Search NASA⌕ Search

SEARCH · Search NASA

Results for “temperature control applications”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 55 records · Page 3

Evaluation of High Temperature Knitted Spring Tubes for Structural Seal Applications

Control surface seals are crucial to current and future space vehicles, as they are used to seal the gaps surrounding body flaps, elevons, and other actuated exterior surfaces. During reentry, leakage of high temperature gases through these gaps could damage underlying lower temperature structures such as rudder drive motors and mechanical actuators, resulting in impaired vehicle control. To be effective, control surface seals must shield lower temperature structures from heat transfer by maintaining sufficient resiliency to remain in contact with opposing sealing surfaces through multiple compression cycles. The current seal exhibits significant loss of resiliency after a few compression cycles at elevated temperatures (i.e., 1900 F) and therefore would be inadequate for advanced space vehicles. This seal utilizes a knitted Inconel X-750 spring tube as its primary resilient element. As part of a larger effort to enhance seal resiliency, researchers at the NASA Glenn Research Center performed high temperature compression testing (up to 2000 F) on candidate spring tube designs employing material substitutions and modified geometries. These tests demonstrated significant improvements in spring tube resiliency (5.5x better at 1750 F) through direct substitution of heat treated Rene 41 alloy in the baseline knit design. The impact of geometry modification was minor within the range of parameters tested, however trends did suggest that moderate resiliency improvements could be obtained by optimizing the current spring tube geometry.

Taylor, Shawn C.↗

Thermal energy storage

The general scope of study on thermal energy storage development includes: (1) survey and review possible concepts for storing thermal energy; (2) evaluate the potentials of the surveyed concepts for practical applications in the low and high temperature ranges for thermal control and storage, with particular emphasis on the low temperature range, and designate the most promising concepts; and (3) determine the nature of further studies required to expeditiously convert the most promising concept(s) to practical applications. Cryogenic temperature control by means of energy storage materials was also included.

Grodzka, P. G.↗

Miniature Heat Pipes

Small Business Innovation Research contracts from Goddard Space Flight Center to Thermacore Inc. have fostered the company work on devices tagged "heat pipes" for space application. To control the extreme temperature ranges in space, heat pipes are important to spacecraft. The problem was to maintain an 8-watt central processing unit (CPU) at less than 90 C in a notebook computer using no power, with very little space available and without using forced convection. Thermacore's answer was in the design of a powder metal wick that transfers CPU heat from a tightly confined spot to an area near available air flow. The heat pipe technology permits a notebook computer to be operated in any position without loss of performance. Miniature heat pipe technology has successfully been applied, such as in Pentium Processor notebook computers. The company expects its heat pipes to accommodate desktop computers as well. Cellular phones, camcorders, and other hand-held electronics are forsible applications for heat pipes.

Source record↗

Controlled-Temperature Hot-Air Gun

Materials that find applications in wind tunnels first tested in laboratory. Hot-Air Gun differs from commercial units in that flow rate and temperature monitored and controlled. With typical compressed-airsupply pressure of 25 to 38 psi (170 to 260 kPa), flow rate and maximum temperature are 34 stdft3/min (0.96 stdm3/min) and 1,090 degrees F (590 degrees C), respectively. Resembling elaborate but carefully regulated hot-air gun, setup used to apply blasts of air temperatures above 1,500 degrees F (815 degrees C) to test specimens.

Munoz, M. C.↗

Thermal conductance of two interface materials and their applications in space systems

The temperature control of spacecraft and instrument systems and subsystems requires heat transfer interface materials that possess good thermal and structural characteristics, among other properties, to respond to the vacuum environment of space. These materials must be easy to apply to, and remove from, the surfaces where they are applied, and must be able to withstand power dissipation extremes, and be used for different clamping configurations and pressures. Silicone based greases, used in the past, tend to migrate and to contaminate nearby surfaces. Bare metal to metal contact offers low thermal conductance and difficulties in estimating the actual heat transfer. Several polymeric materials containing different thermal conductive compounds and structural reinforcements were prepared to overcome grease and metal problems. Two polymeric materials were evaluated: Cho-Therm 1671 elastomer; and the CV-2946, a conductive RTV silicone. Tests were done to learn more about these products. Results indicate that the tightly bolted, torqued fixtures did not buckle or distort, and provided optimum thermal conductance. Fixtures simulating actual spacecraft configuration suffered bowing and separating.

