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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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44 records · Page 3

Degradation of TATP, TNT, and RDX using mechanically alloyed metals

Bimetallic alloys prepared in a ball milling process, such as iron nickel (FeNi), iron palladium (FePd), and magnesium palladium (MgPd) provide in situ catalyst system for remediating and degrading nitro explosive compounds. Specifically, munitions, such as, 2,4,6-trinitrotoluene (TNT), cyclo-1,3,5-trimethylene-2,4,6-trinitramine (RDX), nitrocellulose and nitroglycerine that have become contaminants in groundwater, soil, and other structures are treated on site to remediate explosive contamination.

Clausen, Christian↗

Remediation Technologies Eliminate Contaminants

All research and development has a story behind it, says Jacqueline Quinn, environmental engineer at Kennedy Space Center. For Quinn, one such story begins with the Saturn 1B launch stand at Kennedy and ends with a unique solution to a challenging environmental problem. Used in a number of Apollo missions and during the Skylab program, the Saturn 1B launch stand was dismantled following the transition to the Space Shuttle Program and stored in an open field at Kennedy. Decades later, the Center s Environmental Program Office discovered evidence of chemicals called polychlorinated biphenyls (PCBs) in the field s soil. The findings were puzzling since PCBs a toxin classified as a probable carcinogen by the Environmental Protection Agency (EPA) have been banned in the United States since 1979. Before the ban, PCBs were commonly used in transformer oils that leached into the ground when the oils were changed out and dumped near transformer sites, but there were no electrical transformers near the dismantled stand. It soon became apparent that the source of the PCBs was the launch stand itself. Prior to the ban, PCBs were used extensively in paints to add elasticity and other desirable characteristics. The PCB-laden paint on the Saturn 1B launch stand was flaking off into the field s soil. Nobody knew there were PCBs in the paint, says Quinn, noting that the ingredient was not monitored carefully when it was in use in 1960s. In fact, she says, the U.S. EPA was not even established until 1970, a year after Neil Armstrong first set foot on the Moon. Nobody knew any better at the time, Quinn says, but today, we have the responsibility to return any natural environmental media to as close to pristine a condition as possible. Quinn, fellow engineer Kathleen Loftin, and other Kennedy colleagues already had experience developing unprecedented solutions for environmental contamination; the team invented the emulsified zero-valent iron (EZVI) technology to safely treat groundwater tainted by chlorinated solvents once used to clean rocket engine components. The award-winning innovation (Spinoff 2010) is now NASA s most licensed technology to date. PCBs in paint presented a new challenge. Removing the launch stand for recycling proved a difficult operation; the toxic paint had to be fully stripped from the steel structure, a lengthy and costly process that required the stripped paint to be treated before disposal. Noting the lack of efficient, environmentally friendly options for dealing with PCBs, Quinn and her colleagues developed the Activated Metal Treatment System (AMTS). AMTS is a paste consisting of a solvent solution containing microscale particles of activated zero-valent metal. When applied to a painted surface, the paste extracts and degrades the PCBs into benign byproducts while leaving the paint on the structure. This provides a superior alternative to other methods for PCB remediation, such as stripping the paint or incinerating the structure, which prevents reuse and can release volatized PCBs into the air. Since its development, AMTS has proven to be a valuable solution for removing PCBs from paint, caulking, and various insulation and filler materials in older buildings, naval ships, and former munitions facilities where the presence of PCBs interferes with methods for removing trace explosive materials. Miles of potentially toxic caulking join sections of runways at airports. Any of these materials installed before 1979 potentially contain PCBs, Quinn says. "This is not just a NASA problem," she says. "It s a global problem."

Source record↗

An Evaluation of Flash Cells Used in Critical Applications

Due to the common use of Flash technology in many commercial and industrial Programmable Logic Devices (PLDs) such as FPGAs and mixed-signal microcontrollers, flash technology is being utilized in fuzed munition applications. This presents a long-term reliability issue for both DoD and NASA safety- and mission-critical applications. A thorough understanding of the data retention failure modes and statistics associated with Flash data retention is of vital concern to the fuze safety community. A key retention parameter for a flash cell is the threshold voltage (VTH), which is an indirect indicator of the amount of charge stored on the cells floating gate. Initial test results based on a study of charge loss in flash cells in an FPGA device is presented. Statistical data taken from a small sample set indicates quantifiable charge loss for devices stored at both room temperature and 150 C. Initial evaluation of the distribution of threshold voltage in a large sample set (800 devices) is presented. The magnitude of charge loss from exposure to electrostatic discharge and electromagnetic fields is measured and presented. Simulated data (and measured data as available) resultant from harsh-environment testing (neutron, heavy ion, EMP) is presented.

