Search NASA⌕ Search

SEARCH · Search NASA

Results for “Screen printing”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

Investigating reliability attributes of silicon photovoltaic cells - An overview

Reliability attributes are being developed on a wide variety of advanced single-crystal silicon solar cells. Two separate investigations: cell-contact integrity (metal-to-silicon adherence), and cracked cells identified with fracture-strength-reducing flaws are discussed. In the cell-contact-integrity investigation, analysis of contact pull-strength data shows that cell types made with different metallization technologies, i.e., vacuum, plated, screen-printed and soldered, have appreciably different reliability attributes. In the second investigation, fracture strength was measured using Czochralski wafers and cells taken at various stages of processing and differences were noted. Fracture strength, which is believed to be governed by flaws introduced during wafer sawing, was observed to improve (increase) after chemical polishing and other process steps that tend to remove surface and edge flaws.

Royal, E. L.↗
NASA NTRS1982

Investigation of reliability attributes and accelerated stress factors on terrestrial solar cells

The accelerated stress test results obtained on all terrestrial solar cells since the inception of the program are summarized. Tested cells were grouped according to the method used to form the conductive metallization layer: solder dipped, vacuum deposited, screen printed, and copper plated. Although metallization systems within each group were quite similar, they differed in numerous details according to the procedures employed by each manufacturer. Test results were summarized for all cells according to both electrical degradation and catastrophic mechanical changes. These results indicated a variability within each metallization category which was dependent on the manufacturer. Only one manufacturer was represented in the copper plated category and, although these showed no signs of detrimental copper diffusion during high temperature testing, their metallization was removed easily during high humidity pressure cooker testing. Preliminary testing of encapsulated cells showed no major differences between encapsulated and unencapsulated cells when subjected to accelerated testing.

Lathrop, J. W.↗
NASA NTRS1982

Development of technique for air coating and nickel and copper metalization of solar cells

Solar cells were made with a variety of base metal screen printing inks applied over silicon nitride AR coating and copper electroplated. Fritted and fritless nickel and fritless tin base printing inks were evaluated. Conversion efficiencies as high as 9% were observed with fritted nickel ink contacts, however, curve shapes were generally poor, reflecting high series resistance. Problems encountered in addition to high series reistance included loss of adhesion of the nickel contacts during plating and poor adhesion, oxidation and inferior curve shapes with the tin base contacts.

Source record↗
NASA NTRS1983

Development of metallization process

Solar cells were produced using a Mo/Sn/TiH screen printed paste with a lead/borosilicate frit that are electrically comparable to control silver cells. The process is currently unsuccessful because the soldering of interconnects to these cells has proved difficult. Future work will investigate using CO instead of H2 as the reducing gas and putting an ITO coating on the cell prior to metallization.

Garcia, A., III↗
NASA NTRS1983

Non-noble metal based metallization systems

The results of efforts to produce a nonsilver metallization system for silicon photovoltaic cells are given. The system uses a metallization system based on molybdenum, tin, and titanium hydride. The initial work in this system was done using the MIDFILM process. The MIDFILM process attains a line resolution comparable to photoresist methods with a process related to screen printing. The surface to be processed is first coated with a thin layer of photopolymer material. Upon exposure to ultraviolet light through a suitable mask, the polymer in the non-pattern area crosslinks and becomes hard. The unexposed pattern areas remain tacky. The conductor material is then applied in the form of a dry mixture of metal which adheres to the tacky pattern area. The assemblage is then fired to ash the photopolymer and sinter the conductor powder.

Garcia, A., III↗
NASA NTRS1984

Development of metallization process. FSA project, cell and module formation research area

New pastes were evaluated that contained additives to aid in the silicon-to-metallization contact. None were completely successful. A reevaluation of the molybdenum oxide paste and the two-step screen printing process was done. The oxide paste did not show promise. The two-step process enabled soldering of the cells but the cells still had a high series resistance. Pastes are on order from a different manufacturer.

Garcia, A., III↗
NASA NTRS1984

A non-noble front metallization process

The optimization, evaluation, and demonstration of a solar cell metallization system is discussed. Screen printing, air firing, reducted atmospheres, and conductive air coating were studied.

Garcia, A., III↗
NASA NTRS1985

Development of metallization process: FSA project, cella and module formation research area

The optimization, evaluation, and demonstration of a novel metallization applied by a screen printing process is examined. Based on previous results of High Resolution, Low Cost Solar Cell Contact Development, a paste consisting of molybdenum, tin, and titanium hydride was selected as the promising composition. No satisfactory cells were made using any of the molybdenum/tin pastes used as a complete replacement for conventional silver pastes. The major problem is the inability to form a bond between the pastes and silicon that withstands soldering.