Scialdone, J. J.↗

Chemical Vapor Deposition Of Silicon Carbide

Large single-crystal SiC boules from which wafers of large area cut now being produced commerically. Availability of wafers opens door for development of SiC semiconductor devices. Recently developed chemical vapor deposition (CVD) process produces thin single-crystal SiC films on SiC wafers. Essential step in sequence of steps used to fabricate semiconductor devices. Further development required for specific devices. Some potential high-temperature applications include sensors and control electronics for advanced turbine engines and automobile engines, power electronics for electromechanical actuators for advanced aircraft and for space power systems, and equipment used in drilling of deep wells. High-frequency applications include communication systems, high-speed computers, and microwave power transistors. High-radiation applications include sensors and controls for nuclear reactors.

Powell, J. Anthony↗

Correction for Self-Heating When Using Thermometers as Heaters in Precision Control Applications

In precision control applications, thermometers have temperature-dependent electrical resistance with germanium or other semiconductor material thermistors, diodes, metal film and wire, or carbon film resistors. Because resistance readout requires excitation current flowing through the sensor, there is always ohmic heating that leads to a temperature difference between the sensing element and the monitored object. In this work, a thermistor can be operated as a thermometer and a heater, simultaneously, by continuously measuring the excitation current and the corresponding voltage. This work involves a method of temperature readout where the temperature offset due to self-heating is subtracted exactly.

Ressler, Michael E.↗

Replacement for a Flex Hose Coating at the Space Shuttle Launch Pad

Aerocoat AR-7 is a coating that has been used to protect stainless steel flex hoses at NASA's Kennedy Space Center launch complex and hydraulic lines of the mobile launch platform (MLP). This coating has great corrosion control performance and low temperature application. AR-7 was developed by NASA and produced exclusively for NASA but its production has been discontinued due to its high content of volatile organic compounds (VOC) and significant environmental impact. The purpose of this project was to select and evaluate candidate coatings to find a replacement coating that is more environmentally friendly, with similar properties to AR-7. No coatings were identified that perform the same as AR-7 in all areas. Candidate coatings failed in comparison to AR-7 in salt fog, beachside atmospheric exposure, pencil hardness, Mandrel bend, chemical compatibility, adhesion, and ease of application tests. However, two coatings were selected for further evaluation.

Whitten, Mary↗

Application of Artificial Neural Network Model for Optimized Control of Condenser Water Temperature Set-Point in a Chilled Water System

Here, in this study, real-time predictive control and optimization model based on an ANN (artificial neural network) was developed to evaluate the cooling energy saving performance of the optimized control of CndWT (condenser water temperature). For this purpose, the difference in TCEC (total cooling energy consumption) between the conventional control strategy when the CndWT produced by the cooling tower is fixed and the optimized control strategy when real-time control of the CndWT through the optimal ANN model is applied was compared and analyzed. For the modeling of the building to be simulated, the co-simulation of EnergyPlus and MATLAB was built through the middleware Building Controls Virtual Test Bed. For the prediction of TCEC, an ANN model was developed through MATLAB's neural network toolbox. The model accuracy of the ANN was examined through Cv(RMSE) index and as a result, Cv(RMSE) of the optimized ANN model turned out to be approximately 25 %. More importantly, the predictive control technique was able to save TCEC by 5.6 % compared to the conventional control method constantly fixing CndWT set-point to 30 °C. These results showed that the CndWT needs to be dynamically controlled using artificial intelligence technique such as ANN model and that significant energy savings were achievable compared to the conventional fixed control.

