SEARCH · Search NASA

Results for “contact printing”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

SourceResearch connectionFrom yearThrough year

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 55 records · Page 3

All sources NASA NTRS DOE OSTI

NASA NTRS2009

Board Saver for Use with Developmental FPGAs

A device denoted a board saver has been developed as a means of reducing wear and tear of a printed-circuit board onto which an antifuse field programmable gate array (FPGA) is to be eventually soldered permanently after a number of design iterations. The need for the board saver or a similar device arises because (1) antifuse-FPGA design iterations are common and (2) repeated soldering and unsoldering of FPGAs on the printed-circuit board to accommodate design iterations can wear out the printed-circuit board. The board saver is basically a solderable/unsolderable FPGA receptacle that is installed temporarily on the printed-circuit board. The board saver is, more specifically, a smaller, square-ring-shaped, printed-circuit board (see figure) that contains half via holes one for each contact pad along its periphery. As initially fabricated, the board saver is a wider ring containing full via holes, but then it is milled along its outer edges, cutting the via holes in half and laterally exposing their interiors. The board saver is positioned in registration with the designated FPGA footprint and each via hole is soldered to the outer portion of the corresponding FPGA contact pad on the first-mentioned printed-circuit board. The via-hole/contact joints can be inspected visually and can be easily unsoldered later. The square hole in the middle of the board saver is sized to accommodate the FPGA, and the thickness of the board saver is the same as that of the FPGA. Hence, when a non-final FPGA is placed in the square hole, the combination of the non-final FPGA and the board saver occupy no more area and thickness than would a final FPGA soldered directly into its designated position on the first-mentioned circuit board. The contact leads of a non-final FPGA are not bent and are soldered, at the top of the board saver, to the corresponding via holes. A non-final FPGA can readily be unsoldered from the board saver and replaced by another one. Once the final FPGA design has been determined, the board saver can be unsoldered from the contact pads on the first-mentioned printed-circuit board and replaced by the final FPGA.

Berkun, Andrew↗

NASA NTRS1980

Screen printing technology applied to silicon solar cell fabrication

The process for producing space qualified solar cells in both the conventional and wraparound configuration using screen printing techniques was investigated. Process modifications were chosen that could be easily automated or mechanized. Work was accomplished to optimize the tradeoffs associated with gridline spacing, gridline definition and junction depth. An extensive search for possible front contact metallization was completed. The back surface field structures along with the screen printed back contacts were optimized to produce open circuit voltages of at least an average of 600 millivolts. After all intended modifications on the process sequence were accomplished, the cells were exhaustively tested. Electrical tests at AMO and 28 C were made before and after boiling water immersion, thermal shock, and storage under conditions of high temperature and high humidity.

Thornhill, J. W.↗

NASA NTRS1980

Investigation of proposed process sequence for the array automated assembly task, phases 1 and 2

Progress was made on the process sequence for module fabrication. A shift from bonding with a conformal coating to laminating with ethylene vinyl acetate and a glass superstrate is recommended for further module fabrication. The processes that were retained for the selected process sequence, spin-on diffusion, print and fire aluminum p+ back, clean, print and fire silver front contact and apply tin pad to aluminum back, were evaluated for their cost contribution.

