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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Light Emitting, Photovoltaic or Other Electronic Apparatus and System

The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of lenses suspended in a polymer deposited or attached over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes are substantially spherical, and have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap.

Ray, William Johnstone↗
NASA NTRS2017

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗
NASA NTRS2016

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗
NASA NTRSDate not supplied

Additive Manufacturing and Working Fluid Characterization of Ceramic Heat Pipes

In this work, additively manufactured (AM) aluminum nitride (AlN) ceramic heat pipes were developed to improve spacecraft heat rejection capabilities beyond the current state-of-the-art metal systems. A low sintering temperature aluminum nitride slurry is developed for digital light processing printing (DLP) and the optimal debinding curves are examined. Printed AlN parts are characterized via SEM and optical profilometry. AlN 3D-printed parts are also tested for compatibility with aluminum bromide, aluminum chloride, and iodine, among other proposed working fluids at 350-600 K in an inert atmosphere, with reactivity measured via SEM and Fourier transform infrared spectroscopy (FTIR).

Thermal Management↗
NASA NTRSDate not supplied

Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods

In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.

Process control↗
NASA NTRS1971

CRT image recording evaluation

Performance capabilities and limitations of a fiber optic coupled line scan CRT image recording system were investigated. The test program evaluated the following components: (1). P31 phosphor CRT with EMA faceplate; (2). P31 phosphor CRT with clear clad faceplate; (3). Type 7743 semi-gloss dry process positive print paper; (4). Type 777 flat finish dry process positive print paper; (5). Type 7842 dry process positive film; and (6). Type 1971 semi-gloss wet process positive print paper. Detailed test procedures used in each test are provided along with a description of each test, the test data, and an analysis of the results.

Source record↗
NASA NTRS2024

Metal Extraction from Trash via Trash-to-Gas Processing for Use in 3D Printing

This work synergized state-of-the-art trash-to-gas (TtG) and in-space manufacturing (ISM) technologies to successfully extract metals from astronaut waste items for use in 3D printing. This was accomplished by isolating pure aluminum (Al 1235) from astronaut multilayer food packaging via TtG processing, cleaning the extracted aluminum, and preparing it for compatibility with the bound metal deposition (BMD) 3D printing process. A suite of material analyses was performed on the extracted aluminum product to fully characterize the key properties linked to effective additive manufacturing, including particle size distribution, oxygen content quantitation, and elemental composition. Metal extraction from Lunar and Martian regolith has become a significant area of interest for the in-situ resource utilization (ISRU) community to produce metallic equipment for various mission scenarios. However, the extraction of metals from astronaut waste streams has yet to be investigated. This project demonstrated an end-to-end waste metallic reuse process which may garner considerable metal production that would otherwise be disposed of.

Ray Pitts↗
NASA NTRSDate not supplied

Characterization and Testing of Copper-Nickel Electroplated 3D Printed Parts for Space Flight Applications

3D printing enables novel designs which are impossible to replicate with conventional machining. The process involves 3D printing components from a polymer using a standard resin-based printing process, then electroplating the parts with a thin layer of copper-nickel. Initial results have shown these electroplated components have increased structural strength, while being less expensive; less massive; and can be made faster compared to conventional CNC machining. The focus and metric of success was to qualify this process and to answer the question if the 3D printed electroplated parts can be fabricated in a more cost, mass and schedule efficient manor compared to traditional CNC machining. Also, to determine if using this method will cause parts to have contamination issues or if parts can survive space environment testing. This was accomplished by conducting several critical tests such as outgassing, material testing and thermal cycling. In addition, this method is being used to develop a practical structural application for KArLE (Potassium Argon Laser Experiment).

3-D Printing↗
NASA NTRS2015

3D Printing Multi-Functionality: Embedded RF Antennas and Components

Significant research and press has recently focused on the fabrication freedom of Additive Manufacturing (AM) to create both conceptual models and final end-use products. This flexibility allows design modifications to be immediately reflected in 3D printed structures, creating new paradigms within the manufacturing process. 3D printed products will inevitably be fabricated locally, with unit-level customization, optimized to unique mission requirements. However, for the technology to be universally adopted, the processes must be enhanced to incorporate additional technologies; such as electronics, actuation, and electromagnetics. Recently, a novel 3D printing platform, Multi3D manufacturing, was funded by the presidential initiative for revitalizing manufacturing in the USA using 3D printing (America Makes - also known as the National Additive Manufacturing Innovation Institute). The Multi3D system specifically targets 3D printed electronics in arbitrary form; and building upon the potential of this system, this paper describes RF antennas and components fabricated through the integration of material extrusion 3D printing with embedded wire, mesh, and RF elements.

antennas↗
NASA NTRSDate not supplied

Towards Integrated Computational Materials Engineering for Quantifying Performance Impacts of Microstructure and Defect Interactions in Powder Bed Fusion Parts

