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Electric Drive Technologies Research: ELT223 Component Modeling, Co-Optimization, and Trade-Space Evaluation Annual Report

This project is intended to support the development of new traction drive systems that meet the targets of 100 kW/L for power electronics and 50 kW/L for electric machines with reliable operation to 300,000 miles. To meet these goals, new designs must be identified that make use of state-of-the-art and next-generation electronic materials and design methods. Designs must exploit synergies between components, for example converters designed for high-frequency switching using wide band gap (WBG) devices and ceramic capacitors. This project included: (1) a survey of available technologies; (2) investigating new technologies, that for example, reduce volume of thermal management or magnetic components; (3) the development of computer aided design tools that consider the converter volume, reliability, and electrical performance; (4) exercising the design software to evaluate performance gaps and predict the impact of certain technologies and design approaches, i.e. GaN semiconductors, ceramic capacitors, ceramic thermal management components, and select topologies; (5) building and testing hardware prototypes to validate models and concepts. The design tools enable co-optimization of the power module and passive elements and provide some design guidance. At the end of the project, new advanced computing methods, such as machine learning approaches, were considered.

33 ADVANCED PROPULSION SYSTEMS

System Miniaturization Via Heterogeneous Integration of Electronic Devices for Deep Space Missions

The scientific devices designed for each of the Outer Planets Program Focuses will likely be groundbreaking not only with respect to their scientific role but also regarding the electronics required to perform such investigations. In the past, the performance of packaged electronics was limited by the components themselves, with minimal influence of the packaging technology. The rapid development of integrated circuit technology, however, has drastically increased the importance of packaging technology in the ultimate performance of devices. If not carefully considered in the overall design, the packaging may become the limiting factor in the operation of the system. Although industry is responsible for several significant accomplishments in the field of electronics packaging, deep space/outer planet missions must take into account additional requirements such as extremely low temperatures, high radiation levels, hermetic sealing, and severe size and weight limitations. Therefore, the present investigation has been designed to meet the needs of NASA's sensor intensive outer planets program by combining (using flip chip technology) an array of devices (including analog, digital, power volt-age, passives, and MEMS) into a miniaturized heterogeneous system and utilizing optical buses to enable autonomy. Additional information is contained in the original extended abstract.

DelCastillo, L.

Passive Dust Mitigation Technologies Being Developed for Demonstration Under Patch Plate Materials Compatibility Analysis Task

With the Artemis program, we are planning longer stays on the surface, with more activities that have the potential to put the astronauts and equipment in contact with greater quantities of lunar dust. The success of these missions will depend on our understanding of material interactions with lunar dust and the development of ways to mitigate dust effects in cases where exposure to dust will lead to failure of components, unacceptable loss of power or thermal control, unacceptable loss of visibility, or health issues. Passive dust mitigation by coating or surface alteration is one method that is being developed and demonstrated under the Space Technology Mission Directorate’s Game Changing Technology, Dust Mitigation Program as part of the Patch Plate Materials Compatibility Assessment Task. The goal of the task is to alter the surfaces of materials in order to passively reduce the adhesion of dust, demonstrate their performance in relevant ground-based tests using lunar simulants, and prepare them for demonstration through experiment on the lunar surface. Optically transparent, sputter deposited, work function matching coatings are being developed to reduce adhesion of dust to windows, lenses and display panels by matching the minimum energy to remove an electron from the surface to that of lunar dust in order to reduce adhesion due to charge transfer. Low surface energy coatings and surfaces for thermal control are also being developed to reduce the bonding of dust with the surface enabling it to be removed more easily. Conductive coatings with the ability to shed dust more easily are being developed for use with the active Electrodynamic Dust Shield technology to help reduce the power needed to remove dust from the surface. Passive dust mitigation surfaces for metals such as aluminum, stainless steel, and titanium are being developed that reduce the area of dust contact with the surfaces through topographical modification using laser ablation patterning to impart hierarchical topographies with nanometer to micrometer length scales in a single step. Topographically modified polymeric materials, both those with extensive space heritage and those with lower technology readiness levels, are also being evaluated. Space suit fabric surfaces that can reduce dust penetration into and through the fabric are also being investigated as well as pristine and topographically modified ceramic materials that exhibit high wear resilience. An overview of the passive dust mitigation surfaces and coatings being developed under this task, ground testing being conducted using lunar simulants, characterization techniques, and materials preparation for flight sample delivery for integration into the Alpha Space Regolith Adherence Characterization experiment going to the lunar surface on a Commercial Lunar Payload Services (CLPS) lander in 2023 will be discussed.

