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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 667 records · Page 37
All sourcesNASA NTRSDOE OSTI
NASA NTRS1986

Correlation of processing and sintering variables with the strength and radiography of silicon nitride

A sintered Si3N4-SiO2-Y2O3 composition, NASA 6Y, was developed that reached four-point flexural average strength/standard deviation values of 857/36, 544/33, and 462/59 MPa at room temperature, 1200 and 1370 C, respectively. These strengths represented improvements of 56, 38, and 21 percent over baseline properties at the three test temperatures. At room temperature the standard deviation was reduced by over a factor of three. These accomplishments were realized by the iterative utilization of conventional X-radiography to characterize structural (density) uniformity as affected by systematic changes in powder processing and sintering parameters. Accompanying the improvement in mechanical properties was a change in the type of flaw causing failure from a pore to a large columnar beta-Si3N4 grain typically 40-80 micron long, 10-30 micron wide, and with an aspect ratio of 5:1.

Sanders, W. A.↗
NASA NTRS1988

Processing, texture and mechanical properties of sintered silicon carbide

With regard to its favorable properties, in particular those shown at high temperatures, silicon carbide is of great interest for applications related to the construction of engines and turbines. Thus, silicon carbide could replace heat-resisting alloys with the objective to achieve a further increase in operational temperature. The present investigation is concerned with approaches which can provide silicon carbide material with suitable properties for the intended applications, taking into account the relations between characteristics of the raw material, material composition, sinter conditions, and results of the sintering process. The effects of density and texture formation on the mechanical properties are studied. It is found that a dense material with a fine-grained microstructure provides optimal mechanical properties, while any deviation from this ideal condition can lead to a considerable deterioration with respect to the material properties.

Landfermann, H.↗
NASA NTRS1987

Gravitational contributions to microstructural coarsening in liquid phase sintering

Preliminary experiments for determining the role of gravity in liquid phase sintering have been carried out. Tungsten heavy alloys were selected for this investigation because of the large density difference between solid and liquid, extensive interest in the alloys and considerable data on these alloys. By identifying and isolating the role that gravity plays in shape distortion and microstructural coarsening, further insight into the mechanisms of coarsening kinetics may be realized. Improvements in mechanical properties, shape complexity, and dimensional stability may be realized in the future from low gravity sintering.

Kipphut, C. M.↗
NASA NTRS1990

Sintered Fiber Electrodes

Method proposed to make improved porous electrodes for oxygen pumps, oxygen sensors, high-temperature solid-electrolyte fuel cells, and high-temperature solid-electrolyte electrolysis cells. Electrode made by sintering mat of conducting fibers. Many sintered bonds between intersecting fibers increase electrical conductivity and provide strength, yet allow mat to remain highly porous.

Schroeder, James E.↗
NASA NTRS1990

Investigation of mechanical and thermal properties of microwave-sintered lunar simulant materials using 2.45 GHz radiation

The mechanical and thermal properties of lunar simulant material were investigated. An alternative method of examining thermal shock in microwave-sintered lunar samples was researched. A computer code was developed that models how the fracture toughness of a thermally shocked lunar simulant sample is related to the sample hardness as measured by a micro-hardness indentor apparatus. This technique enables much data to be gathered from a few samples. Several samples were sintered at different temperatures and for different times at the temperatures. The melting and recrystallization characteristics of a well-studied binary system were also investigated to see if the thermodynamic barrier for the nucleation of a crystalline phase may be affected by the presence of a microwave field. The system chosen was the albite (sodium alumino silicate) anorthite system (calcium alumino silicate). The results of these investigations are presented.

Meek, T. T.↗
NASA NTRS1991

Sintering of two phase lamellar microstructures

The effect of an inert phase on neck growth rates during sintering of lamellar structures is described. Sintering diagrams are constructed for an aggregate of two-phase Cu spheres with lamellar microstructure containing an inert phase. It is shown that the regions corresponding to lattice diffusion domination shrink due to the inert phase presence. As the dispersion becomes finer, the alterations in the map become substantial.

Courtney, T. H.↗
NASA NTRS1992

Superplastic Titanium Tube Applies Pressure For Sintering

In newly developed technique, titanium vessel filled with gas to exert pressure necessary for sintering. Used in brazing, sintering, and hot forming. Simplifies fabrication of parts having complicated shapes and has potential for variety of applications, including fabrication of heat pipes for high-performance vehicles.

Mueller, Allen H.↗
NASA NTRS1991

A very low resistance, non-sintered contact system for use on indium phosphide concentrator/shallow junction solar cells

An investigation is made into the possibility of providing low resistance contacts to shallow junction InP solar cells which do not require sintering and which do not cause device degradation even when subjected to extended annealing at elevated temperatures. We show that the addition of In to Au contacts in amounts that exceed the solid solubility limit lowers the as-fabricated (unsintered) contact resistivity (R sub c) to the 10(exp -5) ohm cm(exp 2) range. We next consider the contact system Au/Au2P3, which has been shown to exhibit as-fabricated R sub c values in the 10(exp -6) ohm cm(exp 2) range, but which fails quickly when heated. We show that the substitution of a refractory metal (W, Ta) for Au preserves the low R sub c values while preventing the destructive reactions that would normally take place in this system at high temperatures. We show, finally, that R sub c values in the 10(exp -7) ohm cm(exp 2) range can be achieved without sintering by combining the effects of In or Ga additions to Au contacts with the effects of introducing a thin Au2P3 layer at the metal-InP interface.

