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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS1989

High-Temperature Strain-And-Temperature Gauge

Two-element gauge used alternately in two different bridge circuits to measure both temperature and strain. Three-lead strain-and-temperature gauge developed for use at temperatures up to 750 degree F (390 degree C) on fiber-reinforced carbon/carbon composite material having coefficient of thermal expansion of 0.8 ppm/degree F. Unlike most temperature-compensated gauges, gauge gives accurate results even during rapid heating and cooling cycles. Similar gauges produced for materials with different coefficients of thermal expansion.

Wnuk, S. P.↗
NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗
DOE OSTI2021

A Practical Analysis Framework for Assessment of Printed Circuit Heat Exchangers in High-Temperature Nuclear Service

Abstract Printed circuit heat exchangers (PCHEs) have high thermal efficiency because of the numerous minuscule channels. These minuscule channels result in a high thermal exchange area per unit volume, making PCHE a top contender for an intermediate heat exchanger (IHX) in high-temperature reactors. Thousands of minuscule channels make finite element analysis of the PCHE computationally infeasible. A two-dimensional analysis is usually performed for the PCHE core, which cannot simulate the local channel level responses reasonably because of the absence of global constraint influence. At present, there is no analysis technique available in the ASME Code or literature that is computationally efficient and suitable for engineers to estimate PCHE local responses. A novel but practical two-step analysis framework is proposed for performing PCHE analysis. In the first step, the channeled core is replaced by orthotropic solids with similar stiffness to simulate the global thermomechanical elastic responses of the PCHE. In the second step, local submodel analysis with detailed channel geometry and loading is performed using the elastic-perfectly plastic (EPP) material model. The proposed two-step analysis technique provides a unique capability to estimate the channel corner responses to be used for PCHE performance assessment. This study first developed a methodology for calculating the elastic orthotropic properties of the PCHE core. Next, the two-step analysis is performed for a realistic size PCHE core, and different issues observed in the results are scrutinized and resolved. Finally, a practical finite element analysis framework for PCHEs in high-temperature nuclear service is recommended.

Engineering↗
NASA NTRS1987

The dual element method of strain gauge temperature compensation

The use of a known temperature compensation technique is suggested to reduce the overall temperature sensitivity of a PdCr strain gauge system being developed for turbine engine research. The temperature compensation technique proposed for this application uses a resistance thermometer in an adjacent leg of the strain gauge bridge circuit to cancel the thermally generated resistance change of the strain gauge. Equations for calculating the required compensation resistor values and the sensitivity of the resulting strain gauge bridge to both temperature and strain are presented.

Englund, David R.↗
NASA NTRS1985

Optical Mounts for Cryogenic Beam Splitters

Spring-loaded optical mounts maintain flatness and alinement of rigid, framed, or pellicle beam splitters over wide temperature range, despite differences in thermal expansion amoung materials. Mounts permit optical adjustments at ambient temperature even though optical system operated subsequently within few degrees of absolute zero. Mounts useful as holders for integrated-circuit master patterns, survey targets, vibrating membranes, noise- or pressure-sensing membranes, osmosis filters, and fuel-cell elements.

Rudman, A. A.↗
NASA NTRS2005

Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

Ngo, Quoc↗
NASA NTRS1943

A Hot-wire Circuit with Very Small Time Lag

A circuit for a hot-wire anemometer for the measurement of fluctuating flow is presented in the present report. The principal elements of the circuit are a Wheatstone bridge, one branch of which is the hot wire; and an electronic amplifier and a current regulator for the brief current which in combination maintain the bridge balance constant. Hence the hot wire is kept at practically constant resistance and temperature, and the time lag caused by thermal inertia of the wire is thereby reduced. Through the addition of a nonlinear amplifying stage the reading of the instrument has been rendered proportional to the velocity. A discussion of certain characteristics of the circuit and the results of related calibrating tests are given.