Lunar dust, passive mitigation, lunar simulant, co

Linewidth narrowing in self-injection locked lasers: Effects of quantum confinement

This paper explores the impact of gain medium on linewidth narrowing in integrated self-injection locked III–V/SiN lasers, theoretically and experimentally. We focus on the effects of carrier densities of states in zero- and two-dimensional structures due to quantum-dot and quantum-well confinement. The theoretical approach includes (a) multimode laser interaction to treat mode competition and wave mixing, (b) quantum-optical contributions from spontaneous emission, and (c) composite laser/free-space eigenmodes to describe outcoupling and coupling among components within an extended cavity. For single-cavity lasers, such as distributed feedback lasers, the model reproduces the experimentally observed better linewidth performance of quantum-dot active regions over quantum-well ones. When applied to integrated III–V/SiN lasers, our analysis indicates Hz-level linewidth performance for both quantum-dot and quantum-well gain media due to overcoming the difference in carrier-induced refractive index by incorporating a high-Q SiN passive resonator. Trade-offs are also explored between linewidth, output power, and threshold current.

Cavity quantum electrodynamics

Ceramic Heat Pipe for Thermal Management of a High Frequency Inductor

As the power density of electric machines and power electronics continues to increase to meet the demands of more electric aircraft, the thermal management of these devices becomes increasingly important. Ideally, the thermal management solution of the device should have high thermal conductivity and be electrically insulating so that it can be directly integrated with the device in question. Technical ceramics are a class of materials that meet these two requirements. Direct liquid cooling by submerging electric components in a dielectric fluid is an alternate option, but adds system complexity and may incur pumping loss. In this work, the thermal management solution for a high frequency inductor is presented. A conventional wicked heat pipe is designed that is made from a solid ceramic case with a sintered ceramic wick. This heat pipe can provide structural support for the core and windings and is electrically insulating, so it does not incur any additional eddy current losses from the high frequency magnetic fields. It does not require additional pumping power, because conventional wicked heat pipes are passive devices. In this paper, the manufacturing process of the ceramic heat pipe is also presented. It is shown that the sintering of large diameter spherical ceramic particles is difficult due to their high specific surface area and low surface free energy. To overcome this difficulty, a flux material was used to initiate liquid phase sintering. The results of the sintering trials show that for the 120 μm diameter α-Al2O3powder selected for the wick, the combination of 1650°C sintering temperature and the addition of 5 wt% talc sintered the porous matrix together sufficiently for use as a heat pipe wic

High-frequency Inductor

Ceramic Heat Pipe for Thermal Management of a High Frequency Inductor

As the power density of electric machines and power electronics continues to increase to meet the demands of more electric aircraft, the thermal management of these devices becomes increasingly important. Ideally, the thermal management solution of the device should have high thermal conductivity and be electrically insulating so that it can be directly integrated with the device in question. Technical ceramics are a class of materials that meet these two requirements. Direct liquid cooling by submerging electric components in a dielectric fluid is an alternate option, but adds system complexity and may incur pumping loss. In this work, the thermal management solution for a high frequency inductor is presented. A conventional wicked heat pipe is designed that is made from a solid ceramic case with a sintered ceramic wick. This heat pipe can provide structural support for the core and windings and is electrically insulating, so it does not incur any additional eddy current losses from the high frequency magnetic fields. It does not require additional pumping power, because conventional wicked heat pipes are passive devices. In this paper, the manufacturing process of the ceramic heat pipe is also presented. It is shown that the sintering of large diameter spherical ceramic particles is difficult due to their high specific surface area and low surface free energy. To overcome this difficulty, a flux material was used to initiate liquid phase sintering. The results of the sintering trials show that for the 120 μm diameter α-Al2O3 powder selected for the wick, the combination of 1650°C sintering temperature and the addition of 5 wt% talc sintered the porous matrix together sufficiently for use as a heat pipe wick.

