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At least 613 records · Page 34

TiV_BCC_SolidSolution_128atoms_VASP6

We performed density functional theory (DFT) calculations for body-centered-cubic (BCC) structures with 128 lattices sites of solid solution binary alloys titanium-vanadium (Ti-V). The electronic structures of alloys have been calculated using Vienna Ab initio Simulation Package (VASP). Within this package the DFT approach is used to reduce many-body Schrodinger equation to set of single particle Kohn-Sham (KS) equations. The generalized electronic exchange-correlation functional is described by generalized gradient approximation with the Perdew-Burke-Ernzerhof parametrization. The electron-ion interactions is described by pseudopotentials developed within the plane-wave basis projector augmented-wave (PAW) approach. These pseudopotentials are available at the VASP portal (http://cms.mpi.univie.ac.at/vasp/). Our calculations have been run with the pseudopotentials treating s and p semi-core states as valence in case for the elements Ti and V. The electronic densities and potentials are expanded over plane-waves with energy cutoff of 350 eV. 2x2x2 k-mesh and normal precision were used. The alloys were modeled by supercell containing 128 randomly distributed atoms. At initial step the atoms occupy perfect bcc lattice cites. This initial structure was optimized until energy changes less than 1e-6 eV, while forces acting on atoms don't exceed 1e-2 eV/angstrom. The electron-ion interaction is described by PAW pseudopotentials. The calculations have been collected by sampling chemical compositions across the entire compositional range. The chemical compositions have been sampled by progressively changing the number of atoms per constituent by 4. For each chemical composition of binaries and ternaries, the first-principle calculations have been run for 100 randomized arrangements of the constituents on the BCC lattice sites. We collected data for a total of 3,100 randomized atomic structures over 31 chemical compositions. The calculations have been collected on Air Force HPC11 cluster using the VASP 6.5.1. Additional methodology and file structure information is available in the dataset README.txt file.

36 MATERIALS SCIENCE↗

HfTa_BCC_SolidSolution_128atoms_VASP6

We performed density functional theory (DFT) calculations for body-centered-cubic (BCC) structures with 128 lattices sites of solid solution binary alloys hafnium-tantalum (Hf-Ta). The electronic structures of alloys have been calculated using Vienna Ab initio Simulation Package (VASP). Within this package the DFT approach is used to reduce many-body Schrodinger equation to set of single particle Kohn-Sham (KS) equations. The generalized electronic exchange-correlation functional is described by generalized gradient approximation with the Perdew-Burke-Ernzerhof parametrization. The electron-ion interactions is described by pseudopotentials developed within the plane-wave basis projector augmented-wave (PAW) approach. These pseudopotentials are available at the VASP portal (http://cms.mpi.univie.ac.at/vasp/). Our calculations have been run with the pseudopotentials treating s and p semi-core states as valence in case for the elements Hf and Ta. The electronic densities and potentials are expanded over plane-waves with energy cutoff of 350 eV. 2x2x2 k-mesh and normal precision were used. The alloys were modeled by supercell containing 128 randomly distributed atoms. At initial step the atoms occupy perfect BCC lattice sites. This initial structure was optimized until energy changes less than 1e-6 eV, while forces acting on atoms don't exceed 1e-2 eV/angstrom. The electron-ion interaction is described by PAW pseudopotentials. The calculations have been collected by sampling chemical compositions across the entire compositional range. The chemical compositions have been sampled by progressively changing the number of atoms per constituent by 4. For each chemical composition of binaries and ternaries, the first-principle calculations have been run for 100 randomized arrangements of the constituents on the BCC lattice sites. We collected data for a total of 3,040 randomized atomic structures over 31 chemical compositions. Further methodological and structural information is contained in the dataset README.txt file.

36 MATERIALS SCIENCE↗

Materials Learning Algorithms (MALA): Scalable machine learning for electronic structure calculations in large-scale atomistic simulations

We present the Materials Learning Algorithms (MALA) package, a scalable machine learning framework designed to accelerate density functional theory (DFT) calculations suitable for large-scale atomistic simulations. Using local descriptors of the atomic environment, MALA models efficiently predict key electronic observables, including local density of states, electronic density, density of states, and total energy. The package integrates data sampling, model training and scalable inference into a unified library, while ensuring compatibility with standard DFT and molecular dynamics codes. We demonstrate MALA's capabilities with examples including boron clusters, aluminum across its solid-liquid phase boundary, and predicting the electronic structure of a stacking fault in a large beryllium slab. Scaling analyses reveal MALA's computational efficiency and identify bottlenecks for future optimization. With its ability to model electronic structures at scales far beyond standard DFT, MALA is well suited for modeling complex material systems, making it a versatile tool for advanced materials research.

