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At least 55 records · Page 3

Issues and directions in IR detector readout electronics

An introduction to the major issues encountered in the readout of imaging detector arrays in the infrared are presented. These include circuit issues such as multiplexing, buffering, and noise, as well as materials issues. Future directions in infrared readout electronics will also be discussed. These include on-chip signal processing and advanced hybridization schemes. Finally, recent work at Columbia on 2DEG-charge coupled devices for IR detector multiplexing are described.

Fossum, Eric R.↗

CCD photometry of 2060 Chiron, 1991 January

Observations of 2060 Chiron was performed on 7 to 8 Jan. 1991 with the Mt. Palomar 1.52 m telescope in the Gunn-R passband. On-chip field stars were used to perform differential reductions. The repeatability of the 5.9 hour light curve was excellent, both within a night and from night to night. No evidence for short-term secular variations similar to those seen last year by both Luu and Jewitt (1990) and Buratti and Dunbar (1991) is seen in the new light curve. Chiron's rotational light curve appears strikingly similar to that obtained a year earlier by Luu and Jewitt (1990), both in amplitude and shape. Both light curves show strongly correlated changes over a timescale of perhaps 15 minutes. These same features were marginally visible in the 1986 light curve. Such behavior is believed to be evidence that Chiron may be more aspherical than the 4 percent intensity variation might otherwise indicate, and favors a viewing geometry where the subearth latitude is rather low. Chiron was much fainter in 1985, when a partial light curve was obtained by Marcialis. Due to the lower sampling rate of these early data, no conclusions can be made regarding the high-frequency light curve structure back then. All three of these light curves differ significantly from that obtained by Buratti and Dunbar (1991), one week before the observations of Luu and Jewitt. The Chiron field was calibrated using Landolt standards on Ut 15 Mar. 1991. A mean R-magnitude of 15.6 + or - 0.1 was found. Variability of 2060 Chiron was demonstrated over timescales of minutes, hours, and years. An intense campaign was urged to monitor the photometric behavior of Chiron throughout the 1990s.

Buratti, B. J.↗

Supercomputing systems - A projection to 2000

Advances in computer architecture, computer science, computational methods, and constituent technologies are expected to lead to significant advances in the performance of scientific supercomputing system capabilities over the next decade. By the year 2000, single 1-in-sq dies are projected to incorporate four processors, each of which would be operating faster than 750 million instructions per second (MIPS) for a total on-chip processing performance in excess of 2000 MIPS. Scalable parallel processors can be expected to contain thousands of such multiple processor chips. In general, semiconductor performance advances appear to change about one order of magnitude every five years. Rotating magnetic memory and communications technology are not advancing as rapidly, with the result that the allocation of functions within the system configurations fo future supercomputer systems will require important changes. Availability of massively parallel heterogeneous processing capabilities should be a catalyst leading to new approaches for applications.

Lundstrom, S. F.↗

Non-volatile, high density, high speed, Micromagnet-Hall effect Random Access Memory (MHRAM)

The micromagnetic Hall effect random access memory (MHRAM) has the potential of replacing ROMs, EPROMs, EEPROMs, and SRAMs because of its ability to achieve non-volatility, radiation hardness, high density, and fast access times, simultaneously. Information is stored magnetically in small magnetic elements (micromagnets), allowing unlimited data retention time, unlimited numbers of rewrite cycles, and inherent radiation hardness and SEU immunity, making the MHRAM suitable for ground based as well as spaceflight applications. The MHRAM device design is not affected by areal property fluctuations in the micromagnet, so high operating margins and high yield can be achieved in large scale integrated circuit (IC) fabrication. The MHRAM has short access times (less than 100 nsec). Write access time is short because on-chip transistors are used to gate current quickly, and magnetization reversal in the micromagnet can occur in a matter of a few nanoseconds. Read access time is short because the high electron mobility sensor (InAs or InSb) produces a large signal voltage in response to the fringing magnetic field from the micromagnet. High storage density is achieved since a unit cell consists only of two transistors and one micromagnet Hall effect element. By comparison, a DRAM unit cell has one transistor and one capacitor, and a SRAM unit cell has six transistors.

Wu, Jiin C.↗

Dynamically-allocated multi-queue buffers for VLSI communication switches

Several buffer structures are discussed and compared in terms of implementation complexity, interswitch handshaking requirements, and their ability to deal with variations in traffic patterns and message lengths. A new design of buffers is presented that provide non-FIFO message handling and efficient storage allocation for variable size packets using linked lists managed by a simple on-chip controller. The new buffer design is evaluated by comparing it to several alternative designs in the context of a multistage interconnection network. The present modeling and simulations show that the new buffer outperforms alternative buffers and can thus be used to improve the performance of a wide variety of systems currently using less efficient buffers.

