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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Fabrication of Freestanding Metallic Ni-Mo-W Microcantilever Beams With High Dimensional Stability

Recent studies have elucidated a promising balance of physical and mechanical properties of sputter deposited nickel-molybdenum-tungsten (Ni-Mo-W) films that have a unique nanotwinned microstructure and promising potential for use in high temperature microelectromechanical systems (MEMS). Here, the current study was undertaken to establish the feasibility of making nanotwinned Ni-Mo-W microcantilevers with standard micro- fabrication processing, to assess their dimensional stability, and to demonstrate the possibility of using nanotwinned Ni-Mo-W in metal MEMS devices. Deposition of Ni-Mo-W films in commercial sputtering chambers revealed a wide processing window for the formation of the requisite nanotwinned microstructure. Conventional photolithography and etchants were employed to shape blanket Ni-Mo-W films into freestanding microcantilever beams. Monitoring microcantilever deflections via interferometry provided a direct measure of residual stresses and overall dimensional stability. Heat treatments of 200° C and 400° C were used to mimic wafer bonding temperatures. At 400°C, microcantilevers exhibited modest stress relaxation, yielding beam deflection profiles on the nanometer scale and portending dimensional stability and control for future metal MEMS devices.

36 MATERIALS SCIENCE↗
NASA NTRS2004

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗
NASA NTRS1996

Measuring the Thickness and Elastic Properties of Electroactive Thin-Film Polymers Using Platewave Dispersion Data

Electroactive thin-film polymers are candidate sensors and actuators materials. They are also finding significant potential in muscle mechanisms and microelectromechanical systems (MEMS). In these applications, polymer thin films of thickness varying between 20 and 300 micrometers are utilized. The authors are currently studying the potential use of platewave dispersion curve measurements as an effective gauging tool for electroactive thin-film polymers.

sensors actuators film thickness measurements piez↗
NASA NTRS2008

Low Power, Wide Dynamic Range Carbon Nanotube Vacuum Gauges

This slide presentation presents carbon nanotube vacuum pressure sensor gauges that operate at low power and exhibit a wide-dynamic range based on microelectromechanical systems (MEMS) technology. The fabrication facility, and the formation process are shown. Pressure sensitivity was found to increase rapidly as the bias power was increased. In addition, by etching part of the thermal SiO2 beneath the tubes and minimizing heat conduction through the substrate, pressure sensitivity was extended toward lower pressures. Results are compared to a conventional thin film meander resistor, which was fabricated and whose pressure response was also measured for comparative purposes.

JEOL E-beam aligner↗
NASA NTRS2000

MEMS Reliability Assurance Activities at JPL

An overview of Microelectromechanical Systems (MEMS) reliability assurance and qualification activities at JPL is presented along with the a discussion of characterization of MEMS structures implemented on single crystal silicon, polycrystalline silicon, CMOS, and LIGA processes. Additionally, common failure modes and mechanisms affecting MEMS structures, including radiation effects, are discussed. Common reliability and qualification practices contained in the MEMS Reliability Assurance Guideline are also presented.

Kayali, S.↗
NASA NTRS2002

High Temperature MEMS for Turbine Engine Applications

The presentation will discuss Microelectromechanical Systems (MEMS) research and development activities and technologies being conducted at NASA Glenn Research Center to address the needs of harsh environment applications. The focus will be on silicon carbide based h4EMS for high temperature, high power and high radiation environment as well as high temperature sensor technologies which are made possible by MEMS processing techniques. These technologies can enable new measurements and capabilities for future turbine engines. All the presentation materials are publicly available and have been presented/published before.

