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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1980

Fracture modes of high modulus graphite/epoxy angleplied laminates subjected to off-axis tensile loads

Angleplied laminates of high modulus graphite fiber/epoxy were examined in several ply configurations at various tensile loading angles to the zero ply direction to determine the effects of ply orientations on tensile properties, fracture modes, and fracture surface characteristics of the various plies. Experimental results consist of stress-strain data, selected plots, fracture stresses and strains, and scanning electron microscope (SEM) photographs of fracture surfaces. It was found that the stress-strain curves were linear to fracture, and that although fracture surface characteristics for a given fracture mode are similar to those for the same fracture mode in uniaxial specimens, no simple load angle range can be associated with a given fracture mode. It was also concluded that SEM results must be supplemented with ply stress calculations in order to identify ranges of fracture modes occurring as a function of ply orientation with respect to the load direction.

Sinclair, J. H.↗
NASA NTRS1996

NCMS ESS 2000 Project

ESS 2000 has the vision of enhancing the knowledge necessary to implement cost-effective, leading-edge ESS technologies and procedures in order to increase U.S. electronics industry competitiveness. This paper defines EES and discusses the factors driving the project, the objectives of the project, its participants, the three phases of the project, the technologies involved, and project deliverables.

ESS environmental stress screening electronics ind↗
NASA NTRS2007

Reliability Effects of Surge Current Testing of Solid Tantalum Capacitors

Solid tantalum capacitors are widely used in space applications to filter low-frequency ripple currents in power supply circuits and stabilize DC voltages in the system. Tantalum capacitors manufactured per military specifications (MIL-PRF-55365) are established reliability components and have less than 0.001% of failures per 1000 hours (the failure rate is less than 10 FIT) for grades D or S, thus positioning these parts among electronic components with the highest reliability characteristics. Still, failures of tantalum capacitors do happen and when it occurs it might have catastrophic consequences for the system. This is due to a short-circuit failure mode, which might be damaging to a power supply, and also to the capability of tantalum capacitors with manganese cathodes to self-ignite when a failure occurs in low-impedance applications. During such a failure, a substantial amount of energy is released by exothermic reaction of the tantalum pellet with oxygen generated by the overheated manganese oxide cathode, resulting not only in destruction of the part, but also in damage of the board and surrounding components. A specific feature of tantalum capacitors, compared to ceramic parts, is a relatively large value of capacitance, which in contemporary low-size chip capacitors reaches dozens and hundreds of microfarads. This might result in so-called surge current or turn-on failures in the parts when the board is first powered up. Such a failure, which is considered as the most prevalent type of failures in tantalum capacitors [I], is due to fast changes of the voltage in the circuit, dV/dt, producing high surge current spikes, I(sub sp) = Cx(dV/dt), when current in the circuit is unrestricted. These spikes can reach hundreds of amperes and cause catastrophic failures in the system. The mechanism of surge current failures has not been understood completely yet, and different hypotheses were discussed in relevant literature. These include a sustained scintillation breakdown model [1-3]; electrical oscillations in circuits with a relatively high inductance [4-6]; local overheating of the cathode [5,7, 8]; mechanical damage to tantalum pentoxide dielectric caused by the impact of MnO2 crystals [2,9, 10]; or stress-induced-generation of electron traps caused by electromagnetic forces developed during current spikes [11]. A commonly accepted explanation of the surge current failures is that at unlimited current supply during surge current conditions, the self-healing mechanism in tantalum capacitors does not work, and what would be a minor scintillation spike if the current were limited, becomes a catastrophic failure of the part [l, 12]. However, our data show that the scintillation breakdown voltages are significantly greater that the surge current breakdown voltages, so it is still not clear why the part, which has no scintillations, would fail at the same voltage during surge current testing (SCT).

Teverovsky, Alexander↗
NASA NTRS2007

Effect of Mechanical Stresses on Characteristics of Chip Tantalum Capacitors

The effect of compressive mechanical stresses on chip solid tantalum capacitors is investigated by monitoring characteristics of different part types under axial and hydrostatic stresses. Depending on part types, an exponential increase of leakage currents was observed when stresses exceeded 10 MPa to 40 MPa. For the first time, reversible variations of leakage currents (up to two orders of magnitude) with stress have been demonstrated. Mechanical stresses did not cause significant changes of AC characteristics of the capacitors, whereas breakdown voltages measured during the surge current testing decreased substantially indicating an increased probability of failures of stressed capacitors in low impedance applications. Variations of leakage currents are explained by a combination of two mechanisms: stress-induced scintillations and stress-induced generation of electron traps in the tantalum pentoxide dielectric.

