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High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗

AIAA Ascend 2021 Conference On Demand Manufacturing of Electronics Panel Abstract

1. Session Proposal o Session Title NASA’s In Space Manufacturing and the On Demand Manufacturing of Electronics o Session Topic Primary -- Space Logistics, Autonomy, and Robotics; Secondary – Transformative Research and Technologies o Session Format: Panel Discussion. o Requested Session Duration: 60 minutes o Short Session Description: The goal of NASA’s On Demand Manufacturing of Electronics project is to develop and demonstrate the feasibility of a low-gravity, on-demand manufacturing system for flexible hybrid electronic devices on the International Space Station. This panel will feature several key collaborators and team members from the commercial sector, academia, and internal to NASA, each of which are contributing an unique and vital role to the design and implementation of this new technology system. o Extended Session Description (Please describe in detail the activity proposed, including how you intend to use the requested session duration. This session description will be provided to the reviewers for consideration and will not be displayed in the online agenda.): The session will be moderated by Curtis Hill, the Project Lead for the On Demand Manufacturing of Electronics (ODME), and he will start by giving a brief introduction to the ODME project which is working to produce a demo system for the manufacturing of electronic devices on the International Space Station. Panelists consisting of collaborators and team members to the ODME project will then give a brief (~5 min) introduction highlighting their contributions to the project, followed by time for Q&A from the audience. The panel will consist of: 1. Kenneth Church, nScrypt. nScrypt is a leader in multi-material printing with a modular system that incorporates a direct write thick film print head, a polymer fused filament fabrication print head, a laser sintering attachment, a drill head attachment for milling, and a pick and place. The system can print a layer and scan for accuracy of prints. The combination of multiple print heads and scanning allows for the on-demand production of intricate electronic components. 2. Andy Kurk, TechShot, Inc. Techshot, Inc. has collaborated extensively with NASA on the in space manufacturing of both printed electronics and fused metal materials. They are currently working to develop and integrate a test system for printed electronics, and a flight demonstration on the International Space Station is anticipated in 2024. 3. Ed Hendricks, NextFlex. NextFlex has the goal of advancing the manufacture of flexible hybrid electronics in the U.S. They are working with ODME on the development of AstroSense, an additively manufactured, wireless, flexible, and wearable health sensor. 4. Dr. Pradeep Lall, Auburn University. Professor Lall is the MacFarlane Endowed Distinguished Professor in the Department of Mechanical Engineering with a Courtesy Joint Appointment in the Department of Electrical and Computer Engineering and a Courtesy Joint Appointment in the Department of Finance. He is collaborating with NASA’s ODME project to develop multilayer printable devices and to develop techniques to test the quality of a printed electronic device. 5. Dr. Wei Gao, California Institute of Technology. Professor Gao is an Assistant Professor of Medical Engineering. His group is developing fully printed, flexible, and wearable biosensors for crew health monitoring in collaboration with NASA’s ODME project. In addition, they are working on using sweat to power biofuel cells for wearable, self-powered electronic devices. 6. Beth Paquette, NASA Goddard. The ODME branch at NASA Goddard is spearheading a sounding rocket flight demo to prove the capability of a printed electronic device with multiple sensors. In addition, they focus on thin film and flexible energy storage evaluations. o Session Goal(s)/Outcome(s): Please list the learning objectives and/or tangible outcomes (technical paper or other publication). The goal of this session is to highlight the internal and collaborative efforts of NASA’s On Demand Manufacturing of Electronics project to develop a system for printing electronics that will be tested on the International Space Station in 2024. In addition, the session with facilitate discussion with the community on the state of the art of printable electronics, current challenges, and new avenues for collaboration.