Weizer, Victor G.↗
NASA NTRS1991

A very low resistance, non-sintered contact system for use on indium phosphide concentrator/shallow junction solar cells

An investigation is made into the possibility of providing low resistance contacts to shallow junction InP solar cells which do not require sintering and which do not cause device degradation even when subjected to extended annealing at elevated temperatures. We show that the addition of In to Au contacts in amounts that exceed the solid solubility limit lowers the as-fabricated (unsintered) contact resistivity (R sub c) to the 10(exp -5) ohm cm(exp 2) range. We next consider the contact system Au/Au2P3 which has been shown to exhibit as-fabricated R sub c values in the 10(exp -6) ohm cm(exp 2) range, but which fails quickly when heated. We show that the substitution of a refractory metal (W, Ta) for Au preserves the low R sub c values while preventing the destructive reactions that would normally take place in this system at high temperatures. We show, finally, that R sub c values in the 10(exp -7) ohm cm(exp 2) range can be achieved without sintering by combining the effects of In or Ga additions to Au contacts with the effects of introducing a thin Au2P3 layer at the metal-InP interface.

Weizer, Victor G.↗
NASA NTRS1993

Simple, extremely low resistance contact system to n-InP that does not exhibit metal-semiconductor intermixing during sintering

Contact formation to InP is plagued by the violent metal-semiconductor intermixing that takes place during the contact sintering process. We have discovered a truly unique contact system, involving Au and Ge, which is easily fabricated, which exhibits extremely low values of contact resistivity, and in which there is virtually no metal-semiconductor interdiffusion, even after extended sintering. We present a description of this contact system and suggest possible mechanisms to explain the observed behavior.

Weizer, Victor G.↗
NASA NTRS1993

Study on the mechanism of liquid phase sintering (M-12)

The objectives were to (1) obtain the data representing the growth rate of solid particles in a liquid matrix without the effect of gravity; and (2) reveal the growth behavior of solid particles during liquid phase sintering using the data obtained. Nickel and tungsten are used as the constituent materials in liquid phase sintering. The properties of the constituent metals are given. When a compact of the mixture of tungsten and nickel powders is heated and kept at 1550 C, nickel melts down but tungsten stays solid. As the density of tungsten is much greater than that of nickel, the sedimentation of tungsten particles occurs in the experiment on Earth. The difference between the experiments on Earth and in space is illustrated. The tungsten particles sink to the bottom and are brought into contact with each other. The resulting pressure at the contact point causes the accelerated dissolution of tungsten. Consequently, flat surfaces are formed at the contact sites. As a result of dissolution and reprecipitation of tungsten, the shape of particles changes to a polygon. This phenomenon is called 'flattening.' An example of flattening of tungsten particles is shown. Thus, the data obtained by the experiment on Earth may not represent the exact growth behavior of the solid particles in a liquid matrix. If the experiments were done in a microgravity environment, the data corresponding to the theoretical growth behavior of solid particles could be achieved.

Kohara, S.↗
NASA NTRS1993

Characteristics of products generated by selective sintering and stereolithography rapid prototyping processes

The trend in the modern global economy towards free market policies has motivated companies to use rapid prototyping technologies to not only reduce product development cycle time but also to maintain their competitive edge. A rapid prototyping technology is one which combines computer aided design with computer controlled tracking of focussed high energy source (eg. lasers, heat) on modern ceramic powders, metallic powders, plastics or photosensitive liquid resins in order to produce prototypes or models. At present, except for the process of shape melting, most rapid prototyping processes generate products that are only dimensionally similar to those of the desired end product. There is an urgent need, therefore, to enhance the understanding of the characteristics of these processes in order to realize their potential for production. Currently, the commercial market is dominated by four rapid prototyping processes, namely selective laser sintering, stereolithography, fused deposition modelling and laminated object manufacturing. This phase of the research has focussed on the selective laser sintering and stereolithography rapid prototyping processes. A theoretical model for these processes is under development. Different rapid prototyping sites supplied test specimens (based on ASTM 638-84, Type I) that have been measured and tested to provide a data base on surface finish, dimensional variation and ultimate tensile strength. Further plans call for developing and verifying the theoretical models by carefully designed experiments. This will be a joint effort between NASA and other prototyping centers to generate a larger database, thus encouraging more widespread usage by product designers.

