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At least 559 records · Page 31

Wafer-scale waveguide sidewall roughness scattering loss characterization by image processing

Photonic integrated circuits (PICs) are vital for developing affordable, high-performance optoelectronic devices that can be manufactured at an industrial scale, driving innovation and efficiency in various applications. Optical loss of modes in thin film waveguides and devices is a critical measure of their performance. Thin film growth, lithography, masking, and etching processes are imperfect processes that introduce significant sidewall and top-surface roughness and cause dominating optical losses in waveguides and photonic structures. This roughness, as perturbations couple light from guided to far-field radiation modes, leads to scattering losses that can be estimated from theoretical models. Typically, with UV-based lithography, sidewall roughness is significantly larger than wafer-top surface roughness. Atomic force microscopy (AFM) imaging measurement gives a 3D and high-resolution roughness profile, but the measurement is inconvenient, costly, and unscalable for large-scale PICs and at wafer-scale. Here, we evaluate the sidewall roughness profile based on 2D high-resolution scanning electron microscope (SEM) imaging. We characterized the loss on two homemade nitride and oxide films on 3-inch silicon wafers with 12 waveguide devices on each and correlated the scattering loss estimated from a 2D image-based sidewall profile and theoretical Payne model. The lowest loss of guided fundamental transverse electric (TE 0 ) mode is found at 0.075 dB/cm at 633 nm across 24 devices, a record at visible wavelength. Our work shows 100% success (edge continuity span exceeding 95% of image width/height) in edge detection in image processing of all images to estimate autocorrelation function and optical mode loss. These demonstrations offer valuable insights into waveguide sidewall roughness and a comparison of experimental and 2D SEM image processing based loss estimations with applications in loss characterization at wafer-scale PICs.

Khurana, Mohit (ORCID:0000000207898672)↗

A Survey of Applications and Research in Integrated Design Systems Technology

The initial part of the study was begun with a combination of literature searches, World Wide Web searches, and contacts with individuals and companies who were known to members of our team to have an interest in topics that seemed to be related to our study. There is a long list of such topics, such as concurrent engineering, design for manufacture, life-cycle engineering, systems engineering, systems integration, systems design, design systems, integrated product and process approaches, enterprise integration, integrated product realization, and similar terms. These all capture, at least in part, the flavor of what we describe here as integrated design systems. An inhibiting factor in this inquiry was the absence of agreed terminology for the study of integrated design systems. It is common for the term to be applied to what are essentially augmented Computer-Aided Design (CAD) systems, which are integrated only to the extent that agreements have been reached to attach proprietary extensions to proprietary CAD programs. It is also common for some to use the term integrated design systems to mean a system that applies only, or mainly, to the design phase of a product life cycle. It is likewise common for many of the terms listed earlier to be used as synonyms for integrated design systems. We tried to avoid this ambiguity by adopting the definition of integrated design systems that is implied in the introductory notes that we provided to our contacts, cited earlier. We thus arrived at this definition: Integrated Design Systems refers to the integration of the different tools and processes that comprise the engineering, of complex systems. It takes a broad view of the engineering of systems, to include consideration of the entire product realization process and the product life cycle. An important aspect of integrated design systems is the extent to which they integrate existing, "islands of automation" into a comprehensive design and product realization environment. As the study progressed, we relied increasingly upon a networking approach to lead us to new information. The departure point for such searches often was a government-sponsored project or a company initiative. The advantage of this approach was that short conversations with knowledgeable persons would usually cut through confusion over differences of terminology, thereby somewhat reducing the search space of the study. Even so, it was not until late in our eight-month inquiry that we began to see signs of convergence of the search, in the sense that a number of the latest inquiries began to turn up references to earlier contacts. As suggested above, this convergence often occurred with respect to particular government or company projects.

