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NASA NTRS1989

Composites of vinyl polystyrylpyridine/bismaleimide-aliphatic ether copolymers

An aliphatic ether bismaleimide was prepared and coreacted with a polyvinylstyrylpyridine (VPSP) oligomer. Studies showed that a controlled ratio of aliphatic to aromatic units in the polymer backbone improved both processibility and interlaminar shear properties for the carbon-fiber composite system. This modified resin was readily soluble in tetrahydrofuran, allowing for better fiber impregnation and thus enhancing adhesive properties and reproducibility. DSC studies have shown a lower cure temperature for the copolymer than for the neat aliphatic bismaleimide, and a glass transition temperature of 260 C, which is more than adequate for most applications. Limited measurements indicated an improvement in toughness (impact resistance).

Heimbuch, Alvin H.↗

NASA NTRS1999

Copolyimides Prepared from 3,4'-Oxydianiline and 1,3-Bis(3-Aminophenoxy) Benzene with 3,3', 4,4'-Biphenylcarboxylic Dianhydride

Polyimide copolymers were prepared by reacting different ratios of 3,4'-oxydianiline (ODA) and 1,3-bis(3- aminophenoxy)benzene (APB) with 3,3',4,4'- biphenylcarboxylic dianhydride (BPDA) and endcappfng with an effective amount of a non-reactive endcapper. Within a narrow ratio of diamines, from -50% ODA/50% APB to -95% ODA/5% APB, the copolyimides prepared with BPDA have a unique combination of properties that make them very attractive for various applications. This unique combination of properties includes low pressure processing (200 psi and below), long term melt stability (several hours at 390 C.), improved toughness, improved solvent resistance, improved adhesive properties, and improved composite mechanical properties.

Jensen, Brian J.↗

NASA NTRS1995

Solvent resistant copolyimide

A solvent resistant copolyimide was prepared by reacting 4,4'-oxydiphthalic anhydride with a diaimine blend comprising, based on the total amount of the diamine blend, about 75 to 90 mole percent of 3,4'-oxydianiline and about 10 to 25 mole percent p-phenylene diamine. The solvent resistant copolyimide had a higher glass transition temperature when cured at 350.degree. , 371.degree. and 400.degree. C. than LaRC.TM.-IA. The composite prepared from the copolyimide had similar mechanical properties to LaRC.TM.-IA. Films prepared from the copolyimide were resistant to immediate breakage when exposed to solvents such as dimethylacetamide and chloroform. The adhesive properties of the copolyimide were maintained even after testing at 23.degree., 150.degree., 177.degree. and 204.degree. C.

Chang, Alice C.↗

NASA NTRS1994

A solvent resistant copolyimide

A solvent resistant copolyimide was prepared by reacting 4,4'-oxydiphthalic anhydride with a diamine blend comprising, based on the total amount of the diamine blend, about 75 to 90 mole percent of 3,4'-oxydianiline and about 10 to 25 mole percent p-phenylene diamine. The solvent resistant copolyimide had a higher glass transition temperature when cured at 350 C, 371 C and 400 C than LaRC(TM)-IA. The composite prepared from the copolyimide had similar mechanical properties to LaRC(TM)-IA. Films prepared from the copolyimide were resistant to immediate breakage when exposed to solvents such as dimethylacetamide and chloroform. The adhesive properties of the copolyimide were maintained even after testing at 23 C, 150 C, 177 C and 204 C.

Chang, Alice C.↗

NASA NTRS1975

Effect of polymer properties and adherend surfaces on adhesion

The surface properties associated with good adhesive joints were evaluated in terms of application of adhesive bonding in aerospace technology. The physical and chemical nature was determined of Ti and Al adherend surfaces after various surface treatments, and the effects on fracture surfaces of high temperature aging, and variations in amide, anhydride, and solvent during polymer synthesis. The effects were characterized of (1) high temperature during shear strength testing, (2) fiber-reinforced composites as adherends, (3) acid/base nature of adherends, (4) aluminum powder adhesive filler, and (5) bonding pressure.

