SEARCH · Search NASA

Results for “Electronics Packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

SourceResearch connectionFrom yearThrough year

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 577 records · Page 32

All sources NASA NTRS DOE OSTI

NASA NTRS2000

First-Generation Jet Propulsion Laboratory "Hockey-Puck" Free-Flying Magnetometers for Distributed In-Situ Multiprobe Measurement of Current Density Filamentation in the Northern Auroral Zone: Enstrophy Mission

The sub-orbital rocket mission was a collaborative project between the University of New Hampshire, Cornell University, and the Jet Propulsion Laboratory (JPL) to study filamentation phenomena in the northern Auroral zone. The Enstrophy mission test flies the JPL Free-Flying Magnetometer (FFM) concept. The FFM technology development task has been funded by NASA develop miniaturized, low-power, integrated "sensorcrafts". JPL's role was to design, integrate, test, and deliver four FFMs for deployment from the sounding rocket, allowing a unique determination of curl-B. This provides a direct measurement of magnetic-field-aligned current density along the rocket trajectory. A miniaturized three-axis fluxgate magnetometer was integrated with a 4-channel 22-bit sigma-delta Analog to Digital Converter (ADC), four temperature sensors, digital control electronics, seven (Li-SOCl2) batteries, two (4 deg x 170 deg field of view) sun-sensors, a fan-shaped-beam laser diode beacon, a (16 MHz) stable Temperature Compensated Crystal Oscillator (TCXO) clock, Radio Frequency (RF) communication subsystem, and an antenna for approximately 15 minutes of operation where data was collected continuously and transmitted in three (3) bursts (approximately 26 seconds each) to ground station antennas at Poker Flat, Alaska. FFMs were stowed within two trays onboard the rocket during the rocket launch and were released simultaneously using the spinning action of the rocket at approximately 300 km altitude (approximately 100 sec. into the flight). FFMs were deployed with spin rate of approximately 17 Hz and approximately 3 m/sec linear velocity with respect to the rocket. For testing purposes while the rocket was in the launch pad and during flight prior to release of FFMs from the rocket, commands (such as "power on", "test", "flight", "power off', and clock "Reset" signal) were transmitted via a infrared Light Emitting Diode to an infrared detector in the FFM. Special attention was paid to low magnetic signature electronic design and choice of materials in packaging. The miniaturized fluxgate magnetometers had a range of 1-60000 nT with 0.1% full-scale linearity. The frequency range of interest for magnetic measurement was 10 mHz - 50 Hz. Digital data from the magnetometer's three axes were placed in a 4MB Static Random Access Memory (SRAM) in data packages (frames) formatted together with time tags and frame ID. After a specified time was elapsed, the data were Viterbi encoded and transmitted at a rate of 100 kbps (BPSK). Each of the four FFMs transmitted at different frequency. These carrier frequencies were in the range of 2200-2300 MHz. The antenna was a single patch on a high dielectric constant substrate covering one end-plate of the hockey-puck-sized unit. The local clocks aboard the FFMs were reset at the start of the mission and stayed synchronized within 3 msec during the mission. Position of each FFM with respect to the rocket is calculated by the knowledge of its release velocity (measured at exit point of the FFM launcher tract) providing an accuracy of 1 m over the maximum range of 3 km. Spatial and temporal nature of observants can be separated to within 3 m in space or 3 msec time interval.

Javadi, H.↗

NASA NTRS1980

Safe Handling Practices

In 1977 Compugraphic Corporation was experiencing an unacceptable failure rate on microelectronic chips. Company engineers suspected that static electricity was causing the trouble because some electronic components are highly susceptible to damage by electrostatic charge. From a NASA Tech Brief, they learned that Rockwell International had prepared a report on safe handling practices for electronic components. NASA provided a Technical Support Package detailing 50 safe handling procedures affecting workers, work areas, equipment and packaging materials. Where poor practices were discovered, re-education of employees and other corrective measures were undertaken.