High frequency inductor

Thermal Infrared Sensor (TIRS) Instrument Thermal Subsystem Design and Lessons Learned

The Thermal Infrared Sensor (TIRS) is one of two instruments on the Landsat Data Continuity Mission (LDCM), which is scheduled to launch in February of 2013. The TIRS instrument was officially added to the mission later in the flow, which led to a highly aggressive schedule that became one of the main drivers during instrument development. The thermal subsystem design of the TIRS Sensor Unit is comprised of five thermal zones which range in temperature from less than 43 Kelvin to 330 Kelvin. Most zones are proportional heater controlled, and all are within a volume of 35 cu.ft. A two-stage cryocooler is used to cool the "cold stage" including three QWIP detectors to less than 43 Kelvin, and cool the "warm stage" to 105 Kelvin. The excess power dissipation from the cryocooler is rejected via ammonia transport heat pipes to a dedicated Cryocooler Radiator with embedded ammonia heat pipes. The cryogenic subsystem includes a series of shells used to radiatively and conductively isolate the cold stage from the warmer surroundings. The Optical System (telescope) is passively cooled to 180-190 Kelvin using a "thermal link" (comprised of a Flexible Conductive Thermal Strap and an APG Bar) which couples the telescope stage to a dedicated radiator with embedded ethane heat pipes. The Scene Select Mechanism, which is responsible for moving the Scene Select Mirror to three distinct positions (including Nadir, Space, and On-board Black Body Calibrator pointing), runs nominally at 278 Kelvin and is thermally isolated from the cryogenic thermal zones. The On-board Black Body Calibrator requires a dedicated radiator which allows for a temperature range of 260-330 Kelvin at the Source. The detectors are powered by the FPE Box, which is mounted to the nadir external surface of the composite honeycomb structure. There are two additional electronics boxes which are wet-mounted directly to the spacecraft shear panel, the Main Electronics Box and Cryocooler Electronics Box; thermal control of these boxes is the responsibility of Orbital Sciences Corporation, the spacecraft developer. The TIRS thermal subsystem design was successfully verified during months of testing campaign, from component & subsystem level to two instrument-level thermal vacuum tests. The Instrument, despite an aggressive schedule, was delivered to the spacecraft vendor in February of 2012 and is currently undergoing the final stages of spacecraft environmental testing in preparation for launch.

Otero, Veronica

Compact Radar Transceiver with Included Calibration

The Digital Beamforming Synthetic Aperture Radar (DBSAR) is an eight-channel phased array radar system that employs solid-state radar transceivers, a microstrip patch antenna, and a reconfigurable waveform generator and processor unit. The original DBSAR transceiver design utilizes connectorized electronic components that tend to be physically large and heavy. To achieve increased functionality in a smaller volume, PCB (printed circuit board) transceivers were designed to replace the large connectorized transceivers. One of the most challenging problems designing the transceivers in a PCB format was achieving proper performance in the calibration path. For a radar loop-back calibration path, a portion of the transmit signal is coupled out of the antenna feed and fed back into the receiver. This is achieved using passive components for stability and repeatability. Some signal also leaks through the receive path. As these two signal paths are correlated via an unpredictable phase, the leakage through the receive path during transmit must be 30 dB below the calibration path. For DBSAR s design, this requirement called for a 100-dB isolation in the receiver path during transmit. A total of 16 solid-state L-band transceivers on a PCB format were designed. The transceivers include frequency conversion stages, T/R switching, and a calibration path capable of measuring the transmit power-receiver gain product during transmit for pulse-by-pulse calibration or matched filtering. In particular, this calibration path achieves 100-dB isolation between the transmitted signal and the low-noise amplifier through the use of a switching network and a section of physical walls achieving attenuation of radiated leakage. The transceivers were designed in microstrip PCBs with lumped elements and individually packaged components for compactness. Each transceiver was designed on a single PCB with a custom enclosure providing interior walls and compartments to isolate transceiver subsystems from radiated interference. The enclosure also acts as a heat sink for the voltage regulators and power amplifiers inside the system. The PCB transceiver design produces transmit pulses of 2 W with an arbitrary duty cycle. Each transceiver is fed by an external 120-MHz signal transmit and two 1,140-MHz local oscillator signals. The received signal is amplified and down-converted to 120 MHz and is fed to the data processor. The transceiver dimensions are approximately 3.5 11.5 0.6 in. (9 29 1.5 cm). The PCB transceiver design reduces the volume and weight of the DBSAR instrument while maintaining the functionality found in the original design. Both volume and weight are critical for airborne and flight remote sensing instrumentation.

