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NASA NTRS2003

Piezoelectrically Actuated Microvalve for Liquid Effluents

Modifications have been proposed to effect further improvement of the device described in Improved Piezoelectrically Actuated Microvalve (NPO-30158), NASA Tech Briefs, Vol. 26, No. 1 (January 2002), page 29. To recapitulate: What is being developed is a prototype of valves for microfluidic systems and other microelectromechanical systems (MEMS). The version of the valve reported in the cited previous article included a base (which contained a seat, an inlet, and an outlet), a diaphragm, and a linear actuator. With the exception of the actuator, the parts were micromachined from silicon. The linear actuator consisted of a stack of piezoelectric disks in a rigid housing. To make the diaphragm apply a large sealing force on the inlet and outlet, the piezoelectric stack was compressed into a slightly contracted condition during assembly of the valve. Application of a voltage across the stack caused the stack to contract into an even more compressed condition, lifting the diaphragm away from the seat, thereby creating a narrow channel between the inlet and outlet. The positions of the inlet and outlet, relative to the diaphragm and seat, were such that the inlet flow and pressure contributed to sealing and thus to a desired normally-closed mode of operation.

Yang, Eui-Hyeok↗
NASA NTRS2003

Pressure-Sensor Assembly Technique

Nielsen Engineering & Research (NEAR) recently developed an ultrathin data acquisition system for use in turbomachinery testing at NASA Glenn Research Center. This system integrates a microelectromechanical- systems- (MEMS-) based absolute pressure sensor [0 to 50 psia (0 to 345 kPa)], temperature sensor, signal-conditioning application-specific integrated circuit (ASIC), microprocessor, and digital memory into a package which is roughly 2.8 in. (7.1 cm) long by 0.75 in. (1.9 cm) wide. Each of these components is flip-chip attached to a thin, flexible circuit board and subsequently ground and polished to achieve a total system thickness of 0.006 in. (0.15 mm). Because this instrument is so thin, it can be quickly adhered to any surface of interest where data can be collected without disrupting the flow being investigated. One issue in the development of the ultrathin data acquisition system was how to attach the MEMS pressure sensor to the circuit board in a manner which allowed the sensor s diaphragm to communicate with the ambient fluid while providing enough support for the chip to survive the grinding and polishing operations. The technique, developed by NEAR and Jabil Technology Services Group (San Jose, CA), is described below. In the approach developed, the sensor is attached to the specially designed circuit board, see Figure 1, using a modified flip-chip technique. The circular diaphragm on the left side of the sensor is used to actively measure the ambient pressure, while the diaphragm on the right is used to compensate for changes in output due to temperature variations. The circuit board is fabricated with an access hole through it so that when the completed system is installed onto a wind tunnel model (chip side down), the active diaphragm is exposed to the environment. After the sensor is flip-chip attached to the circuit board, the die is underfilled to support the chip during the subsequent grinding and polishing operations. To prevent this underfill material from getting onto the sensor s diaphragms, the circuit board is fabricated with two 25- micrometer-tall polymer rings, sized so that the diaphragms fit inside the rings once the chip is attached.

Pruzan, Daniel A.↗
NASA NTRS2015

On-Orbit, Immuno-Based, Label-Free White Blood Cell Counting System with Microelectromechanical Sensor Technology (OILWBCS-MEMS)

Aurora Flight Sciences, in partnership with Draper Laboratory, has developed a miniaturized system to count white blood cells in microgravity environments. The system uses MEMS technology to simultaneously count total white blood cells, the five white blood cell differential subgroups, and various lymphocyte subtypes. The OILWBCS-MEMS detection technology works by immobilizing an array of white blood cell-specific antibodies on small, gold-coated membranes. When blood flows across the membranes, specific cells' surface protein antigens bind to their corresponding antibodies. This binding can be measured and correlated to cell counts. In Phase I, the partners demonstrated surface chemistry sensitivity and specificity for total white blood cells and two lymphocyte subtypes. In Phase II, a functional prototype demonstrated end-to-end operation. This rugged, miniaturized device requires minimal blood sample preparation and will be useful for both space flight and terrestrial applications.

