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At least 649 records · Page 36

Reliability and risk assessment of structures

Development of reliability and risk assessment of structural components and structures is a major activity at Lewis Research Center. It consists of five program elements: (1) probabilistic loads; (2) probabilistic finite element analysis; (3) probabilistic material behavior; (4) assessment of reliability and risk; and (5) probabilistic structural performance evaluation. Recent progress includes: (1) the evaluation of the various uncertainties in terms of cumulative distribution functions for various structural response variables based on known or assumed uncertainties in primitive structural variables; (2) evaluation of the failure probability; (3) reliability and risk-cost assessment; and (4) an outline of an emerging approach for eventual certification of man-rated structures by computational methods. Collectively, the results demonstrate that the structural durability/reliability of man-rated structural components and structures can be effectively evaluated by using formal probabilistic methods.

Chamis, C. C.↗

Improvements in High Speed, High Resolution Dynamic Digital Image Correlation for Experimental Evaluation of Composite Drive System Components

Composite materials have the potential to reduce the weight of rotating drive system components. However, these components are more complex to design and evaluate than static structural components in part because of limited ability to acquire deformation and failure initiation data during dynamic tests. Digital image correlation (DIC) methods have been developed to provide precise measurements of deformation and failure initiation for material test coupons and for structures under quasi-static loading. Attempts to use the same methods for rotating components (presented at the AHS International 68th Annual Forum in 2012) are limited by high speed camera resolution, image blur, and heating of the structure by high intensity lighting. Several improvements have been made to the system resulting in higher spatial resolution, decreased image noise, and elimination of heating effects. These improvements include the use of a high intensity synchronous microsecond pulsed LED lighting system, different lenses, and changes in camera configuration. With these improvements, deformation measurements can be made during rotating component tests with resolution comparable to that which can be achieved in static tests

high speed imaging↗

Improvements in High Speed, High Resolution Dynamic Digital Image Correlation for Experimental Evaluation of Composite Drive System Components

Composite materials have the potential to reduce the weight of rotating drive system components. However, these components are more complex to design and evaluate than static structural components in part because of limited ability to acquire deformation and failure initiation data during dynamic tests. Digital image correlation (DIC) methods have been developed to provide precise measurements of deformation and failure initiation for material test coupons and for structures under quasi-static loading. Attempts to use the same methods for rotating components (presented at the AHS International 68th Annual Forum in 2012) are limited by high speed camera resolution, image blur, and heating of the structure by high intensity lighting. Several improvements have been made to the system resulting in higher spatial resolution, decreased image noise, and elimination of heating effects. These improvements include the use of a high intensity synchronous microsecond pulsed LED lighting system, different lenses, and changes in camera configuration. With these improvements, deformation measurements can be made during rotating component tests with resolution comparable to that which can be achieved in static tests.

composite materials↗

Improvements in High Speed, High Resolution Dynamic Digital Image Correlation for Experimental Evaluation of Composite Drive System Components

Composite materials have the potential to reduce the weight of rotating drive system components. However, these components are more complex to design and evaluate than static structural components in part because of limited ability to acquire deformation and failure initiation data during dynamic tests. Digital image correlation (DIC) methods have been developed to provide precise measurements of deformation and failure initiation for material test coupons and for structures under quasi-static loading. Attempts to use the same methods for rotating components (presented at the AHS International 68th Annual Forum in 2012) are limited by high speed camera resolution, image blur, and heating of the structure by high intensity lighting. Several improvements have been made to the system resulting in higher spatial resolution, decreased image noise, and elimination of heating effects. These improvements include the use of a high intensity synchronous microsecond pulsed LED lighting system, different lenses, and changes in camera configuration. With these improvements, deformation measurements can be made during rotating component tests with resolution comparable to that which can be achieved in static tests.

Kohlman, Lee↗

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Electric aircrafts↗

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Multifunctional↗

Structural loads.

Structural loads calculated for launch and reentry vehicles, noting extra loads due to system failures

REENTRY VEHICLE↗

Status Update on the Development of Transducers and Bonding Techniques for Enabling Acoustic Measurements of Damage in Microreactor Components