McLinden, Matthew

The efficiency of photovoltaic cells exposed to pulsed laser light

Future space missions may use laser power beaming systems with a free electron laser (FEL) to transmit light to a photovoltaic array receiver. To investigate the efficiency of solar cells with pulsed laser light, several types of GaAs, Si, CuInSe2, and GaSb cells were tested with the simulated pulse format of the induction and radio frequency (RF) FEL. The induction pulse format was simulated with an 800-watt average power copper vapor laser and the RF format with a frequency-doubled mode-locked Nd:YAG laser. Averaged current vs bias voltage measurements for each cell were taken at various optical power levels and the efficiency measured at the maximum power point. Experimental results show that the conversion efficiency for the cells tested is highly dependent on cell minority carrier lifetime, the width and frequency of the pulses, load impedance, and the average incident power. Three main effects were found to decrease the efficiency of solar cells exposed to simulated FEL illumination: cell series resistance, LC 'ringing', and output inductance. Improvements in efficiency were achieved by modifying the frequency response of the cell to match the spectral energy content of the laser pulse with external passive components.

Lowe, R. A.

Electronic Components for use in Extreme Temperature Aerospace Applications

Electrical power management and control systems designed for use in planetary exploration missions and deep space probes require electronics that are capable of efficient and reliable operation under extreme temperature conditions. Space-based infra-red satellites, all-electric ships, jet engines, electromagnetic launchers, magnetic levitation transport systems, and power facilities are also typical examples where the electronics are expected to be exposed to harsh temperatures and to operate under severe thermal swings. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and, therefore, new parts must be developed or the conventional devices need to be modified. For example, spacecraft operating in the cold environment of deep space carry a large number of radioisotope heating units in order to maintain the surrounding temperature of the on-board electronics at approximately 20 C. At the other end, built-in radiators and coolers render the operation of electronics possible under hot conditions. These thermal measures lead to design complexity, affect development costs, and increase size and weight. Electronics capable of operation at extreme temperatures, thus, will not only tolerate the hostile operational environment, but also make the overall system efficient, more reliable, and less expensive. The Extreme Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electronics suitable for applications in the aerospace environment and deep space exploration missions. Research is being conducted on devices, including COTS parts, for potential use under extreme temperatures. These components include semiconductor switching devices, passive devices, DC/DC converters, operational amplifiers, and oscillators. An overview of the program will be presented along with some experimental findings.

Patterson, Richard L.

Laer-induced Breakdown Spectroscopy Instrument for Element Analysis of Planetary Surfaces

One of the most fundamental pieces of information about any planetary body is the elemental and mineralogical composition of its surface materials. We are developing an instrument to obtain such data at ranges of up to several hundreds of meters using the technique of Laser-Induced Breakdown Spectroscopy (LIBS). We envision our instrument being used from a spacecraft in close rendezvous with small bodies such as comets and asteroids, or deployed on surface-rover vehicles on large bodies such as Mars and the Moon. The elemental analysis is based on atomic emission spectroscopy of a laser-induced plasma or spark. A pulsed, diode pumped Nd:YAG laser of several hundred millijoules optical energy is used to vaporize and electronically excite the constituent elements of a rock surface remotely located from the laser. Light emitted from the excited plasma is collected and introduced to the entrance slit of a small grating spectrometer. The spectrally dispersed spark light is detected with either a linear photo diode array or area CCD array. When the latter detector is used, the optical and spectrometer components of the LIBS instrument can also be used in a passive imaging mode to collect and integrate reflected sunlight from the same rock surface. Absorption spectral analysis of this reflected light gives mineralogical information that provides a remote geochemical characterization of the rock surface. We performed laboratory calibrations in air and in vacuum on standard rock powders to quantify the LIBS analysis. We performed preliminary field tests using commercially available components to demonstrate remote LIBS analysis of terrestrial rock surfaces at ranges of over 25 m, and we have demonstrated compatibility with a six-wheeled Russian robotic rover vehicle. Based on these results, we believe that all major and most minor elements expected on planetary surfaces can be measured with absolute accuracy of 10-15 percent and much higher relative accuracy. We have performed preliminary systems analysis of a LIBS instrument to evaluate probable mass and power requirements; results of this analysis are summarized.