Teverovsky, Alexander A.↗
NASA NTRS1965

Blood-Pressure Measuring System Gives Accurate Graphic Output

The problem: To develop an instrument that will provide an external (indirect) measurement of arterial blood pressure in the form of an easily interpreted graphic trace that can be correlated with standard clinical blood-pressure measurements. From sphygmograms produced by conventional sphygmographs, it is very difficult to differentiate the systolic and diastolic blood-pressure pulses and to correlate these indices with the standard clinical values. It is nearly impossible to determine these indices when the subject is under physical or emotional stress. The solution: An electronic blood-pressure system, basically similar to conventional ausculatory sphygmomanometers, employing a standard occluding cuff, a gas-pressure source, and a gas-pressure regulator and valve. An electrical output transducer senses cuff pressure, and a microphone positioned on the brachial artery under the occluding cuff monitors the Korotkoff sounds from this artery. The output signals present the conventional systolic and diastolic indices in a clear, graphical display. The complete system also includes an electronic timer and cycle-control circuit.

Source record↗
NASA NTRS2018

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses

Electronics packaging↗
NASA NTRS1992

Polarized-Cathodoluminescence Study Of Stress In GaAs/Si

Report describes experiments in which linearly polarized cathodoluminesce scanning electron microscopy, in both imaging and spectroscopic forms, used to analyze spatial variations in stress tensors in specimens of GaAs/Si. Specimens fabricated by atmospheric-pressure metallo-organic chemical vapor deposition of GaAs to thickness of 4 micrometers on Si substrates. Combination of mismatch between Si and GaAs crystal lattices and differential thermal contraction of materials from deposition temperature (700 degrees C) to room temperature gives rise to stresses in GaAs layer. Experiments conducted to contribute to understanding of effects of these stresses and ramifications thereof for fabrication of electronic devices in GaAs/Si system.

Rich, Daniel H.↗
NASA NTRS2001

C-Coupon Studies of CMCS: Fracture Behavior and Microstructural Characterization

A curved beam 'C-coupon' was used to assess fracture behavior in a Sylramic(tm)/melt infiltration (MI) SiC matrix composite. Failure stresses and fracture mechanisms, as determined by optical and scanning electron microstructural analysis, are compared with finite element stress calculations to analyze failure modes. Material microstructure was found to have a strong influence on mechanical behavior. Fracture occurs in interlaminar tension (ILT), provided that the ratio of ILT to tensile strength for the material is less than the ratio of radial to hoop stresses for the C-coupon geometry. Utilization of 3D architectures to improve interlaminar strength requires significant development efforts to incorporate through thickness fibers in regions with high curvatures while maintaining uniform thickness, radius, and microstructure.

Hurwitz, Frances I.↗
NASA NTRS1983

Correlation of Rupture Life, Creep Rate, and Microstructure for Type 304 Stainless Steel

The stress and temperature sensitivites of the rupture life and secondary creep rate were examined in detail for a single heat of type 304 stainless steel (9T2796). Assuming that the rupture life has a power law stress dependency, relatively small differences in the stress exponent were observed over a broad range of stress and temperature. In contrast, large changes were observed for equivalent parameter for secondary creep rate. As a result of these differences, the Monkman-Grant correlation was sensitive to stress and temperature below 650 C. Metallurgical studies based on light and transmission electron microscopy suggested that the temperature and stress sensitivities of secondary creep rate at temperatures below 650 C were related to features of the substructure not present at higher temperature. Specifically, the presence of a fine dislocation network stabilized by precipitates altered the stress and temperature sensitivities relative to what might be expected from high temperature studies.

