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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3

Alternatives to the ISS Plasma Contacting Units

A spacecraft in a high-density equatorial LEO plasma will float negative relative to the ambient plasma. Because of the electron collection of exposed conductors on its solar arrays, it may float negative by up to its array voltage. The floating potential depends on the relative areas of electron and ion collection of the spacecraft. Early estimates of the International Space Station (ISS) potential were about -140 V relative to the surrounding plasma, because of its 160 V solar array string voltage. Because of the possibility of arcing of ISS structures and astronaut EMUs (spacesuits) into the space plasma, Plasma Contacting Units (PCUs) were added to the ISS design, to reduce the highly negative floating potentials by emitting electrons (effectively increasing the ion collecting area). In addition to the now-operating ISS PCUs, safety rules require another independent arc-hazard control method. In this paper, I discuss alternatives to the ISS PCUs for keeping the ISS floating potential at values below the arc-thresholds of ISS and EMU surface materials. Advantages and disadvantages of all of the recline loss will be presented.

Ferguson, Dale C.↗

Phase equilibria and crystal chemistry of rubidium niobates and rubidium tantalates

The phase equilibria relations and crystal chemistry of portions of the Rb2O-Nb2O5 and Rb2O-Ta2O5 systems were investigated for structures potentially useful as ionic conductors. A hexagonal tungsten bronze-type (HTB) structure was found in both systems as well as three hexagonal phases with mixed HTB-pyrochlore type structures. Ion exchange experiments between various alkali ions are described for several phases. Unit cell dimensions and X-ray diffraction powder patterns are reported.

Minor, D. B.↗

An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. Also, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB). The rare polycrystalline structure seen in the FIB cross section was confirmed using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size to determine that the tin plating on the card guides had a bright finish.

Courey, Karim J.↗

An Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers-Part I

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance, electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data, we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. In addition, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross sectioned and studied using a focused ion beam (FIB).

Courey, Karim↗

An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. Also, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB). The rare polycrystalline structure seen in the FIB cross section was confirmed using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size to determine that the tin plating on the card guides had a bright finish.

Courey, Karim J.↗

Investigation of high voltage spacecraft system interactions with plasma environments

The exposure of high voltage spacecraft systems to the charged particle environment of space can produce interactions that will influence system operation. An experimental investigation of these interactions has been undertaken for insulator and conductor test surfaces biased up to plus or minus 1 kV in a simulated low earth orbit charged particle environment. It has been found that these interactions are controlled by the insulator surfaces surrounding the biased conductors. For positive applied voltages the electron current collection can be enhanced by the insulators. For negative applied voltages the insulator surface confines the voltage to the conductor region; this can cause arcing. Understanding these interactions and the technology to control their impact on system operation is essential to the design of solar cell arrays for ion drive propulsion applications that use direct drive power processing.

Stevens, N. J.↗

Tin Whisker Electrical Short Circuit Characteristics Part 2

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. In addition, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB).

Courey, Karim J.↗

Electrical screening procedure for solid ionic conductors

An electrical screening method has been developed for preliminary evaluation of polycrystalline specimens of candidates for use as solid ionic conductive electrolytes in batteries. The procedure measures dielectric loss and capacitance, from which are calculated an ac conductivity attributed provisionally to ions and an activation energy for that conductivity. Electronic conductivity is directly measured. The screening procedure applied to sodium beta-alumina yielded acceptable values for conductivity and activation energy.

Kautz, H. E.↗

Description and charging results from the RSPM

Representative satellite materials, to be flown on STP-78-2 in 1979 on the SSPM instruments, were included as part of the AFGL Rocket payload flown from White Sands Missile Range on January 21, 1978. Potentials as high as + 1100 volts on the conductor and + or - 400 volts on the insulator were recorded by the RSPM near the minimum in the electron density vs altitude profile. In addition to the charging potentials measured during ion gun operation, sample charging currents also were recorded with time resolutions near 30 milliseconds. These results demonstrate the validity of the experiment concept of the SSPM on SCATHA.

