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At least 55 records · Page 3

Analysis of multifastener composite joints

A new numerical procedure for determining load proportioning in multiple-hole mechanical joints in composite plates is presented. The joints are loaded in double lap fashion in tension with pins through the holes. The commercial finite-element program ABAQUS is used to predict the load proportioning among holes using two independent plane stress finite-element models, one representing the composite inner lap and one representing the two steel outer laps, interacting through rigid circular surfaces. The circular surfaces effectively represent rigid pins. Load proportioning is predicted for a number of geometries. Excellent correlation with experimental data is obtained. Experimental and computed surface strains are also found to compare well. The assumption of a radial cosine distribution of contact stress between pin and hole is shown to be substantially in error for some holes.

Griffin, O. H., Jr.↗

The effect of channel convergence on heat transfer in a passage with short pin fins

Array averaged heat transfer coefficients were obtained for two configurations of short pin fins in a converging channel and for two flat plate configurations in a converging channel. The effect of flow acceleration due to channel convergence and the effect of varying pin length on the heat transfer was determined. Results are presented in the form of Nusselt number versus Reynolds number for the four geometries tested.

Brigham, B. A.↗

Thermal Effects on the Bearing Behavior of Composite Joints

Thermal effects on the pin-bearing behavior of an IM7/PET15 composite laminate are studied comprehensively. A hypothesis presents factors influencing a change in pin-bearing strength with a change in temperature for a given joint design. The factors include the change in the state of residual cure stress, the material properties, and the fastener fit with a change in temperature. Experiments are conducted to determine necessary lamina and laminate material property data for the IM7/PET15 being utilized in this study. Lamina material properties are determined between the assumed stress free temperature of 460 F down to -200 F. Laminate strength properties are determined for several lay-ups at the operating temperatures of 350 F, 70 F, and -200 F. A three-dimensional finite element analysis model of a composite laminate subject to compressive loading is developed. Both the resin rich layer located between lamina and the thermal residual stresses present in the laminate due to curing are determined to influence the state of stress significantly. Pin-bearing tests of several lay-ups were conducted to develop an understanding on the effect of temperature changes on the pin-bearing behavior of the material. A computational study investigating the factors influencing pin-bearing strength was performed. A finite element model was developed and used to determine the residual thermal cure stresses in the laminate containing a hole. Very high interlaminar stress concentrations were observed two elements away from the hole boundary at all three operating temperatures. The pin-bearing problem was modeled assuming a rigid frictionless pin and restraining only radial displacements at the hole boundary. A uniform negative pressure load was then applied to the straight end of the model. A solution, where thermal residual stresses were combined with the state of stress due to pin-bearing loads was evaluated. The presence of thermal residual stresses intensified the interlaminar stresses predicted at the hole boundary in the pin-bearing problem. This dissertation shows that changes in material properties drives pin-bearing strength degradation with increasing temperature.

Walker, Sandra Polesky↗

Load and dynamic assessment of B-52B-008 carrier aircraft for finned configuration 1 space shuttle solid rocket booster decelerator subsystem drop test vehicle. Volume 3: Pylon load data method 1

The pylon loading at the drop test vehicle and wing interface attach points is presented. The loads shown are determined using a stiffness method, which assumes the side stiffness of the foreward hook guide to be one-fourth of the fore and aft stiffness of each drag pin. The net effect of this assumption is that the forward hook guide reacts approximately 85% of the drop test vehicle yawing moment. For a comparison of these loads to previous X-15 analysis design loadings, see Volume 1 of this document.

Quade, D. A.↗

Biaxial method for in-plane shear testing

Method for obtaining uniform shear deformation yields more accurate values for material mechanical properties than uniaxial picture frame techniques. Forces applied are one-half usual magnitude, reducing transmitted force and related pin deformations. Biaxial method installs square sandwich specimen in stiff frame with pinned corners. Frictional effects are negligible, and stiffening of honeycomb core is corrected for in results.

