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Advances in thin-film solar cells for lightweight space photovoltaic power

The present stature and current research directions of photovoltaic arrays as primary power systems for space are reviewed. There have recently been great advances in the technology of thin-film solar cells for terrestrial applications. In a thin-film solar cell the thickness of the active element is only a few microns; transfer of this technology to space arrays could result in ultralow-weight solar arrays with potentially large gains in specific power. Recent advances in thin-film solar cells are reviewed, including polycrystalline copper-indium selenide (CuInSe2) and related I-III-VI2 compounds, polycrystalline cadmium telluride and related II-VI compounds, and amorphous silicon:hydrogen and alloys. The best experimental efficiency on thin-film solar cells to date is 12 percent AMO for CuIn Se2. This efficiency is likely to be increased in the next few years. The radiation tolerance of thin-film materials is far greater than that of single-crystal materials. CuIn Se2 shows no degradation when exposed to 1 MeV electrons. Experimental evidence also suggests that most of all of the radiation damage on thin-films can be removed by a low temperature anneal. The possibility of thin-film multibandgap cascade solar cells is discussed, including the tradeoffs between monolithic and mechanically stacked cells. The best current efficiency for a cascade is 12.5 percent AMO for an amorphous silicon on CuInSe2 multibandgap combination. Higher efficiencies are expected in the future. For several missions, including solar-electric propulsion, a manned Mars mission, and lunar exploration and manufacturing, thin-film photovolatic arrays may be a mission-enabling technology.

Landis, Geoffrey A.↗

History of Sulphur Content Effects on the Thermal Stability of RP-1 under Heated Conditions

As technologies advance in the aerospace industry, a strong desire has emerged to design more efficient, longer life, reusable liquid hydrocarbon fueled rocket engines. To achieve this goal, a more complete understanding of the thermal stability and chemical makeup of the hydrocarbon propellant is needed. Since the main fuel used in modern liquid hydrocarbon systems is RP-1, there is concern that Standard Grade RP-1 may not be a suitable propellant for future-generation rocket engines due to concern over the outdated Mil-Specification for the fuel. This current specification allows high valued limits on contaminants such as sulfur compounds, and also lacks specification of required thermal stability qualifications for the fuel. Previous studies have highlighted the detrimental effect of high levels of mercaptan sulfur content (^50 ppm) on copper rocket engine materials, but the fuel itself has not been studied. While the role of sulfur in other fuels (e.g., aviation, diesel, and automotive fuels) has been extensively studied, little has been reported on the effects of sulfur levels in rocket fuels. Lower RP-1 sulfur concentrations need to be evaluated and an acceptable sulfur limit established before RP-1 can be recommended for use as the propellant for future launch vehicles. (5 tables, 8 figures, 9 refs.)

ASTM METHOD D-5623↗

Aerospace Structural Materials Handbook Supplement GRCop-84

GRCop-84 is a high strength-high conductivity copper-based alloy developed at NASA Glenn Research Center for combustion chamber liners of regeneratively cooled rocket engines. It also has promise for other high heat flux applications operating at temperatures up to 700 C (1292 F) and potentially higher. The alloy must be made by powder metallurgy techniques such as gas atomization. Slower cooling rates such as those experienced during casting do not develop a proper microstructure. Once made into powder, the alloy exhibits excellent processability using conventional consolidation and forming techniques, e.g., extrusion and rolling. GRCop-84 is strengthened by a combination of dispersion and precipitation strengthening by fine (50-500 nanometer (2-20 microinch)) Cr2Nb particles and Hall-Petch strengthening from a fine copper grain size. The presence of a high volume fraction of particles prevents grain boundary sliding at high temperatures and contributes to the alloy's overall good high temperature mechanical properties. Maximum thermal conductivity is obtained by using two alloying elements (Cr, Nb) with limited solubility in solid Cu that form a high temperature intermetallic compound with an even lower solid solubility. The resulting matrix of the alloy is nearly pure copper. The limited solubility also minimizes Cr2Nb particle coarsening at elevated temperatures and enhances microstructural and mechanical property stability. Further enhancement of the microstructural stability is obtained by using a high volume fraction (approx. 14 vol.%) of Cr2Nb particles that effectively pin grain growth.

Ellis, David L.↗

Reactively evaporated films of copper molybdenum sulfide

Films of superconducting Chevrel-phase copper molybdenum sulfide CuxMo6S8 were deposited on sapphire substrates by reactive evaporation using H2S as the reacting gas. Two superconducting temperatures (10.0 K and 5.0 K) of the films were found, corresponding to two different phases with different copper concentrations. All films were superconducting above 4.2 K and contained Chevrel-phase compound as well as free molybdenum. The critical current was measured as a function of applied field. One sample was found to deviate from the scaling law found for co-evaporated or sputtered samples, which possibly indicates a different pinning mechanism or inhomogeneity of the sample.