Density functional theory↗

Novel Low-Cost, Low-Power Miniature Thermionic Cathode Developed for Microwave/Millimeter Wave Tube and Cathode Ray Tube Applications

A low cost, small size and mass, low heater power, durable high-performance barium dispenser thermionic cathode has been developed that offers significant advancements in the design, manufacture, and performance of the electron sources used in vacuum electronic devices--such as microwave (and millimeter wave) traveling-wave tubes (TWT's)--and in display devices such as high-brightness, high-resolution cathode ray tubes (CRT's). The lower cathode heater power and the reduced size and mass of the new cathode are expected to be especially beneficial in TWT's for deep space communications, where future missions are requiring smaller spacecraft, higher data transfer rates (higher frequencies and radiofrequency output power), and greater electrical efficiency. Also expected to benefit are TWT's for commercial and government communication satellites, for both low and geosynchronous Earth orbit, with additional benefits offered by lower cost and potentially higher cathode current loading. A particularly important TWT application is in the microwave power module (MPM), which is a hybrid microwave (or millimeter wave) amplifier consisting of a low-noise solid state driver, a vacuum power booster (small TWT), and an electronic power conditioner integrated into a single compact package. The attributes of compactness and potentially high electrical efficiency make the MPM very attractive for many commercial and government (civilian and defense) applications in communication and radar systems. The MPM is already finding application in defense electronic systems and is under development by NASA for deep space communications. However, for the MPM to become competitive and commercially successful, a major reduction in cost must be achieved.

Wintucky, Edwin G.↗

Vibration-based health characterization of multiple IMUs in UAV applications

Inertial measurement units (IMUs) are vital in UAV navigation for vehicle attitude and position estimation, especially in the frequently-occurring case of temporary loss of GPS capabilities. Degradation in these units could yield inaccurate position estimates, resulting in incorrect input for vehicle control systems. A wide variety of these units exist to meet the needs of UAV operators, general aviation, and military vehicles. In recent decades, lightweight and inexpensive MEMS sensors have grown in popularity with respect to UAVs. Studies into the failure modes of MEMS devices suggest that vibration is one of the leading causes of MEMS degradation. MEMS sensors are generally encased in their own hermetic packaging, as their small size and sensitivity cause them to be particularly vulnerable to air damping and particulate contamination when exposed. Exposure to excessive vibration can cause cracking in this packaging as well as damage to connecting electronics, with recorded results that cause sensors to act outside of their specifications, potentially providing unreliable input to controllers. A prior study from the Politecnico di Torino looked into the degradation of MEMS IMUs, specifically the AXIS-AIS402, for aerospace and vibrating environments. In the study, the authors found that after exposing MEMS IMUs to simulated vibrations from working conditions of aerospace applications, the sensors showed increased noise and increased bias instability. At NASA Ames, several widely-used MEMS IMUs were selected for a new IMU degradation study, comparing accelerometer performance before and after exposure to similar levels of vibration simulating aerospace conditions. The IMUs were selected from the Pixhawk autopilot systems, hobby sUAS, or prior experimental studies at NASA. Additionally, the industrial grade VectorNav-100 IMU was selected as a ground truth reference point to which the performance of the test sensors can be compared. In the study, each sensor is exposed to functional levels of UAV vibration as replicated on a single-frequency vibratory table in the NASA Ames SHARP Laboratory, and each accelerometer is characterized for bias, drift, and noise characteristics both before and after vibratory exposure. The focus of this study is to monitor the health of the IMU sensors and determine if sensor degradation can be detected from output error and frequency spectrum analysis, rather than from microscopic examination of the sensors. In this case, sensor degradation and faulty data can be more easily detectable by non-experts hoping to use these sensors as an important piece of an integrated package. In addition, specific sensor degradation modes potentially leading to in-flight hazards could be identified, such as accelerated levels of drift and altered temperature response. The overall goal of this work is to increase levels of safety for future users of these sensors and to provide a clear analysis of sensor limitations currently lacking in most sensor specification documentation.