Bush, H. G.↗

Magnetic properties and magnetic hardening mechansim of Pt-Co-B alloys

The intrinsic coercivity is found to be maximized in the Pt42Co45B13 ternary alloy which is undercooled and rapidly solidified (quenched using a 70 m/s wheel speed after undercooling), and then annealed (800 C for 2400 min). The same alloy, processed at slower cooling rates and annealed in the same way, has a much larger scale microstructure and a much lower resulting magnetic coercivity. The microstructure which would optimize the coercitvity of this coercivity of this ternary alloy is a completely ordered L1(sub zero) Pt-Co matrix with a submicron magnetic single-domion Co-boride precipitate. The L1(sub zero) phase is highly anistropic magnetically while the Co-boride precipate is somewhat less so. Annealing treatments designed to produced single-domain Co-boride precipitates enhance the coercivity. This suggests that the refined microstructures is responsible for the high coercivities found in the rapidly solidified and annealed alloy. The magnetic domain wall thickness for a Co-boride precipitate is determined from both experimental observation and theoretical calculation in order to evaluate its influence on the coercivity of the alloy. The effects of the pinning of domain walls and the barrier to the nucleation of reverse domains on the coercivity are discussed. Both microstrucutral analysis and theoretical calculation indicate that the high coercivities in the Pt42Co45B13 alloy are due to the difficult nucleation of reverse magnetic domains.

Qiu, Ning↗

Mechanisms of isothermal phase transformations in rapidly solidified Ti-24Al-11Nb

A dynamic simulation for the motion of an isolated superdislocation (SD) under an applied stress is presented. The simulation incorporates the concept that cross slip from (111) planes to (010) planes can locally pin the SD. It is determined that the principal effect of cross-slip-pinning is not the reduction in the SD velocity, but rather the exhaustion of the density of mobile SDs.

Hsiung, L. M.↗

Counterface effects on the tribological properties of polyimide composites

Graphite fiber reinforced polyimide composite pins were slid against seven different counterfaces to determine the effect of material type on the tribological properties of polymer composites. In addition, the effect of sliding a new pin on a pre-established transfer film was investigated. The results indicated that almost a five order of magnitude difference in composite wear rate can occur just by varying the counterface material. An attempt to make all surfaces as smooth as possible was made, but due to differences in material composition this was not possible and a range of surface roughnesses were obtained. The results indicate that the smoother the surface, the lower the composite wear rate; but that small protrusions (not discernible with arithmetic surface roughness measurements) can markedly increase wear rates. A pre-established transfer film improved both run in and steady state wear rates.

Fusaro, Robert L.↗

Superconducting properties of annealed Nb-Al-Ge thin films.

Discussion of the superconducting transition temperature and other superconducting properties of annealed Nb-Al-Ge thin films which were prepared by sputtering from a 3Nb-0.8Al-0.2Ge cathode. Annealing was performed in a high-vacuum environment maintained at 10 to the minus 9th torr or less, for times and temperatures near the optimum conditions for bulk Nb-Al-Ge. Films with transition temperatures from 12 to 16 K were annealed and in all cases a rise in transition temperature was observed, with the maximum value obtained thus far being 17.5 K. The current carrying capacity values, already substantially higher for unannealed thin films than for the bulk, were raised even further in the annealed samples, indicating that annealing has no detrimental effects on the flux pinning in these films.

Janocko, M. A.↗

Crack-opening displacements in center-crack, compact, and crack-line wedge-loaded specimens

The theoretical crack-opening displacements for center-crack, compact, and crack-line wedge-loaded specimens (reported in the ASTM Proposed Recommended Practice for R-Curve Determination (1974)) disagree with experimental measurements in the literature. The disagreement is a result of using approximate specimen configurations and load representation to obtain the theoretical displacements. An improved method of boundary collocation is presented which was used to obtain the theoretical displacements in these three specimen types; the actual specimen configurations and more accurate load representation were used. In the analysis of crack-opening displacements in the compact and crack-line wedge-loaded specimens, the effects of the pin-loaded holes were also included. The theoretical calculations agree with the experimental measurements reported in the literature. Also examined are accurate polynomial expressions for crack-opening displacements in both compact and crack-line wedge-loaded specimens.