Weske, John R↗
NASA NTRS1999

Rotary Motors Actuated by Traveling Ultrasonic Flexural Waves

Efficient miniature actuators that are compact and consume low power are needed to drive space and planetary mechanisms in future NASA missions. Ultrasonic rotary motors have the potential to meet this NASA need and they are developed as actuators for miniature telerobotic applications. These motors have emerged in commercial products but they need to be adapted for operation at the harsh space environments that include cryogenic temperatures and vacuum and also require effective analytical tools for the design of efficient motors. A finite element analytical model was developed to examine the excitation of flexural plate wave traveling in a piezoelectrically actuated rotary motor. The model uses 3D finite element and equivalent circuit models that are applied to predict the excitation frequency and modal response of the stator. This model incorporates the details of the stator including the teeth, piezoelectric ceramic, geometry, bonding layer, etc. The theoretical predictions were corroborated experimentally for the stator. In parallel, efforts have been made to determine the thermal and vacuum performance of these motors. Experiments have shown that the motor can sustain at least 230 temperature cycles from 0 C to -90 C at 7 Torr pressure significant performance change. Also, in an earlier study the motor lasted over 334 hours at -150 C and vacuum. To explore telerobotic applications for USMs a robotic arm was constructed with such motors.

Bar-Cohen, Yoseph↗
NASA NTRS1980

Solar cell array design handbook - The principles and technology of photovoltaic energy conversion

Photovoltaic solar cell array design and technology for ground-based and space applications are discussed from the user's point of view. Solar array systems are described, with attention given to array concepts, historical development, applications and performance, and the analysis of array characteristics, circuits, components, performance and reliability is examined. Aspects of solar cell array design considered include the design process, photovoltaic system and detailed array design, and the design of array thermal, radiation shielding and electromagnetic components. Attention is then given to the characteristics and design of the separate components of solar arrays, including the solar cells, optical elements and mechanical elements, and the fabrication, testing, environmental conditions and effects and material properties of arrays and their components are discussed.

Rauschenbach, H. S.↗
DOE OSTI2020

Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications

Solid State Circuit Breakers (SSCBs) are an attractive protection solution for their arcless current interruption and fast actuation speeds over mechanical breakers. This paper proposes a Bidirectional SSCB (BSSCB) with a thermally defined and digitally controlled current time profile for fault protection in EV and other low-voltage DC systems. The paper proposes an organic packaging approach utilizing flex circuitry to develop a reliable, cost-effective power module for BSSCBs. The paper studies transient heat transfer in the power modules using finite element analysis (FEA). An RC themal ladder network is extracted to define a fusing curve. To demonstrate and verify the design, a 1kV/50 A SiC MOSFET BSSCB prototype is fabricated and tested, having a power density of 60 W/cm3 and 4x reduction in form factor over presently researched breakers. Also, given are results for 750 V/150 A operation showing interruption in 2.4 μs.

organic power packaging↗
DOE OSTI2022

Effective Field Theory of Random Quantum Circuits

Quantum circuits have been widely used as a platform to simulate generic quantum many-body systems. In particular, random quantum circuits provide a means to probe universal features of many-body quantum chaos and ergodicity. Some such features have already been experimentally demonstrated in noisy intermediate-scale quantum (NISQ) devices. On the theory side, properties of random quantum circuits have been studied on a case-by-case basis and for certain specific systems, and a hallmark of quantum chaos—universal Wigner–Dyson level statistics—has been derived. This work develops an effective field theory for a large class of random quantum circuits. The theory has the form of a replica sigma model and is similar to the low-energy approach to diffusion in disordered systems. The method is used to explicitly derive the universal random matrix behavior of a large family of random circuits. In particular, we rederive the Wigner–Dyson spectral statistics of the brickwork circuit model by Chan, De Luca, and Chalker [Phys. Rev. X 8, 041019 (2018)] and show within the same calculation that its various permutations and higher-dimensional generalizations preserve the universal level statistics. Finally, we use the replica sigma model framework to rederive the Weingarten calculus, which is a method of evaluating integrals of polynomials of matrix elements with respect to the Haar measure over compact groups and has many applications in the study of quantum circuits. The effective field theory derived here provides both a method to quantitatively characterize the quantum dynamics of random Floquet systems (e.g., calculating operator and entanglement spreading) and a path to understanding the general fundamental mechanism behind quantum chaos and thermalization in these systems.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2025