Jennifer McInnis Jones↗

Windform® XT 2.0 Use as 3U CubeSat Primary Structure

CubeSats provide a platform for small-scale space research and technology demonstration at reduced complexity, cost, and development time. These advantages drove the NASA Langley Research Center (LaRC) to develop and launch the GPX2 3U CubeSat to explore the viability of using Commercial Off-The-Shelf (COTS) differential GPS (dGPS) in low earth orbit. To reduce manufacturing costs and increase design flexibility, the project chose additive manufactured Windform® XT 2.0 as the primary bus material rather than traditional subtractive manufactured (milled) metal. The bus is a two-part, Selective Laser Sintered, 3D-print structure consisting of a single-piece, five-walled chassis and single-walled cover. The bus was specially designed to allow the project to accommodate the payload electronics stack as well as antennas, receivers, and deployable mechanisms. By using an additive manufactured solution, LaRC was able to design in features unrealizable through traditional milling, with a lead-time of roughly two weeks. In comparison, traditional subtractive manufacturing limits geometry options due to toolpath reach and bus construction would have required multiple components for each wall. This would have resulted in a more costly, longer lead-time article with more joints, fasteners, and complexity with a commensurate increase in overall mass. A number of lessons-learned were captured during the design, analysis, and testing of the GPX2 CubeSat covering thermal and structural analysis, vibration modeling, and geometric tolerancing. Additionally, a variety of material testing and verification were performed before and during spacecraft design and integration to assure the suitability of Windform® XT 2.0 for the launch and mission environments. This article provides the highlights of designing and testing the GPX2 bus.

CubeSat↗

Aerodynamic Performance and Acoustic Impacts of Varying Tip Speeds and Tripping Conditions on Small Rotors in an Anechoic Hover Chamber

Performance and acoustic measurements were taken in a hover chamber for various optimum hovering rotors (OPT2) and a commercial-off-the-shelf (COTS) rotor. A total of 10 rotors are included in this report, all of which have two blades and a tip radius of 0.1905 m (7.5 in.). For the OPT2, results for three additive manufacturing methods of fabrication are presented: stereolithography(SLA) using Accura Xtreme, SLA using FormLabs 10K resin, and selective laser sintering (SLS) using mineral-filled PA12 nylon material. All but one set of rotors were designed with a trailing edge bluntness that is 3% of the chord length, and one set was designed with a bluntness that is 1% of the chord length. Spanwise boundary layer trips were applied to the SLA, FormLabs and COTS rotors. Performance comparisons between untripped and tripped configurations demonstrate the impact of boundary layer state on rotor efficiency. Acoustic results, including periodic and broadband noise components, are presented. The effects of tripping these rotors near the leading edge are also presented. For some of the rotors, acoustic spectra of tip speed sweeps are presented to show how the frequency content changes with tip speed. Amplitude and frequency scaling methods are used to collapse broadband spectra at various tip speeds towards a unified curve. These findings contribute to the understanding of small rotor aeroacoustics and provide valuable datasets for computational model validation in urban air mobility applications.

eVTOL↗

Experimental Characterization of Additively Manufactured Nickel-Titanium Shape Memory Alloy Heat Pipes

Shape memory alloys (SMA) have been identified for use in spacecraft components as replacement for conventional deployment mechanisms. They may be used in thermal management components such as radiators to create self-deploying radiators. One SMA, NiTi, has also been developed for additive manufacturing processes. Heat pipes are a common way to create highly effective and lightweight spaceflight radiators, and heat pipes can also be made from NiTi and related alloys. The wick is the critical element of a functioning heat pipe, and recent progress over the past years has led to the development of additively manufactured heat pipe wicks in various materials. The combination of these efforts is the focus of this project: creating an additively manufactured, shape memory alloy self-deploying heat pipe radiator. This paper will focus on the experimental characterization of these additively manufactured NiTi heat pipes. The heat pipe coupons were additively manufactured by direct metal laser sintering (DMLS), with an integral liquid cooled condenser. Heat is input to the heat pipe via a thin film heater. Thermocouples were spot welded to the heat pipes to measure temperature at several axial locations. The heat pipes were tested with two working fluids: water and ethanol. Ethanol is not an ideal working fluid for heat pipes but is useful in characterizing them because it wets well to a wide variety of surfaces. Water is in general a superior working fluid for heat pipes, but its contact angle and therefore wicking performance strongly depends on the surface chemistry of the surface it is in contact with. A particular measurement of interest in this test is the evaporator to condenser thermal conductance, which will be compared in the full paper to recently published correlations for additively manufactured heat pipes. Experimental results for two straight geometry and one bellows geometry heat pipe will be presented. The bellows geometry is of interest for condenser of the self-deploying radiator design.

Additive manufacturing↗

Preliminary work toward the development of a dimensional tolerance standard for rapid prototyping

Rapid prototyping is a new technology for building parts quickly from CAD models. It works by slicing a CAD model into layers, then by building a model of the part one layer at a time. Since most parts can be sliced, most parts can be modeled using rapid prototyping. The layers themselves are created in a number of different ways - by using a laser to cure a layer of an epoxy or a resin, by depositing a layer of plastic or wax upon a surface, by using a laser to sinter a layer of powder, or by using a laser to cut a layer of paper. Rapid prototyping (RP) is new, and a standard part for use in comparing dimensional tolerances has not yet been chosen and accepted by ASTM (the American Society for Testing Materials). Such a part is needed when RP is used to build parts for investment casting or for direct use. The objective of this project was to start the development of a standard part by using statistical techniques to choose the features of the part which show curl - the vertical deviation of a part from its intended horizontal plane.