Tamir, Yuval↗

A three channel telemetry system

A three channel telemetry system intended for biomedical applications is described. The transmitter is implemented in a single chip using a 2 micron BiCMOS processes. The operation of the system and the test results from the latest chip are discussed. One channel is always dedicated to temperature measurement while the other two channels are generic. The generic channels carry information from transducers that are interfaced to the system through on-chip general purpose operational amplifiers. The generic channels have different bandwidths: one from dc to 250 Hz and the other from dc to 1300 Hz. Each generic channel modulates a current controlled oscillator to produce a frequency modulated signal. The two frequency modulated signals are summed and used to amplitude modulate the temperature signal which acts as a carrier. A near-field inductive link telemeters the combined signals over a short distance. The chip operates on a supply voltage anywhere from 2.5 to 3.6 Volts and draws less than 1 mA when transmitting a signal. The chip can be incorporated into ingestible, implantable and other configurations. The device can free the patient from tethered data collection systems and reduces the possibility of infection from subcutaneous leads. Data telemetry can increase patient comfort leading to a greater acceptance of monitoring.

Lesho, Jeffery C.↗

Double dipole antenna SIS receivers at 100 and 400 GHz

Antenna patterns were measured between 95 and 120 GHz for a double dipole antenna / ellipsoidal lens combination. The structure produces a non-astigmatic beam with low side lobe levels over that whole band. A heterodyne SIS receiver based on this concept gave a best noise temperature of 145 K DSB at 98 GHz. Measurements were also made with a 400 GHz heterodyne SIS receiver, using a double dipole antenna in conjunction with a hyperhemispherical lens. The best noise temperature was 220 K DSB at 402 GHz. On-chip stubs were used to tune out the SIS junction capacitance.

Skalare, A.↗

Comparisons between Intel 386 and i486 microprecessors

A quick and preliminary comparison is made between the Intel 386 and i486 microprocessors. The following topics are discussed: the i486 key elements, comparison of instruction set architecture, the i486 on-chip cache characteristics, the i486 multiprocessor support, comparison of performance, comparison of power consumption, comparison of radiation hardening potential, and recommendations for the Space Station Freedom (SSF) Data Management System (DMS).

Liu, Yuan-Kwei↗

Theory of dispersive microlenses

A dispersive microlens is a miniature optical element which simultaneously focuses and disperses light. Arrays of dispersive mircolenses have potential applications in multicolor focal planes. They have a 100 percent optical fill factor and can focus light down to detectors of diffraction spot size, freeing up areas on the focal plane for on-chip analog signal processing. Use of dispersive microlenses allows inband color separation within a pixel and perfect scene registration. A dual-color separation has the potential for temperature discrimination. We discuss the design of dispersive microlenses and present sample results for efficient designs.

Herman, B.↗

Performance of defect-tolerant set-associative cache memories

The increased use of on-chip cache memories has led researchers to investigate their performance in the presence of manufacturing defects. Several techniques for yield improvement are discussed and results are presented which indicate that set-associativity may be used to provide defect tolerance as well as improve the cache performance. Tradeoffs between several cache organizations and replacement strategies are investigated and it is shown that token-based replacement may be a suitable alternative to the widely-used LRU strategy.

Frenzel, J. F.↗

SPROC: A multiple-processor DSP IC

A large, single-chip, multiple-processor, digital signal processing (DSP) integrated circuit (IC) fabricated in HP-Cmos34 is presented. The innovative architecture is best suited for analog and real-time systems characterized by both parallel signal data flows and concurrent logic processing. The IC is supported by a powerful development system that transforms graphical signal flow graphs into production-ready systems in minutes. Automatic compiler partitioning of tasks among four on-chip processors gives the IC the signal processing power of several conventional DSP chips.

Davis, R.↗

A CAM-based LZ data compression IC

A custom CMOS processor is introduced that implements the Data Compression Lempel-Ziv (DCLZ) standard, a variation of the LZ2 Algorithm. This component presently achieves a sustained compression and decompression rate of 10 megabytes/second by employing an on-chip content-addressable memory for string table storage.

Winters, K.↗

CCD data acquisition systems at Lick and Keck Observatories

This paper will describe and compare two distinct but related CCD data acquisition systems (DAS) currently under development at Lick and Keck Observatories. Although these two systems have a number of major architectural differences, they share a considerable amount of common hardware and software. Both of these new systems build on a large body of proven software that is the foundation of the existing CCD DAS currently in use at Lick Observatory. Both will provide support for reading up to four on-chip amplifiers per CCD and/or reading out mosaics of CCD chips. In addition, they will provide the capability for interactive, real-time adjustment of CCD waveforms for engineering purposes. Each of these two systems is composed of three major subsystems: (1) an instrument computer and its software; (2) a data capture computer and its software; and (3) a CCD/dewar controller and its software. The instrument computer is a Unix workstation, and the functions it provides include user interfaces, the interactive real-time display of CCD images, and the recording of image and FITS header data to disk and/or tape. The data capture computer is responsible for the packaging and high-speed transfer of the CCD pixel data stream into a bulk RAM, and the subsequent transfer of this data to the instrument computer. The CCD/dewar controller generates the waveforms for clocking the CCD, digitizes the pixel data, and transmits it via high-speed link to the data capture computer. It is also responsible for monitoring and controlling the dewar temperature and cryogen levels. Given the number of different types of processors and high-speed data links employed in both systems, a major emphasis of this paper will be on the various forms of interprocessor communications utilized for data transfer and distributed process synchronization.