Newman, J. C., Jr.↗

Surface recombination velocity and lifetime in InP measured by transient microwave reflectance

Minority carrier lifetime and surface recombination velocity are determined in organometallic vapor-phase epitaxy (OMVPE)-grown InP by a contactless microwave technique. For lightly doped n-type InP, a surface recombination velocity of 5000 cm/s is measured. However, in solar cells with a heavily doped n-type emitter a surface recombination velocity of 1 x 10 to the 6th cm/s is observed. Possible reasons for this due to surface pinning are discussed. The effects of various chemical treatments and SiO on the surface recombination velocity are measured.

Bothra, S.↗

Zinc Alloys for the Fabrication of Semiconductor Devices

ZnBeO and ZnCdSeO alloys have been disclosed as materials for the improvement in performance, function, and capability of semiconductor devices. The alloys can be used alone or in combination to form active photonic layers that can emit over a range of wavelength values. Materials with both larger and smaller band gaps would allow for the fabrication of semiconductor heterostructures that have increased function in the ultraviolet (UV) region of the spectrum. ZnO is a wide band-gap material possessing good radiation-resistance properties. It is desirable to modify the energy band gap of ZnO to smaller values than that for ZnO and to larger values than that for ZnO for use in semiconductor devices. A material with band gap energy larger than that of ZnO would allow for the emission at shorter wavelengths for LED (light emitting diode) and LD (laser diode) devices, while a material with band gap energy smaller than that of ZnO would allow for emission at longer wavelengths for LED and LD devices. The amount of Be in the ZnBeO alloy system can be varied to increase the energy bandgap of ZnO to values larger than that of ZnO. The amount of Cd and Se in the ZnCdSeO alloy system can be varied to decrease the energy band gap of ZnO to values smaller than that of ZnO. Each alloy formed can be undoped or can be p-type doped using selected dopant elements, or can be n-type doped using selected dopant elements. The layers and structures formed with both the ZnBeO and ZnCdSeO semiconductor alloys - including undoped, p-type-doped, and n-type-doped types - can be used for fabricating photonic and electronic semiconductor devices for use in photonic and electronic applications. These devices can be used in LEDs, LDs, FETs (field effect transistors), PN junctions, PIN junctions, Schottky barrier diodes, UV detectors and transmitters, and transistors and transparent transistors. They also can be used in applications for lightemitting display, backlighting for displays, UV and visible transmitters and detectors, high-frequency radar, biomedical imaging, chemical compound identification, molecular identification and structure, gas sensors, imaging systems, and for the fundamental studies of atoms, molecules, gases, vapors, and solids.

Ryu, Yungryel↗

Microhardness of carbon-doped (111) p-type Czochralski silicon

The effect of carbon on (111) p-type Czochralski silicon is examined. The preparation of the silicon and microhardness test procedures are described, and the equation used to determine microhardness from indentations in the silicon wafers is presented. The results indicate that as the carbon concentration in the silicon increases the microhardness increases. The linear increase in microhardness is the result of carbon hindering dislocation motion, and the effect of temperature on silicon deformation and dislocation mobility is explained. The measured microhardness was compared with an analysis which is based on dislocation pinning by carbon; a good correlation was observed. The Labusch model for the effect of pinning sites on dislocation motion is given.

Danyluk, S.↗

Evaluation of Contact Separation Force Testing as a Screening Methodology for Electrical Socket Contacts

During system level testing intermittent and permanent open circuit failures of mated, crimp removable, electrical contact pairs were experienced. The root cause of the failures was determined to be low (but not zero) contact forces applied by the socket contact tines against the engaging pin. The low contact force reduces the effectiveness of the wiping action of the socket tines against the pin. The observed failure mode may be produced when insufficient wiping during mate, demate and small relative movement in use allows for the accumulation of debris or insulating films that electrically separate the contact pair. The investigation identified at least three manufacturing process control problems associated with the socket contacts that enabled shipment of contacts susceptible to developing low contact forces: (1) Improper heat treatment of the socket tines resulting in plastic rather than elastic behavior; (2) Overly thinned socket tines at their base resulting in reduced pin retention forces; (3) Insufficient screening tests to identify parts susceptible to the aforementioned failure mechanisms. The results from an extensive screening program of socket contacts utilizing the industry standard contact separation force test procedures are described herein. The investigation shows this method to be capable of identifying initially weak sockets. However, sockets whose contact retention forces may degrade during use may not be screened out by pin retention testing alone. Further investigations are required to correlate low contact retention forces with increased electrical contact resistance in the presence of insulating films that may accumulate in the use environment.