Kennedy, W. J.↗

Pulsed Laser Deposition of High Temperature Protonic Films

Pulsed laser deposition has been used to fabricate nanostructured BaCe(0.85)Y(0.15)O3- sigma) films. Protonic conduction of fabricated BaCe(0.85)Y(0.15)O(3-sigma) films was compared to sintered BaCe(0.85)Y(0.15)O(3-sigma). Sintered samples and laser targets were prepared by sintering BaCe(0.85)Y(0.15)O(3-sigma) powders derived by solid state synthesis. Films 1 to 8 micron thick were deposited by KrF excimer laser on porous Al2O3 substrates. Thin films were fabricated at deposition temperatures of 700 to 950 C at O2 pressures up to 200 mTorr using laser pulse energies of 0.45 - 0.95 J. Fabricated films were characterized by X-ray diffraction, electron microscopy and electrical impedance spectroscopy. Single phase BaCe(0.85)Y(0.15)O(3-sigma) films with a columnar growth morphology are observed with preferred crystal growth along the [100] or [001] direction. Results indicate [100] growth dependence upon laser pulse energy. Electrical conductivity of bulk samples produced by solid state sintering and thin film samples were measured over a temperature range of 100 C to 900 C. Electrical conduction behavior was dependent upon film deposition temperature. Maximum conductivity occurs at deposition temperature of 900 oC; the electrical conductivity exceeds the sintered specimen. All other deposited films exhibit a lower electrical conductivity than the sintered specimen. Activation energy for electrical conduction showed dependence upon deposition temperature, it varied

Dynys, Fred W.↗

Pulsed Laser Deposition of BaCe(sub 0.85)Y(sub 0.15)0(sub 3) FILMS

Pulsed laser deposition has been used to grow nanostructured BaCe(sub 0.85)Y(sub 0.15)0(sub 3) films. The objective is to enhance protonic conduction by reduction of membrane thickness. Sintered samples and laser targets were prepared by sintering BaCe(sub 0.85)Y(sub 0.15)O(sub 3) powders derived by solid state synthesis. Films 2 to 6 m thick were deposited by KrF excimer laser on Si and porous Al2O3 substrates. Nanocrystalline films were fabricated at deposition temperatures of 600-800 C deg at O2 pressure of 30 mTorr and laser fluence of 1.2 J/cm square. Films were characterized by x-ray diffraction, scanning electron microscopy and electrical impedance spectroscopy. Dense single phase BaCe(sub 0.85)Y((sub 0.15) 0(sub 3) films with a columnar growth morphology is observed, preferred crystal growth was found to be dependent upon deposition temperature and substrate type. Electrical conductivity of bulk samples produced by solid state sintering and thin film samples were measured over a temperature range of 100 C deg to 900 C deg in moist argon. Electrical conduction of the fabricated films was 1 to 4 orders of magnitude lower than the sintered bulk samples. With respect to the film growth direction, activation energy for electrical conduction is 3 times higher in the perpendicular direction than the parallel direction.

Dynys, F. W.↗

Study of deposition of YBa2Cu3O7-x on cubic zirconia

Films of YBa2Cu3O7-x were grown on (100) cubic zirconia with 8 percent yttria by laser ablation from sintered targets of YBa2Cu3O7-x. The temperature of the zirconia substrate during growth was varied between 700 and 780 C. The atmosphere during growth was 170 mtorr of O2. The films were subsequently slowly cooled in-situ in 1 atm of O2. The best films were c-axis aligned and had a transition temperature of 87.7 K. The superconducting transition temperature and the X-ray diffraction analysis is reported as a function of the substrate temperature and of the angle between the laser beam and the target's normal.

