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At least 55 records · Page 3

Finite element simulations of thermosolutal convection in vertical solidification of binary alloys

Dendritic vertical solidification of a binary alloy is modeled using the finite element method to assess the effect of thermosolutal convection in macrosegregation. The mathematical model assumes steady-state solidification with a planar, undeformable surface defined by the dendrite tips and the eutectic isotherm. The dendritic region is assumed to advance at a constant solidification velocity v. The stability of the modeled system has been investigated and nonlinear calculations performed that show finger-like convection when the system is unstable. Results for lead-tin alloys show that when the system is unstable, convection is only significant in the uppermost part of the mush and is entirely driven by convection in the bulk fluid.

Heinrich, J. C.↗

Vertical solidification of dendritic binary alloys

Three numerical techniques are employed to analyze the influence of thermosolutal convection on defect formation in directionally solidified (DS) alloys. The finite-element models are based on the Boussinesq approximation and include the plane-front model and two plane-front models incorporating special dendritic regions. In the second model the dendritic region has a time-independent volume fraction of liquid, and in the last model the dendritic region evolves as local conditions dictate. The finite-element models permit the description of nonlinear thermosolutal convection by treating the dendritic regions as porous media with variable porosities. The models are applied to lead-tin alloys including DS alloys, and severe segregation phenomena such as freckles and channels are found to develop in the DS alloys. The present calculations and the permeability functions selected are shown to predict behavior in the dendritic regions that qualitatively matches that observed experimentally.

Heinrich, J. C.↗

Optimization of Aluminum-Tin Ink Composition and Sintering in Atmospheric Conditions

This study will focus on the basics of generating an aluminum-tin ink that can sinter in air and exhibits properties near that of a solid aluminum-tin alloy. Sintering temperatures will also be assessed in this study. Once the optimal aluminum ink composition is determined, the optimal ink thickness for homogeneous sintering must be determined by additional experimentation. Additive manufacturing is a rapidly developing and growing manufacturing process and has proven successful in many different ways. Processes, such as extrusion three-dimensional (3D) printing and selective laser melting (SLM), have proven to work but have limitations, such as material capabilities or density issues. SLM is a revolutionary process for additive manufacturing of metals but cannot be used in outer space due to the need for metallic powder which would diffuse into the atmosphere in a zero-gravity environment. For this reason, metallic ink additive manufacturing is a potential solution. Work is being done on metallic ink additive manufacturing in a vacuum for electrical applications. This project has focused on developing an aluminum-tin metallic ink that can sinter without the need of a vacuum or inert gas-purged atmosphere in order to prevent oxidation of the aluminum by adding flux. Once a potential ink composition has been determined through sintering of small disks and thin layers of ink, the ink may be studied with a multimaterial 3D printer at NASA Marshall Space Flight Center (MSFC) in future experiments. If successful, this aluminum-tin ink will be capable for use on the International Space Station to make replacement parts quickly. Along with its zero-gravity advantages, this ink may also have applications on Earth because it may be extruded on a substrate with precise ceramic tips in a 3D printing process. This would allow the fabrication of precise, complex shapes and may generate a much faster and more efficient printing process as compared with traditional powder bed additive manufacturing processes. The process would not be limited by a small building volume because the system would not require an enclosed chamber.

Courtright, Z. S.↗

Evaluating Iodine Immobilization Technologies: Cermets, Polycermets, and Polyhalmets

The work in this report documents the efforts conducted to assess the feasibility of some of the ideas documented in Pacific Northwest National Laboratory invention disclosure reports (IDRs) including: 1) Iodine capture in polyacrylonitrile (PAN)-containing composite sorbents (32451-E). In this work, the composites evaluated included Ag0, Bi0, Cu0, Bi2S3, and Cu2S embedded in PAN. 2) Metal iodide removal from these sorbents through dissolution in dimethyl sulfoxide (DMSO) (32729-E). In this work, PAN dissolution was evaluated for multiple types of sorbents including Ag-Pan, Bi-PAN, Cu-PAN, Bi2S3-PAN, and Cu2S-PAN. 3) Using metal-sulfide sorbents for iodine capture (32647-E). In this work, the composites evaluated under this IDR included Ag2S, Bi2S3, and Cu2S embedded in PAN. 4) Using low-melting metals to immobilize (encapsulate) iodine-loaded and polymer-containing sorbents into polymer-ceramic-metal (called polycermet) or polymer-halide-metal (called polyhalmet) composite waste forms (32625-E). In this work, the iodine-loaded PAN composites included AgI-PAN, BiI-PAN, and CuI-PAN. 5) Ceramic-metal composite waste form synthesis of polymer-containing materials using low-melting metals like bismuth, tin, or bismuth-tin alloys (32537-E). In this work, the metals evaluated included Bi, 58Bi-42Sn eutectic. 6) Cermets for immobilizing commercial sorbents loaded with radioiodine (32806-E). In this work, AgIX (iodine-loaded silver faujasite zeolite) was evaluated in cermet form.