IMUs↗

Flip chip packaging of a MEMS neuro-prosthetic system

A joint research team from California Institute of Technology and Jet Propulsion Laboratory is developing a fully miniaturized, smart implantable neuro-prosthetic system, by combining integrated electronics with Micro Electro Mechanical Structure (MEMS) based electrode arrays. The packaging group of this project team has been tasked with designing and fabricating a package to interface electrically between a MEMS electrode array, capable of extracting signals from brain, and an electronic chip, capable of providing on chip conditioning/processing of extracted data, while delivering the output data to a detector located outside the body.

flip↗

Double-probe potential measurements near the Spacelab 2 electron beam

As part of the Spacelab 2 mission the plasma diagnostics package (PDP) was released from the shuttle as a free-flying satellite. The PDP carried a quasi-static electric field instrument which made differential voltage measurements between two floating probes. At various times during the free flight, an electron beam was ejected from the shuttle. Large differential voltages between the double probes were recorded in association with the electron beam. However, analysis indicates that these large signals are probably not caused by ambient electric fields. Instead, they can be explained by considering three effects: shadowing of the probes from streaming electrons by the PDP chassis, crossing of the PDP wake by the probes, and spatial gradients in the fluxes of energetic electrons reaching the probes. Plasma measurements on the PDP show that energetic electrons exist in a region 20 m wide and up to at least 170 m downstream from the electron beam. At 80 or more meters downstream from the beam, the double probe measurements show that the energetic electron flux is opposite to the injection direction, as would be expected for a secondary returning electron beam produced by scattering of the primary electron beam.

Steinberg, J. T.↗

Magnetic tape transport for high reliability in space

Studies of tape recorder failure modes in spacecraft tape-recorder applications reveal that failures within the mechanical transport package far outnumber those of the associated electronics. It would, therefore, be desirable to simplify the transport mechanism and to separate the moving parts with a continuously fresh supply of a single inert lubricant medium. The suggestion is made to replace the ball bearings with hydrostatically pressurized fluid film bearings.

Hoffman, J. K.↗

First-Generation Jet Propulsion Laboratory "Hockey-Puck" Free-Flying Magnetometers for Distributed In-Situ Multiprobe Measurement of Current Density Filamentation in the Northern Auroral Zone: Enstrophy Mission

The sub-orbital rocket mission was a collaborative project between the University of New Hampshire, Cornell University, and the Jet Propulsion Laboratory (JPL) to study filamentation phenomena in the northern Auroral zone. The Enstrophy mission test flies the JPL Free-Flying Magnetometer (FFM) concept. The FFM technology development task has been funded by NASA develop miniaturized, low-power, integrated "sensorcrafts". JPL's role was to design, integrate, test, and deliver four FFMs for deployment from the sounding rocket, allowing a unique determination of curl-B. This provides a direct measurement of magnetic-field-aligned current density along the rocket trajectory. A miniaturized three-axis fluxgate magnetometer was integrated with a 4-channel 22-bit sigma-delta Analog to Digital Converter (ADC), four temperature sensors, digital control electronics, seven (Li-SOCl2) batteries, two (4 deg x 170 deg field of view) sun-sensors, a fan-shaped-beam laser diode beacon, a (16 MHz) stable Temperature Compensated Crystal Oscillator (TCXO) clock, Radio Frequency (RF) communication subsystem, and an antenna for approximately 15 minutes of operation where data was collected continuously and transmitted in three (3) bursts (approximately 26 seconds each) to ground station antennas at Poker Flat, Alaska. FFMs were stowed within two trays onboard the rocket during the rocket launch and were released simultaneously using the spinning action of the rocket at approximately 300 km altitude (approximately 100 sec. into the flight). FFMs were deployed with spin rate of approximately 17 Hz and approximately 3 m/sec linear velocity with respect to the rocket. For testing purposes while the rocket was in the launch pad and during flight prior to release of FFMs from the rocket, commands (such as "power on", "test", "flight", "power off', and clock "Reset" signal) were transmitted via a infrared Light Emitting Diode to an infrared detector in the FFM. Special attention was paid to low magnetic signature electronic design and choice of materials in packaging. The miniaturized fluxgate magnetometers had a range of 1-60000 nT with 0.1% full-scale linearity. The frequency range of interest for magnetic measurement was 10 mHz - 50 Hz. Digital data from the magnetometer's three axes were placed in a 4MB Static Random Access Memory (SRAM) in data packages (frames) formatted together with time tags and frame ID. After a specified time was elapsed, the data were Viterbi encoded and transmitted at a rate of 100 kbps (BPSK). Each of the four FFMs transmitted at different frequency. These carrier frequencies were in the range of 2200-2300 MHz. The antenna was a single patch on a high dielectric constant substrate covering one end-plate of the hockey-puck-sized unit. The local clocks aboard the FFMs were reset at the start of the mission and stayed synchronized within 3 msec during the mission. Position of each FFM with respect to the rocket is calculated by the knowledge of its release velocity (measured at exit point of the FFM launcher tract) providing an accuracy of 1 m over the maximum range of 3 km. Spatial and temporal nature of observants can be separated to within 3 m in space or 3 msec time interval.