Edmonds, Jessica↗
NASA NTRS2007

Multiple-Parameter, Low-False-Alarm Fire-Detection Systems

Fire-detection systems incorporating multiple sensors that measure multiple parameters are being developed for use in storage depots, cargo bays of ships and aircraft, and other locations not amenable to frequent, direct visual inspection. These systems are intended to improve upon conventional smoke detectors, now used in such locations, that reliably detect fires but also frequently generate false alarms: for example, conventional smoke detectors based on the blockage of light by smoke particles are also affected by dust particles and water droplets and, thus, are often susceptible to false alarms. In contrast, by utilizing multiple parameters associated with fires, i.e. not only obscuration by smoke particles but also concentrations of multiple chemical species that are commonly generated in combustion, false alarms can be significantly decreased while still detecting fires as reliably as older smoke-detector systems do. The present development includes fabrication of sensors that have, variously, micrometer- or nanometer-sized features so that such multiple sensors can be integrated into arrays that have sizes, weights, and power demands smaller than those of older macroscopic sensors. The sensors include resistors, electrochemical cells, and Schottky diodes that exhibit different sensitivities to the various airborne chemicals of interest. In a system of this type, the sensor readings are digitized and processed by advanced signal-processing hardware and software to extract such chemical indications of fires as abnormally high concentrations of CO and CO2, possibly in combination with H2 and/or hydrocarbons. The system also includes a microelectromechanical systems (MEMS)-based particle detector and classifier device to increase the reliability of measurements of chemical species and particulates. In parallel research, software for modeling the evolution of a fire within an aircraft cargo bay has been developed. The model implemented in the software can describe the concentrations of chemical species and of particulate matter as functions of time. A system of the present developmental type and a conventional fire detector were tested under both fire and false-alarm conditions in a Federal Aviation Administration cargo-compartment- testing facility. Both systems consistently detected fires. However, the conventional fire detector consistently generated false alarms, whereas the developmental system did not generate any false alarms.

Hunter, Gary W.↗
NASA NTRS2008

Vacuum Packaging of MEMS With Multiple Internal Seal Rings

A proposed method of design and fabrication of vacuum-packaged microelectromechanical systems (MEMS) and of individual microelectromechanical devices involves the use of multiple internal seal rings (MISRs) in conjunction with vias (through holes plated with metal for electrical contacts). The proposed method is compatible with mass production in a wafer-level fabrication process, in which the dozens of MEMS or individual microelectromechanical devices on a typical wafer are simultaneously vacuum packaged by bonding a capping wafer before the devices are singulated (cut apart by use of a dicing saw). In addition to being compatible with mass production, the proposed method would eliminate the need for some complex and expensive production steps and would yield more reliable vacuum seals. Conventionally, each MEMS or individual microelectromechanical device is fabricated as one of many identical units on a device wafer. Vacuum packaging is accomplished by bonding the device wafer to a capping wafer with metal seal rings (one ring surrounding each unit) that have been formed on the capping wafer. The electrical leads of each unit are laid out on what would otherwise be a flat surface of the device wafer, against which the seal ring is to be pressed for sealing. The resulting pattern of metal lines and their insulating oxide coverings presents a very rough and uneven surface, upon which it is difficult to pattern the sealing metal. Consequently, the seal is prone to leakage unless additional costly and complex planarization steps are performed before patterning the seal ring and bonding the wafers.

Hayworth, Ken↗
NASA NTRS2001

Toward a Micro Gas Chromatograph/Mass Spectrometer (GC/MS) System

Miniature mass filters (e.g., quadrupoles, ion traps) have been the subject of several miniaturization efforts. A project is currently in progress at JPL to develop a miniaturized Gas Chromatograph/Mass Spectrometer (GC/MS) system, incorporating and/or developing miniature system components including turbomolecular pumps, scroll type roughing pump, quadrupole mass filter, gas chromatograph, precision power supply and other electronic components. The preponderance of the system elements will be fabricated using microelectromechanical systems (MEMS) techniques. The quadrupole mass filter will be fabricated using an X-ray lithography technique producing high precision, 5x5 arrays of quadrupoles with pole lengths of about 3 mm and a total volume of 27 cubic mm. The miniature scroll pump will also be fabricated using X-ray lithography producing arrays of scroll stages about 3 mm in diameter. The target detection range for the mass spectrometer is 1 to 300 atomic mass units (AMU) with are solution of 0.5 AMU. This resolution will allow isotopic characterization for geochronology, atmospheric studies and other science efforts dependant on the understanding of isotope ratios of chemical species. This paper will discuss the design approach, the current state-of-the art regarding the system components and the progress toward development of key elements. The full system is anticipated to be small enough in mass, volume and power consumption to allow in situ chemical analysis on highly miniaturized science craft for geochronology, atmospheric characterization and detection of life experiments applicable to outer planet roadmap missions.

