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At least 631 records · Page 35

Evaluation of Dynamic Mechanical Loading as an Accelerated Test Method for Ribbon Fatigue

Dynamic Mechanical Loading (DML) of photovoltaic modules is explored as a route to quickly fatigue copper interconnect ribbons. Results indicate that most of the interconnect ribbons may be strained through module mechanical loading to a level that will result in failure in a few hundred to thousands of cycles. Considering the speed at which DML may be applied, this translates into a few hours of testing. To evaluate the equivalence of DML to thermal cycling, parallel tests were conducted with thermal cycling. Preliminary analysis suggests that one +/-1 kPa DML cycle is roughly equivalent to one standard accelerated thermal cycle and approximately 175 of these cycles are equivalent to a 25-year exposure in Golden Colorado for the mechanism of module ribbon fatigue.

14 SOLAR ENERGY↗

Develop Silicone Encapsulation Systems for Terrestrial Silicon Solar Arrays

The results of a study for Task 3 of the Low Cost Solar Array Project, directed toward the development of a cost effective encapsulation system for photovoltaic modules using silicon based materials, are reported. Results of the following are discussed: (1) weather-ometer stressing vs. weathering history of silicon and silicon modified materials; (2) humidity/temperature cycling exposure; (3) exposure at high humidity/high temperature; (4) outdoor exposure stress; (5) thermal cycling stress; and (6) UV screening agents. The plans for the next quarter are outlined.

Source record↗

Develop Silicone Encapsulation Systems for Terrestrial Silicon Solar Arrays

The results for Task 3 of the Low Cost Solar Array Project are presented. Task 3 is directed toward the development of a cost effective encapsulating system for photovoltaic modules using silicon based materials. The technical approach of the contract effort is divided into four special tasks: (1) technology review; (2) generation of concepts for screening and processing silicon encapsulation systems; (3) assessment of encapsulation concepts; and (4) evaluation of encapsulation concepts. The candidate silicon materials are reviewed. The silicon and modified silicon resins were chosen on the basis of similarity to materials with known weatherability, cost, initial tangential modulus, accelerated dirt pick-up test results and the ratio of the content of organic phenyl substitution of methyl substitution on the backbone of the silicon resin.

Source record↗

Procedure for developing experimental designs for accelerated tests for service-life prediction

Recommended design procedures to reduce the complete factorial design by retaining information on anticipated important interaction effects, and by generally giving up information on unconditional main effects are discussed. A hypothetical photovoltaic module used in the test design is presented. Judgments were made of the relative importance of various environmental stresses such as UV radiation, abrasion, chemical attack, temperature, mechanical stress, relative humidity and voltage. Consideration is given to a complete factorial design and its graphical representation, elimination of selected test conditions, examination and improvement of an engineering design, and parametric study. The resulting design consists of a mix of conditional main effects and conditional interactions and represents a compromise between engineering and statistical requirements.

Thomas, R. E.↗

Glass fiber reinforced concrete for terrestrial photovoltaic arrays

The use of glass-fiber-reinforced concrete (GRC) as a low-cost structural substrate for terrestrial solar cell arrays is discussed. The properties and fabrication of glass-reinforced concrete structures are considered, and a preliminary design for a laminated solar cell assembly built on a GRC substrate is presented. A total cost for such a photovoltaic module, composed of a Korad acrylic plastic film front cover, an aluminum foil back cover, an ethylene/vinyl acetate pottant/adhesive and a cotton fabric electrical isolator in addition to the GRC substrate, of $9.42/sq m is projected, which is less than the $11.00/sq m cost goal set by the Department of Energy. Preliminary evaluations are concluded to have shown the design capabilities and cost effectiveness of GRC; however, its potential for automated mass production has yet to be evaluated.

Maxwell, H.↗

LSA field test

After almost four years of endurance testing of photovoltaic modules, no fundamental life-limiting mechanisms were identified that could prevent the twenty-year life goal from being met. The endure data show a continual decline in the failure rate with each new large-scale procurement. Cracked cells and broken interconnects continue to be the principal causes of failure. Although the modules are more adversely affected physically by hot, humid environments than by cool or dry environments there are insufficient data to correlate failure with environment. There is little connection between the outward physical condition of a module and changes in its electrical performance.

Jaffe, P.↗

Design, analysis, and test verification of advanced encapsulation systems

Thermal, optical, structural, and electrical isolation analyses are decribed. Major factors in the design of terrestrial photovoltaic modules are discussed. Mechanical defects in the different layers of an encapsulation system, it was found, would strongly influence the minimum pottant thickness required for electrical isolation. Structural, optical, and electrical properties, a literature survey indicated, are hevily influenced by the presence of moisture. These items, identified as technology voids, are discussed. Analyses were based upon a 1.2 meter square module using 10.2 cm (4-inch) square cells placed 1.3 mm apart as shown in Figure 2-2. Sizing of the structural support member of a module was determined for a uniform, normal pressure load of 50 psf, corresponding to the pressure difference generated between the front and back surface of a module by a 100 mph wind. Thermal and optical calculations were performed for a wind velocity of 1 meter/sec parallel to the ground and for module tilt (relative to the local horizontal) of 37 deg. Placement of a module in a typical array field is illustrated.