Kibrick, R. I.↗

Ku-band high efficiency GaAs MMIC power amplifiers

The development of Ku-band high efficiency GaAs MMIC power amplifiers is examined. Three amplifier modules operating over the 13 to 15 GHz frequency range are to be developed. The first MMIC is a 1 W variable power amplifier (VPA) with 35 percent efficiency. On-chip digital gain control is to be provided. The second MMIC is a medium power amplifier (MPA) with an output power goal of 1 W and 40 percent power-added efficiency. The third MMIC is a high power amplifier (HPA) with 4 W output power goal and 40 percent power-added efficiency. An output power of 0.36 W/mm with 49 percent efficiency was obtained on an ion implanted single gate MESFET at 15 GHz. On a dual gate MESFET, an output power of 0.42 W/mm with 27 percent efficiency was obtained. A mask set was designed that includes single stage, two stage, and three stage single gate amplifiers. A single stage 600 micron amplifier produced 0.4 W/mm output power with 40 percent efficiency at 14 GHz. A four stage dual gate amplifier generated 500 mW of output power with 20 dB gain at 17 GHz. A four-bit digital-to-analog converter was designed and fabricated which has an output swing of -3 V to +/- 1 V.

Tserng, H. Q.↗

Active Pixel Sensors: Are CCD's Dinosaurs?

Charge-coupled devices (CCD's) are presently the technology of choice for most imaging applications. In the 23 years since their invention in 1970, they have evolved to a sophisticated level of performance. However, as with all technologies, we can be certain that they will be supplanted someday. In this paper, the Active Pixel Sensor (APS) technology is explored as a possible successor to the CCD. An active pixel is defined as a detector array technology that has at least one active transistor within the pixel unit cell. The APS eliminates the need for nearly perfect charge transfer -- the Achilles' heel of CCDs. This perfect charge transfer makes CCD's radiation 'soft,' difficult to use under low light conditions, difficult to manufacture in large array sizes, difficult to integrate with on-chip electronics, difficult to use at low temperatures, difficult to use at high frame rates, and difficult to manufacture in non-silicon materials that extend wavelength response.

Fossum, Eric R.↗

A 128 x 128 CMOS Active Pixel Image Sensor for Highly Integrated Imaging Systems

A new CMOS-based image sensor that is intrinsically compatible with on-chip CMOS circuitry is reported. The new CMOS active pixel image sensor achieves low noise, high sensitivity, X-Y addressability, and has simple timing requirements. The image sensor was fabricated using a 2 micrometer p-well CMOS process, and consists of a 128 x 128 array of 40 micrometer x 40 micrometer pixels. The CMOS image sensor technology enables highly integrated smart image sensors, and makes the design, incorporation and fabrication of such sensors widely accessible to the integrated circuit community.

Mendis, Sunetra K.↗

Fault detection and bypass in a sequence information signal processor

The invention comprises a plurality of scan registers, each such register respectively associated with a processor element; an on-chip comparator, encoder and fault bypass register. Each scan register generates a unitary signal the logic state of which depends on the correctness of the input from the previous processor in the systolic array. These unitary signals are input to a common comparator which generates an output indicating whether or not an error has occurred. These unitary signals are also input to an encoder which identifies the location of any fault detected so that an appropriate multiplexer can be switched to bypass the faulty processor element. Input scan data can be readily programmed to fully exercise all of the processor elements so that no fault can remain undetected.

Peterson, John C.↗

Bubble domain circuit organization

An on-chip bubble domain circuit organization. One or more storage registers are connected to a propagation path whereby data in the form of magnetic bubble domains (bubbles) may be transferred into and out of the storage registers. The propagation path includes a generator for producing the initial bubbles which are expanded into any desired number of new bubbles by a unique multiple output replicator. A unique input decoder is utilized to determine to which storage register the bubbles from the replicator will be directed along the propagation path. Those bubbles not selected may be annihilated. An output decoder utilizing essentially the same decoding scheme as the input decoder, selectively receives bubbles from the storage register. A transfer and replicate switch is utilized between the storage register and output decoder to selectively transfer bubbles to the output decoder. The output decoder may collapse all of the bubbles from certain storage registers so that only the information from the selected storage register reaches the detector. The detectors in turn produce the chip output signal. External control electronics are utilized to control the selective operation of the various devices utilized in the propagation path.

Chen, Thomas T.↗