system as well as in the quality assurance program of a special package design. To use the package or packaging in a safe manner and in compliance with the regulations a management system for each phase of the life of the package or packaging is necessary. In order to help manufactures, which measurements and documents are needed for the assessment procedure, BAM developed a guideline. The guideline BAM-GGR 016 [5] describes the needed quality management for the design, manufacture, testing, documentation, use, maintenance and inspection of a packaging and the package. The poster to be presented will explain the different requirements of the quality assurance measures and give examples. (authors)
OPTIMUS{sup TM} Packaging for Intermediate Level Wastes and Spent Fuel - 20129
NAC's OPTIMUS{sup TM} packaging is a family of Type B(U)F transportation packages designed for maximum flexibility and cost-efficiency to support shipment of a wide range of challenging wastes and materials. They are small, modular packaging designs meeting DOT weight limits for road transport. OPTIMUS{sup TM} contents include low level waste, mixed low-level waste, irradiated fuel waste and intermediate level waste. Contents can also include aerosol cans with compressed gas and liquefied gas propellants and standard DOT 3E lecture bottles for shipment to treatment facilities. OPTIMUS{sup TM} packaging provides a cost-effective solution for challenging and unique waste contents combined with design simplicity and operational flexibility meeting the requirements of both SSR-6 and 10 CFR 71 for Type B(U)F packaging. The modular design of the packaging components combined with the flexibility to add modified internals for enhanced packaging performance makes OPTIMUS{sup TM} the preferred solution for many radioactive material transportation needs. The OPTIMUS{sup TM} product line currently includes two packaging designs; OPTIMUS{sup TM}-L and OPTIMUS{sup TM}-H. OPTIMUS{sup TM}-L is a lightweight transportation packaging intended for low-activity wastes, whereas OPTIMUS{sup TM}-H is a larger, heavier package intended for high-activities wastes. Due to its small size and weight, six (6) to ten (10) OPTIMUS{sup TM}-L packages can be accommodated on a single legal-weight truck shipment, depending on the weight of the contents. For typical payloads, two (2) OPTIMUS{sup TM}-H packages can be accommodated on a single legal-weight truck shipment. The OPTIMUS{sup TM} packaging share the same cask containment vessel (CCV) in the OPTIMUS{sup TM}-H and OPTIMUS{sup TM}-L. The large cavity size of the CCV, which can accommodate a 416-liter (110-gallon) drum, combined with the small size, low weight and modularity of the OPTIMUS{sup TM} packaging provides unmatched flexibility. In this paper, NAC provides a technical overview of the OPTIMUS{sup TM} packaging and identifies the design features and technology advancements making the OPTIMUS{sup TM} a readily adaptable and flexible solution for packaging processing facilities, reactor and decommissioning wastes. Optimized shielding performance through the addition of internal shielding components and alternative shipping configurations are discussed. In addition, an overview of the first major deployment of the OPTIMUS{sup TM} packaging for the Whiteshell Laboratories Closure Project (WLCP) is discussed. (authors)
Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment
This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.
Conditioning and Requalification of Legacy Waste Packages - 18648
In most German interim storage facilities, hundreds of waste packages are waiting for re-conditioning and qualification to comply with the waste acceptance criteria (WAC) for the Konrad repository. Especially the waste classification as well as some characteristics and the description of the material composition in its current state do not comply with the Konrad requirements since the conditioning of these waste packages took place up to 40 years ago. The German name for these waste packages is 'Altgebinde', hereafter referred to as 'legacy waste packages'. The present article will provide an overview of the measures for the qualification of these legacy waste packages to fulfill the Konrad requirements. The following measures, when necessary, are carried out for the qualification of legacy waste packages: - Collection and evaluation of all documents related to the primary conditioning process, e. g. the used equipment, documented waste and packaging properties, conditioning and radiology, if available (hereafter 'old documents'). - Preparation of a conceptual report and a process control quality plan based on existing data, with appropriate measures to qualify the waste packages. Assessment and approval of the process control quality plan by the competent authority. - Characterization of the waste and packaging properties by visual inspection or tomography, recording or updating of dose rate, contamination and mass, verification of product stability, for example by gas analysis of the interior atmosphere of the container. - Characterization of the nuclide inventory by gammas scans, sample taking to analyze nuclides which can not be measured by means of in-situ gamma spectrometry, and for material declaration. - Qualification or post-conditioning of the legacy waste packages if necessary, e. g. by drying the waste packages and packaging them in containers approved for disposal. - Compilation of all results of the above mentioned tests and steps to create a waste package documentation, including the calculations for the nuclide inventory and the description of the material composition of the waste packages. - Receiving approval by the competent authority after evaluation of the final documentation. The aim behind this structured approach is to prevent additional, unnecessary measures and treatment of the waste. Consequently, the additional characterization is preferably carried out on the basis of the available documents. (authors)
lNAC's OPTIMUS{sup TM}-L Package - the Next Transformation - 19396