Mizera, P. F.↗

Pt: Ti Diffusion Barrier, Interconnect, and Simultaneous Ohmic Contacts to n- and p-type 4H-SiC

We report the initial results of using co-sputtered Pt:Ti 80:20 at. % composition ratio metallization as a diffusion barrier against gold (Au) and oxygen (O), as an interconnect layer, as well as forming simultaneous ohmic contacts to n-and p-type 4H-SiC. Having a single conductor with such combined multi-functional attributes would appreciably reduce the fabrication costs, processing time and complexity that are inherent in the production of SiC based devices. Auger Electron Spectroscopy, Focused Ion Beam-assisted Field Emission Scanning Electron Microscopy and Energy Dispersive Spectroscopy analyses revealed no Au and O migration to the SiC contact surface and minimal diffusion through the Pt:Ti barrier layer after 15 minutes of exposure at 800 °C in atmosphere, thus offering potential long term stability of the ohmic contacts. Specific contact resistance values of 7 x 10(exp -5) and 7.4 x 10(exp -4) Ω-sq.cm were obtained on the n (N(sub d)=7 x 10(exp 18) per cu.cm and p (N(sub a)=2 x 10(exp 20) per cu. cm) -type 4H-SiC, respectively. The resistivity of 75 μΩ-cm was obtained for the Pt:Ti layer that was sandwiched between two SiO2 layers and annealed in pure O ambient up to 900 °C, which offers promise as a high temperature interconnect metallization.

Simultaneous Ohmic Contact↗

Charge Deposition/Neutralization and Dust Removal via Plasma Interactions

Electrically charged and chemically reactive lunar dust can cause serious problems to spacecraft, surface equipment, and astronaut health, so understanding its interaction with and transport through the lunar plasma environment is important to dust mitigation efforts. We explore the charging of granular material in the natural environment of the Moon, recreate those conditions in the laboratory under high vacuum, and examine dust transport and charge neutralization for application in future lunar missions. Phenomena such as charge deposition via electron and ion beams, photoionization through ultraviolet light exposure, neutralization of charge through impingement by an ionized compressed gas, and tribocharging during dust liberation from surfaces will be presented. Surface materials of interest such as floating/grounded conductors and orthofabric for spacesuits are the preliminary focus of this effort. An electrometer is used to characterize currents interacting with the surfaces in the case of the electron/ion/UV source exposure, an electrostatic voltmeter is used to measure the potential on the surfaces without inadvertently discharging them, and a charge plate monitor is used to verify the efficiency of discharging the surfaces via ionized gas impingement. After setup of the initial charge conditions on the surfaces, a quick burst of high-pressure gas is used to overcome adhesion forces and initially dislodge the dust from the surfaces, followed by a low flow of gas that is ionized via application of a strong electric field. The gas is released in a high vacuum environment so as the pressure drops from the initial compressed state through to the vacuum state, the mean free path reaches a point where ionization can occur before all the gas disperses into the vacuum. This ionized gas can then neutralize both the dust and the surface to ensure minimal resettling. Several parameters such as gas composition, electrode geometry, high voltage waveform shape/polarity, and pulse timing have been explored and will be presented here.

electrostatics↗

Vertical bloch line memory

Vertical Bloch Line (VBL) memory is a recently conceived, integrated, solid-state, block-access, VLSI memory which offers the potential of 1Gbit/sq cm real storage density, gigabit per second data rates, and sub-millisecond average access times simultaneously at relatively low mass, volume, and power values when compared to alternative technologies. VBL's are micromagnetic structures within magnetic domain walls which can be manipulated using magnetic fields from integrated conductors. The presence or absence of VBL pairs are used to store binary information. At present, efforts are being directed at developing a single-chip memory using 25Mbit/sq cm technology in magnetic garnet material which integrates, at a single operating point, the writing, storage, reading, and amplification functions needed in a memory. This paper describes the current design architecture, functional elements, and supercomputer simulation results which are used to assist the design process. The current design architecture uses three metal layers, two ion implantation steps for modulating the thickness of the magnetic layer, one ion implantation step for assisting propagation in the major line track, one NiFe soft magnetic layer, one CoPt hard magnetic layer, and one reflective Cr layer for facilitating magneto-optic observation of magnetic structure. Data are stored in a series of elongated magnetic domains, called stripes, which serve as storage sites for arrays of VBL pairs. The ends of these stripes are placed near conductors which serve as VBL read/write gates. A major line track is present to provide a source and propagation path for magnetic bubbles. Writing and reading, respectively, are achieved by converting magnetic bubbles to VBL's and vice versa. The output function is effected by stretching a magnetic bubble and detecting it magnetoresistively. Experimental results from the past design cycle created four design goals for the current design cycle. First, the bias field ranges for the stripes and the major line needed to be matched. Second, the magnetic field barrier between the stripe and the read/write gates needed to be reduced. Third, current conductor routing needed to be improved to reduce occurrences of open-circuiting, short-circuiting, and eddy-current shielding. Fourth, a modified Co-alloy was needed with an increased coercivity and controlled magnetization to allow VBL stabilization to occur without affecting stripe stability.