Dwight, D. W.↗

NASA NTRS1999

The Mars Environmental Compatibility Assessment (MECA)

The Mars Environmental Compatibility Assessment (MECA) will evaluate the Martian environment for soil and dust-related hazards to human exploration as part of the Mars Surveyor Program 2001 Lander. Sponsored by the Human Exploration and Development of Space (HEDS) enterprise, MECA's goal is to evaluate potential geochemical and environmental hazards that may confront future martian explorers, and to guide HEDS scientists in the development of high fidelity Mars soil simulants. In addition to objectives related to human exploration, the MECA data set will be rich in information relevant to basic geology, paleoclimate, and exobiology issues. The integrated MECA payload contains a wet-chemistry laboratory, a microscopy station, an electrometer to characterize the electrostatics of the soil and its environment, and arrays of material patches to study the abrasive and adhesive properties of soil grains. MECA is allocated a mass of 10 kg and a peak power usage of 15 W within an enclosure of 35 x 25 x 15 cm (figures I and 2). The Wet Chemistry Laboratory (WCL) consists of four identical cells that will accept samples from surface and subsurface regions accessible to the Lander's robotic arm, mix them with water, and perform extensive analysis of the solution. Using an array of ion-specific electrodes (ISEs), cyclic voltammetry, and electrochemical techniques, the chemistry cells will wet soil samples for measurement of basic soil properties of pH, redox potential, and conductivity. Total dissolved material, as well as targeted ions will be detected to the ppm level, including important exobiological ions such as Na, K+, Ca++, Mg++, NH4+, Cl, S04-, HC03, as well as more toxic ions such as Cu++, Pb++, Cd++, Hg++, and C104-. MECA's microscopy station combines optical and atomic-force microscopy (AFM) to image dust and soil particles from millimeters to nanometers in size. Illumination by red, green, and blue LEDs is augmented by an ultraviolet LED intended to excite fluorescence in the sample. Substrates were chosen to allow experimental study of size distribution, adhesion, abrasion, hardness, color, shape, aggregation, magnetic and other properties. To aid in the detection of potentially dangerous quartz dust, an abrasion tool measures sample hardness relative to quartz and a hard glass (Zerodur).

Meloy, Thomas P.↗

NASA NTRS1984

Status of high temperature adhesives

The status of high temperature organic adhesives is reviewed. These materials are defined by having usable adhesive properties at temperatures ranging from 232 C (after hundreds of hours at 232 C) to 538 C (after a few minutes at 538 C). The search for high temperature adhesives began in the 1960s, primarily under government funding. Since then, many high temperature polymers have undergone evaluation as adhesives. In spite of this effort, only a few are commercially available because of an elusive market and an unfavorable combination of price, processability and performance. The principal adhesives to be discussed will be addition and condensation polyimides, polyquinoxalines, polybenzimidazoles, and addition, condensation, and cross-linked polyphenylquinoxalines. The synthesis, processability, adhesive performance, and availabiity of these materials are addressed.

Hergenrother, P. M.↗

NASA NTRS1990

An evaluation of two flat-black silicone paints for space application

Tests were conducted on two flat-black silicone paints suggested for space applications to determine their optical, electrical, and mechanical properties. Three different types of substrate materials were chosen for these paint tests; the application of the paints onto the primed substrates was carried out by spray coating. The adhesion properties were verified by thermal shock and sudden immersion into liquid nitrogen. A controlled thermal vacuum tests was also carried out by varying the temperature of the paint from -100 to 225 C. The measured optical properties included normal and hemispherical emittance, and solar absorption/reflectance. A simultaneous exposure to low-energy proton/UV irradiation in vacuum, and high-energy proton/electron irradiation was carried out. Additional tests of the paints are described.

Clatterbuck, Carroll H.↗

NASA NTRS1997

Adhesion Performance of Solid Film Lubricants on Substrates Cleaned With Environmentally Compliant Cleaners

Solid film adhesion testing was used to determine the effect different environmentally compliant cleaners have on the adhesion properties of solid film lubricants used for several NASA programs. In an action to remove ozone depleting chemicals from aerospace processes, a replacement cleaner must be identified that does not affect the adhesion of solid film lubricants used on flight critical NASA hardware. ASTM D251083 Standard Test Method for Adhesion of Solid Film Lubricants was used to evaluate the cleaners. Two different lubricants - Inlox 88 and Boosterlube - were tested using various commercially available cleaners. Inlox 88 is produced by E/M Corporation and is a liquid oxygen compatible lubricant used in the Space Shuttle Main Engine, and Boosterlube is a new lubricant being implemented for use on the Space Shuttle Solid Rocket Booster. These lubricants were selected because of their specific use on flight critical NASA components. Results of this testing are presented in the paper.