Blacic, J.

NASA Tech Briefs, January 2008

Topics covered include: Induction Charge Detector with Multiple Sensing Stages; Generic Helicopter-Based Testbed for Surface Terrain Imaging Sensors; Robot Electronics Architecture; Optimized Geometry for Superconducting Sensing Coils; Sensing a Changing Chemical Mixture Using an Electronic Nose; Inertial Orientation Trackers with Drift Compensation; Microstrip Yagi Antenna with Dual Aperture-Coupled Feed; Patterned Ferroelectric Films for Tunable Microwave Devices; Micron-Accurate Laser Fresnel-Diffraction Ranging System; Efficient G(sup 4)FET-Based Logic Circuits; Web-Enabled Optoelectronic Particle-Fallout Monitor; SiO2/TiO2 Composite for Removing Hg from Combustion Exhaust; Lightweight Tanks for Storing Liquefied Natural Gas; Hybrid Wound Filaments for Greater Resistance to Impacts; Making High-Tensile-Strength Amalgam Components; Bonding by Hydroxide-Catalyzed Hydration and Dehydration; Balanced Flow Meters without Moving Parts; Deflection-Compensating Beam for Use inside a Cylinder; Four-Point-Latching Microactuator; Curved Piezoelectric Actuators for Stretching Optical Fibers; Tunable Optical Assembly with Vibration Dampening; Passive Porous Treatment for Reducing Flap Side-Edge Noise; Cylindrical Piezoelectric Fiber Composite Actuators; Patterning of Indium Tin Oxide Films; Gimballed Shoulders for Friction Stir Welding; Improved Thermal Modulator for Gas Chromatography; Nuclear-Spin Gyroscope Based on an Atomic Co-Magnetometer; Utilizing Ion-Mobility Data to Estimate Molecular Masses; Optical Displacement Sensor for Sub-Hertz Applications; Polarization/Spatial Combining of Laser-Diode Pump Beams; Spatial Combining of Laser-Diode Beams for Pumping an NPRO; Algorithm Optimally Orders Forward-Chaining Inference Rules; Project Integration Architecture; High Power Amplifier and Power Supply; Estimating Mixing Heights Using Microwave Temperature Profiler; and Multiple-Cone Sunshade for a Spaceborne Telescope.

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Low-Power SOI CMOS Transceiver

The work aims at developing a low-power Silicon on Insulator Complementary Metal Oxide Semiconductor (SOI CMOS) Transceiver for deep-space communications. RF Receiver must accomplish the following tasks: (a) Select the desired radio channel and reject other radio signals, (b) Amplify the desired radio signal and translate them back to baseband, and (c) Detect and decode the information with Low BER. In order to minimize cost and achieve high level of integration, receiver architecture should use least number of external filters and passive components. It should also consume least amount of power to minimize battery cost, size, and weight. One of the most stringent requirements for deep-space communication is the low-power operation. Our study identified that two candidate architectures listed in the following meet these requirements: (1) Low-IF receiver, (2) Sub-sampling receiver. The low-IF receiver uses minimum number of external components. Compared to Zero-IF (Direct conversion) architecture, it has less severe offset and flicker noise problems. The Sub-sampling receiver amplifies the RF signal and samples it using track-and-hold Subsampling mixer. These architectures provide low-power solution for the short- range communications missions on Mars. Accomplishments to date include: (1) System-level design and simulation of a Double-Differential PSK receiver, (2) Implementation of Honeywell SOI CMOS process design kit (PDK) in Cadence design tools, (3) Design of test circuits to investigate relationships between layout techniques, geometry, and low-frequency noise in SOI CMOS, (4) Model development and verification of on-chip spiral inductors in SOI CMOS process, (5) Design/implementation of low-power low-noise amplifier (LNA) and mixer for low-IF receiver, and (6) Design/implementation of high-gain LNA for sub-sampling receiver. Our initial results show that substantial improvement in power consumption is achieved using SOI CMOS as compared to standard CMOS process. Potential advantages of SOI CMOS for deep-space communication electronics include: (1) Radiation hardness, (2) Low-power operation, and (3) System-on-Chip (SOC) solutions.