38 RADIATION CHEMISTRY, RADIOCHEMISTRY, AND NUCLEA↗

Molybdenum-tin as a solar cell metallization system

The operations of solar cell manufacture are briefly examined. The formation of reliable, ohmic, low-loss, and low-cost metal contacts on solar cells is a critical process step in cell manufacturing. In a commonly used process, low-cost metallization is achieved by screen printing a metal powder-glass frit ink on the surface of the Si surface and the conductive metal powder. A technique utilizing a molybdenum-tin alloy for the metal contacts appears to lower the cost of materials and to reduce process complexity. The ink used in this system is formulated from MoO3 with Sn powder and a trace amount of titanium resonate. Resistive losses of the resulting contacts are low because the ink contains no frit. The MoO3 is finally melted and reduced in forming gas (N2+H2) to Mo metal. The resulting Mo is highly reactive which facilitates the Mo-Si bonding.

Boyd, D. W.↗

Double-diffusive convection and its effect under reduced gravity

This paper reviews recent results on three aspects of double-diffusive convection under reduced gravity: diffusive instability caused by sideways heating, diffusive instability caused by bottom heating, and the salt-finger convection case. Some of the processes that are likely to occur during solidification are highlighted. Using property values of lead-tin alloy, it is concluded that diffusive instabilities are unlikely to occur at steady reduced gravity levels of 0.01 and 0.0001 g(0). Salt finger convection is likely to be generated, however.

Chen, C. F.↗

High Temperature - Thin Film Strain Gages Based on Alloys of Indium Tin Oxide

A stable, high temperature strain gage based on reactively sputtered indium tin oxide (ITO) was demonstrated at temperatures up to 1050 C. These strain sensors exhibited relatively large, negative gage factors at room temperature and their piezoresistive response was both linear and reproducible when strained up to 700 micro-in/in. When cycled between compression and tension, these sensors also showed very little hysteresis, indicating excellent mechanical stability. Thin film strain gages based on selected ITO alloys withstood more than 50,000 strain cycles of +/- 500 micro-in/in during 180 hours of testing in air at 1000 C, with minimal drift at temperature. Drift rates as low as 0.0009%/hr at 1000 C were observed for ITO films that were annealed in nitrogen at 700 C prior to strain testing. These results compare favorably with state of the art 10 micro-m thick PdCr films deposited by NASA, where drift rates of 0.047%/hr at 1050 C were observed. Nitrogen annealing not only produced the lowest drift rates to date, but also produce the largest dynamic gage factors (G = 23.5). These wide bandgap, semiconductor strain sensors also exhibited moderately low temperature coefficients of resistance (TCR) at temperatures up to 1100 C, when tested in a nitrogen ambient. A TCR of +230 ppm/C over the temperature range 200 C < T < 500 C and a TCR of -469 ppm/C over the temperature range 600 C < T < 1100 C was observed for the films tested in nitrogen. However, the resistivity behavior changed considerably when the same films were tested in oxygen ambients. A TCR of -1560 ppm/C was obtained over the temperature range of 200 C < T < 1100 C. When similar films were protected with an overcoat or when ITO films were prepared with higher oxygen contents in the plasma, two distinct TCR's were observed. At T < 800 C, a linear TCR of -210 ppm/C was observed and at T > 800 C, a linear TCR of -2170 DDm/C was observed. The combination of a moderately low TCR and a relatively large gage factor make these semiconducting oxide films promising candidates for the active strain elements in high temperature thin film strain gages, particularly in applications where static strain measurement is desired.

Gregory, Otto J.↗

Cycling-Induced Microstructural Changes in Alloy Anodes for Lithium-Ion Batteries

Abstract High-capacity electrochemical alloying materials, such as tin and tin-based alloys, present an opportunity for the advancement of lithium-ion batteries. However, the destructive effects of volumetric expansion must be mitigated in order to sustain this high capacity during extended cycling. One way to mitigate these effects is by alloying Sn with more malleable metals to accommodate the strain related to severe volumetric expansion. Ex situ X-ray microtomography data of cycled Cu6Sn5 pellets were used to quantify the microstructural changes that occur during lithiation and delithiation. The microtomography data were segmented into three distinct phases to evaluate phase size distributions, specific surface area, and tortuosity. Electrodes lithiated and then delithiated showed the most substantial reduction in overall phase sizes. This suggests that full lithiation of the Sn followed by partial delithiation of the Li4.4Sn to Li2CuSn can cause substantial microstructural changes related to volume expansion on lithiation and structural collapse upon delithiation. When considering other microstructural characteristics, this subset of the electrodes analyzed showed the highest tortuosity values. These results show that in addition to the mechanical degradation of the electrodes, excessive volume expansion can also influence transport networks in the active material and supporting phases of the electrode. While based on studies of the active–inactive alloy Cu6Sn5 for lithium-ion battery applications, the insights obtained are expected to be applicable to other alloy electrodes and battery chemistries.