Hall, P. B.↗

NASA NTRS1985

STPI/LARC: A 200 deg C polyimide adhesive

A copolyimide, STPI/LARC, was prepared from the reaction of 3,3'4'benzophenonetetracarboxylic dianhydride (BTDA), equimolar quantities of m-phenylenediamine and 4,4'-oxydianiline, and a small amount of phthalic anhydride to control the molecular weight. The processability and adhesive properties of STPI/LARC were compared to those of a commercially available form of LARC-TPI. LARC-TPI, a thermoplastic polyimide, from the reaction of BTDA and 3,3'-diaminobenzophenone, had previously shown promise as a high temperature structural adhesive. Lap shear specimens were fabricated using adhesive tape prepared from each of the two polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to a 72-hour water-boil and to aging at 204 C.

Progar, D. J.↗

NASA NTRS1985

A thermoplastic copolyimide

A copolyimide, STPI/LARC, was prepared from the reaction of 3,3'4,4'-benzophenonetetracarboxylic dianhydride (BTDA), equimolar quantities of m-phenylenediamine and 4,4'-oxydianiline, and a small amount of phthalic anhydride to control the molecular weight. The processability and adhesive properties of STPI/LARC were compared to those of a commercially available form of LARC-TPI. LARC-TPI, a thermoplastic polyimide, from the reaction of BTDA and 3,3'-diaminobenzophenone, had previously shown promise as a high temperature structural adhesive. Lap shear specimens were fabricated using adhesive tape prepared from each of the two polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to a 72-hour water-boil and to aging at 204 C.

Progar, D. J.↗

NASA NTRS1984

Mechanical and spectroscopic properties of metal containing polyimides

The incorporation of specific metal ions into polyimides is described. Detailed studies have included various compounds of copper, lithium, and palladium as dopants. Addition of the metal during polymermzation or after formation of the polyamic acid precedes the thermal imidization step. With many dianhydride-diamine-dopant combinations high quality variously colored films are produced. Many metal doped films exhibit (1) improved high temperature adhesive properties, (2) increased electrical conductivity, (3) excellent thermal stability, (4) improved acid/base resistance, (5) increased modulus in flexible films and (6) excellent high temperature tensile strength. X-ray photo-electron spectroscopic study of these films suggests that many of the additives undergo chemical modification during thermal imidization. Palladium dopants appear to be partially reduced to the metallic state, while lithium and copper dopants are probably converted to their oxides. Ion etching experiments with Auger electron spectroscopy monitoring are discussed.

Taylor, L. T.↗

NASA NTRS1983

Mechanical and spectroscopic properties of metal-containing polyimides

The incorporation of specific metal ions into polyimides is described. Detailed studies have included various compounds of copper, lithium, and palladium as dopants. Addition of the metal during polymerization or after formation of the polyamic acid precedes the thermal imidization step. With many dianhydride-diamine-dopant combinations high quality variously colored films are produced. Many metal doped films exhibit (1) improved high temperature adhesive properties, (2) increased electrical conductivity, (3) excellent thermal stability, (4) improved acid/base resistance, (5) increased modulus in flexible films and (6) excellent high temperature tensile strength. X-ray photo-electron spectroscopic study of these films suggests that many of the additives undergo chemical modification during thermal imidization. Palladium dopants appear to be partially reduced to the metallic state, while lithium and copper dopants are probably converted to their oxides. Ion etching experiments with Auger electron spectroscopy monitoring are discussed.

Taylor, L. T.↗

NASA NTRS1980

Residual Silicone Detection

Both photoelectron emission and ellipsometry proved successful in detecting silicone contamination on unpainted and epoxy painted metal surfaces such as those of the external tank and the solid rocket booster. Great success was achieved using photoelectron emission (PEE). Panels were deliberately contaminated to controlled levels and then mapped with PEE to reveal the areas and levels that were contaminated. The panels were then tested with regard to adhesive properties. Tapes were bonded over the contaminated and uncontaminated regions and the peel force was measured, or the contaminated panels were bonded (with CPR 483 foam) to uncontaminated panels and made into lap shear specimens. Other panels were bonded and made into wedge specimens for hydrothermal stress endurance tests. Strong adhesion resulted if the PEE signal fell within an acceptance window, but was poor outside the acceptance window. A prototype instrument is being prepared which can automatically be scanned over the external liquid hydrogen tank and identify those regions that are contaminated and will cause bond degradation.

Smith, T.↗

NASA NTRS1998

Undoped Polyaniline/Surfactant Complex for the Corrosion Prevention

Due to the strict regulations on the usage of heavy metals as the additives in the coating industries, the search for effective organic corrosion inhibitors in replace of those metal additives has become essential. Electrically conducting polymers have been shown to be effective for corrosion prevention but the poor solubility of these intractable polymers has been a problem. We have explored a polyaniline/4-dodecylphenol complex (PANi/DDPh) to improve the dissolution and it has been shown to be an effective organic corrosion inhibitor. With the surfactant, DDPh, PANi could be diluted into the coatings and the properties of the coatings were affected. Emeraldine base (EB) form of PANi was also found to be oxidized by the hardener. The oxidized form of polyaniline provides improved corrosion protection of metals than that of emeraldine base since the value of the standard electrode potential for the oxidized form of PANi is higher than that of EB. Additionally, the surfactant improves the wet adhesion property between the coating and the metal surface.