Source record↗

NASA NTRSDate not supplied

Development of a Multi-Gas Microsensor Array for the Exploration Portable Life Support System

The Portable Life Support System (PLSS) of the Exploration Extravehicular Mobility Unit (xEMU) requires sensors capable of measuring the major constituents of the gas stream. These major constituents include oxygen, carbon dioxide, and water vapor. The sensors must operate across a wide range of flow and pressure conditions and introduce very low pressure drop in the ventilation loop. The sensors must operate with low power and occupy a small volume. This paper reports the development of a compact, low power, multi-parameter astronaut life support sensor (M-PALSS). M-PALSS consists of an array of low-power chemical microsensors for oxygen, carbon dioxide, water vapor, and pressure. M-PALSS includes custom electronics to control the sensors and is packaged in a custom housing that meets the volume and shape requirements for service in the PLSS.

James Makel↗

NASA NTRSDate not supplied

Development of a Multi-Gas Microsensor Array for the Exploration Portable Life Support System

James Makel↗

NASA NTRSDate not supplied

Development of a Multi-Gas Microsensor Array for the Exploration Portable Life Support System

James Makel↗

NASA NTRS2011

Thermally Stabilized Transmit/Receive Modules

RF-hybrid technologies enable smaller packaging and mass reduction in radar instruments, especially for subsystems with dense electronics, such as electronically steered arrays. We are designing thermally stabilized RF-hybrid T/R modules using new materials for improved thermal performance of electronics. We are combining advanced substrate and housing materials with a thermal reservoir material, and develop new packaging techniques to significantly improve thermal-cycling reliability and performance stability over temperature.

thermal cycling stress↗

NASA NTRS2000

Modular Low-Heater-Power Cathode/Electron Gun Assembly for Microwave and Millimeter Wave Traveling Wave Tubes

A low-cost, low-mass, electrically efficient, modular cathode/electron gun assembly has been developed by FDE Inc. of Beaverton, Oregon, under a Small Business Innovation Research (SBIR) contract with the NASA Glenn Research Center at Lewis Field. This new assembly offers significant improvements in the design and manufacture of microwave and millimeter wave traveling-wave tubes (TWT's) used for radar and communications. It incorporates a novel, low-heater-power, reduced size and mass, high-performance barium dispenser type thermionic cathode and provides for easy integration of the cathode into a large variety of conventional TWT circuits. Among the applications are TWT's for Earth-orbiting communication satellites and for deep space communications, where future missions will require smaller spacecraft, higher data transfer rates (higher frequencies and radiofrequency output power), and greater electrical efficiency. A particularly important TWT application is in the microwave power module (a hybrid microwave/millimeter wave amplifier consisting of a low-noise solid-state driver, a small TWT, and an electronic power conditioner integrated into a single compact package), where electrical efficiency and thermal loading are critical factors and lower cost is needed for successful commercialization. The design and fabrication are based on practices used in producing cathode ray tubes (CRT's), which is one of the most competitive and efficient manufacturing operations in the world today. The approach used in the design and manufacture of thermionic cathodes and electron guns for CRT's has been optimized for fully automated production, standardization of parts, and minimization of costs. It is applicable to the production of similar components for microwave tubes, with the additional benefits of low mass and significantly lower cathode heater power (less than half that of dispenser cathodes presently used in TWT s). Modular cathode/electron gun assembly. The modular cathode/electron gun assembly consists of four subassemblies the cathode, the focus electrode, the header (including the electrical feedthroughs), and the gun envelope (including the anode) a diagram of which is shown. The modular construction offers a number of significant advantages, including flexibility of design, interchangeability of parts, and a drop-in final assembly procedure for quick and accurate alignment. The gun can accommodate cathodes ranging in size from 0.050 to 0.250-in. in diameter and is applicable to TWT's over a broad range of sizes and operating parameters, requiring the substitution of only a few parts: that is, the cathode, focus electrode, and anode. The die-pressed cathode pellets can be made with either flat or concave (Pierce gun design) emitting surfaces. The gun can be either gridded (pulse operation) or ungridded (continuous operation). Important factors contributing to low cost are the greater use of CRT materials and parts, the standardization of processes (welding and mechanical capture), and tooling amenable to automated production. Examples are the use of simple shapes, drawn or stamped metal parts, and parts joined by welding or mechanical capture. Feasibility was successfully demonstrated in the retrofit and testing of a commercial Kaband (22-GHz) TWT. The modular cathode/electron gun assembly was computer modeled to replicate the performance of the original electron gun and fabricated largely from existing CRT parts. Significant test results included demonstration of low heater power (1.5-W, 1010 C brightness temperature for a 0.085-in.-diameter cathode), mechanical ruggedness (100g shock and vibration tests in accordance with military specifications (MIL specs)), and a very fast warmup. The results of these tests indicate that the low-cost CRT manufacturing approach can be used without sacrificing performance and reliability.