Electrochemistry↗

Macrosegregation in undercooled Pb-Sn eutectic alloys

A novel technique resulting in large undercoolings in bulk samples (23g) of lead-tin eutectic alloy is described. Samples of eutectic composition were processed with undercoolings ranging from 4 to 20 K and with cooling rates varying between 0.04 to 4 K/sec. The final macrostructure of undercooled samples depends on both the initial undercooling of the melt and the cooling rate. Gravity-driven segregation is found to increase with increasing undercooling. A eutectic Pb-Sn alloy undercooled at 20 K and cooled at 4 K/sec had a composition of about Pb-72 wt pct Sn at the top and 55 pct Sn at the bottom. Macrosegregation in these undercooled lead-tin eutectic alloys is shown to be primarily due to a sink/float mechanism caused by the difference in density of the solid and liquid phases and the undercooling and nucleation behavior of the alloy.

De Groh, H. C., III↗

Evaluating MetGlasTM Solderability with Tin-Silver-Copper and Tin-Silver-Bismuth Solder Alloys

The solderability of MetGlas TM (subsidiary of Hitachi Metals, America Ltd) 2826 MB, a rapidly solidified metallic foil, was evaluated by the meniscus height/wetting force method for tin-silver-copper (SnAgCu) and tin-silver-bismuth (SnAgBi) solders to understand the effects of the extreme non-equilibrium condition of the MetglasTM surface on solderability performance. Of the variables studied here (solder temperature, heat treatment, and solder composition), solder composition had the largest impact on contact angle. Flux and foil composition remained constant throughout; but, these factors would also be predicted to significantly affect solderability. A greater understanding of the manner whereby non-equilibrium cooling affects solderability of these foils will broaden the application of soldering technology of structures fabricated by rapid cooling process (i.e. additively manufactured coatings and parts). Developing a robust database for Pb-free solderability behavior is also necessary, as industry transitions from tin-lead (SnPb) to lead free (Pb-free) solders.

36 MATERIALS SCIENCE↗

Understanding Stabilization in Nanoporous Intermetallic Alloy Anodes for Li-Ion Batteries Using Operando Transmission X-ray Microscopy

Tin-based alloying anodes are exciting due to their high energy density. Unfortunately, these materials pulverize after repetitive cycling due to the large volume expansion during lithiation and delithiation; both nanostructuring and intermetallic formation can help alleviate this structural damage. Here, these ideas are combined in nanoporous antimony–tin (NP-SbSn) powders, synthesized by a simple and scalable selective-etching method. The NP-SbSn exhibits bimodal porosity that facilitates electrolyte diffusion; those void spaces, combined with the presence of two metals that alloy with lithium at different potentials, further provide a buffer against volume change. This stabilizes the structure to give NP-SbSn good cycle life (595 mAh/g after 100 cycles with 93% capacity retention). Operando transmission X-ray microscopy (TXM) showed that during cycling NP-SbSn expands by only 60% in area and then contracts back nearly to its original size with no physical disintegration. The pores shrink during lithiation as the pore walls expand into the pore space and then relax back to their initial size during delithiation with almost no degradation. Importantly, the pores remained open even in the fully lithiated state, and structures are in good physical condition after the 36th cycle. The results of this work should thus be useful for designing nanoscale structures in alloying anodes.

25 ENERGY STORAGE↗

Tin–Lead Liquid Metal Alloy Source for Focused Ion Beams

Focused Ion Beam (FIB) systems are increasingly utilized in nanotechnology for nanostructuring, surface modification, doping, and rapid prototyping. Recently, their potential for quantum applications has been explored, leveraging FIB’s direct-write capabilities for in situ single ion implantation, which is crucial for fabricating single photon emitters. Color centers in diamond can function as qubits and are of particular interest due to their capacity to store and transmit quantum information. While Group-IV color centers exhibit high brightness, they require low temperatures to retain coherence. However, lead-vacancy in diamond (PbV) operates at the higher end (4 K) of this temperature spectrum due to larger ground-state splitting, making them particularly interesting. In this context, our study presents results for lead (Pb)-containing alloys with eutectic points below 600 °C and results on using tantalum (Ta) and titanium (Ti) as emitter materials for a Pb liquid metal alloy ion source. We show that a standard FIB system is able to resolve the different Pb isotopes and achieve nanoscale spot sizes, as required for quantum information science applications.

color center↗