data retention↗

An Evaluation of Flash Cells Used in Critical Applications

Due to the common use of Flash technology in many commercial and industrial Programmable Logic Devices (PLDs) such as FPGAs and mixed-signal microcontrollers, flash technology is being utilized in fuzed munition applications. This presents a long-term reliability issue for both DoD and NASA safety- and mission-critical applications. A thorough understanding of the data retention failure modes and statistics associated with Flash data retention is of vital concern to the fuze safety community. A key retention parameter for a flash cell is the threshold voltage (VTH), which is an indirect indicator of the amount of charge stored on the cells floating gate. Initial test results based on a study of charge loss in flash cells in an FPGA device is presented. Statistical data taken from a small sample set indicates quantifiable charge loss for devices stored at both room temperature and 150 C. Initial evaluation of the distribution of threshold voltage in a large sample set (800 devices) is presented. The magnitude of charge loss from exposure to electrostatic discharge and electromagnetic fields is measured and presented. Simulated data (and measured data as available) resultant from harsh-environment testing (neutron, heavy ion, EMP) is presented.

Data Retention↗

Environmental Effects on Data Retention in Flash Cells

Flash technology is being utilized in fuzed munition applications and, based on the development of digital logic devices in the commercial world, usage of flash technology will increase. Antifuse technology, prevalent in non-volatile field programmable gate arrays (FPGAs), will eventually be phased out as new devices have not been developed for approximately a decade. The reliance on flash technology presents a long-term reliability issue for both DoD and NASA safety- and mission-critical applications. A thorough understanding of the data retention failure modes and statistics associated with Flash data retention is of vital concern to the fuze safety community. A key retention parameter for a flash cell is the threshold voltage (VTH), which is an indirect indicator of the amount of charge stored on the cells floating gate. This paper will present the results of our on-going tests: long-term storage at 150 C for a small population of devices, neutron radiation exposure, electrostatic discharge (ESD) testing, and the trends of large populations (over 300 devices for each condition) exposed to three difference temperatures: 25 C, 125 C, and 150 C.

Flash↗

Testing of ACC-6 Carbon-Carbon at High Strain Rates and High Temperatures

Some materials, such as steel, titanium, and tungsten, have a yield stress that depends on the strain rate, and actually are stronger at high rates of load or deformation. The increase in strength is relevant; and if not taken into account, the computer models will not match the experimental behavior observed in typical shock loading, ordnance, or ballistic tests. For higher velocity (hypervelocity impacts), an equation of state that accounts for non-linearities and temperature in the pressure-volume relation, may also be needed. This rate-dependent behavior of the strength has also been observed in some composite materials. Southwest Research Institute® (SwRI®) has started an internal research effort to measure and better model the behavior of materials, in particular carbon/carbon composites like ACC-6, at ultra-high temperatures for both static and high rates of deformation. The ultimate objective is to obtain reliable computer models of carbon/carbon material under hypersonic flight conditions, hypervelocity impacts, shock-loading situations such as booster-vehicle separation, and munition operation events. SwRI® has successfully modeled in the past ballistic impact on other composites, namely S-2 glass/epoxy, Kevlar/resin, polyethylene fibers/resin, and carbon fiber composites. This presentation will show test results relevant to the strength properties of the ACC-6 C/C material which were measured at quasistatic, medium, and the moderately high strain rates (~103 s—1) achievable in a conventional Split Hopkinson bar apparatus. Some of the tests were performed at both high-rates and high temperatures typical of hypersonic flight, something that, to the authors’ knowledge, has never been published in the past for this particular material. The test method will be presented, as well as the comparison of the stress-strain curves for the different temperatures and strain-rates of interest. A discussion of how the results can be used in the typical hydrocodes of interest will be included.

carbon/carbon↗

Space Flight Middleware: Remote AMS over DTN for Delay-Tolerant Messaging

This paper describes a technique for implementing scalable, reliable, multi-source multipoint data distribution in space flight communications -- Delay-Tolerant Reliable Multicast (DTRM) -- that is fully supported by the "Remote AMS" (RAMS) protocol of the Asynchronous Message Service (AMS) proposed for standardization within the Consultative Committee for Space Data Systems (CCSDS). The DTRM architecture enables applications to easily "publish" messages that will be reliably and efficiently delivered to an arbitrary number of "subscribing" applications residing anywhere in the space network, whether in the same subnet or in a subnet on a remote planet or vehicle separated by many light minutes of interplanetary space. The architecture comprises multiple levels of protocol, each included for a specific purpose and allocated specific responsibilities: "application AMS" traffic performs end-system data introduction and delivery subject to access control; underlying "remote AMS" directs this application traffic to populations of recipients at remote locations in a multicast distribution tree, enabling the architecture to scale up to large networks; further underlying Delay-Tolerant Networking (DTN) Bundle Protocol (BP) advances RAMS protocol data units through the distribution tree using delay-tolerant storeand- forward methods; and further underlying reliable "convergence-layer" protocols ensure successful data transfer over each segment of the end-to-end route. The result is scalable, reliable, delay-tolerant multi-source multicast that is largely self-configuring.

Disruption Tolerant Networking (DTN)↗