Results for “thermal compression bonding” — Page 3

NASA NTRS1997

A Model of the THUNDER Actuator

A THUNDER actuator is a composite of three thin layers, a metal base, a piezoelectric wafer and a metal top cover, bonded together under pressure and at high temperature with the LaRC SI polyimid adhesive. When a voltage is applied between the metal layers across the PZT the actuator will bend and can generate a force. This document develops and describes an analytical model the transduction properties of THUNDER actuators. The model development is divided into three sections. First, a static model is described that relates internal stresses and strains and external displacements to the thermal pre-stress and applied voltage. Second, a dynamic energy based model is described that allows calculation of the resonance frequencies, developed force and electrical input impedance. Finally, a fully coupled electro-mechanical transducer model is described. The model development proceeds by assuming that both the thermal pre-stress and the piezoelectric actuation cause the actuator to deform in a pure bend in a single plane. It is useful to think of this as a two step process, the actuator is held flat, differential stresses induce a bending moment, the actuator is released and it bends. The thermal pre-stress is caused by the different amounts that the constituent layers shrink due to their different coefficients of thermal expansion. The adhesive between layers sets at a high temperature and as the actuator cools, the metal layers shrink more than the PZT. The PZT layer is put into compression while the metal layers are in tension. The piezoelectric actuation has a similar effect. An applied voltage causes the PZT layer to strain, which in turn strains the two metal layers. If the PZT layer expands it will put the metal layers into tension and PZT layer into compression. In both cases, if shear force effects are neglected, the actuator assembly will experience a uniform in-plane strain. As the materials each have a different elastic modulus, different stresses will develop in each layer and these stresses will induce a bending moment. When the actuator is released from its flat configuration, the differential stresses are relieved as the actuator bends.

Curtis, Alan R. D.↗

NASA NTRS2018

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Electric aircrafts↗

NASA NTRS2018

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Multifunctional↗

NASA NTRS2004

Epoxy Adhesives for Stator Magnet Assembly in Stirling Radioisotope Generators (SRG)

As NASA seeks to fulfill its goals of exploration and understanding through missions planned to visit the moons of Saturn and beyond, a number of challenges arise from the idea of deep space flight. One of the first problems associated with deep space travel is electrical power production for systems on the spacecraft. Conventional methods such as solar power are not practical because efficiency decreases substantially as the craft moves away from the Sun. The criterion for power generation during deep space missions are very specific, the main points requiring high reliability, low mass, minimal vibration and a long lifespan. A Stirling generator, although fairly old in concept, is considered to be a potential solution for electrical power generation for deep space flight. A Stirling generator works on the same electromagnetic principles of a standard generator, using the linear motion of the alternator through the stationary stator which produces electric induction. The motion of the alternator, however, is produced by the heating and cooling dynamics of pressurized gases. Essentially heating one end and cooling another of a contained gas will cause a periodic expansion and compression of the gas from one side to the other, which a displacer translates into linear mechanical motion. NASA needs to confirm that the materials used in the generator will be able to withstand the rigors of space and the life expectancy of the mission. I am working on the verification of the epoxy adhesives used to bond magnets to the steel lamination stack to complete the stator; in terms of in-service performance and durability under various space environments. Understanding the proper curing conditions, high temperature properties, and degassing problems as well as production difficulties are crucial to the long term success of the generator. system and steel substrate used in the stator. To optimize the curing conditions of the epoxies, modulated differential scanning calorimetry analysis was done as a function of cure time and temperatures. Adhesion bond strength was tested at various temperatures with lap shear samples using Hiperco 50 substrate to ensure that the proper adhesive is being used. To try and solve the problem of bondline thickness, micro glass beads of 0.0017" in diameter were investigated to see if any other physical properties of the epoxy were affected. Efforts will be made to develop a standard, optimized, fabrication process/procedure of sub-scale magnet-stator assemblies for various adhesive performance evaluation studies under simulated generator conditions. Also, accelerated aging testing will be done in a pressurized canister with stator assembly samples for three years to verify if any degassing or thermal degradation of the epoxy occurs. The necessity of verifying the correct epoxy adhesive system for the stator magnet in the SRG is crucial because failure of the stator assembly would jeopardize the electrical system, and thereby the entire mission itself. My work involves specimen fabrications, testing, and data analyses of the epoxy adhesive system for the stator magnet in the SRG is crucial because failure of the stator assembly would jeopardize the electrical system, and thereby the entire mission itself.