Hunter, Gary W.↗
NASA NTRS2008

MEMS AO for Planet Finding

This slide presentation reviews a method for planet finding using microelectromechanical systems (MEMS) Adaptive Optics (AO). The use of a deformable mirror (DM) is described as a part of the instrument that was designed with a nulling interferometer. The strategy that is used is described in detail.

calibration interferometer↗
NASA NTRS2012

Ultra-Low-Power MEMS Selective Gas Sensors

This innovation is a system for gas sensing that includes an ultra-low-power MEMS (microelectromechanical system) gas sensor, combined with unique electronic circuitry and a proprietary algorithm for operating the sensor. The electronics were created from scratch, and represent a novel design capable of low-power operation of the proprietary MEMS gas sensor platform. The algorithm is used to identify a specific target gas in a gas mixture, making the sensor selective to that target gas.

Stetter, Joseph↗
NASA NTRS2003

Development of Probabilistic Life Prediction Methodologies and Testing Strategies for MEMS

This effort is to investigate probabilistic life prediction methodologies for MicroElectroMechanical Systems (MEMS) and to analyze designs that determine stochastic properties of MEMS. This includes completion of a literature survey regarding Weibull size effect in MEMS and strength testing techniques. Also of interest is the design of a proper test for the Weibull size effect in tensile specimens. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. Another potential item of interest is analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structuredlife (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads. Along these lines work may also be performed on transient fatigue life prediction methodologies.

Jadaan, Osama M.↗
DOE OSTI2023

Position sensing circuit for an electrostatically driven MEMS device

The present disclosure relates to a system for detecting movement of a microelectromechanical system (MEMS) device. The system uses a drive voltage signal source for generating a low frequency drive voltage signal for driving the MEMS device. An excitation signal source may be used for generating an excitation signal which is also applied to the MEMS device. The excitation signal has a frequency which is above a physical response capability of the MEMS device, such that operation of the MEMS device is not significantly affected by the excitation signal. A sensing impedance is used to help generate a signal which is responsive to the capacitance of the MEMS device. The capacitance of the MEMS device changes in response to movement of the MEMS device. An output subsystem is provided which responds to changes sensed by the sensing impedance, and which produces an output voltage signal. A filter filters the output voltage signal to produce a filtered output voltage signal. The filtered output voltage signal is indicative of a position of the MEMS device.

Panas, Robert Matthew↗
NASA NTRS2001

MEMS Memory Elements

This paper presents a design example that illustrates the potential of microelectromechanical systems (MEMS) to perform the mechanical positioning required for addressing stored data and to enable an entirely new mechanism for reading and writing magnetic data. Specifically, MEMS sensors and actuators can be used to achieve active servo control of the separation between magnetic probe tips and a media surface with sub-nanometer accuracy. This allows mechanical position to be used to selectively write magnetic marks in a continuous thin-film magnetic media. In addition, MEMS sensors can be used to measure the separation between a magnetic probe tip and the media with a noise floor of roughly 22 picometers, allowing them to be used as position sensors in a magnetic force microscope (MFM) style data detection system.

Carley, L. Richard↗
NASA NTRS2006

Implantable Wireless MEMS Sensors for Medical Uses

Sensors designed and fabricated according to the principles of microelectromechanical systems (MEMS) are being developed for several medical applications in outer space and on Earth. The designs of these sensors are based on a core design family of pressure sensors, small enough to fit into the eye of a needle, that are fabricated by a "dissolved wafer" process. The sensors are expected to be implantable, batteryless, and wireless. They would be both powered and interrogated by hand-held radio transceivers from distances up to about 6 in. (about 15 cm). One type of sensor would be used to measure blood pressure, particularly for congestive heart failure. Another type would be used to monitor fluids in patients who have hydrocephalus (high brain pressure). Still other types would be used to detect errors in delivery of drugs and to help patients having congestive heart failure.

