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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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44 records · Page 3

Polymer infiltration studies

During the past three months, significant progress has been made on the preparation of carbon fiber composites using advanced polymer resins. The results are set forth in recent reports and publications, and will be presented at forthcoming national and international meetings. Current and ongoing research activities reported herein include: textile composites from powder-coated towpreg; role of surface coating in braiding; prepregger hot sled operation; ribbonizing powder-impregenated towpreg; textile composites from powder-coated towpreg; role of bulk factor powder curtain prepreg process advanced tow placement (ATP) open-section part warpage control. During the coming months research will be directed toward further development of the new powder curtain prepregging method and on ways to customize dry powder towpreg for textile and robotic applications in aircraft part fabrication. Studies of multi-tow powder prepregging and ribbon preparation will be conducted in conjunction with continued development of prepregging technology and the various aspects of composite part fabrication using customized towpreg. Also, during the period ahead work will continue on the analysis of the performance of the new solution prepregger.

Marchello, Joseph M.↗

Polymer infiltration studies

During the past three months, significant progress has been made on the preparation of carbon fiber composites using advanced polymer resins. The results are set forth in recent reports and publications, and will be presented at forthcoming national and international meetings. Current and ongoing research activities reported herein include: textile composites from powder-coated towpreg - role of surface coating in braiding; prepregger hot sled operation in making tape from powder coated tow; ribbonizing powder-impregnated towpreg; textile composites from powder-coated towpreg - role of bulk factor in consolidation; powder curtain prepreg process improvements in doctoring of powder; and hot/cold shoe for ATP open-section part warpage control.

Marchello, Joseph M.↗

Weldability of a Nickel-based Superalloy

The electron beam welding process is used to investigate the weldability of the Ni-based superalloy Udimet 720LI. This is a modified form of the alloy Udimet 720, which has reduced concentrations of interstitial elements such as boron, silicon, and carbon. The history of high strength superalloys like this one suggests that welding will be difficult because of their tendency towards hot cracking during the welding process, or strain-age cracking during the post-weld aging process. Studies were done on several sizes of weldability test specimens to determine if Udimet 720LI will exhibit cracking tendencies. It was found that the alloy was not susceptible to hot cracking unless it had received the four-step aging heat treatment that is recommended by the manufacturer. It was also found that a restrained weldment is susceptible to strain-age cracking; however, if the weldment is allowed to deform then warpage can occur instead of cracking.

Kalinowski, Joseph M.↗

Thickness-Independent Ultrasonic Imaging Applied to Abrasive Cut-Off Wheels: An Advanced Aerospace Materials Characterization Method for the Abrasives Industry. A NASA Lewis Research Center Technology Transfer Case History

Abrasive cut-off wheels are at times unintentionally manufactured with nonuniformity that is difficult to identify and sufficiently characterize without time-consuming, destructive examination. One particular nonuniformity is a density variation condition occurring around the wheel circumference or along the radius, or both. This density variation, depending on its severity, can cause wheel warpage and wheel vibration resulting in unacceptable performance and perhaps premature failure of the wheel. Conventional nondestructive evaluation methods such as ultrasonic c-scan imaging and film radiography are inaccurate in their attempts at characterizing the density variation because a superimposing thickness variation exists as well in the wheel. In this article, the single transducer thickness-independent ultrasonic imaging method, developed specifically to allow more accurate characterization of aerospace components, is shown to precisely characterize the extent of the density variation in a cut-off wheel having a superimposing thickness variation. The method thereby has potential as an effective quality control tool in the abrasives industry for the wheel manufacturer.

Roth, Don J.↗

The Effect of Heat Treatment on Residual Stress and Machining Distortions in Advanced Nickel Base Disk Alloys

This paper describes an extension of NASA's AST and IDPAT Programs which sought to predict the effect of stabilization heat treatments on residual stress and subsequent machining distortions in the advanced disk alloy, ME-209. Simple "pancake" forgings of ME-209 were produced and given four heat treats: 2075F(SUBSOLVUS)/OIL QUENCH/NO AGE; 2075F/OIL QUENCH/1400F@8HR;2075F/OIL QUENCH/1550F@3HR/l400F@8HR; and 2160F(SUPERSOLVUS)/OIL QUENCH/1550F@3HR/ 1400F@8HR. The forgings were then measured to obtain surface profiles in the heat treated condition. A simple machining plan consisting of face cuts from the top surface followed by measurements of the surface profile opposite the cut were made. This data provided warpage maps which were compared with analytical results. The analysis followed the IDPAT methodology and utilized a 2-D axisymmetric, viscoplastic FEA code. The analytical results accurately tracked the experimental data for each of the four heat treatments. The 1550F stabilization heat treatment was found to significantly reduce residual stresses and subsequent machining distortions for fine grain (subsolvus) ME209, while coarse grain (supersolvus) ME209 would require additional time or higher stabilization temperatures to attain the same degree of stress relief.

