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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 667 records · Page 37

Advanced Thermal Management for High Power Density Electronics

Demand for enhanced cooling technologies within various commercial and consumer applications has increased in recent decades due to electronic devices becoming more energy dense. This study demonstrates jumping-droplet based electric-field-enhanced (EFE) condensation as a potential method to achieve active hot spot cooling in electronic devices. To test the viability of EFE condensation, we developed an experimental setup to remove heat via droplet evaporation from single and multiple high power gallium nitride (GaN) transistors acting as local hot spots (4.6 mm x 2.6 mm). An externally powered circuit was developed to direct jumping droplets from a copper oxide (CuO) nanostructured superhydrophobic surface to the transistor hot spots by applying electric fields between the condensing surface and the transistor. Heat transfer measurements were performed in ambient air (22-25°C air temperature, 20-45% relative humidity) to determine the effects of gap spacing (2-4 mm), electric field (50-250 V/cm), and heat flux (demonstrated to 13 W/cm 2 ). EFE condensation was shown to enhance the heat transfer from the local hot spot by ≈ 200% compared to cooling without jumping and by 20% compared to non-EFE jumping. Dynamic switching of the electric field for a two-GaN system reveals the potential for active cooling of mobile hot spots. The opportunity for further cooling enhancement by the removal of non-condensable gases promises hot spot heat dissipation rates approaching 120 W/cm 2 . This work provides a framework for the development of active jumping droplet based vapor chambers and heat pipes capable of spatial and temporal thermal dissipation control.

42 ENGINEERING↗

Data-driven Cyberattack Detection for Photovoltaic (PV) Systems through Analyzing Micro-PMU Data

With increasing exposure to software-based sensing and control, Photovoltaic (PV) systems are facing higher risks of cyber attacks. Here, to ensure the system stability and minimize potential economic losses, it is imperative to monitor operating states and detect attacks at the early stage. To meet this demand, Micro-Phasor Measurement Units (μPMU) are increasingly popular in monitoring distribution networks. However, due to the relatively low sampling rate, μPMU has not yet been used to detect and classify cyber-attacks in power electronics enabled smart grid. To our knowledge, this is one of the first attempts to use μPMU to detect cyber attacks that degrade the performance of power electronics systems. We propose to apply data-driven methods on micro-PMU data to implement attack detection. We have evaluated data-driven methods, including decision tree (DT), K-nearest neighbor (KNN), support vector machine (SVM), artificial neural network (ANN), long short-term memory (LSTM) and convolutional neural network (CNN). The proposed CNN model achieves the required performances with the highest 99.23% accuracy and 0.9963 F 1 score.

14 SOLAR ENERGY↗

Architecture of a Residential Solid State Power Substation (SSPS) Node

High integration rates of new loads and distributed generation at the edge of the grid are posing new challenges. However, existing smart power electronic systems are not designed to coordinate and maximize grid support or provide multiple grid services simultaneously. This work presents the application of a solid-state power substation (SSPS) to residential systems to increase this coordination and reduce future challenges. The proposed residential SSPS is validated in simulation including power electronic converter models, feeder models, and optimization.

Krishna Moorthy, Radha↗

Interarea Oscillation Damping Control Using High-Voltage DC Transmission: A Survey

High-voltage, direct current (HVDC) transmission lines are increasingly being installed in power systems around the world, and this trend is expected to continue with advancements in power electronics technology. These advancements are also bringing multi-terminal direct current (MTDC) systems closer to practical application. In addition, the continued deployment of phasor measurement units (PMUs) makes dynamic information about a large power system readily available for highly controllable components, such as HVDC lines. All these trends have increased the appeal of modulating HVDC lines and MTDC systems to provide grid services in addition to bulk power transfers. This paper provides a literature survey of HVDC and MTDC damping controllers for interarea oscillations in large interconnected power systems. The literature shows a progression from theoretical research to practical applications. There are already practical implementations of HVDC modulation for lines in point-to-point configuration, although the modulation of MTDC systems is still in the research stage. As a conclusion, this paper identifies and summarizes open questions that remain to be tackled by researchers and engineers.