NAC has developed the OPTIMUS{sup TM}-L package, the newest addition to the OPTIMUS{sup TM} packaging product line. OPTIMUS{sup TM}-L is a Type B(U)F-96 transportation package designed for maximum flexibility and cost-efficiency to support shipment of a wide range of challenging low-activity wastes. The OPTIMUS{sup TM}-L package utilizes the same cask containment vessel (CCV) as its predecessor, OPTIMUS{sup TM}-H, packaged inside lightweight outer packaging. The large cavity size of the CCV, which can accommodate a 110-gallon drum, combined with the small size and modularity of the OPTIMUS{sup TM}-L package provides unmatched flexibility for the user. OPTIMUS{sup TM}-L can accommodate more radioactive waste in each drum (up to a Fissile Gram Equivalent (FGE) limit of 395 g Pu-239) than larger packages can in 10 drums. Furthermore, because of its small size and weight, up to ten (10) OPTIMUS{sup TM}-L packages can be accommodated per legal-weight truck shipment. Thus, one Legal Weight Truck (LWT) shipment of 10 OPTIMUS{sup TM}-L packages can accommodate more than 10 times the FGE as a large package containing 10 drums. OPTIMUS{sup TM}-L contents include low level waste, mixed low-level waste, intermediate level waste and contact handled transuranic (CH-TRU) waste. Furthermore, all contents can include aerosol cans with compressed gas and liquefied gas propellants and standard Department of Transportation (DOT) 3E lecture bottles for shipment to treatment facilities. The OPTIMUS{sup TM}-L is also designed to accommodate irradiated fuel debris and other fissile material waste, which may be packaged inside shield inserts if required for supplemental radiation shielding. In this paper, NAC provides a technical overview of the OPTIMUS{sup TM}-L package and identifies the design features and technology advancements that makes the OPTIMUS{sup TM} product line a readily adaptable and flexible solution for packaging DOE and other orphan wastes and enables the integration of these wastes into the waste management system process and disposition infrastructure. (authors)
Packaging Technologies for High Temperature Electronics and Sensors
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.
SRNL's Lessons Learned from the University of Nevada Reno{sup TM} Nuclear Packaging Internships - 19464
The U.S. Department of Energy's Packaging Certification Program (DOE PCP) and the University of Nevada, Reno (UNR) Mechanical Engineering Department have developed an accredited, graduate level nuclear packaging certificate. The mission is to ensure that the DOE staff and users of PCP services are knowledgeable and competent in packaging and transportation activities. Since 2008, the Savannah River National Laboratory (SRNL) has been teaching two classes for the DOE PCP Packaging University. This paper introduces a recently added third class, where SRNL provided Site Supervisors, targeted toward engineering interns. As part of ensuring a future workforce, the Packaging Technology and Transportation Engineering Group (PT and TE) at Savannah River National Laboratory (SRNL) normally employs two to three summer interns each year. The internships provide SRNL innovative s performing valuable research and support work related to package certification. It also provides SRNL the opportunity to bring in perspective engineers on 'trial-basis.' The interns benefit by learning valuable career skills and gaining exposure to a broad-based career field in the field of packaging. As part of the job specific training, the summer interns are provided an overview of package design, testing, and certification. This includes package operations, containment vessel leak testing, and SARP preparation. Two years ago, SRNL recognized the efficiency of using the SRNL-taught courses for the summer interns working in SRNL PT and TE. SRNL requested that UNR allow the PT and TE two summer interns, who were rising college juniors, to enroll in the SRNL-taught courses for graduate credit. UNR agreed and allowed the interns to enroll under a special admission status. Since that time, UNR developed a new class within the Graduate Certificate in Nuclear Packaging (GCNP), for the summer intern research work. This new class offers a formalized framework for the summer interns to conduct research, while ensuring that the research is performed in a rigor consistent with an accredited college level setting. Last summer, the SRNL PT and TE had three summer interns - all participating in the new course, UNR ME-699 Nuclear Packaging Summer Internship - with each earning three graduate credits from UNR in mechanical engineering. This paper provides a brief overview of the DOE PCP Packaging University/ UNR GCNP, a discussion of SRNL's use of summer interns as a tool to recruit and train the future workforce, and lessons learned from having last year's three SRNL PPT and TE summer interns enroll in the UNR Packaging Internship Class. (authors)
Textile Carbon Fiber Packaging and NCF Production
This Technical Collaboration Project focused on packaging large tow (≥ 10 grams/meter) textile carbon fibers, for which currently there is no suitable method. Prior to this project, Oak Ridge National Laboratory (ORNL) used a crude packaging approach to deliver (approximately) 100-meter packages for evaluation by intermediates producers, composites fabricators and other collaborators. That packaging approach was simply a hoop wrap on a standard 75 mm (3 inch) cardboard tube, with paper interleaved between layers and little or no tension control during spooling. While this approach was very effective for initial fiber development and sample fiber and small composite sample evaluation, these packages were inadequate for larger-scale demonstrations and more extensive applications development. The paper-interleaved packages were inconsistent, wasteful, and too small for commercial utilization; they were designed as a quick and simple means to package material for delivery into prototyping operations and were never expected to satisfy industrial requirements for commercial production. This project aimed to develop a commercially relevant approach for packaging large tow textile carbon fibers for robust delivery into downstream commercial intermediates and composites production operations. The development of robust packaging equipment that delivers packages meeting industrial requirements is essential to commercial implementation. In this project, the team identified packaging requirements, created a design, and prototyped a new packaging concept at ORNL’s Carbon Fiber Technology Facility (CFTF) and resulting packages were tested in production of non-crimp fabric (NCF).
Packaging Technologies for High Temperature Electronics and Sensors
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.