Garcia, A., III↗
NASA NTRS1986

Metalizing Solar Cells by Selective Electroplating

Contact patterns traced by laser scanning. Conductor paths deposited on silicon solar-cell wafers by laser irradiation followed by electroplating. Laser-assisted metalization technique offers better resolution and lower contact resistance than does conventional metalization by screen printing. At the same time, less expensive than metalization with masks and photolithography.

Dutta, S.↗
NASA NTRS1985

Real-time SEM studies in controlled reactive atmospheres

A unique scanning electron accessory has been developed that allows the observation of specimens under partial pressures of any gas. The sample is placed in a metal support boat inside a special sample holder. The sample in the boat is imaged on a CRT and is simultaneously recorded on a videotape, allowing the reaction between the sample and the gas to be observed in real time. Sample changes can be seen continuously as the sample is being heated or cooled. This process allows the observation of material transformations such as phase changes as they happen. Temperatures as high as 1000 C have been used and are continuously monitored using a thermocouple with a digital display on the CRT and videotape. X-ray analyses can also be run before and after any reactions. In the study described here, thick-film screen-printing inks using molybdenum/tin compositions as a replacement for silver were developed to be used on terrestrial photovoltaic cells. Pieces were placed on the sample stage and heated in both O2 and H2 atmospheres. The results were used to determine the most effective frits to be used in the thick-film inks.

Gallagher, B. D.↗
NASA NTRS1987

Ink jet assisted metallization for low cost flat plate solar cells

Computer-controlled ink-jet-assisted metallization of the front surface of solar cells with metalorganic silver inks offers a maskless alternative method to conventional photolithography and screen printing. This method can provide low cost, fine resolution, reduced process complexity, avoidance of degradation of the p-n junction by firing at lower temperature, and uniform line film on rough surface of solar cells. The metallization process involves belt furnace firing and thermal spiking. With multilayer ink jet printing and firing, solar cells of about 5-6 percent efficiency without antireflection (AR) coating can be produced. With a titanium thin-film underlayer as an adhesion promoter, solar cells of average efficiency 8.08 percent without AR coating can be obtained. This efficiency value is approximately equal to that of thin-film solar cells of the same lot. Problems with regard to lower inorganic content of the inks and contact resistance are noted.

Teng, K. F.↗
NASA NTRS1989

Portable Pull Tester

In new tester, dc motor controlled by personal computer drives lead screw. Lead screw attached to load cell and to test button bonded to specimen of material under test. Data examined on computer screen, printed out, or transmitted to larger computer for analysis. Monitors speed of motor to maintain it constant, provides constant rate of pull. Cart holds computer, printer, and motor-driving circuits so moved easily to test site.

Golden, Harry E.↗
NASA NTRS1990

High Tc superconducting materials and devices

The high Tc Y1Ba2Cu3O(7-x) ceramic materials, initially developed in 1987, are now being extensively investigated for a variety of engineering applications. The superconductor applications which are presently identified as of most interest to NASA-LaRC are low-noise, low thermal conductivity grounding links; large-area linear Meissner-effect bearings; and sensitive, low-noise sensors and leads. Devices designed for these applications require the development of a number of processing and fabrication technologies. Included among the technologies most specific to the present needs are tapecasting, melt texturing, magnetic field grain alignment, superconductor/polymer composite fabrication, thin film MOD (metal-organic decomposition) processing, screen printing of thick films, and photolithography of thin films. The overall objective of the program was to establish a high Tc superconductivity laboratory capability at NASA-LaRC and demonstrate this capability by fabricating superconducting 123 material via bulk and thin film processes. Specific objectives include: order equipment and set up laboratory; prepare 1 kg batches of 123 material via oxide raw material; construct tapecaster and tapecaster 123 material; fabricate 123 grounding link; fabricate 123 composite for Meissner linear bearing; develop 123 thin film processes (nitrates, acetates); establish Tc and Jc measurement capability; and set up a commercial use of space program in superconductivity at LaRC. In general, most of the objectives of the program were met. Finally, efforts to implement a commercial use of space program in superconductivity at LaRC were completed and at least two industrial companies have indicated their interest in participating.

