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At least 55 records · Page 3

External-Field-Induced Phase Transformation and Associated Properties in a Ni 50 Mn 34 Fe 3 In 13 Metamagnetic Shape Memory Wire

Metamagnetic shape memory alloys exhibit a series of intriguing multifunctional properties and have great potential for applications in magnetic actuation, sensing and magnetic refrigeration. However, the poor mechanical properties of these alloys with hardly any tensile deformability seriously limit their practical application. In the present work, we developed a Ni-Fe-Mn-In microwire that exhibits both a giant, tensile superelasticity and a magnetic-field-induced first-order phase transformation. The recoverable strain of superelasticity is more than 20% in the temperature range of 233–283 K, which is the highest recoverable strain reported heretofore in Ni-Mn-based shape memory alloys (SMAs). Moreover, the present microwire exhibits a large shape memory effect with a recoverable strain of up to 13.9% under the constant tensile stress of 225 MPa. As a result of the magnetic-field-induced first-order phase transformation, a large reversible magnetocaloric effect with an isothermal entropy change ΔS m of 15.1 J kg –1 K –1 for a field change from 0.2 T to 5 T was achieved in this microwire. The realization of both magnetic-field and tensile-stress-induced transformations confers on this microwire great potential for application in miniature multi-functional devices and provides an opportunity for multi-functional property optimization under coupled multiple fields.

36 MATERIALS SCIENCE↗

Ruggedness Evaluation of ASTM International Standard Test Methods for Shape Memory Materials: E3097 Standard Test Method for Mechanical Uniaxial Constant Force Thermal Cycling of Shape Memory Alloys

This paper evaluates the ruggedness testing of the newly released ASTM International E3097 Standard Test Method for Mechanical Uniaxial Constant Force Thermal Cycling of Shape Memory Alloys. The ruggedness experiment was designed with eight runs in two replicates, consisting of seven factors of strain rate (ė), heating and cooling rates (T(sub heat) and T(sub cool), respectively), upper and lower cycle temperatures (UCT and LCT, respectively), hold time (t(sub hold)), and minimum load (F(sub min)) imparted on the samples. The results indicate that the hold time factor had no effect on any result variable. The minimum load factor, alternatively, had the greatest effect on several result variables, with the greatest influence on the strains at martensite start and finish (strain variation ~0.1 percent), and the strains at the upper and lower cycle temperatures (strain variation of 0.14 percent). The UCT was found to have a large effect on the austenite and martensite finish tangent line and data intersect, denoted by A(sub f(sup *)) and M(sub f(sup*)), by ~17 and 4 °C, respectively. The testing methodology, analysis techniques, and resulting conclusions on the ruggedness of the test methods are presented.

Benafan, Othmane↗

Ruggedness Evaluation of ASTM International Standard Test Methods for Shape Memory Materials: E3098 Standard Test Method for Mechanical Uniaxial Pre-strain and Thermal Free Recovery of Shape Memory Alloys

This paper evaluates the ruggedness testing of the recently released ASTM International E3098 Standard Test Method for Mechanical Uniaxial Pre-strain and Thermal Free Recovery of Shape Memory Alloys. The ruggedness experiment was designed with eight runs in two replicates, consisting of seven factors: strain rate (ė), heating and cooling rates (Ṫ heat and Ṫ cool , respectively), upper and lower cycle temperatures (UCT and LCT, respectively), hold time (t hold ), and minimum load (F min ) imparted on the samples. The results indicate that the strain rate factor had no effect on any result variable, whereas the minimum load factor had a large effect on several result variables including the austenite start and martensite finish temperatures as well as most of the strain measurements from the thermal cycle. The lower cycle temperature factor had a large effect on the stress at maximum strain during pre-straining (e i ), denoted by S i , at ~7.2 MPa, as well as the A f , at 5.47 °C. Closely following the LCT effect, Ṫ heat was found to have a large effect on the austenite start temperature (A s ), at a value of ~2.72 °C. The testing methodology, analysis techniques, and resulting conclusions on the ruggedness of the test method are presented.

Shape memory alloys↗

Efficient thermal management of Li-ion batteries with a passive interfacial thermal regulator based on a shape memory alloy [A passive interfacial thermal regulator based on shape memory alloy and its application to battery thermal management]

The poor performance of lithium-ion batteries in extreme temperatures is hindering their wider adoption in the energy sector. A fundamental challenge in battery thermal management systems (BTMSs) is that hot and cold environments pose opposite requirements: thermal transmission at high temperature for battery cooling, and thermal isolation at low temperature to retain the batteries’ internally generated heat, leading to an inevitable compromise of either hot or cold performances. Here, we demonstrate a thermal regulator that adjusts its thermal conductance as a function of the temperature, just as desired for the BTMS. Without any external logic control, this thermal regulator increases battery capacity by a factor of 3 at an ambient temperature (T ambient ) of -20 °C in comparison to a baseline BTMS that is always thermally conducting, while also limiting the battery temperature rise to 5 °C in a very hot environment (T ambient = 45 °C) to ensure safety. The result expands the usability of lithium-ion batteries in extreme environments and opens up new applications of thermally functional devices.

25 ENERGY STORAGE↗

Bidirectional shape memory device

A resistively heated shape memory polymer device is operated using resistive heating to heat the shape memory polymer device. The resistively heated shape memory polymer device is made by providing a wire that includes a resistive medium. The wire is coated with a first shape memory polymer. The wire is exposed and electrical leads are attached to the wire. In one embodiment the shape memory polymer device is in the form of a clot destruction device. In another embodiment the shape memory polymer device is in the form of a microvalve. In another embodiment the shape memory polymer device is in the form of a micropump. In yet another embodiment the shape memory polymer device is in the form of a thermostat or relay switch.