Mardesich, N.↗

NASA NTRS2013

Fully Printed, Flexible, Phased Array Antenna for Lunar Surface Communication

NASAs future exploration missions focus on the manned exploration of the Moon, Mars, and beyond, which will rely heavily on the development of a reliable communications infrastructure from planetary surface-to-surface, surface-to-orbit, and back to Earth. Flexible antennas are highly desired in many scenarios. Active phased array antennas (active PAAs) with distributed control and processing electronics at the surface of an antenna aperture offer numerous advantages for radar communications. Large-area active PAAs on flexible substrates are of particular interest in NASA s space radars due to their efficient inflatable package that can be rolled up during transportation and deployed in space. Such an inflatable package significantly reduces stowage volume and mass. Because of these performance and packaging advantages, large-area inflatable active PAAs are highly desired in NASA s surface-to-orbit and surface-to-relay communications. To address the issues of flexible electronics, a room-temperature printing process of active phased-array antennas on a flexible Kapton substrate was developed. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proved feasible for the PAA system. This innovation is a new type of fully inkjet-printable, two-dimensional, high-frequency PAA on a flexible substrate at room temperature. The designed electronic circuit components, such as the FET switches in the phase shifter, metal interconnection lines, microstrip transmission lines, etc., are all printed using a special inkjet printer. Using the developed technology, entire 1x4, 2x2, and 4x4 PAA systems were developed, packaged, and demonstrated at 5.3 GHz. Several key solutions are addressed in this work to solve the fabrication issues. The source/drain contact is developed using droplets of silver ink printed on the source/drain areas prior to applying CNT thin-film. The wet silver ink droplets allow the silver to wet the CNT thin-film area and enable good contact with the source and drain contact after annealing. A passivation layer to protect the device channel is developed by bonding a thin Kapton film on top of the device channel. This film is also used as the media for transferring the aligned CNT thin-film on the device substrate. A simple and cost-effective technique to form multilayer metal interconnections on flexible substrate is developed and demonstrated. Contact vias are formed on the second substrate prior to bonding on the first substrate. Inkjet printing is used to fill the silver ink into the via structure. The printed silver ink penetrates through the vias to contact with the contact pads on the bottom layer. It is then annealed to form a good connection. One-dimensional and two-dimensional PAAs were fabricated and characterized. In these circuits, multilayer metal interconnects were used to make a complete PAA system.

Subbaraman, Harish↗

NASA NTRS1994

Neutral ion sources in precision manufacturing

Ion figuring of optical components is a relatively new technology that can alleviate some of the problems associated with traditional contact polishing. Because the technique is non contacting, edge distortions and rib structure print through do not occur. This initial investigation was aimed at determining the effect of ion figuring on surface roughness of previously polished or ductile ground ceramic optical samples. This is the first step in research directed toward the combination of a pre-finishing process (ductile grinding or polishing) with ion figuring to produce finished ceramic mirrors. The second phase of the project is focusing on the development of mathematical algorithms that will deconvolve the ion beam profile from the surface figure errors so that these errors can be successfully removed from the optical components. In the initial phase of the project, multiple, chemical vapor deposited silicon carbide (CVD SiC) samples were polished or ductile ground to specular or near-specular roughness. These samples were then characterized to determine topographic surface information. The surface evaluation consisted of stylus profilometry, interferometry, and optical and scanning electron microscopy. The surfaces, were ion machined to depths from 0-5 microns. The finished surfaces were characterized to evaluate the effects of the ion machining process with respect to the previous processing methods and the pre-existing subsurface damage. The development of the control algorithms for figuring optical components has been completed. These algorithms have been validated with simulations and future experiments have been planned to verify the methods. This paper will present the results of the initial surface finish experiments and the control algorithms simulations.

Fawcett, Steven C.↗

NASA NTRS1981

An automated process sequence using preformed cell contacts and interconnects with a total cost of $0.64 per peak watt in 1986

A process sequence is described which utilizes a preformed metal mesh electrostatically bonded to each cell to provide the front contact. Cells of 12 percent AM1 efficiency have been produced using this scheme. This method also permits access to both contacts on the cell from the back side. In addition, low cost cell interconnection is accomplished using a flexible 'printed circuit' sheet which is ultrasonically bonded to the cell contacts. The complete process sequence as well as automated equipment which also uses ion implantation and pulse annealing is described. The total cost for module fabrication is estimated at $0.64 per peak watt for a 30 MW/year plant.

Armini, A. J.↗

NASA NTRS2004

Printed Multi-Turn Loop Antenna for RF Bio-Telemetry

In this paper, a novel printed multi-turn loop antenna for contact-less powering and RF telemetry from implantable bio- MEMS sensors at a design frequency of 300 MHz is demonstrated. In addition, computed values of input reactance, radiation resistance, skin effect resistance, and radiation efficiency for the printed multi-turn loop antenna are presented. The computed input reactance is compared with the measured values and shown to be in fair agreement. The computed radiation efficiency at the design frequency is about 24 percent.

Simons, Rainee N.↗

NASA NTRS1972

Development of a container for handling, testing, and storing discrete microelectronic components

A container has been developed for handling, testing, burning-in, and storing discrete microelectronic components without removal from the protective package. The package was designed to accommodate the leadless inverted device and other carrier-mounted active devices and chip-type discrete resistors and capacitors. Before the indicated development, components were handled and tested in various ways, some of which resulted in damage or contamination. The basic design of the container utilizes precision machined printed circuit boards and chemically milled (photoetched) contact springs. Included in this design for protection is an O-ring-sealed cover. Methods of fabrication and limitations of the current hardware are presented. Current applications of and possible extensions to the technology are discussed.