Cariapa, Vikram↗
NASA NTRS2003

Sintering Behavior of Diboride Based Materials

A brief history of diboride research, an overview of processing, and sintering studies are covered in this viewgraph presentation. UHTCs are a family of ceramic materials, including diborides of Hf and Zr, with extremely high melting temperatures. Spark Plasma Sintering (SPS) is a novel processing technique useful in consolidating difficult materials. The presentation also contains microphotographs of the microstructure of HfB2 and ZrB2 processed in different ways.

Gasch, Matt↗
NASA NTRS2004

Effect of Sintering on Mechanical and Physical Properties of Plasma-Sprayed Thermal Barrier Coatings

The effect of sintering on mechanical and physical properties of free-standing plasma-sprayed ZrO2-8 wt% Y2O3 thermal barrier coatings (TBCs) was determined by annealing them at 1316 C in air. Mechanical and physical properties of the TBCs, including strength, modes I and II fracture toughness, elastic modulus, Poisson s response, density, microhardness, fractography, and phase stability, were determined at ambient temperature as a function of annealing time ranging from 0 to 500 h. All mechanical and physical properties, except for the amount of monoclinic phase, increased significantly in 5 to 100 h and then reached a plateau above 100 h. Annealing resulted in healing of microcracks and pores and in grain growth, accompanying densification of the TBC s body due to the sintering effect. However, an inevitable adverse effect also occurred such that the desired lower thermal conductivity and good expansivity, which makes the TBCs unique in thermal barrier applications, were degraded upon annealing. A model was proposed to assess and quantify all the property variables in response to annealing in a normalized scheme. Directionality of as-sprayed TBCs appeared to have an insignificant effect on their properties, as determined via fracture toughness, microhardness, and elastic modulus measurements.

Choi, Sung R.↗
NASA NTRSDate not supplied

Laser Sintering of RTM385-SLS Thermoset Polyimides With Boron Nitride

RTM385-SLS is a melt-processable thermoset polyimide resin specially formulated with a complex melt viscosity (ƞ*) of ~104-105 poise for laser sintering. RTM385-SLS resin powder was mixed with 20-25% of hexagonal boron nitride (h-BN) and subjected to laser sintering (LS) to print out “Green” disks and dogbone specimens which could be further post-cured in an oven to complete the crosslinking of the reactive phenylethynyllphthalic anhydride (PEPA) terminal groups within the resin to achieve a very high glass transition temperature (T g ) of 385°C. The cured composite specimens were then subjected to thermal analysis, thermal conductivity measurement and mechanical testing for characterization.

Additive manufacturing↗
DOE OSTI2012

Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry

The sum of chemical and mechanical bonding limits the adhesive strength of die-attach and substrate-attach layers. This is also true for sintered silver joints whose development and employment are underway in the electronic packaging community. Chemical bonding is dictated by numerous parameters associated with the compatibility of the metallurgical bond of the two mating surfaces and the processing history that brings them together. However, the efficacy of mechanical bonding is likely affected by the topographies (e.g., roughness) of the two adjoined surfaces and also perhaps the shape of the attachment layer itself (e.g., circles, squares, and sizes thereof). In this study the mechanical bonding component is examined through the modification of the copper cladding surface on direct bonded copper (DBC) substrates, the shape of the silver pad attachment bonded to it, and the use of a joined 'DBC sandwich' that facilitates their study. It was found that simple employment of both surface topography control and printed pad geometry can affect and improve shear strength of silver sintered joints, and that there is logic to perhaps hybridize their effects. This is an important observation as more future attention is devoted to joining constituents with larger areas (> 100 mm2) in electronic packages.

36 MATERIALS SCIENCE↗
DOE OSTI2014

Sintered wire cesium dispenser photocathode

A photoelectric cathode has a work function lowering material such as cesium placed into an enclosure which couples a thermal energy from a heater to the work function lowering material. The enclosure directs the work function lowering material in vapor form through a low diffusion layer, through a free space layer, and through a uniform porosity layer, one side of which also forms a photoelectric cathode surface. The low diffusion layer may be formed from sintered powdered metal, such as tungsten, and the uniform porosity layer may be formed from wires which are sintered together to form pores between the wires which are continuous from the a back surface to a front surface which is also the photoelectric surface.

42 ENGINEERING↗
DOE OSTI2018

Porous metals from sintering of nanoparticles

A method including encapsulating or capping metallic nanoparticles by a dendrimer or a polymer with binding sites for metal particless or metal ions dispersed in a fluid; modifying the fluid to disrupt the interaction of the dendrimer or polymer with the particles; and subsequently or concomitantly sintering or partially consolidating the zero valent metal. A method including introducing a first metal salt and a second metal salt into a dendrimer or a polymer with binding sites for metals or metal ions; reducing a metal ion of the first metal salt to a zero valent first metal and a metal ion of the second metal salt to a zero valend second metal; disrupting an interaction between the dendrimer or the polymer and the first metal and the second metal; and sintering or partially consolidating the first metal and the second metal.

36 MATERIALS SCIENCE↗