Source record↗

Computational Materials Techniques for Thermal Protection Solutions: Materials and Process Design

Integrated computational materials techniques that span the atomistic and continuum scales have the potential to aid the design and manufacturing of thermal protection materials. Two cases demonstrating the practical application of these methods are discussed. Case one examines the selection of a high temperature coating for carbon/carbon, with the target application being a solar thermal propulsion heat exchanger. The performance of various refractory metal and metal-carbide coatings is characterized considering extreme thermal (3500 K) and chemical (hydrogen flows) conditions. The recession rate, hydrogen leakage, and likelihood of mechanical failure are characterized and provide directions for further experimental investigation. Case two examines the process optimization of a heat shield material composed of a woven silica fiber preform and cyanate ester resin. Frequently, internal voids were found to be present in this composite after the resin infusion and curing stages of manufacturing. Using the manufacturing conditions, computations indicate that both water adsorption and resin cure shrinkage are contributing factors to void formation. The results suggest an alternative process configuration for curing that would mitigate voids.

thermal protection↗

Computational Materials Techniques for Thermal Protection Solutions: Materials and Process Design

Integrated computational materials techniques that span the atomistic and continuum scales have the potential to aid the design and manufacturing of thermal protection materials. Two cases demonstrating the practical application of these methods are discussed. Case one examines the selection of a high temperature coating for carbon/carbon, with the target application being a solar thermal propulsion heat exchanger. The performance of various refractory metal and metal-carbide coatings is characterized considering extreme thermal (3500 K) and chemical (hydrogen flows) conditions. The recession rate, hydrogen leakage, and likelihood of mechanical failure are characterized and provide directions for further experimental investigation. Case two examines the process optimization of a heat shield material composed of a woven silica fiber preform and cyanate ester resin. Frequently, internal voids were found to be present in this composite after the resin infusion and curing stages of manufacturing. Using the manufacturing conditions, computations indicate that both water adsorption and resin cure shrinkage are contributing factors to void formation. The results suggest an alternative process configuration for curing that would mitigate voids.

Haskins, Justin↗

Computational Materials Techniques for Thermal Protection Solutions: Materials and Process Design

Integrated computational materials techniques that span the atomistic and continuum scales have the potential to aid the design and manufacturing of thermal protection materials. Two cases demonstrating the practical application of these methods are discussed. Case one examines the selection of a high temperature coating for carbon/carbon, with the target application being a solar thermal propulsion heat exchanger. The performance of various refractory metal and metal-carbide coatings is characterized considering extreme thermal (3500 degrees Kelvin) and chemical (hydrogen flows) conditions. The recession rate, hydrogen leakage, and likelihood of mechanical failure are characterized and provide directions for further experimental investigation. Case two examines the process optimization of a heat shield material composed of a woven silica fiber preform and cyanate ester resin. Frequently, internal voids were found to be present in this composite after the resin infusion and curing stages of manufacturing. Using the manufacturing conditions, computations indicate that both water adsorption and resin cure shrinkage are contributing factors to void formation. The results suggest an alternative process configuration for curing that would mitigate voids.

Thermal Protection↗

Integrated CMOS photodetectors and signal processing for very low-level chemical sensing with the bioluminescent bioreporter integrated circuit

We report an integrated CMOS microluminometer optimized for the detection of low-level bioluminescence as part of the bioluminescent bioreporter integrated circuit (BBIC). This microluminometer improves on previous devices through careful management of the sub-femtoampere currents, both signal and leakage, that flow in the front-end processing circuitry. In particular, the photodiode is operated with a reverse bias of only a few mV, requiring special attention to the reset circuitry of the current-to-frequency converter (CFC) that forms the front-end circuit. We report a sub-femtoampere leakage current and a minimum detectable signal (MDS) of 0.15 fA (1510 s integration time) using a room temperature 1.47 mm2 CMOS photodiode. This microluminometer can detect luminescence from as few as 5000 fully induced Pseudomonas fluorescens 5RL bacterial cells. c2002 Elsevier Science B.V. All rights reserved.