Haertling, Gene H.↗
NASA NTRS1992

An acetate precursor process for BSCCO (2223) thin films and coprecipitated powders

Since the discovery of high temperature superconducting oxides much attention has been paid to finding better and useful ways to take advantage of the special properties exhibited by these materials. One such process is the development of thin films for engineering applications. Another such process is the coprecipitation route to producing superconducting powders. An acetate precursor process for use in thin film fabrication and a chemical coprecipitation route to Bismuth based superconducting materials has been developed. Data obtained from the thin film process were inconclusive to date and require more study. The chemical coprecipitation method of producing bulk material is a viable method, and is preferred over the previously used solid state route. This method of powder production appears to be an excellent route to producing thin section tape cast material and screen printed devices, as it requires less calcines than the oxide route to produce quality powders.

Haertling, Gene H.↗
NASA NTRS1992

Superconductivity devices: Commercial use of space

High T sub C superconducting thick film were prepared by a screen printing process. Y-based (YBa2Cu3O(7-x) superconducting thick film were printed on 211/Al2O3, SNT/Al2O3, and YSZ substrates. Because of poor adhesion of the superconductor thick films to 211/Al2O3 and SNT/Al2O3 substrates, relatively low T sub C and J sub C values were obtained from the films printed on these substrates. Critical temperatures (T sub C) of YBa2Cu3O(7-x) thick films deposited on 211/Al2O3 and SNT/Al2O3 substrates were about 80 K. The critical current densities (J sub C) of these films were less than 2 A/sq cm. Higher T sub C and J sub C YBa2Cu3O(7-x) thick films were printed on YSZ substrates. A YBa2Cu3O(7-x) thick film with T sub C=86.4 and J sub C= 50.4 A/sq cm was prepared by printing the film on YSZ substrate and firing at 990 C for 10 minutes. Multiple-lead samples were also prepared on the YSZ substrates. The multiple-lead samples showed lower T sub C and/or J sub C values than those of the plain samples. The electrical properties of YBa2Cu3O(7-x) thick films were determined by the microstructures of the films. The YBa2Cu3O(7-x) thick films printed on the YSZ substrates, which had the best properties among the films printed on the three different kinds of substrates, had the highest density and the best particle interconnection. The YBa2Cu3O(7-x) thick films with preferred orientation in (001) direction were obtained on the YSZ substrates. Cracks, which retard the properties of the films, were found from the films deposited on the YSZ substrates. Currently, a MSZ (Magnesium Stabilized Zirconia) substrate, which had higher thermal expansion coefficient than the YSZ substrate, is used as substrate for the YBa2Cu3O(7-x) thick film in order to eliminate the cracks on the film. Bi-based superconductor thick films were printed on polycrystalline MgO and YSZ substrates. Interactions between BSCCO thick films and the YSZ substrates were observed. Various buffer layer materials were applied onto the substrates in order to avoid the interactions between the BSCCO thick films and the ZrO2-based substrates. So far, a BSCCO printed on MgO substrate with T Sub C=89K was obtained. The J sub C of the film was lower than 0.1 A/sq cm by reason of poor interconnectivity of the BSCCO particles.

Haertling, Gene↗
NASA NTRS1993

High-Tc thermal bridges for space-borne cryogenic infrared detectors

The potential for using high-temperature superconductive elements, screen-printed onto ceramic substrates, as thermal bridges to replace the currently employed manganin wires is studied at NASA-LaRC. Substrate selection is considered to be the most critical parameter in device production. Due to the glass-like thermal behavior of yttria-stabilized-zirconia (YSZ) and fused silica substrates, these materials are found to reduce the heat load significantly. The estimated thermal savings for superconductive leads printed onto YSZ or fused silica substrates range from 6 to 14 percent.

Wise, S. A.↗
NASA NTRS1993

Superconductivity devices: Commercial use of space

The processing and screen printing of the superconducting BSCCO and 123 YBCO materials on substrates is described. The resulting superconducting properties and the use of these materials as possible electrode materials for ferroelectrics at 77 K are evaluated. Also, work performed in the development of solid-state electromechanical actuators is reported. Specific details include the fabrication and processing of high strain PBZT and PLZT electrostrictive materials, the development of PSZT and PMN-based ceramics, and the testing and evaluation of these electrostrictive materials. Finally, the results of studies on a new processing technology for preparing piezoelectric and electrostrictive ceramic materials are summarized. The process involves a high temperature chemical reduction which leads to an internal pre-stressing of the oxide wafer. These reduced and internally biased oxide wafers (RAINBOW) can produce bending-mode actuator devices which possess a factor of ten more displacement and load bearing capacity than present-day benders.

Haertling, Gene↗