Powder bed fusion (PBF) additive manufacturing (AM) enables the creation of parts with complexity and functionality levels that were previously impossible with traditional manufacturing methods. By modifying the laser power, hatch spacing, or the numerous other processing parameters, the PBF process supports the production of a wide set of materials and geometries. However, that same process parameter design flexibility causes the process-design space of PBF to be massive and expensive to explore experimentally. Another challenge is quality variation across a build. As a part is being built, geometric variance between locations, such as at a thin-wall section vs. the bulk material, may cause the specified processing parameters to no longer be acceptable for producing defect-free printing. Furthermore, if the processing parameters deviate during the print process, it is difficult to assess if the part will still perform satisfactorily. Integrated Computational Materials Engineering (ICME) provides a way to understand and address these various challenges. This talk will present advancements in process-structure simulations of PBF at NASA Langley Research Center. The ability to simulate grain-scale PBF microstructures using the Physically Based Monte Carlo method will be demonstrated and compared to experimental measurements. Techniques for simulating three-dimensional lack-of-fusion and keyhole porosity defects based on the specific processing conditions and approaches for integrating the two porosity prediction techniques alongside the computational microstructure evolution models will be shown. Finally, the integration of simulated PBF microstructures, embedded process defects, and crystal plasticity finite element models to elucidate the interaction of porosity and microstructure on micromechanical fields will be demonstrated. These integrated techniques demonstrate an example of using ICME to relate processing to performance for PBF AM materials. With continued maturity, it is hoped that such ICME approaches will lead to next-generation computational-materials supported qualification and certification of AM parts.

Additive manufacturing↗
NASA NTRSDate not supplied

Backshell Thermal Protection Materials for Additive Manufacturing

Leveraging AM technology focused on the Fused Deposition Modeling (FDM) process could automate the heat shield manufacturing process and allow it to reduce cost and build time and improve the design to 3D print and process TPS materials directly on the structure in monolith segments. Furthermore, AM allows the production of complicated three-dimensional geometry and density gradient layers without custom molds or special tools. NASA invests in additive manufacturing (AM) to enable new mission architectures and design methods; AM is suited for backshell thermal protection materials that require many complex closeouts that lead to integration challenges. Current work will review backshell thermal protection material formulation, development, and characterization.3D printer was used to 3D print arc-jet test coupons. The coupons were tested at the NASA Ames arc jet facility, and the results show promising properties compared with the heritage materials.

Tane Boghozian↗
NASA NTRSDate not supplied

Powder Bed Fusion Laser Beam Metals Additive Manufacturing: Process Monitoring Approaches for Qualification and Certification

The use of in-situ process monitoring is of interest to lower the cost of inspection for the qualification of powder bed fusion laser beam metal (PBF-LB/M) additively manufactured (AM) parts. Precise monitoring of the PBF-LB/M AM build process constitutes a multi-scale and multi-discipline task. There are several significant challenges to the in-situ approach: the synchronization of sensor signals to process steps; the physical interpretation and classification of sensor signals; managing very large datasets; and comparing the inputs with the observed monitoring signals. At NASA Langley Research Center, a configurable architecture additive testbed has been developed to monitor the build process with synchronized sensors. The philosophy and method adopted for the synchronization of the cameras with laser power and position throughout a complex PBF-LB/M AM build will be described. The synchronized in-situ monitoring signals are compared with ex-situ nondestructive inspection, x-ray computed tomography (XCT). Such comparisons permit a better understanding of how the sequential process actions of LPBF-AM can affect build quality. The multi-scale and complex process of printing additively manufactured (AM) parts can have unexpected, but predictable, build conditions that result in material microstructure variability. This presentation will describe an additive manufacturing model-based process metric (AM-PM) computational method that is a fully parallel reduced order modeling approach developed to evaluate the evolution of AM processes. This method couples the known sequence of the AM process with a physically informed nearest neighbors’ calculation to map the conditions of a part-scale build. The result is a map of the build that is derived directly from build files or in-situ process monitoring sensors. The methodology of the approach will be described and mapped to the porosity observed from XCT for a complex PBF-LB/M build. Such comparative results develop understanding of how the sequential process actions can affect the PBF-LB/M AM build quality and microstructure variability.