Katti, R.↗

Sub-ppb Oxygen Contaminant Detection in Semi-Conductor Processing

Gaseous contaminants such as oxygen, water vapor, nitrogen and hydrocarbons are often present in the processing environment in semiconductor device fabrication and in containerless materials processing. The contaminants arise as a result of outgassing from hot surfaces or they may be part of the impurities in commercial ultra-high purity gases. Among these gaseous contaminants, oxygen is the most reactive and, therefore, has the most adverse effects on the end product. There has been an intense effort at the Jet Propulsion Laboratory to develop different types of oxygen sorbents to reduce oxygen concentration in a microgravity processing environment to sub-ppb (parts-per-billion) levels. Higher concentrations can lead to rapid surface oxide formation, hence reducing the quality of semiconductor devices. If the concentration of oxygen in a processing chamber at 1000oC is in the ppb level, it will only take approximately 10 seconds for an oxide layer to form on the surface of a sample. The interaction of oxygen with the water surface can lead to the formation of localized defects in semi-conductor devices, hence decreasing the manufacturing yield. For example, efficient production of 64 Mb RAM chips requires contaminations below ppb levels. This paper describes a technique for measuring trace quantities of oxygen contaminants by recording the monoatomic negative ions, O-, using mass spectrometry. The O- formation from the e--O2 interaction utilizes the electron dissociative attachment method that is greatly enhanced at the resonant energy (6.8 eV). The device combines a small gridded electron ionizer with a compact mass spectrometer. The concentrations of oxygen have been measured using the method of standard additions by diluting O2 in N2. The lowest detection limit obtained was 1.2 kHz (O- count rate) at a concentration of 10-10, corresponding to 0.1 ppb.

Sub-ppb Contaminant↗

Leo space plasma interactions

Photovoltaic arrays interact with the low earth orbit (LEO) space plasma in two fundamentally different ways. One way is the steady collection of current from the plasma onto exposed conductors and semiconductors. The relative currents collected by different parts of the array will then determine the floating potential of the spacecraft. In addition, these steady state collected currents may lead to sputtering or heating of the array by the ions or electrons collected, respectively. The second kind of interaction is the short time scale arc into the space plasma, which may deplete the array and/or spacecraft of stored charge, damage solar cells, and produce EMI. Such arcs only occur at high negative potentials relative to the space plasma potential, and depend on the steady state ion currents being collected. New high voltage solar arrays being incorporated into advanced spacecraft and space platforms may be endangered by these plasma interactions. Recent advances in laboratory testing and current collection modeling promise the capability of controlling, and perhaps even using, these space plasma interactions to enable design of reliable high voltage space power systems. Some of the new results may have an impact on solar cell spacing and/or coverslide design. Planned space flight experiments are necessary to confirm the models of high voltage solar array plasma interactions. Finally, computerized, integrated plasma interactions design tools are being constructed to place plasma interactions models into the hands of the spacecraft designer.