36 MATERIALS SCIENCE↗

Bidirectional shape memory device

A resistively heated shape memory polymer device is operated using resistive heating to heat the shape memory polymer device. The resistively heated shape memory polymer device is made by providing a wire that includes a resistive medium. The wire is coated with a first shape memory polymer. The wire is exposed and electrical leads are attached to the wire. In one embodiment the shape memory polymer device is in the form of a clot destruction device. In another embodiment the shape memory polymer device is in the form of a microvalve. In another embodiment the shape memory polymer device is in the form of a micropump. In yet another embodiment the shape memory polymer device is in the form of a thermostat or relay switch.

Marion, III, John E.↗

Design, characterization and shape recovery behavior of 3D/4D printed shape memory polymers (SMPs)

Shape memory polymers (SMPs) represent a paradigm shift in material science, uniquely capable of undergoing reversible shape transformations triggered by external stimuli, positioning them as pivotal in developing next-generation biomedical devices, aerospace components, and adaptive structures. Extensive research has been done on SMPs with a major focus on high-temperature programming methods, which can limit energy efficiency and applicability with temperature-sensitive materials. Additionally, while various SMP blends have demonstrated great potential, limited work has been done on the suitability for 3D printing these materials, particularly under high-strain and ambient temperature programming conditions. In this study, a three-component optimized SMP composition was evaluated by 3D printing via the Material Extrusion (MEX) technique and investigating its ambient temperature-programming behavior at high strains. The SMP formulation studied was a tailored blend of thermoplastic polyurethane (TPU), polycaprolactone (PCL), and an octadecane diol-based copolymer (OBC) that exhibits robust shape memory behavior, high strain tolerance, and efficient force generation. Rigorous thermal, mechanical, and shape recovery analyses, along with optimized printing parameters and consistent shape recovery rates of up to 90%, were achieved under dynamic mechanical analysis (DMA), even under ambient programming conditions. This work demonstrates the SMP composition’s potential for adaptive, self-deployable systems with 4D printing characteristics ideal for bio-inspired structures and artificial muscle fibers.

Sudan, Kavish [University of Louisville, KY]↗

Effect of Thermomechanical Processing on the Microstructure, Properties, and Work Behavior of a Ti50.5 Ni29.5 Pt20 High-Temperature Shape Memory Alloy

TiNiPt shape memory alloys are particularly promising for use as solid state actuators in environments up to 300 C, due to a reasonable balance of properties, including acceptable work output. However, one of the challenges to commercializing a viable high-temperature shape memory alloy (HTSMA) is to establish the appropriate primary and secondary processing techniques for fabrication of the material in a required product form such as rod and wire. Consequently, a Ti(50.5)Ni(29.5)Pt20 alloy was processed using several techniques including single-pass high-temperature extrusion, multiple-pass high-temperature extrusion, and cold drawing to produce bar stock, thin rod, and fine wire, respectively. The effects of heat treatment on the hardness, grain size, room temperature tensile properties, and transformation temperatures of hot- and cold-worked material were examined. Basic tensile properties as a function of temperature and the strain-temperature response of the alloy under constant load, for the determination of work output, were also investigated for various forms of the Ti(50.5)Ni(29.5)Pt20 alloy, including fine wire.

Noebe, Ronald↗

Constitutive Models for Shape Memory Alloy Polycrystals

Shape memory alloys (SMA) exhibiting the superelastic or one-way effects can produce large recoverable strains upon application of a stress. In single crystals this stress and resulting strain are very orientation dependent. We show experimental stress/strain curves for a Ni-Al single crystal for various loading orientations. Also shown are model predictions; the open and closed circles indicate recoverable strains obtained at various stages in the transformation process. Because of the strong orientation dependence of shape memory properties, crystallographic texture can be expected to play an important role in the mechanical behavior of polycrystalline SMA. It is desirable to formulate a constitutive model to better understand and exploit the unique properties of SMA.

Comstock, R. J., Jr.↗

Magnetic and magneto-transport studies of substrate effect on the martensitic transformation in a NiMnIn shape memory alloy

The effect of substrates on the magnetic and transport properties of Ni{sub 2}Mn{sub 1.5}In{sub 0.5} ultra-thin films were studied theoretically and experimentally. High quality 8-nm films were grown by laser-assisted molecular beam epitaxy deposition. Magneto-transport measurements revealed that the films undergo electronic structure transformation similar to those of bulk materials at the martensitic transformation. The temperature of the transformation depends strongly on lattice parameters of the substrate. To explain this behavior, we performed DFT calculations on the system and found that different substrates change the relative stability of the ferromagnetic (FM) austenite and ferrimagnetic (FiM) martensite states. We conclude that the energy difference between the FM austenite and FiM martensite states in Ni{sub 2}Mn{sub 1.5}In{sub 0.5} films grown on MgO (001) substrates is ΔE = 0.20 eV per NiMnIn f.u, somewhat lower compared to ΔE = 0.24 eV in the bulk material with the same lattice parameters. When the lattice parameters of Ni{sub 2}Mn{sub 1.5}In{sub 0.5} film have values close to those of the MgO substrate, the energy difference becomes ΔE = 0.08 eV per NiMnIn f.u. These results suggest the possibility to control the martensitic transition in thin films through substrate engineering.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