42 ENGINEERING↗

Performance Evaluation of an Automotive-Grade, High Speed Gate Driver for SiC FETs, Type UCC27531, Over a Wide Temperature Range

Silicon carbide (SiC) devices are becoming widely used in electronic power circuits as replacement for conventional silicon parts due to their attractive properties that include low on-state resistance, high temperature tolerance, and high frequency operation. These attributes have a significant impact by reducing system weight, saving board space, and conserving power. In this work, the performance of an automotive-grade high speed gate driver with potential use in controlling SiC FETs (field-Effect Transistors) in converters or motor control applications was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance and to determine suitability of this device for use in space exploration missions under extreme temperature conditions.

Transistor Gate Drive↗

Development of a Temperature Sensor for Jet Engine and Space Mission Applications

Electronics for Distributed Turbine Engine Control and Space Exploration Missions are expected to encounter extreme temperatures and wide thermal swings. In particular, circuits deployed in a jet engine compartment are likely to be exposed to temperatures well exceeding 150 C. To meet this requirement, efforts exist at the NASA Glenn Research Center (GRC), in support of the Fundamental Aeronautics Program/Subsonic Fixed Wing Project, to develop temperature sensors geared for use in high temperature environments. The sensor and associated circuitry need to be located in the engine compartment under distributed control architecture to simplify system design, improve reliability, and ease signal multiplexing. Several circuits were designed using commercial-off-the-shelf as well as newly-developed components to perform temperature sensing at high temperatures. The temperature-sensing circuits will be described along with the results pertaining to their performance under extreme temperature.

Patterson, Richard L.↗

Silicon carbide, an emerging high temperature semiconductor

In recent years, the aerospace propulsion and space power communities have expressed a growing need for electronic devices that are capable of sustained high temperature operation. Applications for high temperature electronic devices include development instrumentation within engines, engine control, and condition monitoring systems, and power conditioning and control systems for space platforms and satellites. Other earth-based applications include deep-well drilling instrumentation, nuclear reactor instrumentation and control, and automotive sensors. To meet the needs of these applications, the High Temperature Electronics Program at the Lewis Research Center is developing silicon carbide (SiC) as a high temperature semiconductor material. Research is focussed on developing the crystal growth, characterization, and device fabrication technologies necessary to produce a family of silicon carbide electronic devices and integrated sensors. The progress made in developing silicon carbide is presented, and the challenges that lie ahead are discussed.

Matus, Lawrence G.↗

Low temperature fluid blender

Blender supplies hydrogen at temperatures from 289 deg K to 367 deg K. Hydrogen temperature is controlled by using blender to combine flow from liquid hydrogen tank /276 deg K/ and gaseous hydrogen cylinder /550 deg K/. Blenders are applicable where flow of controlled low-temperature fluid is desired.

Repas, G. A.↗

Real-time estimation of the electron temperature profile in DIII-D by leveraging neural-network surrogate models

Control of both the magnitude and the shape of tokamak profiles will be necessary to achieve stable, high-performance plasmas. In order to reject disturbances in real time, feedback-control algorithms rely on accurate real-time knowledge of the plasma state. When diagnostics alone are insufficient, either because they are limited in number or their measurements are too noisy, observers can be used to combine diagnostic data with a response model to provide a better estimation of different plasma properties. An observer has been developed to estimate the electron temperature profile in real time using both diagnostic data from the Thomson scattering system and a model based on the electron heat transport equation describing the evolution of the electron temperature profile. Here, neural network surrogate models are leveraged to help improve the overall model prediction while staying within computation time constraints for real-time use. The observer algorithm is shown in offline tests to produce smooth profiles that are consistent with both the diagnostic data and the electron heat transport equation. When implemented into the real-time plasma control system, this observer will provide valuable information on the electron temperature profile to many potential feedback-control applications.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Review of the physical and mechanical properties and potential applications of the B2 compound NiAl: Unabridged version of a paper published in International materials review