This report provides an overview of potential sensors and sensor-bonding techniques to enable the online acoustic interrogation of microreactor components and enhance structural health monitoring capabilities. The report focuses primarily on optical fiber–based acoustic sensors and describes initial experimental progress toward the deployment of these sensors for microreactor applications. The general approach is to monitor the resonant frequencies of microreactor components and search for evidence of structural defects that could indicate imminent failure. If properly identified, then the components could be repaired during the next reactor outage to prevent costly unplanned shutdowns. The ability to monitor the structural health of components could also reduce the need for time-consuming visual inspections and reduce staffing to improve microreactor economic viability. Increased sensor density is also one of the first steps to moving toward eventual semiautonomous operation. The expected microreactor conditions in which acoustic sensors must survive are characterized, including temperatures, neutron fluences, thermomechanical strains, and vibrational frequencies. Optical fiber–based acoustic sensors are identified as an attractive candidate for acoustic monitoring because of their high accuracy, immunity to electromagnetic interference, and resiliency in high-temperature, high-radiation environments. Optical fiber–based intrinsic sensors, such as type-II fiber-Bragg gratings and Fabry-Pérot Cavities (FPCs), are particularly attractive for a microreactor environment because of their high temperature stability, and FPCs also enable higher frequency interrogation with a lower sensitivity to radiation-induced drift. This report describes multiple interrogation systems, but the best interrogation system for a given situation will depend on the specific microreactor application, including the desired acoustic vibrational amplitudes, modes, and resonant frequencies. Initial experiments included fabricating three FPCs, tack-welding these FPCs to stainless-steel pipes or rods and performing room-temperature acoustic sensing tests to capture the vibrational frequency content. Peaks were identified in the measured frequency spectra and compared with the theoretical fundamental frequencies obtained from Euler-Bernoulli beam theory. Two of the three FPCs measured vibrational frequencies that generally matched those obtained from theory. Future work will include similar testing on pipes or other microreactor components with intentional flaws to evaluate the ability to determine changes in resonant frequencies. Finally, these tests will be repeated at high temperatures, potentially with an applied thermomechanical stress, to include environmental conditions similar to those for a microreactor application.

21 SPECIFIC NUCLEAR REACTORS AND ASSOCIATED PLANTS↗

Logic analysis of complex systems by characterizing failure phenomena to achieve diagnosis and fault-isolation

A recent result shows that, for a certain class of systems, the interdependency among the elements of such a system together with the elements constitutes a mathematical structure a partially ordered set. It is called a loop free logic model of the system. On the basis of an intrinsic property of the mathematical structure, a characterization of system component failure in terms of maximal subsets of bad test signals of the system was obtained. Also, as a consequence, information concerning the total number of failure components in the system was deduced. Detailed examples are given to show how to restructure real systems containing loops into loop free models for which the result is applicable.

Wong, J. T.↗

Flightweight radiantly and actively cooled panel: Thermal and structural performance

A 2- by 4-ft flightweight panel was subjected to thermal/structural tests representative of design flight conditions for a Mach 6.7 transport and to off-design conditions simulating flight maneuvers and cooling system failures. The panel utilized Rene 41 heat shields backed by a thin layer of insulation to radiate away most of the 12 Btu/ft2-sec incident heating. A solution of ethylene glycol in water circulating through tubes in an aluminum-honeycomb-sandwich panel absorbed the remainder of the incident heating (0.8 Btu/sq ft-sec). The panel successfully withstood (1) 46.7 hr of radiant heating which included 53 thermal cycles and 5000 cycles of uniaxial inplane loading of + or - 1200 lfb/in; (2) simulated 2g-maneuver heating conditions and simulated cooling system failures without excessive temperatures on the structural panel; and (3) the extensive thermal/structural tests and the aerothermal tests reported in NASA TP-1595 without significant damage to the structural panel, coolant leaks, or hot-gas ingress to the structural panel.

Shore, C. P.↗

Structural evaluation of concepts for a solar energy concentrator for Space Station advanced development program

Solar dynamic power systems have a higher thermodynamic efficiency than conventional photovoltaic systems; therefore they are attractive for long-term space missions with high electrical power demands. In an investigation conducted in support of a preliminary concept for Space Station Freedom, an approach for a solar dynamic power system was developed and a number of the components for the solar concentrator were fabricated for experimental evaluation. The concentrator consists of hexagonal panels comprised of triangular reflective facets which are supported by a truss. Structural analyses of the solar concentrator and the support truss were conducted using finite-element models. A number of potential component failure scenarios were postulated and the resulting structural performance was assessed. The solar concentrator and support truss were found to be adequate to meet a 1.0-Hz structural dynamics design requirement in pristine condition. However, for some of the simulated component failure conditions, the fundamental frequency dropped below the 1.0-Hz design requirement. As a result, two alternative concepts were developed and assessed. One concept incorporated a tetrahedral ring truss support for the hexagonal panels: the second incorporated a full tetrahedral truss support for the panels. The results indicate that significant improvements in stiffness can be obtained by attaching the panels to a tetrahedral truss, and that this concentrator and support truss will meet the 1.0-Hz design requirement with any of the simulated failure conditions.