Wintucky, Edwin G.↗

NASA NTRS1989

Three-dimensional simulation of whistler mode excited by the Spacelab 2 electron beam

During the Spacelab 2 mission, while an electron beam was being ejected from the Shuttle, the Plasma Diagnostics Package (PDP) detected a clear funnel-shaped emission that is believed to be caused by whistler-mode emission from the electron beam. In order to understand the mechanism of this emission, simulations with a three-dimensional partially magnetostatic code have been performed. The simulation results show that whistler-mode and lower hybrid waves are excited by the electron beam, which is initially localized in the column in the three-dimensional simulation system, and that they propagate away from the beam. The wave spectra of the electric and magnetic fields diagnosed at some points show several peaks due to the waves excited by the electron beam. The frequency range of these spectra is in qualitative agreement with the PDP data. The intense narrowband electrostatic emission near the electron plasma frequency is observed by the simulations. The simulation results show that the beam instability is responsible for the generation mechanism of these emissions.

Nishikawa, K.-I.↗

NASA NTRS1989

Coherent Cerenkov radiation from the Spacelab 2 electron beam

The plasma environment of the Spacelab 2 mission was investigated through the deployment of the Plasma Diagnostics Package (PDP) by the Space Shuttle Orbiter and the Orbiter's ejection of a continuous 1-keV/50-mA electron beam along a field line. As the PDP flew by the beam, its plasma-wave instrument detected intense whistler-mode radiation originating from the beam. A detailed model has been developed of the coherent Cerenkov emission process, using a one-dimensional computer simulation of the beam to model the expected phase space structure of the electrons. The power calculated for the modeled 200-m beam segment can easily account for the measured whistler mode wave power.

Farrell, W. M.↗

NASA NTRS1995

Advanced packaging for Integrated Micro-Instruments

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

Lyke, James L.↗

NASA NTRS2005

Electronic Router

Electronic Router (E-Router) is an application program for routing documents among the cognizant individuals in a government agency or other organization. E-Router supplants a prior 14 NASA Tech Briefs, May 2005 system in which paper documents were routed physically in packages by use of paper slips, packages could be lost, routing times were unacceptably long, tracking of packages was difficult, and there was a need for much photocopying. E-Router enables a user to create a digital package to be routed. Input accepted by E-Router includes the title of the package, the person(s) to whom the package is to be routed, attached files, and comments to reviewers. Electronic mail is used to notify reviewers of needed actions. The creator of the package can, at any time, see the status of the package in the routing structure. At the end of the routing process, E-Router keeps a record of the package and of approvals and/or concurrences of the reviewers. There are commercial programs that perform the general functions of E-Router, but they are more complicated. E-Router is Web-based, easy to use, and does not require the installation or use of client software.