Liu, Lo-Min↗

NASA NTRSDate not supplied

Dust Characterization Needs for Dust Mitigation

Unknowns remain regarding several lunar dust characteristics, and the lunar dust mitigation community, in collaboration with the science community, is compiling a list of lunar dust characterization needs. It is expected, through the course of currently planned or future lunar surface mission instrumentation, lab experiments, or analysis, that some of these unknowns will be characterized. This list is derived from several sources including findings from the 2020 publication “The Impact of Lunar Dust on Human Exploration”, NASA-STD-1008, SLS-SPEC-159 DSNE, and known gaps identified within NASA programs and projects. The goal of this information collection process is to create a list of dust characterization needs based on scientific and engineering knowledge gaps that will aid in the design and survival of designed and future systems, and address the challenges related to defining the lunar environment and mitigating lunar dust effects on systems and operations. Examples of dust properties and characterization needs include detailed examination of the finest fraction of lunar regolith as it varies by surface location, understanding dust transfer within natural and induced environments, determination of the effects of the lunar plasma environment with regards to materials and hardware, understand the triboelectric charging effects for activities and hardware in contact with the regolith, including grain to grain electrostatic interactions, and material adhesive properties.

dust mitigation↗

NASA NTRS2008

Coating Reduces Ice Adhesion

The Shuttle Ice Liberation Coating (SILC) has been developed to reduce the adhesion of ice to surfaces on the space shuttle. SILC, when coated on a surface (foam, metal, epoxy primer, polymer surfaces), will reduce the adhesion of ice by as much as 90 percent as compared to the corresponding uncoated surface. This innovation is a durable coating that can withstand several cycles of ice growth and removal without loss of anti-adhesion properties. SILC is made of a binder composed of varying weight percents of siloxane(s), ethyl alcohol, ethyl sulfate, isopropyl alcohol, and of fine-particle polytetrafluoroethylene (PTFE). The combination of these components produces a coating with significantly improved weathering characteristics over the siloxane system alone. In some cases, the coating will delay ice formation and can reduce the amount of ice formed. SILC is not an ice prevention coating, but the very high water contact angle (greater than 140 ) causes water to readily run off the surface. This coating was designed for use at temperatures near -170 F (-112 C). Ice adhesion tests performed at temperatures from -170 to 20 F (-112 to -7 C) show that SILC is a very effective ice release coating. SILC can be left as applied (opaque) or buffed off until the surface appears clear. Energy dispersive spectroscopy (EDS) and x-ray photoelectron spectroscopy (XPS) data show that the coating is still present after buffing to transparency. This means SILC can be used to prevent ice adhesion even when coating windows or other objects, or items that require transmission of optical light. Car windshields are kept cleaner and SILC effectively mitigates rain and snow under driving conditions.

Smith, Trent↗

NASA NTRS1992

Quartz/fused silica chip carriers

The primary objective of this research and development effort was to develop monolithic microwave integrated circuit (MMIC) packaging which will operate efficiently at millimeter-wave frequencies. The packages incorporated fused silica as the substrate material which was selected due to its favorable electrical properties and potential performance improvement over more conventional materials for Ka-band operation. The first step towards meeting this objective is to develop a package that meets standard mechanical and thermal requirements using fused silica and to be compatible with semiconductor devices operating up to at least 44 GHz. The second step is to modify the package design and add multilayer and multicavity capacity to allow for application specific integrated circuits (ASIC's) to control multiple phase shifters. The final step is to adapt the package design to a phased array module with integral radiating elements. The first task was a continuation of the SBIR Phase 1 work. Phase 1 identified fused silica as a viable substrate material by demonstrating various plating, machining, and adhesion properties. In Phase 2 Task 1, a package was designed and fabricated to validate these findings. Task 2 was to take the next step in packaging and fabricate a multilayer, multichip module (MCM). This package is the predecessor to the phased array module and demonstrates the ability to via fill, circuit print, laminate, and to form vertical interconnects. The final task was to build a phased array module. The radiating elements were to be incorporated into the package instead of connecting to it with wire or ribbon bonds.

Source record↗