Fujikawa, Gene

NASA Tech Briefs, July 2011

Topics covered include: 1) Collaborative Clustering for Sensor Networks; 2) Teleoperated Marsupial Mobile Sensor Platform Pair for Telepresence Insertion Into Challenging Structures; 3) Automated Verification of Spatial Resolution in Remotely Sensed Imagery; 4) Electrical Connector Mechanical Seating Sensor; 5) In Situ Aerosol Detector; 6) Multi-Parameter Aerosol Scattering Sensor; 7) MOSFET Switching Circuit Protects Shape Memory Alloy Actuators; 8) Optimized FPGA Implementation of Multi-Rate FIR Filters Through Thread Decomposition; 9) Circuit for Communication Over Power Lines; 10) High-Efficiency Ka-Band Waveguide Two-Way Asymmetric Power Combiner; 11) 10-100 Gbps Offload NIC for WAN, NLR, and Grid Computing; 12) Pulsed Laser System to Simulate Effects of Cosmic Rays in Semiconductor Devices; 13) Flight Planning in the Cloud; 14) MPS Editor; 15) Object-Oriented Multi Disciplinary Design, Analysis, and Optimization Tool; 16) Cryogenic-Compatible Winchester Connector Mount and Retaining System for Composite Tubes; 17) Development of Position-Sensitive Magnetic Calorimeters for X-Ray Astronomy; 18) Planar Rotary Piezoelectric Motor Using Ultrasonic Horns; 19) Self-Rupturing Hermetic Valve; 20) Explosive Bolt Dual-Initiated from One Side; 21) Dampers for Stationary Labyrinth Seals; 22) Two-Arm Flexible Thermal Strap; 23) Carbon Dioxide Removal via Passive Thermal Approaches; 24) Polymer Electrolyte-Based Ambient Temperature Oxygen Microsensors for Environmental Monitoring; 25) Pressure Shell Approach to Integrated Environmental Protection; 26) Image Quality Indicator for Infrared Inspections; 27) Micro-Slit Collimators for X-Ray/Gamma-Ray Imaging; 28) Scatterometer-Calibrated Stability Verification Method; 29) Test Port for Fiber-Optic-Coupled Laser Altimeter; 30) Phase Retrieval System for Assessing Diamond Turning and Optical Surface Defects; 31) Laser Oscillator Incorporating a Wedged Polarization Rotator and a Porro Prism as Cavity Mirror; 32) Generic, Extensible, Configurable Push-Pull Framework for Large-Scale Science Missions; 33) Dynamic Loads Generation for Multi-Point Vibration Excitation Problems; 34) Optimal Control via Self-Generated Stochasticity; 35) Space-Time Localization of Plasma Turbulence Using Multiple Spacecraft Radio Links; 36) Surface Contact Model for Comets and Asteroids; 37) Dust Mitigation Vehicle; 38) Optical Coating Performance for Heat Reflectors of the JWST-ISIM Electronic Component; 39) SpaceCube Demonstration Platform; 40) Aperture Mask for Unambiguous Parity Determination in Long Wavelength Imagers; 41) Spaceflight Ka-Band High-Rate Radiation-Hard Modulator; 42) Enabling Disabled Persons to Gain Access to Digital Media; 43) Cytometer on a Chip; 44) Principles, Techniques, and Applications of Tissue Microfluidics; and 45) Two-Stage Winch for Kites and Tethered Balloons or Blimps.

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