Swindeman, R. W.↗
NASA NTRS2008

Intelligent Memory Module Overcomes Harsh Environments

Solar cells, integrated circuits, and sensors are essential to manned and unmanned space flight and exploration, but such systems are highly susceptible to damage from radiation. Especially problematic, the Van Allen radiation belts encircle Earth in concentric radioactive tori at distances from about 6,300 to 38,000 km, though the inner radiation belt can dip as low as 700 km, posing a severe hazard to craft and humans leaving Earth s atmosphere. To avoid this radiation, the International Space Station and space shuttles orbit at altitudes between 275 and 460 km, below the belts range, and Apollo astronauts skirted the edge of the belts to minimize exposure, passing swiftly through thinner sections of the belts and thereby avoiding significant side effects. This radiation can, however, prove detrimental to improperly protected electronics on satellites that spend the majority of their service life in the harsh environment of the belts. Compact, high-performance electronics that can withstand extreme environmental and radiation stress are thus critical to future space missions. Increasing miniaturization of electronics addresses the need for lighter weight in launch payloads, as launch costs put weight at a premium. Likewise, improved memory technologies have reduced size, cost, mass, power demand, and system complexity, and improved high-bandwidth communication to meet the data volume needs of the next-generation high-resolution sensors. This very miniaturization, however, has exacerbated system susceptibility to radiation, as the charge of ions may meet or exceed that of circuitry, overwhelming the circuit and disrupting operation of a satellite. The Hubble Space Telescope, for example, must turn off its sensors when passing through intense radiation to maintain reliable operation. To address the need for improved data quality, additional capacity for raw and processed data, ever-increasing resolution, and radiation tolerance, NASA spurred the development of the Radiation Tolerant Intelligent Memory Stack (RTIMS).

Source record↗
NASA NTRS1993

Physical properties of glasses exposed to Earth-facing and trailing-side environments on LDEF

The exposure of 108 glass samples and 12 glass-ceramic samples to Earth-orbit environments permitted measurements which establish the effects of each environment. Examination of five glass types and one glass ceramic located on both the Earth-facing side and the trailing edge revealed no reduction in strength within experimental limits. Strength measurements subjected less than 5 percent of the sample surface area to stresses above 90 percent of the glass's failure strength. Seven micrometeorite or space debris impacts occurred on trailing edge samples. One of those impacts occurred in a location which was subjected to 50 percent of the applied stress at failure. Micrometeorite or space debris impacts were not observed on Earth-facing samples. The physical shape and structure of the impact sites were carefully examined using stereographic scanning electron microscopy. These impacts induce a stress concentration at the damaged region which influences mechanical strength. The flaw size produced by such damage was examined to determine the magnitude of strength degradation in micrometeorite or space-debris impacted glasses. Scanning electron microscopy revealed topographical details of impact sites which included central melt zones and glass fiber production. The overall crater structure is similar to much larger impacts of large meteorite on the Moon in that the melt crater is surrounded by shocked regions of material which fracture zones and spall areas. Residual stresses arising from shock compression and cooling of the fused zone cannot currently be included in fracture mechanics analyses based on simple flaw size examination.

Wiedlocher, David E.↗
NASA NTRS1967

Study of stress corrosion in aluminum alloys

Mechanism of the stress corrosion cracking of high-strength aluminum alloys was investigated using electrochemical, mechanical, and electron microscopic techniques. The feasibility of detecting stress corrosion damage in fabricated aluminum alloy parts by nondestructive testing was investigated using ultrasonic surface waves and eddy currents.

Brummer, S. B.↗
NASA NTRS1986

The Comet Giacobini-Zinner magnetotail: Axial stresses and inferred near-nucleus properties

Utilizing the electron and magnetic field data from the ICE tail traversal of comet Giacobini-Zinner along with the MHD equations, a steady state, stress balance model of the cometary magnetotail was developed, and used to infer important but unmeasured ion properties within the magnetotail at ICE and upstream at the average point along each streamline where cometary ions are picked-up. The derived tailward ion flow speed at ICE is quite constant at approx. -20 to -30 km/sec across the entire tail. The flow velocity, ion temperature, density, and ion source rates upstream from the lobes (current sheet) at the average pick-up locations are approx. -75 km/sec (approx. -12), approx. 4 million K (approx. 100,000), approx. 20 cc (approx. 400), and approx. 15 cu cm/sec. Gradients in the plasma properties between the two regions are quite strong. Implications of inferred plasma properties for the near-nucleus region and for cometary magnetotail formation are examined.

Mccomas, D. J.↗