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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS2019

NASA Electronic Parts and Packaging (NEPP) Program: Overview and Technology Focus Areas - Responsive Technology Assurance for Civil Space

NASA Electronic Parts and Packaging (NEPP) Program Overview and Technology Highlights – The NEPP Program provides NASA's leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of electrical, electronic, and electromechanical parts by NASA, in collaboration with other government agencies and industry. The NASA Electronic Parts Assurance Group (NEPAG) is a core portion of NEPP. This presentation highlights key focus areas for 2019.

radiation effects↗
NASA NTRS2007

The NASA Electronic Parts and Packaging (NEPP) Program: Insertion of New Electronics Technologies

This viewgraph presentation gives an overview of NASA Electronic Parts and Packaging (NEPP) Program's new electronics technology trends. The topics include: 1) The Changing World of Radiation Testing of Memories; 2) Even Application-Specific Tests are Costly!; 3) Hypothetical New Technology Part Qualification Cost; 4) Where we are; 5) Approaching FPGAs as a More Than a "Part" for Reliability; 6) FPGAs Beget Novel Radiation Test Setups; 7) Understanding the Complex Radiation Data; 8) Tracking Packaging Complexity and Reliability for FPGAs; 9) Devices Supporting the FPGA Need to be Considered; 10) Summary of the New Electronic Technologies and Insertion into Flight Programs Workshop; and 11) Highlights of Panel Notes and Comments

LaBel, Kenneth A.↗
NASA NTRS2010

NASA Electronic Parts and Packaging (NEPP) Program - Update

This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

LaBel, Kenneth A.↗
DOE OSTI2025

ORNL Package Testing Program Overview

Radioactive materials are widespread in our everyday activities which are used in many different types of industries: Consumer products, Medicine, Industry, Energy, and Defense. In the United States there is about 3 million shipments of radioactive materials per year. With radioactive material being very widespread the number of new applications to ship these quantities increases daily. As such, ensuring the safe and secure transport of these materials is paramount, necessitating stringent packaging, transportation, and certification requirements. Shipments of radioactive materials have been made from Oak Ridge National Laboratory (ORNL) for the past 65 years. Since the 1940s ORNL has been at the forefront of the early development of regulations pertaining to the transport of radioactive shipments and associated regulatory testing. The early involvement resulted in ORNL being one of the leaders in the development of regulations and testing standards pertaining to the testing and design of packages. Today all package testing activities are conducted under the Package Testing Program (PTP) at ORNL at the Package Evaluation Facility (PEF). The PTP develops and evaluates testing solutions – ensuring that they are safe, efficient, and meet regulatory requirements ORNL PTP has extensive experience in the regulatory testing of radioactive material packages, supporting certification of Type A, Type, B, Type AF, and special form packages. The PEF serves as a one-stop-shop for design, testing, and certification of a wide variety of packages needed for shipment of radioactive materials. The facility provides the space, expertise, and equipment necessary to conduct rigorous performance testing under both normal and accident conditions or transport environments including free drop, dynamic crush, puncture, penetration, compression, vibration, water spray, water immersion, and thermal test. The PTP remains a key contributor to the safety and compliance of radioactive material transportation. This presentation will provide an overview of the program’s history, capabilities, and its ongoing role in advancing regulatory standards and transportation safety.

Martinez, Oscar [ORNL] (ORCID:0000000181814046)↗
DOE OSTI2022

DOE Packaging Certification Program Engineering Class Demonstration Tests

On Thursday August 11, 2022, a series of explosive demonstration tests were conducted at the Sandia National Laboratories 9920 Test Complex for the 2022 DOE Packaging Certification Program Explosives Engineering class. Class participants included both SNL engineering student interns as well as SNL and LANL staff members. The test series was designed by the class instructor, W. Gary Rivera Org. 6626, and 9920 site test engineer, Marissa Martinez Org. 6648, with help from Michelle Chatter Org 6514 and Luke Gilbert Org 6815.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Package Testing Program Process for Validation and Verification of Software

The purpose of this document is to define the process for validation and verification (V&V) of software used to test the thermal data acquisition equipment in the Oak Ridge National Laboratory (ORNL) Package Testing Program (PTP) as part of the testing configuration(s). This process adheres to all applicable ORNL Standards Based Management System requirements and correlates with the PTP Quality Management System and the Software Quality Assurance Plan.

97 MATHEMATICS AND COMPUTING↗
NASA NTRS2002

Recent photonics activites under the NASA electronic parts and packaging (NEPP) program

With the rapidly increasing insertion of photonic devices, circuits and subsystems into NASA spacecraft, a variety of issues associated with reliability and radiation tolerance have arisen. In this paper, we discuss these issues from the perspective of the work currently ongoing in the NASA Electronic Parts and Packaging (NEPP) Program. This Program is focused on evaluating the reliability and radiation response of advanced and emerging microelectronics and photonics technologies of interest to NASA spacecraft system designers.

NEEP↗
DOE OSTI2022

Test Report for DPP-1 Regulatory Compliance Testing. Volume 1 - Main Report

Consolidated Nuclear Security, LLC (CNS), the management and operating contractor for the Y-12 National Security Complex (Y-12) for the National Nuclear Security Administration (NNSA), is currently responsible for the regulatory testing of a new Type B fissile material shipping package called the Defense Programs Package (DPP)-1. The DPP-1 is a drum packaging with an inner liner and a removable lid. Both the drum body and the lid are filled with an impact-limiting, thermal-insulating material that protects the inner containment vessel (CV) during normal conditions of transport (NCT) and hypothetical accident conditions (HAC) as defined by 10 US code of Federal Regulations (CFR) 71. In fiscal year 2021, the Oak Ridge National Laboratory (ORNL) Package Testing Program (PTP), located at the National Transportation Research Center (NTRC), conducted Type B performance tests as prescribed in Title 10 Code of Federal Regulations Part 71 (10 CFR 71) on seven DPP-1 prototype units. This test report documents test unit (TU) preparation, pretest condition, conditioning of each TU, NCT and HAC testing, and posttest measurements and observations made of the damage resulting from these tests.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
NASA NTRS1993

Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

Fayette, Daniel F.↗