Wiberg, D. V.↗
NASA NTRS2000

Reliability Issues of COTS MEMS Packaging

During the last decade, research and development of microelectromechanical systems (MEMS) has shown a significant promise for a variety of commercial applications including automobile and medical purposes.

Microelectromechanical systems MEMS reliability IC↗
NASA NTRS2007

Review of Polyimides Used in the Manufacturing of Micro Systems

Since their invention, polyimides have found numerous uses in MicroElectroMechanical Systems (MEMS) technology. Polyimides can act as photoresist, sacrificial layers, structural layers, and even as a replacement for silicon as the substrate during MEMS fabrication. They enable fabrication of both low and high aspect ratio devices. Polyimides have been used to fabricate expendable molds and reusable flexible molds. Development of a variety of devices that employ polyimides for sensor applications has occurred. Micro-robotic actuator applications include hinges, thermal actuators and residual stress actuators. Currently, polyimides are being used to create new sensors and devices for aerospace applications. This paper presents a review of some of the many uses of polyimides in the development of MEMS devices, including a new polyimide based MEMS fabrication process.

Wilson, William C.↗
NASA NTRS1999

MEMS reliability assurance guidelines for space applications

This guideline was developed as an aid to help in the understanding of Microelectromechanical Systems (MEMS) reliability and to facilitate the insertion of this technology into high reliability applications. Modeled after the GaAs MMIC Reliability Assurance Guideline for Space Applications by Kayali, et al., is was felt that a guideline would be more advantageous to people than a strict specification.

microelectromechanical↗
NASA NTRS2008

MEMS AO for Planet Finding

This slide presentation reviews a method for planet finding using microelectromechanical systems (MEMS) Adaptive Optics (AO). The use of a deformable mirror (DM) is described as a part of the instrument that was designed with a nulling interferometer. The strategy that is used is described in detail.

calibration interferometer↗
NASA NTRS1996

Measuring the Thickness and Elastic Properties of Electroactive Thin-Film Polymers Using Platewave Dispersion Data

Electroactive thin-film polymers are candidate sensors and actuators materials. They are also finding significant potential in muscle mechanisms and microelectromechanical systems (MEMS). In these applications, polymer thin films of thickness varying between 20 and 300 micrometers are utilized. The authors are currently studying the potential use of platewave dispersion curve measurements as an effective gauging tool for electroactive thin-film polymers.

sensors actuators film thickness measurements piez↗
NASA NTRS2008

Low Power, Wide Dynamic Range Carbon Nanotube Vacuum Gauges

This slide presentation presents carbon nanotube vacuum pressure sensor gauges that operate at low power and exhibit a wide-dynamic range based on microelectromechanical systems (MEMS) technology. The fabrication facility, and the formation process are shown. Pressure sensitivity was found to increase rapidly as the bias power was increased. In addition, by etching part of the thermal SiO2 beneath the tubes and minimizing heat conduction through the substrate, pressure sensitivity was extended toward lower pressures. Results are compared to a conventional thin film meander resistor, which was fabricated and whose pressure response was also measured for comparative purposes.