Chi, K. C.↗

Geomycology

Fungi have long been known to have capabilities for reduction and alkylation of arsenate and selenate but their general capabilities for solubilizing and accumulating metallic substances have been given serious attention only in recent years. Common members of the Aspergillaceae cultured on boron, copper, lead and other metals or oxides can solubilize and concentrate the elements or their compounds. To account for biosolubilization of the metals, we have set up a model study, incubating selected metals, e.g., mercury, in solutions of various metabolites including L-lysine and citric acid. Results of 100-300 days incubation showed that many metals can in fact be readily solubilized, and in some cases more effectively at pH 6-7 than at pH 1.5-2.

Puerner, N. J.↗

Phthalocyanine Tetraamine Epoxy-Curing Agents

Tough fire- and chemical-resistant epoxies produced by using metalphthalocyanine tetraamines (MPT's) of copper, cobalt, or nickel as curing agents. Synthesis of MPT's commercially realizable and gives pure compounds with almost 90-percent yield. Synthesis applicable for metals with atomic radii of about 1.35 angstroms, including Cu, Co, Ni, Zn, Fe, Pt, Al, and V. Possible to use metal phthalocyanines to cure epoxy resins in homogeneous reaction.

Fohlen, G. M.↗

Update - Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bond technology developments continue to be a subject of technical interest to the NASA (National Aeronautics and Space Administration) NEPP (NASA Electronic Parts and Packaging Program) which funded this update. Based on this new research, additional copper bond wire vulnerabilities were found in the literature - Crevice corrosion, intrinsic degradation of palladium coated copper wire, congregation of palladium near ball bond interface leading to failure, residual aluminum pad metallization impact on device lifetimes, stitch cracking phenomena, package delamination's that have resulted in wire bond failures and device failure due to elemental sulfur. A search of the U.S.A. patent web site found 3 noteworthy patents on the following developments: claim of a certain IMC (Intermetallic Compound) thickness as a mitigation solution to chlorine corrosion; claim of using materials with different pHs to neutralize contaminants in a package containing copper wire bonds; and a discussion on ball shear test threshold values for different applications. In addition, an aerospace contractor of military hardware had a presentation on copper bond wires where it was reported that there was a parametric shift and noise susceptibility of devices with copper bond wires which affected legacy design performance. A review of silver bond wire (another emerging technology) technical papers found that an electromigration failure mechanism was evident in device applications that operate under high current conditions. More studies may need to be performed on a comprehensive basis. Research areas for consideration are suggested, however, these research and or qualification/standard test areas are not all inclusive and should not be construed as the element (s) that delivers any potential copper wire bond solution. A false sense of security may occur, whenever there is a reliance on passing any particular qualification, standard, or test protocol.

Rutkowski, E.↗

Copper-containing ceramic precursor synthesis: Solid-state transformations and materials technology

Three copper systems with relevance to materials technology are discussed. In the first, a CuS precursor, Cu4S1O (4-methylpyridine)(sub 4)- (4-MePy), was prepared by three routes: reaction of Cu2S, reaction of CuBr-SMe2, and oxidation of copper powder with excess sulfur in 4-methylpyridine by sulfur. In the second, copper powder was found to react with excess thiourea (H2NC(S)NH2) in 4-methylpyridine to produce thiocyanate (NCS(-)) complexes. Three isolated and characterized compounds are: Cu(NCS)(4-MePy)(sub 2), a polymer, (4-MePy-H)(Cu(NCS)(sub 3)(4-MePy)(sub 2)), a salt, and t-Cu(NCS)(sub 2)(4-MePy)(sub 4). Finally, an attempt to produce a mixed-metal sulfide precursor of Cu and Ga in N-methylimidazole (N-MeIm) resulted in the synthesis of a Cu-containing polymer, Cu(SO4)(N-MeIm). The structures are presented; the chemistry will be briefly discussed in the context of preparation and processing of copper-containing materials for aerospace applications.

Hepp, Aloysius F.↗

Aluminum Alloy and Article Cast Therefrom

A cast article from an aluminum alloy, which has improved mechanical properties at elevated temperatures, has the following composition in weight percent: Silicon 14 - 25.0, Copper 5.5 - 8.0, Iron 0.05 - 1.2, Magnesium 0.5 - 1.5, Nickel 0.05 - 0.9, Manganese 0.05 - 1.0, Titanium 0.05 - 1.2, Zirconium 0.05 - 1.2, Vanadium 0.05 - 1.2, Zinc 0.05 - 0.9, Phosphorus 0.001 - 0.1, and the balance is Aluminum, wherein the silicon-to-magnesium ratio is 10 - 25, and the copper-to-magnesium ratio is 4 - 15. The aluminum alloy contains a simultaneous dispersion of three types of Al3X compound particles (X=Ti, V, Zr) having a LI2, crystal structure, and their lattice parameters are coherent to the aluminum matrix lattice. A process for producing this cast article is also disclosed, as well as a metal matrix composite, which includes the aluminum alloy serving as a matrix and containing up to about 60% by volume of a secondary filler material.