Non-NASA Center↗

Integration of Product, Package, Process, and Environment: A Food System Optimization

The food systems slated for future NASA missions must meet crew nutritional needs, be acceptable for consumption, and use resources efficiently. Although the current food system of prepackaged, moderately stabilized food items works well for International Space Station (ISS) missions, many of the current space menu items do not maintain acceptability and/or nutritive value beyond 2 years. Longer space missions require that the food system can sustain the crew for 3 to 5 years without replenishment. The task "Integration of Product, Package, Process, and Environment: A Food System Optimization" has the objective of optimizing food-product shelf life for the space-food system through product recipe adjustments, new packaging and processing technologies, and modified storage conditions. Two emergent food processing technologies were examined to identify a pathway to stable, wet-pack foods without the detrimental color and texture effects. Both microwave-assisted thermal sterilization (MATS) and pressure-assisted thermal stabilization (PATS) were evaluated against traditional retort processing to determine if lower heat inputs during processing would produce a product with higher micronutrient quality and longer shelf life. While MATS products did have brighter color and better texture initially, the advantages were not sustained. The non-metallized packaging film used in the process likely provided inadequate oxygen barrier. No difference in vitamin stability was evident between MATS and retort processed foods. Similarly, fruit products produced using PATS showed improved color and texture through 3 years of storage compared to retort fruit, but the vitamin stability was not improved. The final processing study involved freeze drying. Five processing factors were tested in factorial design to assess potential impact of each to the quality of freeze-dried food, including the integrity of the microstructure. The initial freezing rate and primary freeze drying temperature and pressure were linked to final product quality in freeze-dried corn, indicating processing modifications that could lead to improved product shelf life. Storage temperatures and packaging systems were also assessed for the impact to food quality. Reduced temperature storage had inconclusive impact to the progression of rancidity in butter cookies. Frozen storage was detrimental to fruit and vegetable textural attributes but refrigerated storage helped to sustain color and organoleptic ratings for plant-based foods. With regard to packaging systems, the metallized film overwrap significantly decreased the progression of the rancidity of butter cookies as compared to the highest barrier non-metallized film. The inclusion of oxygen scavengers resulted in noticeable moisture gains in butter cookies over time, independent of packaging film systems. Neither emergent processing technology nor the freeze dry optimization resulted in compelling quality differences from current space food provisions such that a five-year shelf life is likely with these processing changes alone. Using a combination of refrigeration and PATS processing is expected to result in organoleptically-acceptable fruit quality for most fruits through five years. The vitamin degradation will be aided somewhat by the cold temperatures but, given the labile nature of vitamin C, a more stable fortification method, such as encapsulation, should also be investigated to ensure vitamin delivery throughout the product life. Similarly, significant improvement to the packaging film used in the MATS processing, optimization of formulation for dielectric properties, vitamin fortification, and reduced temperature storage should be investigated as a hurdle approach to reach a five year shelf life in wet-pack entrees and soups. Baked goods and other environmentally-sensitive spaceflight foods will require an almost impenetrable barrier to protect the foods from oxygen and moisture ingress but scavengers and reduced storage temperature did not improve baked good shelf life and are not recommended at this time for these foods.

Cooper, Maya R.↗

Teaching the Next Generation of Scientists and Engineers the NASA Design Process

The Integrated Product Team (IPT) program, led by The University of Alabama in Huntsville (UAH), is a multidisciplinary, multi-university, multi-level program whose goal is to provide opportunities for high school and undergraduate scientists and engineers to translate stakeholder needs and requirements into viable engineering design solutions via a distributed multidisciplinary team environment. The current program supports three projects. The core of the program is the two-semester senior design experience where science, engineering, and liberal arts undergraduate students from UAH, the College of Charleston, Southern University at Baton Rouge, and Ecole Suprieure des Techniques Aronautiques et de Construction Automobile (ESTACA) in Paris, France form multidisciplinary competitive teams to develop system concepts of interest to the local aerospace community. External review boards form to provide guidance and feedback throughout the semester and to ultimately choose a winner from the competing teams. The other two projects, the Innovative Student Project for the Increased Recruitment of Engineering and Science Students (InSPIRESS) Level I and Level II focus exclusively on high school students. InSPIRESS Level I allows high schools to develop a payload to be accommodated on the system being developed by senior design experience teams. InSPIRESS Level II provides local high school students first-hand experience in the senior design experience by allowing them to develop a subsystem or component of the UAH-led system over the two semesters. This program provides a model for NASA centers to engage the local community to become more involved in design projects.