Considerable work has been performed on NiAl over the last three decades, with an extremely rapid growth in research on this intermetallic occurring in the last few years due to recent interest in this material for electronic and high temperature structural applications. However, many physical properties and the controlling fracture and deformation mechanisms over certain temperature regimes are still in question. Part of this problem lies in the incomplete characterization of many of the alloys previously investigated. Fragmentary data on processing conditions, chemistry, microstructure and the apparent difficulty in accurately measuring composition has made direct comparison between individual studies sometimes tenuous. Therefore, the purpose of this review is to summarize all available mechanical and pertinent physical properties on NiAl, stressing the most recent investigations, in an attempt to understand the behavior of NiAl and its alloys over a broad temperature range.

Noebe, Ronald D.↗

Physical and mechanical properties of the B2 compound NiAl

Considerable work has been performed on NiAl over the last three decades, with an extremely rapid growth in research on this intermetallic occurring in the last few years due to recent interest in this material for electronic and high temperature structural applications. However, many physical properties and the controlling fracture and deformation mechanisms over certain temperature regimes are still in question. Part of this problem lies in the incomplete characterization of many of the alloys previously investigated. Fragmentary data on processing conditions, chemistry, microstructure and the apparent difficulty in accurately measuring composition has made direct comparison between individual studies sometimes tenuous. Therefore, the purpose of this review is to summarize all available mechanical and pertinent physical properties on NiAl, stressing the most recent investigations, in an attempt to understand the behavior of NiAl and its alloys over a broad temperature range.

Noebe, R. D.↗

Microelectromechanical System (MEMS) Device Being Developed for Active Cooling and Temperature Control

High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) using a Stirling thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface is being developed at the NASA Glenn Research Center to meet this need. The device can be used strictly in the cooling mode or can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly employ techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces, limited failure modes, and minimal induced vibration. The MEMS cooler has potential applications across a broad range of industries such as the biomedical, computer, automotive, and aerospace industries. The basic capabilities it provides can be categorized into four key areas: 1) Extended environmental temperature range in harsh environments; 2) Lower operating temperatures for electronics and other components; 3) Precision spatial and temporal thermal control for temperature-sensitive devices; and 4) The enabling of microsystem devices that require active cooling and/or temperature control. The rapidly expanding capabilities of semiconductor processing in general, and microsystems packaging in particular, present a new opportunity to extend Stirling-cycle cooling to the MEMS domain. The comparatively high capacity and efficiency possible with a MEMS Stirling cooler provides a level of active cooling that is impossible at the microscale with current state-of-the-art techniques. The MEMS cooler technology builds on decades of research at Glenn on Stirling-cycle machines, and capitalizes on Glenn s emerging microsystems capabilities.

Beach, Duane E.↗

Testing of the Geoscience Laser Altimeter System (GLAS) Prototype Loop Heat Pipe

This paper describes the testing of the prototype loop heat pipe (LHP) for the Geoscience Laser Altimeter System (GLAS). The primary objective of the test program was to verify the loop's heat transport and temperature control capabilities under conditions pertinent to GLAS applications. Specifically, the LHP had to demonstrate a heat transport capability of 100 W, with the operating temperature maintained within +/-2K while the condenser sink was subjected to a temperature change between 273K and 283K. Test results showed that this loop heat pipe was more than capable of transporting the required heat load and that the operating temperature could be maintained within +/-2K. However, this particular integrated evaporator-compensation chamber design resulted in an exchange of energy between the two that affected the overall operation of the system. One effect was the high temperature the LHP was required to reach before nucleation would begin due to inability to control liquid distribution during ground testing. Another effect was that the loop had a low power start-up limitation of approximately 25 W. These Issues may be a concern for other applications, although it is not expected that they will cause problems for GLAS under micro-gravity conditions.

Douglas, Donya↗