Lee, Jonathan A.↗

High Strength Aluminum Alloy For High Temperature Applications

A cast article from an aluminum alloy has improved mechanical properties at elevated temperatures. The cast article has the following composition in weight percent: Silicon 6.0-25.0, Copper 5.0-8.0, Iron 0.05-1.2, Magnesium 0.5-1.5, Nickel 0.05-0.9, Manganese 0.05-1.2, Titanium 0.05-1.2, Zirconium 0.05-1.2, Vanadium 0.05-1.2, Zinc 0.05-0.9, Strontium 0.001-0.1, Phosphorus 0.001-0.1, and the balance is Aluminum, wherein the silicon-to-magnesium ratio is 10-25, and the copper-to-magnesium ratio is 4-15. The aluminum alloy contains a simultaneous dispersion of three types of Al3X compound particles (X=Ti, V, Zr) having a LI2 crystal structure, and their lattice parameters are coherent to the aluminum matrix lattice. A process for producing this cast article is also disclosed, as well as a metal matrix composite, which includes the aluminum alloy serving as a matrix containing up to about 60% by volume of a secondary filler material.

Jonathan A Lee↗

Enhanced Surface Spray Cooling with Embedded and Compound Extended Surface Structures

Experiments were conducted to study the effects of enhanced surface structures on heat flux using spray cooling. The surface enhancements consisted of embedded structures (dimples, pores, and tunnels) and compound extended surface enhancements (straight fins, cubic pin fins and dimples) machined on and within the top surface of copper heater blocks. Each copper block had a projected cross-sectional area of 2.0 sq cm. Measurements were also obtained on a heater block with a flat surface for baseline comparison purposes. A 2x2 nozzle array was used with PF-5060 as the working fluid. Thermal performance data was obtained under nominally degassed (chamber pressure of 41.4 kPa) and gassy conditions (chamber with N2 gas at 101 kPa) with a bulk fluid temperature of 20.5 C. Results for both the nominally degassed and gassy cases show that the highest critical heat flux (CHF) was attained using straight fins and porous tunnels. For the nominally degassed case, both had a CHF of approx.: 142 W/sq cm while for the gassy case their CHF values increased to 175 W/sq cm. This gave an enhancement relative to the nominally degassed flat surface case of approx. 77% and 119% respectively.

Silk, Erie A.↗

Influence of various surface pretreatments on adherence of sputtered molybdenum disulfide to silver, gold, copper, and bronze

Solid film lubricants of radio frequency sputtered molybdenum disulfide (MoS2) were applied to silver, gold, copper, and bronze surfaces that had various pretreatments (mechanical polishing, sputter etching, oxidation, and sulfurization). Optical and electron transmission micrographs and electron diffraction patterns were used to interpret the film formation characteristics and to evaluate the sputtering conditions in regard to the film and substrate compatibility. Sputtered MoS2 films flaked and peeled on silver, copper, and bronze surfaces except when the surfaces had been specially oxidized. The flaking and peeling was a result of sulfide compound formation and the corresponding grain growth of the sulfide film. Sputtered MoS2 films showed no peeling and flaking on gold surfaces regardless of surface pretreatment.

Spalvins, T.↗

Effect of strain hardening on friction behavior of iron lubricated with benzyl structures

Sliding friction experiments were conducted with iron, copper, and aluminum in contact with iron in various states of strain. The surfaces were examined in dry sliding and with various benzyl compounds applied as lubricants. Friction experiments were conducted with a hemispherical rider contacting a flat disk at loads of from 50 to 600 grams with a sliding speed of 0.15 cm/min. Results indicate that straining increases friction for dry sliding and for surfaces lubricated with certain benzyl structures such as dibenzyl disulfide. With other benzyl compounds (e.g., benzyl formate), friction coefficients are lower for strained than for annealed iron.