Warner, Joseph D.↗

Thermal Conductivity and Stability of HfO2-Y2O3 and La2Zr2O7 Evaluated for 1650 Deg C Thermal/Environmental Barrier Coating Applications

HfO2-Y2O3 and La2Zr2O7 are candidate thermal and environmental barrier coating (T/EBC) materials for gas turbine ceramic matrix composite (CMC) combustor applications because of their relatively low thermal conductivity and high temperature capability. In this paper, thermal conductivity and high temperature stability of hot-pressed and plasma sprayed specimens with representative partially-stabilized and fully-cubic HfO2-Y2O3 compositions and La2Zr2O7 were evaluated at temperatures up to 1700 C using a steady-state laser heat-flux technique. Sintering behavior of the plasmasprayed coatings was determined by monitoring the thermal conductivity increases during a 20-hour test period at various temperatures. Durability and failure mechanisms of the HfO2-Y2O3 and La2Zr2O7 coatings on mullite/SiC hexoloy or SiC/SiC CMC substrates were investigated at 1650 C under thermal gradient cyclic conditions. Coating design and testing issues for the 1650 C thermal/environmental barrier coating applications are also discussed.

Zhu, Dong-Ming↗

Thermal Conductivity and Water Vapor Stability of Ceramic HfO2-Based Coating Materials

HfO2-Y2O3 and La2Zr2O7 are candidate thermal/environmental barrier coating materials for gas turbine ceramic matrix composite (CMC) combustor liner applications because of their relatively low thermal conductivity and high temperature capability. In this paper, thermal conductivity and high temperature phase stability of plasma-sprayed coatings and/or hot-pressed HfO2-5mol%Y2O3, HfO2-15mol%Y2O3 and La2Zr2O7 were evaluated at temperatures up to 1700 C using a steady-state laser heat-flux technique. Sintering behavior of the plasma-sprayed coatings was determined by monitoring the thermal conductivity increases during a 20-hour test period at various temperatures. Durability and failure mechanisms of the HfO2-Y2O3 and La2Zr2O7 coatings on mullite/SiC Hexoloy or CMC substrates were investigated at 1650 C under thermal gradient cyclic conditions. Coating design and testing issues for the 1650 C thermal/environmental barrier coating applications will also be discussed.

Zhu, Dong-Ming↗

Laser processing of silicon solar cells

Results of a study to utilize an Nd:glass laser for production line annealing of ion implantation induced damage in solar cells are reported. Czochralski-grown and sawn Si wafers 7.6 cm in diam, 0.35 mm thick, were implanted with phosphorus junctions and boron BSFs. Annealing with electron beam, laser, and firing of an Al paste to form the BSFs in different cells was compared. The laser was employed at 1.06 and 0.53 micron and in combination of both, with a 20-50 nsec pulsewidth, and energy densities of 1.2, 1.5, 1.9, and 2.1 J/sq cm. Best optical coupling was observed with the combined wavelengths and a 20 nsec pulse, using energy densities less than 1.5 J/sq cm. Although the Al sintered cells displayed the best characteristics, laser annealing is concluded to offer electrically active, defect-free, shallow junction Si substrates for high efficiency cells.

Katzeff, J. S.↗

Thermal Conductivity and Sintering Behavior of Advanced Thermal Barrier Coatings

Advanced thermal barrier coatings, having significantly reduced long-term thermal conductivities, are being developed using an approach that emphasizes real-time monitoring of thermal conductivity under conditions that are engine-like in terms of temperatures and heat fluxes. This is in contrast to the traditional approach where coatings are initially optimized in terms of furnace and burner rig durability with subsequent measurement in the as-processed or furnace-sintered condition. The present work establishes a laser high-heat-flux test as the basis for evaluating advanced plasma-sprayed and physical vapor-deposited thermal barrier coatings under the NASA Ultra Efficient Engine Technology (UEET) Program. The candidate coating materials for this program are novel thermal barrier coatings that are found to have significantly reduced thermal conductivities due to an oxide-defect-cluster design. Critical issues for designing advanced low conductivity coatings with improved coating durability are also discussed.

Zhu, Dongming↗

Development of Advanced Low Conductivity Thermal Barrier Coatings

Advanced multi-component, low conductivity oxide thermal barrier coatings have been developed using an approach that emphasizes real-time monitoring of thermal conductivity under conditions that are engine-like in terms of temperatures and heat fluxes. This is in contrast to the traditional approach where coatings are initially optimized in terms of furnace and burner rig durability with subsequent measurement in the as-processed or furnace-sintered condition. The present work establishes a laser high-heat-flux test as the basis for evaluating advanced plasma-sprayed and electron beam-physical vapor deposited (EB-PVD) thermal barrier coatings under the NASA Ultra-Efficient Engine Technology (UEET) Program. The candidate coating materials for this program are novel thermal barrier coatings that are found to have significantly reduced thermal conductivities and improved thermal stability due to an oxide-defect-cluster design. Critical issues for designing advanced low conductivity coatings with improved coating durability are also discussed.