Caruso, Pamela W.↗

Integrating terrestrial and aquatic processes toward watershed scale modeling of dissolved organic carbon fluxes

Dissolved organic carbon (DOC) is not only a critical component of global and regional carbon budgets, but also an important precursor for carcinogenic disinfection byproducts (DBP) generated during drinking water disinfection process. The lack of process based watershed scale model for carbon cycling has been a limiting factor impeding effective watershed management to control DOC fluxes to source waters. Here, we integrated terrestrial and aquatic carbon processes into the widely tested Soil and Water Assessment Tool (SWAT) watershed model to enable watershed-scale DOC modeling (referred to as SWAT-DOC hereafter). The modifications to SWAT mainly fall into two groups: (1) DOC production in soils and its transport to aquatic environment by different hydrologic processes, and (2) riverine transformation of DOC and their interactions with particular organic carbon (POC), inorganic carbon and algae (floating and bottom). We tested the new SWAT-DOC model in the Cannonsville watershed, which is part of the New York City (NYC) water supply system, using long-term DOC load data (from 1998 to 2012) derived from 1399 DOC samplings. The calibration and verification results indicate that SWAT-DOC achieved satisfactory performance for both streamflow and DOC at daily and monthly temporal scales. The parameter sensitivity analysis indicates that DOC loads in the Cannonsville watershed are controlled by the DOC production in soils and its transport in both terrestrial and aquatic environments. Further model uncertainty analysis indicates high uncertainties associated with peak DOC loads, which are attributed to underestimation of high streamflows. Therefore, future efforts to enhance SWAT-DOC to better represent runoff generation processes hold promise to further improve DOC load simulation. Overall, the wide use of SWAT and the satisfactory performance of SWAT-DOC make it a useful tool for DOC modeling and mitigation at the watershed scale.

Dissolved Organic Carbon, non-point source polluti↗

Integrating Cybersecurity Risk Assessment with Process Safety in Chemical Process Industries

This dissertation bridges the gap between industrial cybersecurity and traditional process safety by introducing an integrated Cyber-LOPA framework that combines the Purdue Enterprise Reference Architecture, Cyber Kill Chain, and CVSS v4.0 metrics. Demonstrated on a High-Density Polyethylene slurry process, the work illustrates how cyber threats targeting automation systems can bypass physical protection layers, proving the necessity of unified risk assessments to prevent cyber-induced physical incidents in chemical manufacturing plants.

Cyber-LOPA (CLOPA)↗

The Power of Priors: Improved Enrichment Safeguards

International safeguards currently rely on material accountancy to verify that declared nuclear material is present and unmodified. Although effective, material accountancy for large bulk facilities can be expensive to implement due to the high precision instrumentation required to meet regulatory targets. Process monitoring has long been considered to improve material accountancy. However, effective integration of process monitoring has been met with mixed results. Given the large successes in other domains, machine learning may present a solution for process monitoring integration. Past work has shown that unsupervised approaches struggle due to measurement error. Although not studied in depth for a safeguards context, supervised approaches often have poor generalization for unseen classes of data (e.g., unseen material loss patterns). This work shows that engineered datasets, when used for training, can improve the generalization of supervised approaches. Further, the underlying models needed to generate these datasets need only accurately model certain high importance features.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Integrated RMP-based ELM-crash-control process for plasma performance enhancement during ELM crash suppression in KSTAR