Superconducting coherence peak in near-field radiative heat transfer

Enhancement and peaks in near-field radiative heat transfer (NFRHT) typically arise due to surface phonon-polaritons, plasmon-polaritons, and electromagnetic (EM) modes in structured materials. However, the role of material quantum coherence in enhancing near-field radiative heat transfer remains unexplored. Here, we unravel that NFRHT in superconductor-ferromagnetic systems displays a unique peak at the superconducting phase transition that originates from the quantum coherence of Bogoliubov quasiparticles in superconductors. Our theory takes into account evanescent EM radiation emanating from fluctuating currents related to Cooper pairs and Bogoliubov quasiparticles in stark contrast to the current-current correlations induced by free electrons in conventional materials. Our proposed NFRHT configuration exploits ferromagnetic resonance at frequencies deep inside the superconducting band gap to isolate this superconducting coherence peak. Furthermore, we reveal that Cooper pairs and Bogoliubov quasiparticles have opposite effects on near-field thermal radiation and isolate their effects on many-body radiative heat transfer near superconductors. As a result, our proposed phenomenon can have applications for developing thermal isolators and heat sinks in superconducting circuits.

Dipole approximation↗
DOE OSTI2025

Parameter extraction for a SPICE model of an hTron superconducting thermal switch

Efficiently simulating large circuits is crucial to the development of superconducting nanowire-based electronics. However, current simulation tools for this technology are not adapted to the scaling of circuit size and complexity. We focus on the multilayered heater-nanocryotron (hTron), a promising superconducting nanowire-based switch used in applications such as superconducting nanowire single-photon detector readout. Previously, the hTron was modeled using traditional finite-element methods, which fall short in simulating systems at a larger scale. An empirical-based method would be better adapted to this task, enhancing both simulation speed and agreement with experimental data. In this work, we perform switching current and activation delay measurements on 17 hTron devices. We then develop a method for extracting physical fitting parameters used to characterize the devices. We build a SPICE behavioral model that reproduces the static and transient device behavior using these parameters, and validate it by comparing its performance to a model developed in prior work, showing an improvement in simulation time by several orders of magnitude. Furthermore, our model provides circuit designers with a tool to help understand the hTron’s behavior during all design stages, thus enabling broader use of the hTron across various new areas of application.

Caloritronics↗
NASA NTRS1992

Quartz/fused silica chip carriers

The primary objective of this research and development effort was to develop monolithic microwave integrated circuit (MMIC) packaging which will operate efficiently at millimeter-wave frequencies. The packages incorporated fused silica as the substrate material which was selected due to its favorable electrical properties and potential performance improvement over more conventional materials for Ka-band operation. The first step towards meeting this objective is to develop a package that meets standard mechanical and thermal requirements using fused silica and to be compatible with semiconductor devices operating up to at least 44 GHz. The second step is to modify the package design and add multilayer and multicavity capacity to allow for application specific integrated circuits (ASIC's) to control multiple phase shifters. The final step is to adapt the package design to a phased array module with integral radiating elements. The first task was a continuation of the SBIR Phase 1 work. Phase 1 identified fused silica as a viable substrate material by demonstrating various plating, machining, and adhesion properties. In Phase 2 Task 1, a package was designed and fabricated to validate these findings. Task 2 was to take the next step in packaging and fabricate a multilayer, multichip module (MCM). This package is the predecessor to the phased array module and demonstrates the ability to via fill, circuit print, laminate, and to form vertical interconnects. The final task was to build a phased array module. The radiating elements were to be incorporated into the package instead of connecting to it with wire or ribbon bonds.

Source record↗
NASA NTRS1994

Overview of space power electronic's technology under the CSTI High Capacity Power Program

