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At least 595 records · Page 33

Proposed mechanism to represent the suppression of dark current density by four orders with low energy light ion (H{sup −}) implantation in quaternary alloy-capped InAs/GaAs quantum dot infrared photodetectors

Graphical abstract: - Abstract: Here we propose a carrier transport mechanism for low energy H{sup −} ions implanted InAs/GaAs quantum dot infrared photodetectors supportive of the experimental results obtained. Dark current density suppression of up to four orders was observed in the implanted quantum dot infrared photodetectors, which further demonstrates that they are effectively operational. We concentrated on determining how defect-related material and structural changes attributed to implantation helped in dark current density reduction for InAs/GaAs quantum dot infrared photodetectors. This is the first study to report the electrical carrier transport mechanism of H{sup −} ion-implanted InAs/GaAs quantum dot infrared photodetectors.

36 MATERIALS SCIENCE↗

Modeling boron profiles in silicon after pulsed excimer laser annealing

In this work, we investigated four possible mechanisms which were candidates to explain the shape of boron profiles after ion implantation and melting excimer laser annealing in silicon. A laser with a wavelength of 308 nm and a pulse duration of {approx}180 ns was used. To simulate this process, an existing model for the temperature and phase evolution was complemented with equations for the migration of dopants. Outdiffusion, thermodiffusion, segregation, and adsorption were investigated as possible mechanisms. As a result, we found that outdiffusion and segregation can be excluded as major mechanisms. Thermodiffusion as well as adsorption could both reproduce the build-up at low melt depths, but only adsorption the one at deeper melt depths. In both cases, ion beam mixing during SIMS measurement had to be taken into account to reproduce the measured profiles.

36 MATERIALS SCIENCE↗

Raman and FTIR Studies of Silicon Carbide Surface Damage from Palladium Implantation in Presence of Hydrogen

The ion implantation in a crystal such as silicon carbide will cause both damage in the ion track and in the substrate at the end of the ion track. We used both keV, and MeV Pd ions in fabricating electronic chemical sensors in silicon carbide, which can operate at elevated temperatures. In order to study the feasibility of fabricating an optical chemical sensor (litmus sensor), we need to understand the optical behavior of the embedded damage in the presence of hydrogen, as well as the potential chemical interaction of silicon carbide broken lattice bonds with the hydrogen dissociated from gas by palladium. Implanted samples of silicon carbide were studied using both Raman spectroscopy and FTIR (Fourier Transform-Infrared). The results of this work will be presented during the meeting.

Muntele, I.↗

High-resolution and site-specific scanning spreading resistance microscopy and its applications to silicon devices

Due to the continuous reduction of the critical dimensions of semiconductor devices, it becomes very important to know the two dimensional (2D) doping profile for improving device performance. Scanning spreading resistance microscopy (SSRM) performed in high vacuum is a powerful technique for quantitative 2D-doping profiling, with high spatial resolution and wide dynamic range of carrier concentration, as well as capability of site-specific analysis for accurate position. In this paper, we review SSRM applications to source/drain engineering in Si devices and their correlation with device characteristics by demonstrating several case studies. Direct observation of (110)/(100) CMOSFETs clarified significant differences between both pFETs and nFETs on (110) and (100) silicon substrates, revealing 2D channeling effect of boron ion implantation in pFETs; as well as silicidation impact on junction leakage-current characteristics in nFETs. Furthermore, our sample-preparation breakthrough enables site-specific SSRM characterization within 60 nm ultra thin samples and therefore failure analysis of real SRAM devices, demonstrating the high potential of SSRM technology for further device scaling and for failure analysis.

36 MATERIALS SCIENCE↗

Nano-Engineering of Detector Surfaces to Offer Unprecedented Imager Sensitivity to Soft X-rays and Low Energy Electrons

The focus of this document is to record the learning and process development achieved by the completion of the Nano-Engineering of Detector Surfaces to Offer Unprecedented Imager Sensitivity to Soft X-rays and Low Energy Electrons LDRD. The goal of this effort was to study different silicon detector surface preparation methods such as ion implant parameters, and the addition of a quantum 2-layer superlattice. Enabling the preparation of the surface of silicon detectors (front side illuminated or bonded backside illuminated) increases the responsivity of the diode to shallowly absorbed photons. This increased sensitivity in turn allows for greater fidelity in imaging events that emit low soft X-rays or low energy electrons. Prior work has focused on passivating the surface of a silicon detectors with thin layers (tens of nm thick) of materials to reduce surface recombination sites. Measurements of visible light quantum efficiency, electron responsivity, and pulsed x-ray response indicate that detectors with a 2- layer superlattice enjoy a significant benefit over equivalent detectors using an ion implant at the illuminated surface.