Crusan, Jason↗

NASA NTRS1972

Testing methods and techniques: Testing electrical and electronic devices: A compilation

The methods, techniques, and devices used in testing various electrical and electronic apparatus are presented. The items described range from semiconductor package leak detectors to automatic circuit analyzer and antenna simulators for system checkout. In many cases the approaches can result in considerable cost savings and improved quality control. The testing of various electronic components, assemblies, and systems; the testing of various electrical devices; and the testing of cables and connectors are explained.

Source record↗

NASA NTRS1985

Dynamic Thermophysical Measurements in Space

The objective is to develop techniques for the dynamic measurement of selected thermophysical properties (e.g., heat of fusion, heat capacity, electrical resistivity) of solids and liquids at temperatures above 2000 K in a near zero-gravity environment. The first phase involves establishing the stability (geometrical) limits of specimens when rapidly heated to temperatures beyond their melting point. A test equipment package was designed and constructed for this purpose, consisting of removable specimen cartridge cells, a battery-bank power supply, a high-speed framing camera, a single-wavelength pyrometer, and electronic switching and control equipment. The operation of the equipment package was tested in the laboratory in preparation for near zero-gravity experiments to be performed during a KC-135 flight in September, 1984.

Cezairliyan, A.↗

NASA NTRS1990

Low cost attitude sensors for spacecraft

A review is presented of two-low cost attitude sensors developed with existing technology, but with emphasis directed to reducing the unit costs without compromising reliability or quality. The solar aspect sensor was developed to determine the angle of the sun with respect to the optical axis of the Shuttle Solar Backscatter Ultraviolet (SSBUV) Experiment Package. Using sensor readings updated every five milliseconds, signal processing electronics determine the location of the center of the sun's image on the array. An earth horizon sensor was developed to measure the nadir angle with respect to the optical axis of the SSBUV Experiment Package to an accuracy of + or - 0.5 deg. Operation of each of the sensors is described along with flight results obtained when flown onboard Atlantis as part of the SSBUV Experiment Package.

Auer, S.↗

NASA NTRS1999

Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview

Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.

Kirschman, Randall K.↗

NASA NTRS1978

Electronics for a focal plane crystal spectrometer

The HEAO-B program forced the usual constraints upon the spacecraft experiment electronics: high reliability, low power consumption, and tight packaging at reasonable cost. The programmable high voltage power supplies were unique in both application and simplicity of manufacture. The hybridized measurement chain is a modification of that used on the SAS-C program; the charge amplifier design in particular shows definite improvement in performance over previous work.

Goeke, R. F.↗

NASA NTRS1980

Bennett ion mass spectrometers on the Pioneer Venus Bus and Orbiter

Identical Bennett radio-frequency ion mass spectrometer instruments on the Pioneer Venus Bus and Orbiter have provided the first in-situ measurements of the detailed composition of the planet's ionosphere. The sensitivity, resolution, and dynamic range are sufficient to provide measurements of the solar-wind-induced bow-shock, the ionopause, and highly structured distributions of up to 16 thermal ion species within the ionosphere. The use of adaptive scan and detection circuits and servo-controlled logic for ion mass and energy analysis permits detection of ion concentrations as low as 5 ions/cu cm and ion flow velocities as large as 9 km/sec for O(+). A variety of commandable modes provides ion sampling rates ranging from 0.1 to 1.6 sec between measurements of a single constituent. A lightweight sensor and electronics housing are features of a compact instrument package.

Taylor, H. A., Jr.↗

NASA NTRS1990

Lightweight, Thermally Conductive Composite Material

Aluminum reinforced with carbon fibers superior to copper in some respects. Lightweight composite material has high thermal conductivity. Consists of aluminum matrix containing graphite fibers, all oriented in same direction. Available as sheets, tubes, and bars. Thermal conductivity of composite along fibers rises above that of pure copper over substantial range of temperatures. Graphite/aluminum composite useful in variety of heat-transfer applications in which reduction of weight critical. Used to conduct heat in high-density, high-speed integrated-circuit packages for computers and in base plates for electronic equipment. Also used to carry heat away from leading edges of wings in high-speed airplanes.

Sharp, G. Richard↗