Elizondo, Marcelo A. (ORCID:000000026621252X)↗

A Hot‐Swappable, Fault‐Tolerant, Modular Power Converter System for Solar Photovoltaic Plants

The performance metrics of the state-of-the-art commercial solar inverters, such as system cost, operation and maintenance (O&M) cost, service life, reliability, maintainability, and power density are much lower than the target metrics needed to achieve SunShot’s 2030 levelized cost of energy (LCOE) goals. To overcome the shortcomings of the existing solar inverters, this project proposed a novel Hot-Swappable, Fault-Tolerant, Modular Power Converter (HSFT-MPC) concept for solar photovoltaic (PV) plants and proved the concept through the design, fabrication, and laboratory test validation of a single-phase HSFT-MPC prototype. The HSFT-MPC has the following distinct advantages over the state-of-the-art: 1) elimination of harmonic/ electromagnetic interference (EMI) filter in the inverter stage due to the novel topology, 2) lower system cost and higher power density due to the modular design, elimination of harmonic/EMI filter, and lower cooling requirement, 3) higher efficiency due to lower switching frequencies, 4) higher reliability and longer (50 years) service life due to simpler cooling and fault tolerance capability, 5) easier installation, lower O&M cost, and improved maintainability due to the modular design and hot-swappable power electronic building blocks (PEBBs), and 6) improved manufacturability due to the modular design. This project developed a single-phase HSFT-MPC prototype with 25kW nominal output power, 2.4kV, 60Hz nominal AC output, lower than 5% AC output voltage total harmonic distortion, over 5 kW/L inverter power density, and 99.4% inverter peak efficiency, being tolerant to failure of single and multiple PEBBs, and capable of hot swapping of the failed PEBB(s). The HSFT-MPC enables uninterruptable operation of the solar PV plant when failure of single or multiple PEBBs or PV modules occurs. Compared with the existing solar inverters in the market, the HSFT-MPC is expected to reduce the inverter failure-caused downtime and energy losses of solar PV plants by more than 60% and 50%, respectively. Project findings have been presented at major conferences in the field and published in peer-reviewed papers, which added new knowledge to the field of power electronics for solar PV systems. A minicourse on Solar PV Systems was developed for outreach activities. The minicourse will help attract young individuals to the renewable energy profession which has a significant talent shortage. The HSFT-MPC is expected to overcome all of the shortcomings of the state-of-the-art solar inverters in terms of cost, efficiency, service life, reliability, maintainability, and manufacturability targets needed to achieve SunShot’s 2030 LCOE goals. Therefore, the proposed HSFT-MPC concept has the great potential to disrupt the current solar inverter market. This project created a pathway towards industry adoption of the HSFT-MPC to help achieve 50-year service life solar PV systems. Since the solar PV plants using the HSFT-MPC will feature with higher reliability, longer service life, and easier maintenance, they are particularly useful for the rural areas with underserved populations that demand reliable and affordable clean electricity. The outcomes of the project have the strong potential to address national needs in the field of renewable energy to reduce CO 2 emissions from the electricity sector, reduce imports of energy from foreign sources, and improve energy security, efficiency, and sustainability. Since electricity is used in almost all of society’s sectors, the outcomes of the project will benefit various sectors of society and economy.

14 SOLAR ENERGY↗

High-Temperature, Wirebondless, Ultracompact Wide Bandgap Power Semiconductor Modules

Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultrahigh power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high-temperature device packaging technology. This Phase II project developed an ultracompact hybrid power module packaging technology based on the use of double lead frames and direct lead frame-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degC. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and it will be capable of operating from 450 degC to -125 degC. This technology will have a profound impact on power electronics and energy conversion technologies and help to conserve energy and the environment as well as reduce the nation's dependence on fossil fuels.

Elmes, John↗

Electron Cyclotron power management for control of Neoclassical Tearing Modes in the ITER baseline scenario

Time-dependent simulations are used to evolve plasma discharges in combination with a Modified Rutherford equation (MRE) for calculation of Neoclassical Tearing Mode (NTM) stability in response to Electron Cyclotron (EC) feedback control in ITER. The main application of this integrated approach is to support the development of control algorithms by analyzing the plasma response with physics-based models and to assess how uncertainties in the detection of the magnetic island and in the EC alignment affect the ability of the ITER EC system to fulfill its purpose. These simulations indicate that it is critical to detect the island as soon as possible, before its size exceeds the EC deposition width, and that maintaining alignment with the rational surface within half of the EC deposition width is needed for stabilization and suppression of the modes, especially in the case of modes with helicity (2,1). A broadening of the deposition profile, for example due to wave scattering by turbulence fluctuations or not well aligned beams, could even be favorable in the case of the (2,1)-NTM, by relaxing an over-focussing of the EC beam and improving the stabilization at the mode onset. Pre-emptive control reduces the power needed for suppression and stabilization in the ITER baseline discharge to a maximum of 5 MW, which should be reserved and available to the Upper Launcher during the entire flattop phase. By assuming continuous triggering of NTMs, with pre-emptive control ITER would be still able to demonstrate a fusion gain of Q=10.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Testing and Expertise for Marine Energy (TEAMER) Program Support (CRADA Final Report)