42 ENGINEERING↗

Compact microwave ion source for industrial applications

A 2.45 GHz microwave ion source for ion implanters has many good properties for industrial application, such as easy maintenance and long lifetime, and it should be compact for budget and space. But, it has a dc current supply for the solenoid and a rf generator for plasma generation. Usually, they are located on high voltage platform because they are electrically connected with beam extraction power supply. Using permanent magnet solenoid and multi-layer dc break, high voltage deck and high voltage isolation transformer can be eliminated, and the dose rate on targets can be controlled by pulse duty control with semiconductor high voltage switch. Because the beam optics does not change, beam transfer components, such as focusing elements and beam shutter, can be eliminated. It has shown the good performances in budget and space for industrial applications of ion beams.

43 PARTICLE ACCELERATORS↗

Determination of secondary ion mass spectrometry relative sensitivity factors for polar and non-polar ZnO

Zinc oxide (ZnO) is regarded as a promising material for optoelectronic devices, due to its electronic properties. Solely, the difficulty in obtaining p-type ZnO impedes further progress. In this connection, the identification and quantification of impurities is a major demand. For quantitative information using secondary ion mass spectrometry (SIMS), so-called relative sensitivity factors (RSF) are mandatory. Such conversion factors did not yet exist for ZnO. In this work, we present the determined RSF values for ZnO using primary (ion implanted) as well as secondary (bulk doped) standards. These RSFs have been applied to commercially available ZnO substrates of different surface termination (a-plane, Zn-face, and O-face) to quantify the contained impurities. Although these ZnO substrates originate from the same single-crystal, we observe discrepancies in the impurity concentrations. These results cannot be attributed to surface termination dependent RSF values for ZnO.

36 MATERIALS SCIENCE↗

Plasma diagnostics in spherical tokamaks with silicon charged-particle detectors

Detection of charged fusion products, such as protons and tritons resulting from D(d, p) t reactions, can be used to determine the position and time dependent fusion reaction rate profile in spherical tokamak plasmas with neutral beam heating. We have developed a prototype instrument consisting of 6 ion-implanted-silicon surface barrier detectors combined with collimators in such a way that each detector can accept 3 MeV protons and 1 MeV tritons and thus provides a curved view across the plasma cross section. The combination of the results from all six detectors will provide information on the spatial distribution of the fusion reaction rate. The expected time resolution of about 1 ms makes it possible to study changes in the reaction rate due to slow variations in the neutral beam density profile, as well as rapid changes resulting from MHD instabilities. Details of the new instrument, its data acquisition system, simulation results, and electrical noise testing results are discussed in this paper. First experimental data are expected to be taken during the current experimental campaign at NSTX-U.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Nanoporosity-induced superhydrophobicity and large antireflection in InSb

A porous nanostructure evolves in InSb due to keV ion implantation which leads to superhydrophobic and large antireflective property, indicating a single-step facile fabrication to introduce both functionalities. In particular, it is observed that the contact angle of a water droplet on the nanoporous InSb surface exceeds 150°, revealing the transition to a superhydrophobic surface. Correlation between the contact angle and the porous nanostructures is qualitatively understood in light of the Cassie-Baxter model. It is found that a decrease in the fraction of solid surface wetted by the water droplet and a corresponding increase in the air-water interface fraction lead to the enhancement in the hydrophobicity. We further observe that the large broadband antireflection (in the range of 200–800 nm) is also correlated to the nanoporous structure, arising out of a large reduction in the refractive index due to its increasing porosity. Such a surface with the combination of superhydrophobicity and large antireflection can be very useful for applications of InSb nanostructures in electronic, photonic devices, or infrared detectors.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

Reduction of phosphorus diffusion in germanium by fluorine implantation

The control of phosphorus (P) diffusion in germanium (Ge) is essential for the realisation of ultrashallow n-type junctions in Ge. This work reports a detailed study of the effect of fluorine (F) co-implantation on P diffusion in Ge. P and F profiles were characterized by secondary ion mass spectroscopy. The ion implantation damage was investigated using cross sectional transmission electron microscopy. It is shown that F co-implantation reduces the implanted P profile width and reduces both intrinsic and extrinsic P diffusion in Ge. A defect mediated mechanism for the strong influence of F co-implantation on P diffusion in Ge is proposed and invokes the formation of F{sub n}V{sub m} clusters in the F-amorphized Ge layer. A fraction of these F{sub n}V{sub m} clusters decorate the interstitial type end-of-range defects in the re-grown Ge layer and the rest react during re-growth with interstitial germanium atoms diffusing back from the amorphous crystalline interface. The Ge vacancies are then annihilated and mobile interstitial F is released and out diffuses from the surface. This results in a re-grown Ge layer which has a low vacancy concentration and in which the P diffusion rate is reduced. These results open the way to the realization of enhanced Ge n-type devices.