The integrated Resonant Magnetic Perturbation (RMP)-based Edge-Localized Mode (ELM)-crash-control process aims to enhance the plasma performance during the RMP-driven ELM crash suppression, where the RMP induces an unwanted confinement degradation. In this study, the normalized beta ($\beta_\textrm{N}$) is introduced as a metric for plasma performance. The integrated process incorporates the latest achievements in the RMP technique to enhance $\beta_\textrm{N}$ efficiently. The integrated process triggers the n = 1 Edge-localized RMP (ERMP) at the L–H transition timing using the real-time Machine Learning (ML) classifier. The pre-emptive RMP onset can reduce the required external heating power for achieving the same $\beta_\textrm{N}$ by over 10% compared to the conventional onset. During the RMP phase, the adaptive feedback RMP ELM controller, demonstrating its performance in previous experiments, plays a crucial role in maximizing $\beta_\textrm{N}$ during the suppression phase and sustaining the $\beta_\textrm{N}$-enhanced suppression state by optimizing the RMP strength. The integrated process achieves $\beta_\textrm{N}$ up to ~2.65 during the suppression phase, which is ~10% higher than the previous KSTAR record but ~6% lower than the target of the K-DEMO first phase ($\beta_\textrm{N}$ = 2.8), and maintains the suppression phase above the lower limit of target $\beta_\textrm{N}$ (= 2.4) for ~4 s (~60$\tau_\textrm{E}$). In addition to $\beta_\textrm{N}$ enhancement, the integrated process demonstrates quicker restoration of the suppression phase and recovery of $\beta_\textrm{N}$ compared to the adaptive control with the n = 1 Conventional RMP (CRMP). The post-analysis of the experiment shows the localized effect of the ERMP spectrum in radial and the close relationship between the evolution of $\beta_\textrm{N}$ and the electron temperature.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Optimization of energy requirements for CO 2 post-combustion capture process through advanced thermal integration

The energy optimization modeling work described here was performed to determine efficiency improvements that could be achieved for existing coal-fired power plants to retrofit a partial CO 2 capture from the post-combustion flue gas for carbon sequestration through thermal integration. The work presented includes optimization of the mono-ethanol amine (MEA)-based post-combustion CO 2 capture to reduce energy requirements that could be achieved at existing power plants by thermal integration of the steam turbine cycle, boiler, CO 2 compression train and post-combustion CO 2 capture process to offset efficiency and capacity losses that would be incurred by retrofit or implementation of post-combustion CO 2 capture. Furthermore, partial CO 2 capture, involving treatment of less than 100% of the flue gas leaving the plant and modular design of the CO 2 scrubbing system, was also investigated. Thermal integration of the steam turbine cycle with boiler and CO 2 compression train improved cycle and plant performance and offset, in part, the negative effects of post-combustion CO 2 capture. The best-analyzed integration options improved gross power output by 5% and net unit efficiency by 1.57%, relative to the conventional MEA process. Operating with 40% CO 2 capture increased gross power output by 11.6–14% (depending on the MEA thermal integration option), relative to the conventional MEA integration and 90% CO 2 capture. The improvement in net unit performance is larger compared to the improvement in turbine cycle performance because of the CO 2 compression work, which is also reduced by partial CO 2 capture.

42 ENGINEERING↗

Improving the performance of medical imaging applications using SYCL

As opposed to the Open Computing Language (OpenCL) programming model, in which host and device codes are generally written in different programming languages, SYCL can combine host and device codes for an application in a type-safe way to improve development productivity and performance portability. Hence, this report shows the experimental results of applying the SYCL programming model to medical imaging applications for a study on performance portability and programming productivity between OpenCL and SYCL. Rodinia is a widely used open-source benchmark suite for heterogeneous computing. We choose two medical imaging applications (Heart Wall and Particle Filter) in the benchmark suite, migrate the OpenCL implementations of the applications to the SYCL implementations, and evaluate their performance and productivity on Intel® microprocessors that contain a central processing unit (CPU) and an integrated graphics processing unit (GPU). The maturing SYCL compilers, which are based on a conformant implementation of the SYCL 1.2.1 Khronos specification, have been actively optimized for Intel® computing platforms. The experimental results are promising in terms of the raw performance and productivity. Although the SYCL implementation of the Heart Wall application does not execute successfully on a CPU, the SYCL implementations of the application can achieve comparable or better performance than the OpenCL implementation on Intel® integrated GPUs. For the Particle Filter application, the performance difference between the SYCL and OpenCL implementations is comparable on the GPUs for most cases, but the SYCL implementations are on average 4X faster than the OpenCL implementations on Intel® Xeon® CPUs. For programming productivity, we arguably use lines of code as a way to measure programming productivity in software. The SYCL programs reduce the lines of code of the OpenCL programs by 52% and 38% for the Heart Wall and Particle Filter, respectively. The results indicate that SYCL is a promising programming model for heterogeneous computing with the maturing compilers. We organize the remainder of the report as follows. Section II introduces the SYCL programming model, compares the major differences between an OpenCL program and a SYCL program, and describes the characteristics of the two applications. Section III describes the SYCL programming model in more details, and shows the SYCL implementation of a kernel function in the Particle Filter application as an example. In Section IV, we evaluate the performance of the applications on the CPUs and GPUs. Section V concludes the report.