Javadi, H.↗

Safe Handling Practices

In 1977 Compugraphic Corporation was experiencing an unacceptable failure rate on microelectronic chips. Company engineers suspected that static electricity was causing the trouble because some electronic components are highly susceptible to damage by electrostatic charge. From a NASA Tech Brief, they learned that Rockwell International had prepared a report on safe handling practices for electronic components. NASA provided a Technical Support Package detailing 50 safe handling procedures affecting workers, work areas, equipment and packaging materials. Where poor practices were discovered, re-education of employees and other corrective measures were undertaken.

Source record↗

Development of a Multi-Gas Microsensor Array for the Exploration Portable Life Support System

The Portable Life Support System (PLSS) of the Exploration Extravehicular Mobility Unit (xEMU) requires sensors capable of measuring the major constituents of the gas stream. These major constituents include oxygen, carbon dioxide, and water vapor. The sensors must operate across a wide range of flow and pressure conditions and introduce very low pressure drop in the ventilation loop. The sensors must operate with low power and occupy a small volume. This paper reports the development of a compact, low power, multi-parameter astronaut life support sensor (M-PALSS). M-PALSS consists of an array of low-power chemical microsensors for oxygen, carbon dioxide, water vapor, and pressure. M-PALSS includes custom electronics to control the sensors and is packaged in a custom housing that meets the volume and shape requirements for service in the PLSS.

James Makel↗

Development of a Multi-Gas Microsensor Array for the Exploration Portable Life Support System

The Portable Life Support System (PLSS) of the Exploration Extravehicular Mobility Unit (xEMU) requires sensors capable of measuring the major constituents of the gas stream. These major constituents include oxygen, carbon dioxide, and water vapor. The sensors must operate across a wide range of flow and pressure conditions and introduce very low pressure drop in the ventilation loop. The sensors must operate with low power and occupy a small volume. This paper reports the development of a compact, low power, multi-parameter astronaut life support sensor (M-PALSS). M-PALSS consists of an array of low-power chemical microsensors for oxygen, carbon dioxide, water vapor, and pressure. M-PALSS includes custom electronics to control the sensors and is packaged in a custom housing that meets the volume and shape requirements for service in the PLSS.

James Makel↗

Development of a Multi-Gas Microsensor Array for the Exploration Portable Life Support System

The Portable Life Support System (PLSS) of the Exploration Extravehicular Mobility Unit (xEMU) requires sensors capable of measuring the major constituents of the gas stream. These major constituents include oxygen, carbon dioxide, and water vapor. The sensors must operate across a wide range of flow and pressure conditions and introduce very low pressure drop in the ventilation loop. The sensors must operate with low power and occupy a small volume. This paper reports the development of a compact, low power, multi-parameter astronaut life support sensor (M-PALSS). M-PALSS consists of an array of low-power chemical microsensors for oxygen, carbon dioxide, water vapor, and pressure. M-PALSS includes custom electronics to control the sensors and is packaged in a custom housing that meets the volume and shape requirements for service in the PLSS.

James Makel↗

Thermally Stabilized Transmit/Receive Modules

RF-hybrid technologies enable smaller packaging and mass reduction in radar instruments, especially for subsystems with dense electronics, such as electronically steered arrays. We are designing thermally stabilized RF-hybrid T/R modules using new materials for improved thermal performance of electronics. We are combining advanced substrate and housing materials with a thermal reservoir material, and develop new packaging techniques to significantly improve thermal-cycling reliability and performance stability over temperature.

thermal cycling stress↗

Modular Low-Heater-Power Cathode/Electron Gun Assembly for Microwave and Millimeter Wave Traveling Wave Tubes