Chimbayo, Alexander↗
DOE OSTI2022

A MEMS Gyroscope for Reliable Long Duration Measurement While Drilling at 300°C

The 300°C Microelectromechanical system (MEMS) gyroscope project aims to contribute to DOE’s goal of increased geothermal drilling efficiency by 2025 through the development of a 300°C MEMS gyroscope for Measurement While Drilling (MWD). At the conclusion of the 2-year project, the team will develop a 300°C capable MEMS gyroscope containing GE’s patented Multi-Ring Gyroscope Transducer (MRGT) design, custom Silicon-On-Insulator (SOI) based frontend and feedback control electronics, and with demonstrated functionality and lifetime beyond 1000 hours. The project is divided into two budget periods with Go/No-Go decision at the end of the first budget period. The goal for the first budget period is to establish the feasibility of the MRGT and electronics design for meeting the 300°C performance requirements. The goal for the second budget period is to integrate the MRGT with the SOI-based application specific integrated circuit (ASIC) and demonstrate capability to operate at 300°C for 1000 hours. In Budget Period 1 we met the phase 1 goal. We successfully validated the combined MRG, electronics and packaging capability entitlement to achieving 0.5 degrees azimuth uncertainty while enabling operation at significantly higher temperatures than the state-of-the-art. In Budget Period 2, we successfully completed the integration of the MRGT and ASIC with associated high temperature, high reliability packaging to demonstrate the performance and functionality of the integrated gyroscope across the temperature range from room temperature to at 300°C. Furthermore, the team demonstrated operating life of >1,000 hours at 300°C, thus providing a validation of application-relevant lifetime capability.

15 GEOTHERMAL ENERGY↗
NASA NTRS1999

MEMS reliability assurance guidelines for space applications

This guideline was developed as an aid to help in the understanding of Microelectromechanical Systems (MEMS) reliability and to facilitate the insertion of this technology into high reliability applications. Modeled after the GaAs MMIC Reliability Assurance Guideline for Space Applications by Kayali, et al., is was felt that a guideline would be more advantageous to people than a strict specification.

microelectromechanical↗
NASA NTRS2003

Development of Testing Methodologies for the Mechanical Properties of MEMS

This effort is to investigate and design testing strategies to determine the mechanical properties of MicroElectroMechanical Systems (MEMS) as well as investigate the development of a MEMS Probabilistic Design Methodology (PDM). One item of potential interest is the design of a test for the Weibull size effect in pressure membranes. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. However, the primary area of investigation will most likely be analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. This will be a continuation of the previous years work. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads.

Ekwaro-Osire, Stephen↗
NASA NTRS1999

MEMS for Space Applications

The future of robotic space missions in ever-smaller platforms and MicroElectroMechanical Systems (MEMS) will be key in this development.

MEMS↗
NASA NTRS2003

Development of Probabilistic Life Prediction Methodologies and Testing Strategies for MEMS and CMC's

This effort is to investigate probabilistic life prediction methodologies for ceramic matrix composites and MicroElectroMechanical Systems (MEMS) and to analyze designs that determine stochastic properties of MEMS. For CMC's this includes a brief literature survey regarding lifing methodologies. Also of interest for MEMS is the design of a proper test for the Weibull size effect in thin film (bulge test) specimens. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. A main objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures/Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads. A second set of objectives is to determine the applicability/suitability of the CARES/Life methodology for CMC analysis, what changes would be needed to the methodology and software, and if feasible, run a demonstration problem. Also important is an evaluation of CARES/Life coupled to the ANSYS Probabilistic Design System (PDS) and the potential of coupling transient reliability analysis to the ANSYS PDS.

Jadaan, Osama↗
DOE OSTI2021

The Application of Quaternions to Strap-Down MEMS Sensor Data

We describe the mathematical transformations required to convert the data recorded using typical 6-axis microelectromechanical systems (MEMS) sensor packages (3-axis rate gyroscopes and 3-axis accelerometers) when attached to an object undergoing a short duration loading event, such as blast loading, where inertial data alone are sufficient to track the object motion. By using the quaternion description, the complex object rotations and displacements that typically occur are translated into the more convenient earth frame of reference. An illustrative example is presented where a large and heavy object was thrown by the action of a very strong air blast in a complex manner. The data conversion process yielded an accurate animation of the object’s subsequent motion.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