Filip, G. L.↗

NASA NTRS1986

Ink-jet printing of silver metallization for photovoltaics

The status of the ink-jet printing program at Purdue University is described. The drop-on-demand printing system was modified to use metallo-organic decomposition (MOD) inks. Also, an IBM AT computer was integrated into the ink-jet printer system to provide operational functions and contact pattern configuration. The integration of the ink-jet printing system, problems encountered, and solutions derived were described in detail. The status of ink-jet printing using a MOD ink was discussed. The ink contained silver neodecanate and bismuth 2-ethylhexanoate dissolved in toluene; the MOD ink decomposition products being 99 wt% AG, and 1 wt% Bi.

Vest, R. W.↗

NASA NTRS2020

Electrodynamic Dust Shield Housing for RASSOR Redesign and Fabrication

Abstract—An Electrodynamic Dust Shield (EDS) was to be mounted over the cameras of the Regolith Advanced Surface Systems Operations Robot (RASSOR) to mitigate the clouding effects and abrasive properties of lunar dust. This report discusses the redesign process and physical fabrication of the housing unit planned to attach the EDS to the RASSOR camera. The two-piece 3D-Printed design consists of a holder and cover unit. The EDS Holder seats the EDS near two live copper contacts that are to be wired into the main electronics housing. The EDS Cover seats two metal leaf spring tabs to bridge the connections between the copper contacts and EDS electrodes, as well as a centralized O-ring that is pressed flush against the EDS to mitigate dust intrusion. All components were modeled, printed, and checked for proper electrical contact and mechanical fit. The built-up assembly was subsequently tested in the Electrostatics and Surface Physics Laboratory (ESPL) and demonstrated good dust clearing performance.

Alexander Lacerna↗

NASA NTRS1979

Wraparound-contact solar cells

Positive and negative electrical contacts are on back surface of wraparound-contact solar cell. With both terminals on nonilluminated side, cells can be connected back-to-back, and interconnection of many cells can be automated by using printed-circuit techniques. Cells are made by screen-printing layer of dielectric around edge of cell and extending top contact over dielectric to back surface. Wraparound also facilitates application of transparent covers and encapsulants. Efficiencies of cells are in excess of seventeen percent.

Baraona, C. R.↗

NASA NTRS1986

Metalizing Solar Cells by Selective Electroplating

Contact patterns traced by laser scanning. Conductor paths deposited on silicon solar-cell wafers by laser irradiation followed by electroplating. Laser-assisted metalization technique offers better resolution and lower contact resistance than does conventional metalization by screen printing. At the same time, less expensive than metalization with masks and photolithography.

Dutta, S.↗

NASA NTRS1983

Particle size effects on viscosity of silver pastes: A manufacturer's view

Particles from a variety of silver powders were investigated by scanning electron microscopy and particle size analyses. Particle size distribution curves and volume population graphs were prepared for these silver powders and for glass powders with optimum, extra fine and coarse particle sizes. The viscosity at a given shear rate and slope of viscosity over a range of shear rates were determined for thick film pastes made with these powders. Because of particle anomalies and variations, the need for flexibility to achieve the best printing qualities for silver pastes was evident. It was established that print quality, dried and fired film density and optimum contact of silver particles with silicon, important for cell electrical output, could be achieved by adjusting the slope of viscosity that fell outside of the range, -0.550 to -0.650. This was accomplished through organic vehicle technology that permitted a change in the slope of viscosity, up or down, while maintaining a constant silver and total solids content.