Buckley, D. H.↗

Chemical vapor deposition of high T(sub c) superconducting films in a microgravity environment

Since the discovery of the YBaCuO bulk materials in 1987, Metalorganic Chemical Vapor Deposition (MOCVD) has been proposed for preparing HTSC high T(sub c) films. This technique is now capable of producing high-T(sub c) superconducting thin films comparable in quality to those prepared by any other methods. The MOCVD technique has demonstrated its superior advantage in making large area high quality HTSC thin films and will play a major role in the advance of device applications of HTSC thin films. The organometallic precursors used in the MOCVD preparation of HTSC oxide thin films are most frequently metal beta-diketonates. High T(sub c) superconductors are multi-component oxides which require more than one component source, with each source, containing one kind of precursor. Because the volatility and stability of the precursors are strongly dependent on temperature, system pressure, and carrier gas flow rate, it has been difficult to control the gas phase composition, and hence film stoichiometry. In order circumvent these problems we have built and tested a single source MOCVD reactor in which a specially designed vaporizer was employed. This vaporizer can be used to volatilize a stoichiometric mixture of diketonates of yttrium, barium and copper to produce a mixed vapor in a 1:2:3 ratio respectively of the organometellics. This is accomplished even though the three compounds have significantly different volatilities. We have developed a model which provides insight into the process of vaporizing mixed precursors to produce high quality thin films of Y1Ba2Cu3O7. It shows that under steady state conditions the mixed organometallic vapor must have a stoichiometric ratio of the individual organometallics identical to that in the solid mixture.

Levy, Moises↗

Synthesis, Characterization and Decomposition Studies of Tris(N,N-dibenzyldithiocarbamato) Indium(III): Chemical Spray Deposition of Polycrystalline CuInS2 on Copper Films

Tris(bis(phenylmethyl)carbamodithioato-S,S ), commonly referred to as tris(N,Ndibenzyldithiocarbamato) indium(III), In(S2CNBz2)3, was synthesized and characterized by single crystal X-ray crystallography. The compound crystallizes in the triclinic space group P1 bar with two molecules per unit cell. The material was further characterized using a novel analytical system employing the combined powers of thermogravimetric analysis, gas chromatography/mass spectrometry and Fourier-Transform infrared spectroscopy to investigate its potential use as a precursor for the chemical vapor deposition (CVD) of thin film materials for photovoltaic applications. Upon heating, the material thermally decomposes to release CS2 and benzyl moieties in to the gas phase, resulting in bulk In2S3. Preliminary spray CVD experiments indicate that In(S2CNBz2)3 decomposed on a Cu substrate reacts to produce stoichiometric CuInS2 films.

Hehemann, David G.↗

High-temperature processing of cuprate oxide superconductors

Superconducting Y1Ba2Cu3O7 ('123') films were fabricated on the Y2BaCuO5 ('211') phase substrate. The superconducting characteristics of these films, in terms of superconducting transition temperature (Tc) and width, are better than those using other oxide compounds as substrates. In addition, using high-temperature processing, the bulk 211 phase was converted into the 123 phase. A new high Tc copper oxide material with non-rare-earth elements (Bi-Sr-Cu-O) was prepared using similar high-temperature processing. High-temperature processing presents an alternative synthetic route in the search of new high Tc superconductors.

Wu, M. K.↗

Observations of a Cast Cu-Cr-Zr Alloy

Prior work has demonstrated that Cu-Cr-Nb alloys have considerable advantages over the copper alloys currently used in regeneratively cooled rocket engine liners. Observations indicated that Zr and Nb have similar chemical properties and form very similar compounds. Glazov and Zakharov et al. reported the presence of Cr2Zr in Cu-Cr-Zr alloys with up to 3.5 wt% Cr and Zr though Zeng et al. calculated that Cr2Zr could not exist in a ternary Cu-Cr-Zr alloy. A cast Cu-6.15 wt% Cr-5.25 wt% Zr alloy was examined to determine if the microstructure developed would be similar to GRCop-84 (Cu-6.65 wt% Cr-5.85 wt% Nb). It was observed that the Cu-Cr-Zr system did not form any Cr2Zr even after a thermal exposure at 875 C for 176.5 h. Instead the alloy consisted of three phases: Cu, Cu5Zr, and Cr.

Ellis, David L.↗

Nucleation of the diamond phase in aluminium-solid solutions

Precipitation was studied from fcc solid solutions with silicon, germanium, copper and magnesium. Of all these elements only silicon and germanium form diamond cubic (DC) precipitates in fcc Al. Nucleation of the DC structure is enhanced if both types of atom are dissolved in the fcc lattice. This is interpreted as due to atomic size effects in the prenucleation stage. There are two modes of interference of fourth elements with nucleation of the DC phase in Al + Si, Ge. The formation of the DC phase is hardly affected if the atoms (for example, copper) are rejected from the (Si, Ge)-rich clusters. If additional types of atom are attracted by silicon and/or germanium, DC nuclei are replaced by intermetallic compounds (for example Mg2Si).

Hornbogen, E.↗