Garcia, A.↗

Bypass diode integration

Protective bypass diodes and mounting configurations which are applicable for use with photovoltaic modules having power dissipation requirements in the 5 to 50 watt range were investigated. Using PN silicon and Schottky diode characterization data on packaged diodes and diode chips, typical diodes were selected as representative for each range of current carrying capacity, an appropriate heat dissipating mounting concept along with its environmental enclosure was defined, and a thermal analysis relating junction temperature as a function of power dissipation was performed. In addition, the heat dissipating mounting device dimensions were varied to determine the effect on junction temperature. The results of the analysis are presented as a set of curves indicating junction temperature as a function of power dissipation for each diode package.

Shepard, N. F., Jr.↗

Wafering economies for industrialization from a wafer manufacturer's viewpoint

The key technical limitations which inhibit the lowering of value-added costs for state-of-the-art wafering techniques are assessed. From the best experimental results to date, a projection was made to identify those parts of each system which need to be developed in order to meet or improve upon the value-added cost reduction necessary for $0.70/Wp photovoltaics modules.

Rosenfield, T. P.↗

Design, analysis, and test verification of advanced encapsulation systems

Design sensitivities are established for the development of photovoltaic module criteria and the definition of needed research tasks. The program consists of three phases. In Phase I, analytical models were developed to perform optical, thermal, electrical, and structural analyses on candidate encapsulation systems. From these analyses several candidate systems will be selected for qualification testing during Phase II. Additionally, during Phase II, test specimens of various types will be constructed and tested to determine the validity of the analysis methodology developed in Phase I. In Phse III, a finalized optimum design based on knowledge gained in Phase I and II will be developed. All verification testing was completed during this period. Preliminary results and observations are discussed. Descriptions of the thermal, thermal structural, and structural deflection test setups are included.

Mardesich, N.↗

Experimental evaluation of the Battelle accelerated test design for the solar array at Mead, Nebraska

A previously developed test design for accelerated aging of photovoltaic modules was experimentally evaluated. The studies included a review of relevant field experience, environmental chamber cycling of full size modules, and electrical and physical evaluation of the effects of accelerated aging during and after the tests. The test results indicated that thermally induced fatigue of the interconnects was the primary mode of module failure as measured by normalized power output. No chemical change in the silicone encapsulant was detectable after 360 test cycles.

Frickland, P. O.↗

An investigation of the effect of wind cooling on photovoltaic arrays

Convective cooling of photovoltaic modules for different wind conditions, including steady state controlled testing in a solar simulator and natural test environments in a field was investigated. Analytical thermal models of different module designs were used to correlate experimental data. The applicability of existing heat transfer correlations is confirmed. Reasonable agreement is obtained by applying a power law wind profile.

Wen, L.↗

An analytical approach to photovoltaic encapsulation system design

This paper describes a set of analytical methods which have been developed to enable quantitative analysis of encapsulation system designs for terrestrial photovoltaic modules. Design factors determined most important include: encapsulant thickness and modules, emissivity of module surface, ribs on substrate modulus, and AR.

Garcia, A., III↗

The solar cell laser scanner

As part of the Low Cost Solar Array Program at Jet Propulsion Laboratory, failure analyses have been performed on over 300 photovoltaic modules from thirty different manufacturers and five countries. Because of the volume of work and the variety of module types encountered, it has been necessary to develop non-destructive techniques to rapidly locate the failure sites. This paper will present design details and results obtained with one instrument developed specifically for this purpose, the Solar Cell Laser Scanner (SCLS). The effects of applying a bias current to the modules will also be discussed, based upon experimental observations and computer generated predictions.

Miller, E. L.↗

Designing Flat-Plate Photovoltaic Arrays

Report presents overview of state of art in design techniques for flat-plate solar photovoltaic modules and arrays. Paper discusses design requirements, design analyses, and test methods identified and developed for this technology over past several years in effort to reduce cost and improve utility and reliability for broad spectrum of terrestrial applications.

Ross, R. G., Jr.↗

Terminal System for Photovoltaic Arrays

Quick-connect terminal system provides electrical contact and physical alinement between adjacent photovoltaic modules. Dual-ended plugs connect adjacent modules; single-ended plugs connect bus cables. No tools required to insert plugs and no live terminals exposed before, during, or after connection.

Maloney, T. J.↗

Price estimates for the production of wafers from silicon ingots

The status of the inside-diameter sawing, (ID), multiblade sawing (MBS), and fixed-abrasive slicing technique (FAST) processes are discussed with respect to the estimated price each process adds on to the price of the final photovoltaic module. The expected improvements in each process, based on the knowledge of the current level of technology, are projected for the next two to five years and the expected add-on prices in 1983 and 1986 are estimated.

Mokashi, A. R.↗