Provance, J.↗

NASA NTRS2002

The Effects of Ultra Thin Films on Dynamic Wetting

Dynamic wetting, the displacement of one fluid by another immiscible fluid on a surface, controls many natural and technological phenomena, such as coating, printing, spray painting and lubricating. Particularly in coating and spraying applications, contact lines advance across pre-existing fluid films. Most previous work has focused on contact lines advancing across films sufficiently thick that they behave as simple Newtonian fluids. Ultrathin films, where the film thickness may impinge on fundamental length scales in the fluid, have received less attention. In this talk, we will discuss the effects of ultrathin polymer films on dynamic wetting. We measure the interface shape within microns of moving contact lines advancing across preexisting films and compare the measurements to existing models of viscous bending for interfaces advancing across dry surfaces and 'thick' (in the sense that they behave as liquids) films. In the experiments, we advance a contact line of 10-poise and 1-poise polydimethylsiloxane (silicone oil) across pre-coated films of the same fluid with thickness from a single chain thickness (approx. 10 A) through a couple of radii of gyration (100-200 A) to films so thick they are likely bulk in behavior (10(exp 3) A). All films are physisorbed, i.e. they readily rinse from the surface. Thus, molecules in the film are not anchored to the surface and can move within the film if the hydrodynamics dictate such motion. For films of the thickness of a single chain (approx. 10 A), our experiments indicate that the advancing fluid behaves just as it would if it advanced over a dry surface. For the thicker films (10(exp 3) A), we find behavior indicating that the molecules in the film are acting as a fluid with the bulk properties. In this regime, results for the two different fluids are identical when the experiments are performed at the same pre-existing film thickness and advancing capillary number, Ca. For film of thickness of a few radii of gyration (approx. 100-200 A), the behavior depends on Ca of the advancing meniscus. At low Ca, the viscous bending of the interface near the contact line does not behave as it would on a dry surface. It has a lower curvature than expected. However, at higher Ca, the viscous bending is described by the model for spreading over a dry surface. These results show that the fluid flow in the film does behave differently than bulk as the film thickness becomes comparable to molecular length scale. But even more intriguing is the unusual velocity dependence of that behavior where the film behaves more solid-like at higher contact line speeds. We will discuss these results in terms of the properties of confined polymer melts.

Chen, Xia↗

NASA NTRS2008

Electromagnetically Clean Solar Arrays

The term 'electromagnetically clean solar array' ('EMCSA') refers to a panel that contains a planar array of solar photovoltaic cells and that, in comparison with a functionally equivalent solar-array panel of a type heretofore used on spacecraft, (1) exhibits less electromagnetic interferences to and from other nearby electrical and electronic equipment and (2) can be manufactured at lower cost. The reduction of electromagnetic interferences is effected through a combination of (1) electrically conductive, electrically grounded shielding and (2) reduction of areas of current loops (in order to reduce magnetic moments). The reduction of cost is effected by designing the array to be fabricated as a more nearly unitary structure, using fewer components and fewer process steps. Although EMCSAs were conceived primarily for use on spacecraft they are also potentially advantageous for terrestrial applications in which there are requirements to limit electromagnetic interference. In a conventional solar panel of the type meant to be supplanted by an EMCSA panel, the wiring is normally located on the back side, separated from the cells, thereby giving rise to current loops having significant areas and, consequently, significant magnetic moments. Current-loop geometries are chosen in an effort to balance opposing magnetic moments to limit far-0field magnetic interactions, but the relatively large distances separating current loops makes full cancellation of magnetic fields problematic. The panel is assembled from bare photovoltaic cells by means of multiple sensitive process steps that contribute significantly to cost, especially if electomagnetic cleanliness is desired. The steps include applying a cover glass and electrical-interconnect-cell (CIC) sub-assemble, connecting the CIC subassemblies into strings of series-connected cells, laying down and adhesively bonding the strings onto a panel structure that has been made in a separate multi-step process, and mounting the wiring on the back of the panel. Each step increases the potential for occurrence of latent defects, loss of process control, and attrition of components. An EMCSA panel includes an integral cover made from a transparent material. The silicone cover supplants the individual cover glasses on the cells and serves as an additional unitary structural support that offers the advantage, relative to glass, of the robust, forgiving nature of the silcone material. The cover contains pockets that hold the solar cells in place during the lamination process. The cover is coated with indium tin oxide to make its surface electrically conductive, so that it serves as a contiguous, electrically grounded shield over the entire panel surface. The cells are mounted in proximity to metallic printed wiring. The painted-wiring layer comprises metal-film traces on a sheet of Kapton (or equivalent) polyimide. The traces include contact pads on one side of the sheet for interconnecting the cells. Return leads are on the opposite side of the sheet, positioned to form the return currents substantially as mirror images of, and in proximity to, the cell sheet currents, thereby minimizing magnetic moments. The printed-wiring arrangement mimics the back-wiring arrangement of conventional solar arrays, but the current-loop areas and the resulting magnetic moments are much smaller because the return-current paths are much closer to the solar-cell sheet currents. The contact pads are prepared with solder fo electrical and mechanical bonding to the cells. The pocketed cover/shield, the solar cells, the printed-wiring layer, an electrical bonding agent, a mechanical-bonding agent, a composite structural front-side face sheet, an aluminum honeycomb core, and a composite back-side face sheet are all assembled, then contact pads are soldered to the cells and the agents are cured in a single lamination process.