36 MATERIALS SCIENCE↗

Effect of layer thickness on device response of silicon heavily supersaturated with sulfur

We report on a simple experiment in which the thickness of a hyperdoped silicon layer, supersaturated with sulfur by ion implantation followed by pulsed laser melting and rapid solidification, is systematically varied at constant average sulfur concentration, by varying the implantation energy, dose, and laser fluence. Contacts are deposited and the external quantum efficiency (EQE) is measured for visible wavelengths. We posit that the sulfur layer primarily absorbs light but contributes negligible photocurrent, and we seek to support this by analyzing the EQE data for the different layer thicknesses in two interlocking ways. In the first, we use the measured concentration depth profiles to obtain the approximate layer thicknesses, and, for each wavelength, fit the EQE vs. layer thickness curve to obtain the absorption coefficient of hyperdoped silicon for that wavelength. Comparison to literature values for the hyperdoped silicon absorption coefficients [S.H. Pan et al. Applied Physics Letters 98, 121913 (2011)] shows good agreement. Next, we essentially run this process in reverse; we fit with Beer’s law the curves of EQE vs. hyperdoped silicon absorption coefficient for those wavelengths that are primarily absorbed in the hyperdoped silicon layer, and find that the layer thicknesses obtained from the fit are in good agreement with the original values obtained from the depth profiles. We conclude that the data support our interpretation of the hyperdoped silicon layer as providing negligible photocurrent at high S concentrations. This work validates the absorption data of Pan et al. [Applied Physics Letters 98, 121913 (2011)], and is consistent with reports of short mobility-lifetime products in hyperdoped layers. It suggests that for optoelectronic devices containing hyperdoped layers, the most important contribution to the above band gap photoresponse may be due to photons absorbed below the hyperdoped layer.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Benchmarking of X‐Ray Fluorescence Microscopy with Ion Beam Implanted Samples Showing Detection Sensitivity of Hundreds of Atoms

Abstract Single impurities in insulators are now often used for quantum sensors and single photon sources, while nanoscale semiconductor doping features are being constructed for electrical contacts in quantum technology devices, implying that new methods for sensitive, non‐destructive imaging of single‐ or few‐atom structures are needed. X‐ray fluorescence (XRF) can provide nanoscale imaging with chemical specificity, and features comprising as few as 100 000 atoms have been detected without any need for specialized or destructive sample preparation. Presently, the ultimate limits of sensitivity of XRF are unknown – here, gallium dopants in silicon are investigated using a high brilliance, synchrotron source collimated to a small spot. It is demonstrated that with a single‐pixel integration time of 1 s, the sensitivity is sufficient to identify a single isolated feature of only 3000 Ga impurities (a mass of just 350 zg). With increased integration (25 s), 650 impurities can be detected. The results are quantified using a calibration sample consisting of precisely controlled numbers of implanted atoms in nanometer‐sized structures. The results show that such features can now be mapped quantitatively when calibration samples are used, and suggest that, in the near future, planned upgrades to XRF facilities might achieve single‐atom sensitivity.

36 MATERIALS SCIENCE↗

On the Use of SRIM for Computing Radiation Damage Exposure

The SRIM (formerly TRIM) Monte Carlo simulation code is widely used to compute a number of parameters relevant to ion beam implantation and ion beam processing of materials. It also has the capability to compute a common radiation damage exposure unit known as atomic displacements per atom (dpa). Since dpa is a standard measure of primary radiation damage production, most researchers who employ ion beams as a tool for inducing radiation damage in materials use SRIM to determine the dpa associated with their irradiations. The use of SRIM for this purpose has been evaluated and comparisons have been made with an internationally-recognized standard definition of dpa, as well as more detailed atomistic simulations of atomic displacement cascades. Differences between the standard and SRIM-based dpa are discussed and recommendations for future usage of SRIM in radiation damage studies are made. In particular, it is recommended that when direct comparisons between ion and neutron data are intended, the Kinchin-Pease option of SRIM should be selected.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