Zhu, Dong-Ming↗

Cyclic Failure Mechanisms of Thermal and Environmental Barrier Coating Systems Under Thermal Gradient Test Conditions

Plasma-sprayed ZrO2-8wt%Y2O3 and mullite+BSAS/Si multilayer thermal and environmental barrier coating (TBC-EBC) systems on SiC/SiC ceramic matrix composite (CMC) substrates were thermally cyclic tested under high thermal gradients using a laser high-heat-flux rig in conjunction with furnace exposure in water-vapor environments. Coating sintering and interface damage were assessed by monitoring the real-time thermal conductivity changes during the laser heat-flux tests and by examining the microstructural changes after exposure. Sintering kinetics of the coating systems were also independently characterized using a dilatometer. It was found that the coating failure involved both the time-temperature dependent sintering and the cycle frequency dependent cyclic fatigue processes. The water vapor environments not only facilitated the initial coating conductivity increases due to enhanced sintering and interface reaction, but also promoted later conductivity reductions due to the accelerated coating cracking and delamination. The failure mechanisms of the coating systems are also discussed based on the cyclic test results and are correlated to the sintering and thermal stress behavior under the thermal gradient test conditions.

Zhu, Dongming↗

Low Thermal Conductivity Thermal Barrier Coatings Developed

Thermal barrier coatings (TBCs) are used extensively in modern gas turbine engines to thermally insulate air-cooled metallic components from the hot gases in the engine. These coatings typically consist of a zirconia-yttria ceramic that has been applied by either plasma spraying or physical vapor deposition. Future engines will rely even more heavily on TBCs and will require materials that have even higher temperature capability with improved insulation (i.e., lower thermal conductivity even after many hours at high temperature). This report discusses new TBCs that have been developed with these future requirements in mind. The Ultra-Efficient Engine Technology Program at the NASA Glenn Research Center is funding this effort, which has been conducted primarily at Glenn with contractor support (GE and Howmet) for physical vapor deposition. As stated, the new TBC not only had to be more insulating but the insulation had to persist even after many hours of exposure-that is, the new TBC had to have both lower conductivity and improved sintering resistance. A new type of test rig was developed for this task. This new test approach used a laser to deliver a known high heat flux in an essentially uniform pattern to the surface of the coating, thereby establishing a realistic thermal gradient across its thickness. This gradient was determined from surface and backside pyrometry; and since the heat flux and coating thickness are known, this permitted continuous monitoring of thermal conductivity. Thus, this laser rig allowed very efficient screening of candidate low-conductivity, sinter-resistant TBCs. The coating-design approach selected for these new low-conductivity TBCs was to identify oxide dopants that had the potential to promote the formation of relatively large and stable groupings of defects known as defect clusters. This approach was used because it was felt that such clusters would reduce conductivity while enhancing stability. The approach proved to be successful: low-conductivity TBCs having improved sintering resistance were developed.

Zhu, Dongming↗

Sintering and Fracture Behavior of Plasma-sprayed Thermal Barrier Coatings

Thermal barrier coatings will be more aggressively designed to protect gas turbine engine hot-section components in order to meet future engine higher fuel efficiency and lower emission goals. There is a need to characterize the fundamental sintering and fracture behavior of the current ZrO2-(7 to 8)wt%Y2O3 coating, in order to fully take advantage of the coating capability. In addition, a thorough evaluation of the coating behavior and temperature limits will be useful for more accurately assessing the benefit gained from future advanced coating systems. In this study, the sintering behavior of plasma-sprayed ZrO2-8wt%Y2O3 coatings was systematically investigated as a function of temperature and time using a dilatometer in the temperature range of 1200-1500 C. The coating sintering kinetics obtained by dilatometry were compared with the coating thermal conductivity increase kinetics, determined by a steady-state laser heat-flux testing approach, under high temperature and thermal gradient sintering conditions. The mode I, mode II, and mixed mode I-mode II fracture behavior of as-processed and sintering-annealed coatings was determined in asymmetric flexure loading at ambient and elevated temperatures in order to evaluate the coating sintering effects on the fracture envelope of K(sub I) versus K(sub II). The coating thermal conductivity cyclic response associated with the interface delamination of the coating systems under simulated engine heat-flux conditions will be discussed in conjunction with the sintering and fracture testing results.

Zhu, Dongming↗