Virginia Tech (VT) had previously developed a 50 kW AC to DC power converter that is specifically designed to improve the performance and efficiency of wave energy converters (WECs). Through this CRADA, NLR will test the VT power converter via a coupled dynamometer and power electronics test platform. The NLR test platform will be comprised of (1) a rotary dynamometer that will drive a VT provided gearbox and generator, (2) one or more DC regenerative power supplies that provide input power to and take power from the VT supplied power electronics, and (3) a data acquisition system for measurement. NLR will work with VT to develop a test plan, set up the test platform and integrate the test article, perform the testing, and assist in the data analysis.

16 TIDAL AND WAVE POWER↗

Control and Analysis for a Self-Excited Induction Generator for Wind Turbine and Electrolyzer Applications

Self-Excited Induction Generation(SEIG) is very rugged, simple, lightweight, and it is easy and inexpensive to implement, very simple to control, and requires a very little maintenance. In this variable-speed operation, the SEIG needs a power electronics interface to convert from the variable frequency output voltage of the generator to a DC output voltage for battery or other DC applications. In our study, a SEIG is connected to the power electronics interface such as diode rectifier and DC/DC converter and then an electrolyzer is connected as a final DC load for fuel cell applications. An equivalent circuit model for an electrolyzer is utilized for our application. The control and analysis for the proposed system is carried out by using PSCAD and MATLAB software. This study would be useful for designing and control analysis of power interface circuits for SEIG for a variable speed wind turbine generation with fuel cell applications before the actual implementation.

17 WIND ENERGY↗

Synchronverter-based Control of Multi-Port Autonomous Reconfigurable Solar Plants (MARS)

Control of integrated photovoltaic (PV) plants with energy storage systems (ESSs) has become an important research and development topic in recent times. In this context, a Multi-port Autonomous Reconfigurable Solar (MARS) plant that integrates PV and ESS to alternating current transmission grid and high-voltage direct current (HVdc) link is studied in this paper. With penetration of power electronic based resources in the grid, the grid’s capability to recover from frequency or voltage disturbances are reduced. Therefore, one of the vital objectives of any new grid integrated power electronic resource is to provide advanced control functions like voltage and frequency support to the grid during disturbances. In this research work, a detailed implementation of a synchronverter-based control algorithm of MARS is presented. The proposed control algorithm and the MARS control architecture are evaluated through simulations on PSCAD/EMTDC simulation platform to showcase the performance in different operating conditions. In addition, they are evaluated in Opal-RT offline simulation models which can also be used to perform control-hardware-in-the-loop (cHIL) tests.

Marthi, Phani Ratna Vanamali↗

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

Design and Test of a Structurally-Integrated Heat Sink for the Maxwell X-57 High Lift Motor Controller

An innovative thermal management solution was conceptualized, built and tested for the X57 Maxwell electric airplane. A combination of commercial CFD codes and bespoke thermal modeling tools were employed to rapidly develop a structurally-integral power electronics heat sink. A structurally-integrated heat sink was devised for the GIMC-SCEPTOR high lift motor controller. The nacelle-conforming sink is designed to dissipate heat from the power electronics assembly while simultaneously acting as the mechanical load path between the wing structure and high lift motor.