Laser Powder Bed Fusion↗
NASA NTRS2019

Optimization of Aluminum-Tin Ink Composition and Sintering in Atmospheric Conditions

This study will focus on the basics of generating an aluminum-tin ink that can sinter in air and exhibits properties near that of a solid aluminum-tin alloy. Sintering temperatures will also be assessed in this study. Once the optimal aluminum ink composition is determined, the optimal ink thickness for homogeneous sintering must be determined by additional experimentation. Additive manufacturing is a rapidly developing and growing manufacturing process and has proven successful in many different ways. Processes, such as extrusion three-dimensional (3D) printing and selective laser melting (SLM), have proven to work but have limitations, such as material capabilities or density issues. SLM is a revolutionary process for additive manufacturing of metals but cannot be used in outer space due to the need for metallic powder which would diffuse into the atmosphere in a zero-gravity environment. For this reason, metallic ink additive manufacturing is a potential solution. Work is being done on metallic ink additive manufacturing in a vacuum for electrical applications. This project has focused on developing an aluminum-tin metallic ink that can sinter without the need of a vacuum or inert gas-purged atmosphere in order to prevent oxidation of the aluminum by adding flux. Once a potential ink composition has been determined through sintering of small disks and thin layers of ink, the ink may be studied with a multimaterial 3D printer at NASA Marshall Space Flight Center (MSFC) in future experiments. If successful, this aluminum-tin ink will be capable for use on the International Space Station to make replacement parts quickly. Along with its zero-gravity advantages, this ink may also have applications on Earth because it may be extruded on a substrate with precise ceramic tips in a 3D printing process. This would allow the fabrication of precise, complex shapes and may generate a much faster and more efficient printing process as compared with traditional powder bed additive manufacturing processes. The process would not be limited by a small building volume because the system would not require an enclosed chamber.

Courtright, Z. S.↗
NASA NTRSDate not supplied

Additive Manufacturing Model-Based Process Metrics: Reduced Order Modeling of the Laser Powder Bed Fusion Process

The multi-scale and complex process of printing additively manufactured (AM) parts can have unexpected, but predictable, build conditions that result in material microstructure variability. In this work, we describe a fully parallel reduced order modeling approach that has been developed to evaluate the evolution of AM processes, termed the AM moment measure method. This method couples the known sequence of the AM process with a physically informed nearest neighbors’ calculation to map the conditions of a part-scale build. The result is a map of the build that is derived directly from build files or in-situ process monitoring sensors. The methodology and terminology of the approach will be described, and computed build maps will be calculated and compared for various laser powder bed fusion (LPBF) builds of Ti-6Al-4V. Such comparative results develop understanding of how the sequential process actions can affect the LPBF-AM build quality and microstructure variability.

Laser Powder Bed Fusion↗
NASA NTRS1990

High Tc superconducting materials and devices

The high Tc Y1Ba2Cu3O(7-x) ceramic materials, initially developed in 1987, are now being extensively investigated for a variety of engineering applications. The superconductor applications which are presently identified as of most interest to NASA-LaRC are low-noise, low thermal conductivity grounding links; large-area linear Meissner-effect bearings; and sensitive, low-noise sensors and leads. Devices designed for these applications require the development of a number of processing and fabrication technologies. Included among the technologies most specific to the present needs are tapecasting, melt texturing, magnetic field grain alignment, superconductor/polymer composite fabrication, thin film MOD (metal-organic decomposition) processing, screen printing of thick films, and photolithography of thin films. The overall objective of the program was to establish a high Tc superconductivity laboratory capability at NASA-LaRC and demonstrate this capability by fabricating superconducting 123 material via bulk and thin film processes. Specific objectives include: order equipment and set up laboratory; prepare 1 kg batches of 123 material via oxide raw material; construct tapecaster and tapecaster 123 material; fabricate 123 grounding link; fabricate 123 composite for Meissner linear bearing; develop 123 thin film processes (nitrates, acetates); establish Tc and Jc measurement capability; and set up a commercial use of space program in superconductivity at LaRC. In general, most of the objectives of the program were met. Finally, efforts to implement a commercial use of space program in superconductivity at LaRC were completed and at least two industrial companies have indicated their interest in participating.

Haertling, Gene H.↗
NASA NTRSDate not supplied

Additively Manufactured Ink-based Cell Batteries for Flexible Conformational Applications

With the rise of additively manufactured electronics, the importance of thin, flexible printed batteries has increased for shape-conformal electronics. Traditionally, battery cells such as industry-standard lithium-ion batteries, have been rigid and therefore unable to conform to time-variant surfaces such as smart cards/RFID devices, disposable battery-powered skin patches, foldable electronic devices, and IoT nodes. Aligned with the effort to advance technologies on printed electronics for habitat systems and advanced manufacturing, this proof-of-concept will focus on printing a 50 mAh Zn-Ag battery implementing a DIW Technique. After prototype manufacturing, electrical and environmental testing on the flexible battery cell will be conducted to the evaluate energy and power density over 50 charge cycles under standard atmosphere conditions. The project aims to provide PCB designers, fabricators, and assemblers an integrated battery package to eliminate external batteries, external wiring and connectors, and conformational complexity. Potential end uses of the printed battery process will be within Martian and lunar habitat systems, Gateway, and surface vehicles, or aerial robots where space and geometry is a restriction.

Printed Electronics↗