Ferguson, Dale C.↗

Nanoelectric Materials Laboratory Development

The Ultracapacitor Research and Development project is a collaborative effort between the NASA Marshall Space Flight Center's (MSFC's) ES43 Parts, Packaging, and Fabrication Branch and the EM41 Nonmetallic Materials Branch. NASA's Ultracapacitor Research is an effort to develop solid-state energy storage devices through processing of ceramic materials into printable dielectric inks, which can be formed and treated to produce solid state ultracapacitor cells capable of exceeding lithium-ion battery energy density at a fraction of the weight. Research and development efforts into solid state ultracapacitors have highlighted a series of technical challenges such as understanding as-received nature of ceramic powders, treatment and optimization of ceramic powders, dielectric and conductor ink formulation, and firing of printed (green) ultracapacitor cells. Two facilities have been continually developed since project inception: the Additive Electronics Lab in Bldg. 4487 and the Nanoelectric Materials Lab in Bldg. 4602. The Nanoelectric Materials Lab has become a unique facility at MSFC, capable of custom processing a wide range of media for additive electronics. As research has progressed, it was discovered that additional in-house processing was necessary to achieve smaller, more uniform particle diameters. A vibratory mill was obtained that can agitate powder and media in three directions, which has shown to be much more effective than ball milling. However, in order to understand the effects of milling, a particle size analysis system has been installed to characterize as-received and milled materials Continued research into the ultracapacitor technology included advanced milling and optimization of ceramic nanoparticles, fluidized bed treatment of atomic-layer deposition- (ALD-) coated ceramic particles, custom development of dielectric and conductor inks, as well as custom ink precursors such as polyvinylidene diflouride- (PVDF-) loaded vehicles. Experiments with graphene-based inks were also conducted.

Allen, Lee↗

Ionization Properties of Molecules Commonly Used for Plasma Processing of Semi-Conductors

Two types of processes are involved in plasma processing of semi-conductors. They are: plasma etching or cleaning and plasma deposition of the semi-conducting materials. For plasma etching of semi-conductors mostly halogen containing gases are used as additives to gases such as O2 and N2. For plasma deposition gases such as C2H2, SiH4, Si2H6 have been tested in the past. For an optimal performance of a reactor it is important to model the plasma. In this modeling effort electron impact excitation and ionization cross sections play a central role. For ionization balance calculations values of ionization cross sections are needed. Ion molecule reactions determine the ultimate composition of the plasma. Recently it has been discovered that the by products of many of these plasmas are per fluro hydrocarbons (PFCs) which are highly infrared absorbing species and have long life times in the atmosphere. They cause global warming. A lot of research is being pursued at the present time to find alternative molecules which do not produce global warming gases as the and product of the plasma processing reactor. There is also interest in the ionization and dissociative ionization properties of these molecules from the point view of the plasma abatement of the pollutant gases at the exhaust of the semi-conductor processing reactors. At the conference ionization and dissociative ionization properties of some of these molecules will be presented.

Srivastava, S. K.↗

Ion drag for a negatively biased solar array in low earth orbit

Highly biased solar arrays in the space environment are found to have a number of significant interactions with the space environment. The enhanced drag suffered by highly biased solar arrays is studied with the particle-in-cell code. The results are compared to recent numerical work. The drag calculations contain the effect of having the conductor surrounded by dielectrics as well as the charging of the dielectric by electrons. The results are used to calculate the attitude change expected on the high-voltage solar array of the Japanese Space Flyer Unit.

Hastings, Daniel E.↗

An intracloud lightning parameterization scheme for a storm electrification model

The parameterization of an intracloud lightning discharge has been implemented in the present storm electrification model. The initiation, propagation direction, and termination of the discharge are computed using the magnitude and direction of the electric field vector as the determining criteria. The charge redistribution due to the lightning is approximated assuming the channel to be an isolated conductor with zero net charge over its entire length. Various simulations involving differing amounts of charge transferred and distribution of charges have been done. Values of charge transfer, dipole moment change, and electrical energy dissipation computed in the model are consistent with observations. The effects of the lightning-produced ions on the hydrometeor charges and electric field components depend strongly on the amount of charge transferred. A comparison between the measured electric field change of an actual intracloud flash and the field change due to the simulated discharge shows favorable agreement. Limitations of the parameterization scheme are discussed.

Helsdon, John H., Jr.↗