Packaging electronic circuitry inside ferrite pot cores
Packaging electronic circuitry inside ferrite pot cores
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Packaging electronic circuitry inside ferrite pot cores
Physical, electrical, and mechanical property tests at temperatures between -125 and 125 deg C of dielectric materials for electronic packaging
Capsule system packaging for Mars rough lander
Spectral and spatial filtering in detector package of lunar laser ranging probes
Testing Dacron parachute components and assemblies by exposure to ethylene oxide sterilization, simulated package loading, and heat cycle
Flight-packaged computer-controlled checkout system for manned spacecraft
Electronic packaging techniques and design criteria for preventing corona discharges in high-voltage circuitry
Maintainability design criteria for packaging of spacecraft replaceable electronic equipment
Thermal evaluation of early Apollo scientific experiment package isotope heater models in MSC 1.5 megawatt arc heated facility
Simulation test reports for multiple docking adapter package-fastening devices
Versatile, low cost packaging technique for spacecraft electronics
Improvements in silicon solar cell cover glass assembly and packaging using FEP Teflon
Electronic packaging and cabling on Capsule System Advanced Development Lander for Mars rough landing
Strap-on ferry package for reusable spacecraft and launch vehicles subsonic lift/drag increase
ATS attitude stabilization boom packages, describing torque transmission, drum synchronization, electrical isolation, lubrication, etc
LSI packaging effects on systems design, discussing physical integration
Strap-on ferry package for reusable spacecraft and launch vehicles subsonic lift/drag increase
General Optimization Software Package for Electrical network and system design, noting application to engineering problems and education