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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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42 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS2010

System on a Chip (SoC) Overview

System-on-a-chip or system on chip (SoC or SOC) refers to integrating all components of a computer or other electronic system into a single integrated circuit (chip). It may contain digital, analog, mixed-signal, and often radio-frequency functions all on a single chip substrate. Complexity drives it all: Radiation tolerance and testability are challenges for fault isolation, propagation, and validation. Bigger single silicon die than flown before and technology is scaling below 90nm (new qual methods). Packages have changed and are bigger and more difficult to inspect, test, and understand. Add in embedded passives. Material interfaces are more complex (underfills, processing). New rules for board layouts. Mechanical and thermal designs, etc.

LaBel, Kenneth A.↗
NASA NTRS2017

Applications of Fracture Mechanics to Quantitative Accelerated Life Testing of Plastic Encapsulated Microelectronics

Accelerated testing must address the failure mechanisms active within the devices undergoing tests in order to assess lifetimes in a meaningful way. The assumption of constant temperature, thermally activated lifetime, based upon the Arrhenius assumptions, does not always provide the necessary understanding to interpret accelerated tests in microelectronics. Plastic encapsulants, dielectric polymers, and underfill materials are subject to delamination and cracking with thermal cycling. Crack propagation during use environment exposure, drives the potential for failure of microelectronic devices and is therefore a necessary focal point in qualification and life testing. This paper reviews the available research in the application of fracture mechanics to this class of problems in microelectronics including relevant test data. In addition, useful acceleration factor models are derived for polymer crack propagation based on principles of linear elastic fracture mechanics. Further, a simple approach to estimating the minimum temperature cycling ranges, necessary to propagate a crack, is also presented. Finally, a methodology of applying acceleration factors to develop testing plans is shown, with an example in spaceflight for a cubesat in low Earth orbit. Overall, this is a paper that shows a useful and appropriate process for creating physics of failure based life testing for delamination and cracking failures in microelectronic polymers in a temperature cycling environment.

Accelerated testing↗
NASA NTRS2021

Derivation of the final OSIRIS-REx OVIRS in-flight radiometric calibration

The OSIRIS-REx Visible and InfraRed Spectrometer (OVIRS) operates over the ∼0.4- to 4.3-μm wavelength range. Radiometric calibration over this broad range requires the use of multiple calibration sources. Initial OVIRS in-flight calibration coefficients were previously computed using ground calibration from visible integrating sphere and IR blackbody sources, cross-calibrated with Earth-observing satellites for visible wavelengths, and adjusted using the spectrum of the OSIRIS-REx mission’s target body, asteroid (101955) Bennu. As part of the final in-flight calibration, we determined that the best calibration method removes out-of-band IR signal leakage prior to radiometric calibration and updated the calibration coefficients accordingly. These final calibration coefficients work well for data where the field of view is filled, and we document the possible artifacts in underfilled spots.

Amy A. Simon↗
DOE OSTI2024

Radiopaque particle processing additive

A radiopaque processing medium comprising a plurality of radiopaque particles and a non-radiopaque processing medium. The plurality of radiopaque particles is added to the non-radiopaque processing medium to increase a bulk density of the processing medium thereby forming the radiopaque processing medium. The radiopaque processing medium allows excess process media to be located and characterized during X-ray inspection of an electronic device on which the radiopaque processing medium was used. The radiopaque processing medium may also be used to locate and identify flaws/defects of the electronic device based on the location of excess radiopaque processing medium. The radiopaque processing medium may also be used as an underfill material to reinforce electronic chips soldered to the electronic device.

Diamond, Louis↗
DOE OSTI2025

Phenomena Identification and Ranking Table (PIRT) for Heat Pipes

This Phenomena Identification and Ranking Table (PIRT) report provides an evaluation of key phenomena affecting the performance and operational regimes of heat pipes, particularly in the context of heat pipe microreactors (HPMRs). Heat pipes are advanced passive thermal management devices that utilize phase change and capillary action to achieve efficient heat transfer. However, due to the complexity of the phenomena coupled in the heat pipe, including phase change, turbulent transition, and compressibility effects, among others, there is high uncertainty in identifying and ranking the important phenomena affecting the operation of heat pipes and the current knowledge for their modeling and simulation and experimental measurements and instrumentation. This PIRT exercise, conducted as a collaborative effort involving the Department of Energy (DOE) Microreactor Program (MRP), the Nuclear Regulatory Commission (NRC), and university partners systematically identifies, reviews, and prioritizes critical phenomena affecting the operation of heat pipes based on their importance and knowledge levels. The report analyzes phenomena with high importance and low knowledge, such as wick de-wetting, critical heat flux, contact angles, and pressure dynamics, discussing challenges and future research directions for improving their modeling and simulation and experimental measurements. Additionally, the report addresses phenomena with low knowledge that could impact heat pipe operation during non-normal or transient operation, including frozen startup, laminar to turbulent transition, geysering, wick priming, underfilling conditions, surface roughness of the wick, NCGs trapped in the wick, and the timescales of startup and shutdown. This comprehensive evaluation serves as a valuable resource for guiding future research and development efforts, supporting the successful integration of heat pipes into critical applications such as nuclear reactors, and contributing to the advancement of heat pipe technologies in safety-critical industries.

21 - SPECIFIC NUCLEAR REACTORS AND ASSOCIATED PLAN↗
DOE OSTI2025

Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science

This Perspective builds upon insights from the National Institute of Standards and Technology (NIST)-organized workshop, “Materials and Metrology Needs for Advanced Semiconductor Packaging Strategies,” held at the 35th annual Electronics Packaging Symposium in Binghamton, NY, on September 5, 2024. It outlines critical challenges and opportunities related to polymer-based “soft” materials in advanced semiconductor packaging, with emphasis on polymer science, measurement science (metrology), and the strategic development of Research-Grade Test Materials (RGTMs). These efforts, led by the NIST CHIPS team, aim to advance the fundamental understanding of structure-property-processing relationships, promote standardized guidelines and innovative methods for material characterization, and accelerate the development, qualification, and adoption of next-generation packaging materials. The Perspective also distills key insights from the panel discussion with industry experts, emphasizing the need for close collaboration among materials scientists, process engineers, and metrology experts to enable a holistic strategy, further highlighting the importance of cross-sector partnerships among industry, academia, and government to address pressing challenges in packaging materials and processes.

97 MATHEMATICS AND COMPUTING↗