A low-cost, low-mass, electrically efficient, modular cathode/electron gun assembly has been developed by FDE Inc. of Beaverton, Oregon, under a Small Business Innovation Research (SBIR) contract with the NASA Glenn Research Center at Lewis Field. This new assembly offers significant improvements in the design and manufacture of microwave and millimeter wave traveling-wave tubes (TWT's) used for radar and communications. It incorporates a novel, low-heater-power, reduced size and mass, high-performance barium dispenser type thermionic cathode and provides for easy integration of the cathode into a large variety of conventional TWT circuits. Among the applications are TWT's for Earth-orbiting communication satellites and for deep space communications, where future missions will require smaller spacecraft, higher data transfer rates (higher frequencies and radiofrequency output power), and greater electrical efficiency. A particularly important TWT application is in the microwave power module (a hybrid microwave/millimeter wave amplifier consisting of a low-noise solid-state driver, a small TWT, and an electronic power conditioner integrated into a single compact package), where electrical efficiency and thermal loading are critical factors and lower cost is needed for successful commercialization. The design and fabrication are based on practices used in producing cathode ray tubes (CRT's), which is one of the most competitive and efficient manufacturing operations in the world today. The approach used in the design and manufacture of thermionic cathodes and electron guns for CRT's has been optimized for fully automated production, standardization of parts, and minimization of costs. It is applicable to the production of similar components for microwave tubes, with the additional benefits of low mass and significantly lower cathode heater power (less than half that of dispenser cathodes presently used in TWT s). Modular cathode/electron gun assembly. The modular cathode/electron gun assembly consists of four subassemblies the cathode, the focus electrode, the header (including the electrical feedthroughs), and the gun envelope (including the anode) a diagram of which is shown. The modular construction offers a number of significant advantages, including flexibility of design, interchangeability of parts, and a drop-in final assembly procedure for quick and accurate alignment. The gun can accommodate cathodes ranging in size from 0.050 to 0.250-in. in diameter and is applicable to TWT's over a broad range of sizes and operating parameters, requiring the substitution of only a few parts: that is, the cathode, focus electrode, and anode. The die-pressed cathode pellets can be made with either flat or concave (Pierce gun design) emitting surfaces. The gun can be either gridded (pulse operation) or ungridded (continuous operation). Important factors contributing to low cost are the greater use of CRT materials and parts, the standardization of processes (welding and mechanical capture), and tooling amenable to automated production. Examples are the use of simple shapes, drawn or stamped metal parts, and parts joined by welding or mechanical capture. Feasibility was successfully demonstrated in the retrofit and testing of a commercial Kaband (22-GHz) TWT. The modular cathode/electron gun assembly was computer modeled to replicate the performance of the original electron gun and fabricated largely from existing CRT parts. Significant test results included demonstration of low heater power (1.5-W, 1010 C brightness temperature for a 0.085-in.-diameter cathode), mechanical ruggedness (100g shock and vibration tests in accordance with military specifications (MIL specs)), and a very fast warmup. The results of these tests indicate that the low-cost CRT manufacturing approach can be used without sacrificing performance and reliability.

Wintucky, Edwin G.↗

Three-dimensional simulation of whistler mode excited by the Spacelab 2 electron beam

During the Spacelab 2 mission, while an electron beam was being ejected from the Shuttle, the Plasma Diagnostics Package (PDP) detected a clear funnel-shaped emission that is believed to be caused by whistler-mode emission from the electron beam. In order to understand the mechanism of this emission, simulations with a three-dimensional partially magnetostatic code have been performed. The simulation results show that whistler-mode and lower hybrid waves are excited by the electron beam, which is initially localized in the column in the three-dimensional simulation system, and that they propagate away from the beam. The wave spectra of the electric and magnetic fields diagnosed at some points show several peaks due to the waves excited by the electron beam. The frequency range of these spectra is in qualitative agreement with the PDP data. The intense narrowband electrostatic emission near the electron plasma frequency is observed by the simulations. The simulation results show that the beam instability is responsible for the generation mechanism of these emissions.

Nishikawa, K.-I.↗

Coherent Cerenkov radiation from the Spacelab 2 electron beam

The plasma environment of the Spacelab 2 mission was investigated through the deployment of the Plasma Diagnostics Package (PDP) by the Space Shuttle Orbiter and the Orbiter's ejection of a continuous 1-keV/50-mA electron beam along a field line. As the PDP flew by the beam, its plasma-wave instrument detected intense whistler-mode radiation originating from the beam. A detailed model has been developed of the coherent Cerenkov emission process, using a one-dimensional computer simulation of the beam to model the expected phase space structure of the electrons. The power calculated for the modeled 200-m beam segment can easily account for the measured whistler mode wave power.

Farrell, W. M.↗

Advanced packaging for Integrated Micro-Instruments

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

Lyke, James L.↗