Christopher Green↗

Investigation of Friction Stir Welding of Al Metal Matrix Composite Materials

The innovative process of Friction Stir Welding (FSW) has generated tremendous interest since its inception about a decade or so ago since the first patent in 1991 by TWI of Cambridge, England. This interest has been seen in many recent international conferences and publications on the subject and relevant published literature. Still the process needs both intensive basic study of deformation mechanisms during this FSW process and analysis and feasibility study to evaluate production methods that will yield high quality strong welds from the stirring action of the appropriate pin tool into the weld plate materials. Development of production processes is a complex task that involves effects of material thickness, materials weldability, pin tool design, pin height, and pin shoulder diameter and related control conditions. The frictional heating with rotational speeds of the pin tool as it plunges into the material and the ensuing plastic flow arising during the traverse of the welding faying surfaces provide the known special advantages of the FSW process in the area of this new advanced joining technology.

Diwan, Ravinder M.↗

Effect of counterface material type and its topography on the tribological properties of polyimide composites

Graphite fiber reinforced polyimide composite pins were slid against seven different counterfaces to determine the effect of material type on the tribological properties of polymer composites. In addition, the effect of sliding a new pin on a pre-established transfer film was investigated. The results indicated that almost a five order of magnitude difference in composite wear rate can occur just by varying the counterface material. An attempt to make all surfaces as smooth as possible was made, but due to differences in material composition this was not possible and a range of surface roughnesses were obtained. The results indicate that the smoother the surface, the lower the composite wear rate; but that small protrusions (not discernible with arithmetic surface roughness measurements) can markedly increase wear rates. A pre-established transfer film improved both run in and steady state wear rates.

Fusaro, R. L.↗

The effect of Tricresyl-Phosphate (TCP) as an additive on wear of Iron (Fe)

The effect of tricresyl phosphate (TCP) as an antiwear additive in lubricant trimethyol propane triheptanoate (TMPTH) was investigated. The objective was to examine step loading wear by use of surface analysis, wetting, and chemical bonding changes in the lubricant. The investigation consisted of steploading wear studies by a pin or disk tribometer, the effects on wear related to wetting by contact angle and surface tension measurements of various liquid systems, the chemical bonding changes between lubricant and TCP chromatographic analysis, and by determining the reaction between the TCP and metal surfaces through wear scar analysis by Auger emission spectroscopy (AES). The steploading curve for the base fluid alone shows rapid increase of wear rate with load. The steploading curve for the base fluid in presence of 4.25 percent by volume TCP under dry air purge has shown a great reduction of wear rate with all loads studied. It has also been found that the addition of 4.25 percent by volume TCP plus 0.33 percent by volume water to the base lubricant under N2 purge also greatly reduces the wear rate with all loads studied. AES surface analysis reveals a phosphate type wear resistant film, which greatly increases load-bearing capacity, formed on the iron disk. Preliminary chromatographic studies suggest that this film forms either because of ester oxidation or TCP degradation. Wetting studies show direct correlation between the spreading coefficient and the wear rate.

Ghose, Hiren M.↗

Life test results for an ensemble of CO2 lasers

The effects of cathode material, cathode operating temperature, anode configuration, window materials, and hydrogen additives on laser lifetime are determined. Internally oxidized copper and silber-copper alloy cathodes were tested. The cathode operating temperature was raised in some tubes through the use of thermal insulation. Lasers incorporating thermally insulated silver copper oxide cathodes clearly yielded the longest lifetimes-typically in excess of 22,000 hours. The use of platinum sheet versus platinum pin anodes had no observable effect on laser lifetime. Similarly, the choice of germanium, cadmium telluride, or zinc selenide as the optical window material appears to have no impact on lifetime.

Peruso, C. J.↗