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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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623 records · Page 35
All sourcesNASA NTRSDOE OSTI
NASA NTRS1973

The effect of thermal cycling on the structure and properties of a Co, Cr, Ni-TaC directionally solidified eutectic composite

A Co, Cr, Ni-TaC directionally solidified eutectic composite was subjected to thermal fatigue between 427-1093°C. The material suffered degradation in microstructure and elevated temperature mechanical properties. The loss in properties varied with the maximum cycling temperature and number of cycles. This behavior is attributed to the increasing solubility of the TaC in the matrix with temperature from 0.4% at room temperature to 2.2% at 1200°C. During the thermal cycling, the TaC is subjected to solution and reprecipitation which form serrations on the fibers since the easy growth planes of the TaC are not coincident with the fiber faces exposed to the matrix.

Composites↗
NASA NTRS2017

High Temperature Characteristics of Pt/TaSi2/Pt/W and Pt/Ti/W Diffusion Barrier Systems for Ohmic Contacts to 4H-SiC

The degradation of ohmic contacts to 4H-SiC pressure sensors over time at high temperature is primarily due to two failure mechanisms: migrating bond pad Au and atmospheric O toward the ohmic contact SiC interface and the inter-metallic mixing between diffusion barrier systems (DBS) and the underlying ohmic contact metallization. We investigated the effectiveness of Pt/TaSi2/Pt/W (DBS-A) and Pt/Ti/W (DBS-B) in preventing Au and O diffusion through the underlying binary Ti/W or alloyed W50:Ni50 ohmic contacts to 4H-SiC and the DBS ohmic contact intermixing at temperature up to 700 C.

Platinum↗
NASA NTRS2018

Cracking Problems and Mechanical Characteristics of PME and BME Ceramic Capacitors

Most failures in MLCCs are caused by cracking that create shorts between opposite electrodes of the parts. A use of manual soldering makes this problem especially serious for space industry. Experience shows that different lots of ceramic capacitors might have different susceptibility to cracking under manual soldering conditions. This simulates a search of techniques that would allow revealing capacitors that are most robust to soldering-induced stresses. Currently, base metal electrode (BME) capacitors are introduced to high-reliability applications as a replacement of precious metal electrode (PME) parts. Understanding the difference in the susceptibility to cracking between PME and BME capacitors would facilitate this process. This presentation gives a review of mechanical characteristics measured in-situ on MLCCs that includes flexural strength, Vickers hardness, indentation fracture toughness, and the board flex testing and compare characteristics of BME and PME capacitors. A history case related to cracking in PME capacitors that caused flight system malfunctions and mechanisms of failure are considered. Possible qualification tests that would allow evaluation of the resistance of MLCCs to manual soldering are suggested and perspectives related to introduction of BME capacitors discussed.

Reliability↗