Edwards, Ryan↗

Effective Selective Area Doping for GaN Vertical Power Transistors Enabled by Innovative Materials Engineering

GaN vertical power transistors have emerged as promising candidates for future high efficiency high power electronic applications, with the potential to outperform conventional GaN lateral power devices in terms of power, breakdown, and avalanche characteristics. However, the development of current GaN vertical power transistors is seriously hindered by the poor materials performance of selective area doped p-n junctions. A mechanistic understanding of these fundamental materials issues is essential in order to achieve high performance selective area doped p-n junctions and consequently to advance the GaN vertical power transistor technology. To address this challenge, we carried out a comprehensive research program that advance fundamental knowledge in the selective area doping for GaN materials, and which will lead to the development of high performance GaN vertical power transistors. First, we developed innovative fabrication processes, including novel surface etching, surface passivation, and metalorganic chemical vapor deposition (MOCVD) growth, which provided enhanced opportunities for solving the unique challenges of selective area doping in GaN materials. Second, we performed a fundamental materials study using powerful characterization methods including transmission electron microscopy (TEM), ultraviolet (UV-), x-ray and angle-resolved photoelectron spectroscopy (UPS/XPS/ARPES), electron holography, and cathodoluminescence (CL); Third, we investigated several related issues, including Mg incorporation, polarization effects in carrier transport, and non-ideal material effects, which have rarely been explored so far. At the end of this project, we successfully demonstrated (1) fundamental understanding of selective area etching, regrowth, and doping of GaN, and associated knowledge on defects, interface, and breakdown properties. (2) Effective etch and regrowth processing recipes to achieve etch/regrowth GaN p-n diodes with very low leakage of 3.5 nA at 600 V, which meets the ARPA-E target. (2) High performance vertical GaN p-n didoes and vertical junction termination extension (JTE) devices with breakdown voltage of ~ 2 kV, and breakdown electric field of ~ 3.5 MV/cm, which are close to the performance limit of GaN. The successful outcome has resulted in new fundamental understandings in the selective area doping and regrowth process for GaN, which will lead to groundbreaking GaN vertical transistors for high performance next generation power electronics.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Cost analysis of distributed storage in AC and DC microgrids

Building and microgrid designs with highly-distributed electrical storage have potential advantages over today's conventional topologies with centralized storage. Herein this paper studies the capital cost benefits of several residential behind-the-meter distributed-storage topologies, including AC and DC versions of systems with load-packaged batteries and resilient sub-networks. The study begins by defining the block configuration of each topology. This work then develops a model for the cost of the power electronics necessary to interface with the storage elements. Finally, the analysis develops a model for the total cost of each storage topology, incorporating the installation and soft costs. The results suggest that while the cost of power electronics is lower in centralized topologies, the total cost is lower for distributed storage due to the avoided costs of installation and permitting. This paper also explores the benefits of load-packaged batteries for savings in electrical infrastructure.

25 ENERGY STORAGE↗

Harmonic Modeling, Data Generation and Analysis of Power Electronics-Interfaced Residential Loads

The share of electronics-based residential load is expected to rise as devices such as variable frequency drives (VFDs), electric vehicle chargers, and inverter-based distributed energy resources (DERs), e.g., photovoltaic (PV) systems become more common. These loads may introduce significant harmonics into power networks that need to be closely studied in order to perform accurate load modeling and forecasting. However, it can be difficult to obtain harmonic-rich voltage and current data - necessary for identifying accurate load models - for residential electrical loads. Recognizing this need, we identify and model a set of electronics-based end-use loads and DERs in an electromagnetic transients program (EMTP) tool for a residence with a single- phase split-phase supply. Further, a procedure is developed to model harmonic interactions between end-use loads connected to the same non-ideal supply voltage in a residential setting. Finally, a harmonic-rich dataset produced via the proposed procedure is utilized to identify frequency coupling matrix (FCM) based load model. Numerical results demonstrate the accuracy of the model, and explore model identifiability with limited data points.

harmonics, power quality, load modeling↗

A High-Average-Power Free Electron Laser for Microfabrication and Surface Applications

CEBAF has developed a comprehensive conceptual design of an industrial user facility based on a kilowatt ultraviolet (UV) (160-1000 mm) and infrared (IR) (2-25 micron) free electron laser (FEL) driven by a recirculating, energy recovering 200 MeV superconducting radio frequency (SRF) accelerator. FEL users, CEBAF's partners in the Lase Processing Consortium, including AT&T, DuPont, IBM, Northrop Grumman, 3M, and Xerox, are developing applications such as metal, ceramic, and electronic material micro-fabrication and polymer and metal surface processing, with the overall effort leading to later scale-up to industrial systems at 50-100 kW. Representative applications are described. The proposed high-average-power FEL overcomes limitations of conventional laser sources in available power, cost-effectiveness, tunability, and pulse structure.

Dylla, H. F.↗