Cater, George M.↗

NASA NTRS1996

RAINBOWS and CERAMBOWS: The Technologies of Pre-Stressed Piezo Actuators

Amplified mechanical displacement effects, similar to those observed in the recently reported Rainbow actuators, have also been found to exist in prestressed ceramic/metal composite structures coined as CERAMBOW's - an acronym for CERamic And Metal Biased Oxide Wafer. Mimicking the Rainbows in many ways, the intentionally created internal compressive and tensile stresses within the Cerambows are used to amplify their displacement properties via the combined effects of piezoelectric d31 strain and domain reorientation. They are fabricated from ferroelectric, piezoelectric or electrostrictive materials and metal substrates of significantly different thermal expansions which are largely responsible for the creation of the stress. Typical ceramics used in Cerambows are PZT, PLZT, PBZT, PSZT and PMN and some typical metal substrates are Al, Ag, Ni, brass, steel and Be/Cu foil. Shapes can vary from round disks to square plates and rectangular bars. Formed at an elevated temperature of approximately 250 C, the stresses on cooling to room temperature are generally sufficient to produce displacements as large as 0.125mm (5 mils) when activated unipolar and 0.25mm (10 mils) when operated bipolar at 450 volts in a dome mode. Comparing equal structures of a Cerambow with a Rainbow, the Cerambow was found to achieve approximately 70% of the displacement that would normally be obtained with a Rainbow. Although this difference in displacement is sufficient to prefer a Rainbow for many applications, there are some advantages for the Cerambow. Among these are (1) the processing temperatures are lower, (2) high lead-containing ceramics are not required and (3) in some instances the metal substrate is more convenient to interface with other elements of a device. However, the disadvantages include (1) lower displacement in the dome mode of operation, (2) the higher displacement saddle mode has not yet been demonstrated with a Cerambow and (3) the ceramic/metal bond interface is a possible failure area when operated for extended periods of time. The applications for Cerambows are considered to be similar to Rainbows, i.e., actuators, pumps, deflectors, vibrators, speakers, hydrophones, hydroprojectors, switches, etc.

Haertling, Gene H.↗

NASA NTRS2009

NASA Tech Briefs, December 2009

Topics include: A Deep Space Network Portable Radio Science Receiver; Detecting Phase Boundaries in Hard-Sphere Suspensions; Low-Complexity Lossless and Near-Lossless Data Compression Technique for Multispectral Imagery; Very-Long-Distance Remote Hearing and Vibrometry; Using GPS to Detect Imminent Tsunamis; Stream Flow Prediction by Remote Sensing and Genetic Programming; Pilotless Frame Synchronization Using LDPC Code Constraints; Radiometer on a Chip; Measuring Luminescence Lifetime With Help of a DSP; Modulation Based on Probability Density Functions; Ku Telemetry Modulator for Suborbital Vehicles; Photonic Links for High-Performance Arraying of Antennas; Reconfigurable, Bi-Directional Flexfet Level Shifter for Low-Power, Rad-Hard Integration; Hardware-Efficient Monitoring of I/O Signals; Video System for Viewing From a Remote or Windowless Cockpit; Spacesuit Data Display and Management System; IEEE 1394 Hub With Fault Containment; Compact, Miniature MMIC Receiver Modules for an MMIC Array Spectrograph; Waveguide Transition for Submillimeter-Wave MMICs; Magnetic-Field-Tunable Superconducting Rectifier; Bonded Invar Clip Removal Using Foil Heaters; Fabricating Radial Groove Gratings Using Projection Photolithography; Gratings Fabricated on Flat Surfaces and Reproduced on Non-Flat Substrates; Method for Measuring the Volume-Scattering Function of Water; Method of Heating a Foam-Based Catalyst Bed; Small Deflection Energy Analyzer for Energy and Angular Distributions; Polymeric Bladder for Storing Liquid Oxygen; Pyrotechnic Simulator/Stray-Voltage Detector; Inventions Utilizing Microfluidics and Colloidal Particles; RuO2 Thermometer for Ultra-Low Temperatures; Ultra-Compact, High-Resolution LADAR System for 3D Imaging; Dual-Channel Multi-Purpose Telescope; Objective Lens Optimized for Wavefront Delivery, Pupil Imaging, and Pupil Ghosting; CMOS Camera Array With Onboard Memory; Quickly Approximating the Distance Between Two Objects; Processing Images of Craters for Spacecraft Navigation; Adaptive Morphological Feature-Based Object Classifier for a Color Imaging System; Rover Slip Validation and Prediction Algorithm; Safety and Quality Training Simulator; Supply-Chain Optimization Template; Algorithm for Computing Particle/Surface Interactions; Cryogenic Pupil Alignment Test Architecture for Aberrated Pupil Images; and Thermal Transport Model for Heat Sink Design.

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