The Civilian Space Technology Initiative (CSTI) is a NASA Program targeted at the development of specific technologies in the areas of transportation, operations and science. Each of these three areas consists of major elements and one of the operation's elements is the High Capacity Power element. The goal of this element is to develop the technology base needed to meet the long duration, high capacity power requirements for future NASA initiatives. The High Capacity Power element is broken down into several subelements that includes energy conversion in the areas of the free piston Stirling power converter and thermoelectrics, thermal management, power management, system diagnostics, and environmental compatibility and system's lifetime. A recent overview of the CSTI High capacity Power element and a description of each of the program's subelements is given by Winter (1989). The goals of the Power Management subelement are twofold. The first is to develop, test, and demonstrate high temperature, radiation-resistant power and control components and circuits that will be needed in the Power Conditioning, Control and Transmission (PCCT) subsystem of a space nuclear power system. The results obtained under this goal will also be applicable to the instrumentation and control subsystem of a space nuclear reactor. These components and circuits must perform reliably for lifetimes of 7-10 years. The second goal is to develop analytical models for use in computer simulations of candidate PCCT subsystems. Circuits which will be required for a specific PCCT subsystem will be designed and built to demonstrate their performance and, also, to validate the analytical models and simulations. The tasks under the Power Management subelement will now be described in terms of objectives, approach and present status of work.

Schwarze, Gene E.↗
NASA NTRS1980

Study program to improve the open-circuit voltage of low resistivity single crystal silicon solar cells

The results of a 14 month program to improve the open circuit voltage of low resistivity silicon solar cells are described. The approach was based on ion implantation in 0.1- to 10.0-ohm-cm float-zone silicon. As a result of the contract effort, open circuit voltages as high as 645 mV (AMO 25 C) were attained by high dose phosphorus implantation followed by furnace annealing and simultaneous SiO2 growth. One key element was to investigate the effects of bandgap narrowing caused by high doping concentrations in the junction layer. Considerable effort was applied to optimization of implant parameters, selection of furnace annealing techniques, and utilization of pulsed electron beam annealing to minimize thermal process-induced defects in the completed solar cells.

Minnucci, J. A.↗
NASA NTRS2004

Calibration, Data Acquisition, and Post Analysis of Turbulent Fluid Flow in a Calibration Jet Using Hot-wire Anemometry

The Turbine Branch concentrates on the following areas: Computational Fluid Dynamics (CFD), and implementing experimental procedures to obtain physical modeling data. Hot-wire Anemometry is a valuable tool for obtaining physical modeling data. Hot-wire Anemometry is likely to remain the principal research tool for most turbulent air/gas flow studies. The Hot-wire anemometer consists of a fine wire heated by electric current. When placed in a fluid stream, the hot-wire loses heat to the fluid by forced convection. In forced convection, energy transfer is due to molecular motion imposed by an extraneous force moving fluid parcels. When the hot-wire is in "equilibrium", the rate of heat input to the wire is equal to the rate of heat loss at the wire ends. The equality between heat input and heat loss is the basis for King s equation, which relates the electrical parameters of the hot-wire to the flow parameters of the fluid. Hot-wire anemometry is based on convective heat transfer from a heated wire element placed in a fluid flow. Any change in the fluid flow condition that affects the heat transfer from the heated element will be detected virtually instantaneously by a constant-temperature Hot-wire anemometry system. The system implemented for this research is the IFA 300. The system is a fully-integrated, thermal anemometer-based system that measures mean and fluctuating velocity components in air, water, and other fluids. It also measures turbulence and makes localized temperature measurements. A constant-temperature anemometer is a bridge and amplifier circuit that controls a tiny wire at constant temperature. As a fluid flow passes over the heated sensor, the amplifier senses the bridge off-balance and adjusts the voltage to the top of the bridge, keeping the bridge in balance. The voltage on top of the bridge can then be related to the velocity of the flow. The bridge voltage is sensitive to temperature as well as velocity and so the built-in thermocouple circuit can be attached to a thermocouple that can measure the fluid temperature. Additional information is included in the original extended abstract.

Moreno, Michelle↗
NASA NTRS2010

Self-Validating Thermocouple

Self-Validating Thermocouple (SVT) Systems capable of detecting sensor probe open circuits, short circuits, and unnoticeable faults such as a probe debonding and probe degradation are useful in the measurement of temperatures. SVT Systems provide such capabilities by incorporating a heating or excitation element into the measuring junction of the thermocouple. By heating the measuring junction and observing the decay time for the detected DC voltage signal, it is possible to indicate whether the thermocouple is bonded or debonded. A change in the thermal transfer function of the thermocouple system causes a change in the rise and decay times of the thermocouple output. Incorporation of the excitation element does not interfere with normal thermocouple operation, thus further allowing traditional validation procedures as well.

Perotti, Jose M.↗