High Throughput Coefficient Thermal Expansion Testing Utilizing Digital Image Correlation
Dr. Fitzgerald, a postdoc at Sandia National Laboratories, works in a materials of mechanics group characterizing material properties of ductile materials. Her presentation focuses specifically on increasing throughput of coefficient of thermal expansion (CTE) measurements with the use of optical strain measurements, called digital image correlation (DIC). Currently, the coefficient of thermal expansion is found through a time intensive process called dilatometry. There are multiple types of dilatometers. One type, a double push rod mechanical dilatometer, uses and LVDT to measure the expansion of a specimen in one direction. It uses a reference material with known properties to determine the CTE of the specimen in question. Testing about 500 samples using the double push rod mechanical dilatometer would take about 2 years if testing Monday through Friday, because the reference material needs to be at a constant temperature and heating must done slowly to ensure no thermal gradients across the rod. A second type, scissors type dilatometer, pinches a sample using a “scissor-like” appendage that also uses a LVDT to measure thermal expansion as the sample is heated. Finally, laser dilatometry, was created to provide a non-contact means to measure thermal expansion. This process greatly reduces the time required to setup a measurement but is still only able to measure one sample at a time. The time required to test 500 samples gets reduced to 3.5 weeks. Additionally, to measure expansion in different directions, multiple lasers must be used. Dr. Fitzgerald solved this conundrum by using an optical measurement technique called digital image correlation to create strain maps in multiple orientations as well as measuring multiple samples at once. Using this technique, Dr. Fitzgerald can test 500 samples, conservatively, in 2 days.