JEOL E-beam aligner↗
NASA NTRS2004

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗
NASA NTRS2007

Arrays of Miniature Microphones for Aeroacoustic Testing

A phased-array system comprised of custom-made and commercially available microelectromechanical system (MEMS) silicon microphones and custom ancillary hardware has been developed for use in aeroacoustic testing in hard-walled and acoustically treated wind tunnels. Recent advances in the areas of multi-channel signal processing and beam forming have driven the construction of phased arrays containing ever-greater numbers of microphones. Traditional obstacles to this trend have been posed by (1) the high costs of conventional condenser microphones, associated cabling, and support electronics and (2) the difficulty of mounting conventional microphones in the precise locations required for high-density arrays. The present development overcomes these obstacles. One of the hallmarks of the new system is a series of fabricated platforms on which multiple microphones can be mounted. These mounting platforms, consisting of flexible polyimide circuit-board material (see left side of figure), include all the necessary microphone power and signal interconnects. A single bus line connects all microphones to a common power supply, while the signal lines terminate in one or more data buses on the sides of the circuit board. To minimize cross talk between array channels, ground lines are interposed as shields between all the data bus signal lines. The MEMS microphones are electrically connected to the boards via solder pads that are built into the printed wiring. These flexible circuit boards share many characteristics with their traditional rigid counterparts, but can be manufactured much thinner, as small as 0.1 millimeter, and much lighter with boards weighing as much as 75 percent less than traditional rigid ones. For a typical hard-walled wind-tunnel installation, the flexible printed-circuit board is bonded to the tunnel wall and covered with a face sheet that contains precise cutouts for the microphones. Once the face sheet is mounted, a smooth surface is established over the entire array due to the flush mounting of all microphones (see right side of figure). The face sheet is made from a continuous glass-woven-fabric base impregnated with an epoxy resin binder. This material offers a combination of high mechanical strength and low dielectric loss, making it suitable for withstanding the harsh test section environment present in many wind tunnels, while at the same time protecting the underlying polyimide board. Customized signal-conditioning hardware consisting of line drivers and antialiasing filters are coupled with the array. The line drivers are constructed using low-supply-current, high-gain-bandwidth operational amplifiers designed to transmit the microphone signals several dozen feet from the array to external acquisition hardware. The anti-alias filters consist of individual Chebyshev low-pass filters (one for each microphone channel) housed on small printed-circuit boards mounted on one or more motherboards. The mother/daughter board design results in a modular system, which is easy to debug and service and which enables the filter characteristics to be changed by swapping daughter boards with ones containing different filter parameters. The filter outputs are passed to commercially- available acquisition hardware to digitize and store the conditioned microphone signals. Wind-tunnel testing of the new MEMS microphone polyimide mounting system shows that the array performance is comparable to that of traditional arrays, but with significantly less cost of construction.

Shams, Qamar A.↗
NASA NTRS2004

Integrity of Ceramic Parts Predicted When Loads and Temperatures Fluctuate Over Time

Brittle materials are being used, and being considered for use, for a wide variety of high performance applications that operate in harsh environments, including static and rotating turbine parts for unmanned aerial vehicles, auxiliary power units, and distributed power generation. Other applications include thermal protection systems, dental prosthetics, fuel cells, oxygen transport membranes, radomes, and microelectromechanical systems (MEMS). In order for these high-technology ceramics to be used successfully for structural applications that push the envelope of materials capabilities, design engineers must consider that brittle materials are designed and analyzed differently than metallic materials. Unlike ductile metals, brittle materials display a stochastic strength response because of the combination of low fracture toughness and the random nature of the size, orientation, and distribution of inherent microscopic flaws. This plus the fact that the strength of a component under load may degrade over time because of slow crack growth means that a probabilistic-based life-prediction methodology must be used when the tradeoffs of failure probability, performance, and useful life are being optimized. The CARES/Life code (which was developed at the NASA Glenn Research Center) predicts the probability of ceramic components failing from spontaneous catastrophic rupture when these components are subjected to multiaxial loading and slow crack growth conditions. Enhancements to CARES/Life now allow for the component survival probability to be calculated when loading and temperature vary over time.

Nemeth, Noel N.↗
NASA NTRS2003

Advanced Microgravity Acceleration Measurement Systems (AMAMS) Being Developed

The Advanced Microgravity Acceleration Measurement Systems (AMAMS) project is part of NASA s Instrument Technology Development program to develop advanced sensor systems. The primary focus of the AMAMS project is to develop microelectromechanical systems (MEMS) for acceleration sensor systems to replace existing electromechanical sensor systems presently used to assess relative gravity levels aboard spacecraft. These systems are used to characterize both vehicle and payload responses to low-gravity vibroacoustic environments. The collection of microgravity acceleration data is useful to the microgravity life sciences, microgravity physical sciences, and structural dynamics communities. The inherent advantages of semiconductor-based systems are reduced size, mass, and power consumption, with enhanced long-term calibration stability.

Sicker, Ronald J.↗
NASA NTRS2012

Ultra-Low-Power MEMS Selective Gas Sensors

This innovation is a system for gas sensing that includes an ultra-low-power MEMS (microelectromechanical system) gas sensor, combined with unique electronic circuitry and a proprietary algorithm for operating the sensor. The electronics were created from scratch, and represent a novel design capable of low-power operation of the proprietary MEMS gas sensor platform. The algorithm is used to identify a specific target gas in a gas mixture, making the sensor selective to that target gas.

Stetter, Joseph↗