Kenner, Winfred S.↗

Heat flux in a non-Maxwellian plasma

A hybrid numerical scheme is applied to solve the Landau equation for the electron distribution function over all velocity space. Evidence is presented for the first time of the degree and character of the failure of the classical Spitzer-Haerm heat flux approximation in a realistic solar coronal loop structure. In the loop model used, the failure is so severe at some points that the role of the heat flux in the plasma's energy balance is completely misinterpreted. In the lower corona the Spitzer-Haerm approximation predicts that the heat flux should act as an energy source, whereas the more accurate distribution functions calculated here show this to be an energy sink.

Ljepojevic, N. N.↗

Preliminary metallographic studies of ball fatigue under rolling-contact conditions

The metallurgical results produced on balls tested in the rolling-contact fatigue spin rig were studied by metallographic examination. Origin and progression of fatigue failures were observed. These evaluations were made on SAE 52100 and AISI M-1 balls fatigue tested at room temperature (80 F) and 200 to 250 F. Most failures originated subsurface in shear; inclusions, structure changes, and directionalism adversely affected ball fatigue life. Structures in the maximum-shear-stress region of the balls of both materials were stable at room temperature and unstable at 200 to 250 F. Failures were of the same type as those found in full-scale bearings.

SURFACES, CONTACT - ROLLING↗

Deformation and failure of the CrCoNi medium-entropy alloy subjected to extreme shock loading

The extraordinary work hardening ability and fracture toughness of the face-centered cubic (fcc) high-entropy alloys render them ideal candidates for many structural applications. Here, the deformation and failure mechanisms of an equiatomic CrCoNi medium-entropyalloy (MEA) were investigated by powerful laser-driven shock experiments. Multiscale characterization demonstrates that profuse planar defects including stacking faults, nanotwins, and hexagonal nanolamella were generated during shock compression, forming a three-dimensional network. During shock release, the MEA fractured by strong tensile deformation and numerous voids was observed in the vicinity of the fracture plane. High defect populations, nanorecrystallization, and amorphization were found adjacent to these areas of localized deformation. Molecular dynamics simulations corroborate the experimental results and suggest that deformation-induced defects formed before void nucleation govern the geometry of void growth and delay their coalescence. Our results indicate that the CrCoNi-based alloys are impact resistant, damage tolerant, and potentially suitable in applications under extreme conditions.

36 MATERIALS SCIENCE↗

Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

Fayette, Daniel F.↗

Structural analysis of a thermal insulation retainer assembly

In January 1989 an accident occurred in the National Transonic Facility wind tunnel at NASA Langley Research Center that was believed to be caused by the failure of a thermal insulation retainer. A structural analysis of this retainer assembly was performed in order to understand the possible failure mechanisms. Two loading conditions are important and were considered in the analysis. The first is the centrifugal force due to the fact that this retainer is located on the fan drive shaft. The second loading is a differential temperature between the retainer assembly and the underlying shaft. Geometrically nonlinear analysis is required to predict the stiffness of this component and to account for varying contact regions between various components in the assembly. High, local stresses develop in the band part of the assembly near discontinuities under both the centrifugal and thermal loadings. The presence of an aluminum ring during a portion of the part's operating life was found to increase the stresses in other regions of the band. Under the centrifugal load, high bending stresses develop near the intersection of the band with joints in the assembly. These high bending stresses are believed to be the most likely cause for failure of the assembly.

Greene, William H.↗

Commercialization of NESSUS: Status

A plan was initiated in 1988 to commercialize the Numerical Evaluation of Stochastic Structures Under Stress (NESSUS) probabilistic structural analysis software. The goal of the on-going commercialization effort is to begin the transfer of Probabilistic Structural Analysis Method (PSAM) developed technology into industry and to develop additional funding resources in the general area of structural reliability. The commercialization effort is summarized. The SwRI NESSUS Software System is a general purpose probabilistic finite element computer program using state of the art methods for predicting stochastic structural response due to random loads, material properties, part geometry, and boundary conditions. NESSUS can be used to assess structural reliability, to compute probability of failure, to rank the input random variables by importance, and to provide a more cost effective design than traditional methods. The goal is to develop a general probabilistic structural analysis methodology to assist in the certification of critical components in the next generation Space Shuttle Main Engine.

Thacker, Ben H.↗

Structural breakdown in high power GaN-on-GaN p-n diode devices stressed to failure

The morphology of GaN-on-GaN vertical p-i-n diode devices after reverse-bias electrical stressing to breakdown has been investigated. All failed devices had irreversible structural damage, showing large surface craters that were ∼15–35 μm deep with lengthy surface cracks. Cross-sectional electron micrographs of failed devices showed substantial concentrations of threading dislocations around the cracks and near the crater surfaces. Progressive ion-milling across damaged devices revealed high densities of threading dislocations and the presence of voids beneath the surface cracks; these features were not observed in any unstressed devices. These results should serve as a useful reference for future reliability studies of vertical high-power GaN devices.

Peri, Prudhvi (ORCID:000000022338441X)↗