Gayda, John↗

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗

Metrology of Large Parts

As discussed in the first chapter of this book, there are many different methods to measure a part using optical technology. Chapter 2 discussed the use of machine vision to measure macroscopic features such as length and position, which was extended to the use of interferometry as a linear measurement tool in chapter 3, and laser or other trackers to find the relation of key points on large parts in chapter 4. This chapter looks at measuring large parts to optical tolerances in the sub-micron range using interferometry, ranging, and optical tools discussed in the previous chapters. The purpose of this chapter is not to discuss specific metrology tools (such as interferometers or gauges), but to describe a systems engineering approach to testing large parts. Issues such as material warpage and temperature drifts that may be insignificant when measuring a part to micron levels under a microscope, as will be discussed in later chapters, can prove to be very important when making the same measurement over a larger part. In this chapter, we will define a set of guiding principles for successfully overcoming these challenges and illustrate the application of these principles with real world examples. While these examples are drawn from specific large optical testing applications, they inform the problems associated with testing any large part to optical tolerances. Manufacturing today relies on micrometer level part performance. Fields such as energy and transportation are demanding higher tolerances to provide increased efficiencies and fuel savings. By looking at how the optics industry approaches sub-micrometer metrology, one can gain a better understanding of the metrology challenges for any larger part specified to micrometer tolerances. Testing large parts, whether optical components or precision structures, to optical tolerances is just like testing small parts, only harder. Identical with what one does for small parts, a metrologist tests large parts and optics in particular to quantify their mechanical properties (such as dimensions, mass, etc); their optical prescription or design (i.e. radius of curvature, conic constant, vertex location, size); and their full part shape. And, just as with small parts, a metrologist accomplishes these tests using distance measuring instruments such as tape measures, inside micrometers, coordinate measuring machines, distance measuring interferometers; angle measuring instruments such as theodolites, autocollimators; and surface measuring instruments including interferometers, stylus profilers, interference microscopes, photogrammetric cameras, or other tools. However, while the methodology may be similar, it is more difficult to test a large object for the simple reason that most metrologists do not have the necessary intuition. The skills used to test small parts or optics in a laboratory do not extrapolate to testing large parts in an industrial setting any more than a backyard gardener might successfully operate a farm. But first, what is a large part? A simple definition might be the part's size or diameter. For optics and diffuse surface parts alike, the driving constraint is ability to illuminate the part's surface. For reflective convex mirrors, large is typically anything greater than 1 meter. But, for refractive optics, flats or convex mirrors, large is typically greater than 0.5 meter. While a size definition is simple, it may be less than universal. A more nuanced definition might be that a large part is any component which cannot be easily tested in a standard laboratory environment, on a standard vibration isolated table using standard laboratory infrastructure. A micro-switch or a precision lens might be easily measured to nanometer levels under a microscope in a lab, but a power turbine spline or a larger telescope mirror will not fit under that microscope and may not even fit on the table.

Stahl, H. Philip↗

Beyond Melting: Amorphous Bonding for Joining and Consolidation

Crystallization may be the hidden constraint in thermoplastic composite manufacturing. It requires tightly controlled cooling, induces residual stresses through shrinkage, and introduces path-dependent behavior that complicates predictive modeling yet remains essential for structural performance. This work asks: can bonding be achieved without relying on melt-driven crystallization? To address this, thin (5–20 μm) polyetherimide (PEI) interlayers are pre-healed to slow-cooled polyaryletherketone (PAEK) in two contexts. The first, Thermabond®, is sub-melt joining of low melt-PAEK laminates. Results show that bond quality is governed primarily by processing (i.e., adequate healing and film handling) rather than modest changes in interlayer thickness. This concept is then extended to laminate-scale manufacturing through an architecture known as OATMEAL (Out-of-autoclave Amorphous/semicrystalline Thermoplastic Material for Energy-efficient Aerospace-grade Laminates). PEI is healed to carbon fiber reinforced polyetheretherketone (PEEK) at the prepreg and excess PEI is then ablated from the surface. Crystallinity is developed off-line during prepreg fabrication, while subsequent consolidation occurs below the melt temperature to preserve it. Cross-ply warpage experiments show that, contrary to intuition, repeated amorphous interfaces reduce global curvature by lowering the effective stress lock-in temperature and eliminating crystallization shrinkage from the lamina response. Correspondingly, laminate behavior is accurately predicted using classical laminate theory (CLT) with a single effective stress-free temperature, whereas conventional CF/PEEK requires accounting for crystallization-driven effects. By decoupling interfacial healing from crystallization, OATMEAL enables sub-melt consolidation, reduces energy consumption by up to 75%, and increases manufacturing throughput by fivefold. These results demonstrate that amorphous bonding is not only a joining strategy, but a pathway to more predictable and scalable thermoplastic composite manufacturing.

solidification↗