59 BASIC BIOLOGICAL SCIENCES↗

Design for Manufacturing of Structures with Automated Fiber Placement via Integration of Analysis and Process Planning

Under the Design for Manufacturing (DFM) task in the NASA HiCAM program, significant process has been made towards establishing a fully automated optimization process that spans the structural analysis, design, and manufacturing process planning for Automated Fiber Placement (AFP) structures. Previous efforts in this area established the data formats and mapping processes needed to exchange data between disciplines. The software tools used in the framework are HyperX (structural optimization), CAPP (process planning), and VCP (AFP path generation). The work has culminated with automation of data exchanges and an optimization process that drives the three software toward convergence. Within this framework, HyperX is used to generate mass-optimum composite designs which are iterated with VCP and CAPP to improve manufacturability of the designs. As the ply manufacturing process is adjusted by CAPP and VCP, HyperX continually re-assesses the structural integrity of the part and makes adjustments to the laminate as needed. For example, the position of fiber steering and tow overlaps/gaps can necessitate changes to the laminate design. Once the design converges, the end result is a stack of plies that meets both structural and manufacturing requirements. This paper presents the details of the framework and demonstrations the automated process on several parts with significant double-curvature.

HiCAM↗

Developing a predictive science of the biosphere requires the integration of scientific cultures

Increasing the speed of scientific progress is urgently needed to address the many challenges associated with the biosphere in the Anthropocene. Consequently, the critical question becomes: How can science most rapidly progress to address large, complex global problems? We suggest that the lag in the development of a more predictive science of the biosphere is not only because the biosphere is so much more complex, or because we do not have enough data, or are not doing enough experiments, but, in large part, because of unresolved tension between the three dominant scientific cultures that pervade the research community. We introduce and explain the concept of the three scientific cultures and present a novel analysis of their characteristics, supported by examples and a formal mathematical definition/representation of what this means and implies. The three cultures operate, to varying degrees, across all of science. However, within the biosciences, and in contrast to some of the other sciences, they remain relatively more separated, and their lack of integration has hindered their potential power and insight. Our solution to accelerating a broader, predictive science of the biosphere is to enhance integration of scientific cultures. The process of integration—Scientific Transculturalism—recognizes that the push for interdisciplinary research, in general, is just not enough. Unless these cultures of science are formally appreciated and their thinking iteratively integrated into scientific discovery and advancement, there will continue to be numerous significant challenges that will increasingly limit forecasting and prediction efforts.

54 ENVIRONMENTAL SCIENCES↗

Coal to Carbon Fiber – A Novel Supercritical CO 2 Solvated Process

This project aims to demonstrate, independently, the three primary processes necessary to produce carbon fiber from coal feedstock material and assess the potential for those independent processes to integrate into a single, continuous process in order to provide significant cost reductions in the most costly steps of carbon fiber processing. The specific objective of the present research is to assess the technical feasibility for generation of quality carbon fiber pre-cursor materials from coal using a supercritical carbon dioxide (sCO 2 ) solvation process.

01 COAL, LIGNITE, AND PEAT↗

A bit-serial VLSI array processing chip for image processing

An array processing chip integrating 128 bit-serial processing elements (PEs) on a single die is discussed. Each PE has a 16-function logic unit, a single-bit adder, a 32-b variable-length shift register, and 1 kb of local RAM. Logic in each PE provides the capability to mask PEs individually. A modified grid interconnection scheme allows each PE to communicate with each of its eight nearest neighbors. A 32-b bus is used to transfer data to and from the array in a single cycle. Instruction execution is pipelined, enabling all instructions to be executed in a single cycle. The 1-micron CMOS design contains over 1.1 x 10 to the 6th transistors on an 11.0 x 11.7-mm die.

Heaton, Robert↗