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NASA Electronic Parts and Packaging (NEPP) Program

Recent Findings from Audits, New Technology Data Reviews a) Disabled Chip Burn-ins A recent audit for a QML device discovered that the chip was disabled during the static burn-in, thus it was not drawing any current. Recommendation: For new SMDs add a statement within the burn-in paragraphs stating that the parts shall be kept in their enabled state during the burn-in. b) Class Q 160-hr/125oC Burn-in This is being interpreted as a static burn-in (even for CMOS technology). Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. c) At Frequency (Dynamic) Burn-ins Test equipment limitation is being cited for not doing burn-ins at the application frequency. Recommendation: The burn-in task group to discuss and provide guidance. When the SMD says that the part can be used at 200 MHz, then doing burn-in at 6 MHz (cited as burn-in equipment limitation frequency) is not going to be meaningful! d) Two Static Burn-ins Some manufacturers are doing electrical testing between the two static burn-ins, whereas others do electricals after completing both static burn-ins. Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. e) Thermal Imaging For a device with hot spots, the thermal resistance, junction-to-case, would be much higher than the guidelines given in MIL-STD-1835. One of the suppliers used thermal imaging to find hot spots on the die. Recommendation: Assign a task group to evaluate the effectiveness of thermal imaging at the product development stage.

Class Y↗

NASA Electronic Parts and Packaging (NEPP) Program: Resources for SmallSats on EEE Parts

From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.

Electrical↗

NASA Electronic Parts and Packaging (NEPP) Program - Resources for SmallSats on EEE Parts

From the outside looking in, the NEPP program supports NASA's traditional approach to providing electrical, electronic, and electromechanical (EEE) assurance for space missions. Standards (military and commercial) for EEE parts are based on risk averse methodologies, drive higher costs and schedules, and, in general, provide devices that significantly lag behind commercial devices in performance aspects (speed, power efficiency, etc...). This is NOT the model most small missions realistically can use. However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as NEPP's current research/development efforts that are relevant. While we'll primarily discuss radiation assurance related issues such as data availability and usage, assurances processes for not only the radiation effects side, but also the EEE parts reliability will be touched upon.

Parts assurance↗

The NASA Electronic Parts and Packaging (NEPP) Program - NASA Items of Interest

This presentation provides a background summary of the NEPP Program, its origins and operating principles followed by examples of issues and opportunities that NEPP is currently pursuing. These examples include Electrostatic Discharge protection procedures that are not being properly applied, one reason for which is the confusion caused by the numerous, different standards covering this topic. Updates are provided for key activities in radiation hardness assurance, and the evaluation of automotive grade electronic parts for use in space applications. Some recent examples of part problems experienced by NASA are briefly described and the latest trending of incidences of counterfeit electronic parts is shown graphically. Finally some forward actions are identified and the time, place and typical topics is provided for the next NEPP Electronic Technology Workshop (ETW).

Electrical Electronic and Electromechanical (EEE)↗

Compendium of Current Total Ionizing Dose and Displacement Damage Results from NASA Goddard Space Flight Center and NASA Electronic Parts and Packaging Program

Total ionizing dose and displacement damage testing was performed to characterize and determine the suitability of candidate electronics for NASA space utilization. Devices tested include optoelectronics, digital, analog, linear bipolar devices, and hybrid devices. Displacement Damage, Optoelectronics, Proton Damage, Single Event Effects, and Total Ionizing Dose.

Proton Damage↗