Stem, Theodore G.↗

NASA NTRS1994

Neutral Ion Figuring of Chemical Vapor Deposited SiC

Ion figuring of optical components is a relatively new technology that can alleviate some of the problems associated with traditional contact polishing. Because the technique is noncontacting, edge distortions and rib structure print through do not occur. This investigation was aimed at determining the effect of ion figuring on surface roughness of previously polished or ductile ground ceramic optical samples. This is the first step in research directed toward the combination of a prefinishing process (ductile grinding or polishing) with ion figuring to produce finished ceramic mirrors. Multiple, chemical vapor deposited silicon carbide (CVD SiC) samples were polished or ductile ground to specular or near-specular roughness. These samples were then characterized to determine topographic surface information. The surface evaluation consisted of stylus profilometry, interferometry, and optical and scanning electron microscopy. The surfaces were then ion machined to depths from 0 to 5 micron. The finished surfaces were characterized to evaluate the effects of the ion-machining process with respect to the previous processing methods and the preexisting subsurface damage. This study provides some of the information required to effectively utilize a combined ductile grinding or polishing with ion machining as a procedure for figuring optical components.

Fawcett, Steven C.↗

NASA NTRS2007

MCM Polarimetric Radiometers for Planar Arrays

A polarimetric radiometer that operates at a frequency of 40 GHz has been designed and built as a prototype of multiple identical units that could be arranged in a planar array for scientific measurements. Such an array is planned for use in studying the cosmic microwave background (CMB). All of the subsystems and components of this polarimetric radiometer are integrated into a single multi-chip module (MCM) of substantially planar geometry. In comparison with traditional designs of polarimetric radiometers, the MCM design is expected to greatly reduce the cost per unit in an array of many such units. The design of the unit is dictated partly by a requirement, in the planned CMB application, to measure the Stokes parameters I, Q, and U of the CMB radiation with high sensitivity. (A complete definition of the Stokes parameters would exceed the scope of this article. In necessarily oversimplified terms, I is a measure of total intensity of radiation, while Q and U are measures of the relationships between the horizontally and vertically polarized components of radiation.) Because the sensitivity of a single polarimeter cannot be increased significantly, the only way to satisfy the high-sensitivity requirement is to make a large array of polarimeters that operate in parallel. The MCM includes contact pins that can be plugged into receptacles on a standard printed-circuit board (PCB). All of the required microwave functionality is implemented within the MCM; any required supporting non-microwave ("back-end") electronic functionality, including the provision of DC bias and control signals, can be implemented by standard PCB techniques. On the way from a microwave antenna to the MCM, the incoming microwave signal passes through an orthomode transducer (OMT), which splits the radiation into an h + i(nu) beam and an h - i(nu) beam (where, using complex-number notation, h denotes the horizontal component, nu denotes the vertical component, and +/-i denotes a +/-90deg phase shift). Each of these beams enters the MCM through one of two WR-22 waveguide input terminals in the lid of the MCM. The h + i(nu0 and h - i(nu) signals are amplified, then fed to a phase-discriminator hybrid designed specifically to fit the predominantly planar character of the MCM geometry and to enable determination of Q and U. The phase-discriminator hybrid generates four outputs, which are detected and used to calculate I, Q, and U.

Kangaslahti, Pekka↗

NASA NTRS2006

Modeling of the Near Field Coupling Between an External Loop and an Implantable Spiral Chip Antennas in Biosensor Systems

In this paper, the near field coupling between an external hand-held loop antenna and an implantable miniature (1x1 mm) printed square spiral chip antenna used in bio-MEMS sensors for contact-less powering and RF telemetry is investigated. The loop and the spiral are inductively coupled and effectively form a transformer. The numerical results include the quasi-stationary magnetic field pattern of the implanted antenna, near zone wave impedance as a function of the radial distance and the values of the lumped elements in the equivalent circuit model for the transformer.

Simons, Rainee N.↗